Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

Abstract: The invention relates to a novel complex salt of palladium sulfate and ethylenediamine which contains 31 to 41% by weight of palladium and in which the molar ratio [SO4]:[Pd] is between 0.9 and 1.15 and the ratio [ethylenediamine]:[Pd] is between 0.8 and 1.2.

Abstract: A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.

Abstract: A process for manufacturing a composite membrane for separation of hydrogen gas using palladium, which employs the step of electroplating under vacuum an alloy of a palladium compound and a transition metal.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. Thus, metal is deposited on the barrier layer duplicating a first conductive pattern under the dielectric layer when the first pattern is a serpentine pattern and the metal deposits in the spaces between the conductive lines of a first conductive pattern of a discrete passive element such as a spiral.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In the preferred embodiment, the precious metal layer is a PdCo alloy and the wear resistant particles are sub-micron sized lubricating particles, e.g. polytetrafluoroethylene particles and a flash coat of gold is provided over the composite layer.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: In a process for manufacturing an electrode for a PEM fuel cell or an electrochemical energy converter, an ion-exchange polymer is applied to one face of an electrode substrate. An electrocatalyst is then applied to the substrate by electrochemical deposition, preferably from a solution containing one or more complexes or salts of the electrocatalyst. The electrochemical deposition occurs by application of a voltage between a pair of electrodes, one of which is the electrode under preparation. The voltage between the two electrodes is controlled by controlling the potential of the working electrode. A pulsed voltage profile is applied across the two electrodes during the electrodeposition process.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, cadmium, indium, iron, tin/lead and tin/lead copper.

Abstract: An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potentials of the two metals closer together. Palladium and the alloying metal thus exist as complexes with different structures.

Abstract: A method of codepositing iron and manganese having a high proportion of manganese incorporates use of a new electrochemical cell. The deposit comprises up to 38% manganese from a solution of wide ranging pH from an aqueous bath of sulfate, phosphate salt or any other type of bath, The deposits may subsequently be nitrided, phosphatized or carburized to produced an amorphous surface comparable to Hadfield steel. The manganese alloy deposit exhibits a bright, shiny surface.

Abstract: Disclosed is a method of reactivating a deactivated anode that has a coating of a noble metal or noble metal oxide on a substrate. A coating of a noble metal is deposited on the anode either electrolessly or electrolytically. The noble metal in the deposited coating can be platinum, palladium, iridium, rhodium, ruthenium, osmium, or a mixture thereof.

Abstract: A rapid single step assay suitable for the detection or quantification of enzymes, in particular, hydrolases, especially, aminopeptidases and esterases. The enzymatic reaction causes the cleavage of a metal ligand labelled hydrolase substrate. The cleaved ligand alters the electrochemiluminescence of bidentate aromatic heterocyclic nitrogen-containing ligand reagent. The change in electrochemiluminescence correlates to the presence of hydrolase activity present in the sample. The assay can be performed on an IGEN Origen.RTM. Analyzer.

Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.

Abstract: An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a gold layer deposited on the semi-bright nickel layer, a ruthenium layer deposited on the gold layer, a refractory metal, preferably zirconium, strike layer deposited on the ruthenium layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

Abstract: A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating with an excellent solderability and flexibility onto a substrate by an electrical plating method.

Abstract: Aqueous ammoniacal baths containing polyamines and mercaptoalkane carboxylic acids and/or mercaptoalkane sulfonic acids for the electrodeposition of palladium-silver alloys are provided, which are particularly suited as electrical contacts. The baths have very good stability and permit the deposition of alloys with a silver content up to approximately 99 weight %.

Abstract: A method of recovering volatile ruthenium, which is separated and formed by constant potential electrolysis from high-level radioactive liquid waste discharged from the reprocessing step of spent nuclear fuel by purex process, in the form of stable solid. The method comprises electrolyzing at a constant potential a high-level radioactive liquid waste from which palladium has substantially been removed in advance, thereby vaporizing ruthenium, bringing the vaporized ruthenium into contact with an aqueous solution of formic acid to precipitate ruthenium oxide, and separating the precipitate from the aqueous solution of formic acid.

Abstract: This invention provides a platinum alloy electrodeposition bath which, by alloying platinum with other metals, enables thick plating and can give platinum alloy layers having superior luster and hardness, and also provides a process for manufacturing a platinum alloy electrodeposited product using the same.The platinum alloy electrodeposition bath according to this invention contains 2 to 100 g/lit. of platinum in the form of Pt(OH).sub.6.sup.2- complex ion and at least one of Sn, Zn and Pd in an amount of 1 mg/lit or more.

Abstract: A novel palladium-nickel alloy plating solution provides a uniform electrodeposited film with excellent gloss at a high electric current density. A palladium-nickel alloy plating solution comprises a water-soluble palladium salt, a water-soluble nickel salt, ammonia, an ammonium salt, and 3-pyridinesulfonic acid, which are solved in water. Further additives may be added in the solution.

Abstract: This invention is concerned with production of electrical devices comprising an electrodeposited conductive region free from cracking defects. In the production of a contact portion of the device from a metal strip electroplated with a conductive stripe of an alloy, the stripe exhibited, upon stamping and forming operation, cracked areas. Typically, the stripe coating on the metal strip, such as a copper bronze material, includes a layer of nickel, a layer of palladium alloyed with nickel, cobalt, arsenic or silver, and a flash coating of hard gold. The cracking defects were eliminated by subjecting the plated strip to an annealing treatment prior to the stamping and forming operation. After the heat-treatment, the stripe was free from cracks and separations between the successive layers.

Abstract: An effective bath for plating platinum or platinum alloys contains a complexed platinum (II) salt in which the anion component is a group or radical derived from an organic acid or inorganic acid other than a hydrohalic acid, in alkaline aqueous solution. The bath is more efficient and stable than known baths and permits good plating deposits to be achieved.