Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.

Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

Abstract: Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

Abstract: A process for producing oxygen-consuming electrodes, in particular for use in chloralkali electrolysis, which display good transport capability and storage capability. In the process, a silver oxide-containing sheet-like structure as intermediate is electrochemically reduced. Also disclosed are methods of using these electrodes in chloralkali electrolysis or fuel cell technology or in metal-air batteries, and the fuel cells and metal-air batteries produced.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a conductive pad on a semiconductor die; forming a seed layer over the conductive pad; defining a first mask layer over the seed layer; and forming a silver alloy bump body in the first mask layer. The forming a silver alloy bump body in the first mask layer includes operations of preparing a first cyanide-based bath; controlling a pH value of the first cyanide-based bath to be within a range of from about 6 to about 8; immersing the semiconductor die into the first cyanide-based bath; and applying an electroplating current density of from about 0.1 ASD to about 0.5 ASD to the semiconductor die.

Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.

Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.

Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.

Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Abstract: A hydrogen generation system for producing hydrogen and injecting the hydrogen as a fuel supplement into the air intake of internal combustion engines. Hydrogen and oxygen is produced with a fuel cell at low temperatures and pressure from water in a supply tank. The hydrogen is directed to the air intake of the engine while the oxygen is vented to the atmosphere. The device is powered by the vehicle battery. The system utilizes an engine sensor that permits power to the system only when the engine is in operation.

Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

Abstract: A slide member including a base material; and an overlay that is formed over the base material and that consists of Ag or Ag alloy including crystal planes (hk1) represented by Miller indices; wherein a relative X-ray diffraction intensity of crystal plane (200) to a sum of X-ray diffraction intensities of crystal planes (200), (111), (220), (311), and (222) of the overlay ranges between 1%?(200)/{(200)+(111)+(220)+(311)+(222)}?20% and the relative X-ray diffraction intensity of the crystal plane (200) to the X-ray diffraction intensity of the crystal plane (111) ranges between 1%?(200)/(111)?30%.

Abstract: A device and a method for metallic electrolytic coating of an object of electrically conductive material, wherein the object has at least two surface portions that are desired to be coated with layers of different thicknesses. The device includes an anode. The device is designed to receive the object in such a way that the object constitutes a cathode and that, upon receipt of the object, a space is formed for receiving a liquid-absorbing material and an electrolyte for coating the object. The body of the anode includes at least two surface portions) that have different electrical conductivity and that are arranged opposite to the surface portions of the received object.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.

Abstract: A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.

Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.

Abstract: The invention relates to the field of materials science and material physics and relates to a coated magnetic alloy material, which can be used, for example, as a magnetic cooling material for cooling purposes. The object of the present invention is to disclose a coated magnetic alloy material, which has improved mechanical and/or chemical properties. The object is attained with a magnetic alloy material with a NaZn13 type crystal structure and a composition according to the formula RaFe100-a-x-y-zTxMyLz and the surface of which is coated with a material composed of at least one element from the group Al, Si, C, Sn, Ti, V, Cd, Cr, Mn, W, Co, Ni, Cu, Zn, Pd, Ag, Pt, Au or combinations thereof The object is furthermore attained by a method in which the magnetic alloy material is coated by means of a method from the liquid phase.

Abstract: A method and apparatus for electrolytically producing oxidation reduction potential water from aqueous salt solutions for use in disinfection, sterilization, decontamination, wound cleansing. The apparatus includes an electrolysis unit having a three-compartment cell (22) comprising a cathode chamber (18), an anode chamber (16), and a saline solution chamber (20) interposed between the anode and cathode chambers. Two communicating (24, 26) membranes separate the three chambers. The center chamber includes a fluid flow inlet (21a) and outlet (21b) and contains insulative material that ensures direct voltage potential does not travel through the chamber. A supply of water flows through the cathode and anode chambers at the respective sides of the saline chamber. Saline solution flows through the center chamber, either by circulating a pre-prepared aqueous solution containing ionic species, or, alternatively, by circulating pure water or an aqueous solution of, e.g.

Abstract: The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 ?m or more to 30 ?m or less.

Abstract: A lead acid electric storage battery uses conventional lead-acid secondary battery chemistry. The battery may be a sealed battery, an unsealed battery or a conventional multi-cellbattery. It has 12 to 25 cells in a single case. The case is less than 12 inches long and may be less than 6 inches long. The battery has a set of positive battery grids (plates) which are constructed with a core of thin titanium expanded metal having a thickness preferably, for start batteries etc. in the range 0.1 mm to 0.7 mm and most preferably 0.2 mm to 0.4 mm. The grid cores are of a titanium alloy containing a platinum group metal. The cores are coated with hot melt dip lead and are not lead electroplated. The grid cores expand and contract, with temperature changes, much less than conventional lead grids.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.

Abstract: The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.

Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Abstract: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.

Abstract: A process for the preparation of electrodes for use in a fuel cell comprising a membrane electrode assembly with a negative and a positive electrode is described, said process comprising the following steps: (i) providing an electrode substrate and (ii) coating said substrate electrolytically from a plating bath with a metal layer, said metal being selected from Ag, Au, Pd and its alloys.

Abstract: A method for preparation of nanocomposite solution, comprises preparing basic silica colloid aqueous solution; providing an electrolysis apparatus by installing a negative electrode containing aluminum and a positive electrode containing silver into the basic silica colloid aqueous solution; and forming nanocomposite by applying voltage to the respective electrodes of the electrolysis apparatus. With this configuration, the present invention provides a method of manufacturing solution dispersed with nanocomposite, further particularly to, a method of manufacturing nanocomposite solution having excellent storability and thermal stability and containing silver having antibacterial function, far infrared radiation function, deodorization function.

Abstract: A bonded assembly includes a member, and a substrate comprising beryllium, the substrate configured to be bonded to the member. The bonded assembly includes a first barrier applied to a surface of the substrate, a second barrier applied to a surface of the first barrier, a bonding material disposed between the second barrier and the member, and wherein the second barrier is configured to prevent dissolution of the first barrier into the bonding material.

Abstract: A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.

Abstract: When depositing a metal or a compound of the metal from a liquid crystal phase comprising a metal compound, e.g. a metal salt, by electrochemical means, high concentrations of the salt may be employed by using an ionic surfactant in place of the commonly used non-ionic surfactant.

Abstract: The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3?-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom.

Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface, the tool is able to conduct the metal ions of the substrate and an electric potential is applied so that an electric potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.

Abstract: A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.

Abstract: Described is a method of reducing corrosion of a silver-containing surface comprising electro-depositing a layer of an iodine-containing material on the silver-containing surface at a charge density of about 80 mA*s (milliamps second)/cm2 or less. Also described is an electrical contact also produced by the method.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver. REEXAMINATION RESULTS The questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.