Abstract: Chlorine ion-containing water supplied from one of water discharge pipelines of an electrolysis vessel of an apparatus for continuously forming electrolyzed water is caused to flow backwardly to one of electrode chambers and a water supply branch pipe thereof, passed through a water supply branch pipe of the other of the electrode chambers and/or a water supply pipeline at the upstream thereof and discharged through the other of the electrode chambers and from the other of the water discharge pipe lines. In this state, water in the electrolysis vessel is electrolyzed while operating the electrode of the electrode chamber in which water is caused to flow backwardly as an anode, and the electrolysis vessel and water channels at the upstream thereof are cleaned and sterilized by electrolyzed cleaning water in which hypochlorous acid is formed.

Abstract: An amperometric glucose biosensor having high sensitivity and accuracy over a wide range of glucose concentrations and a method for the rapid detection of glucose in urine are provided. The biosensor strip comprises an electrically conductive carbon layer, having a first redox mediator, a reagent strip containing an enzyme system for the oxidation of glucose and a second redox mediator, and a silver/silver chloride reference electrode. In a preferred form of the sensor that has high sensitivity, a sensing electrode and a reference electrode are arranged so that the electrically conductive layers of the electrodes are face-to-face and sandwich the reagent strip between them. Screening for glucose is achieved by contacting the sensor with a drop of the patient's urine and comparing the current read-out with a standard calibration curve or by automatically converting the current flow generated by the test sample to units of glucose concentration. The sensor can measure urine glucose concentrations below 3 mg/dl.

Abstract: Wastewater containing a surfactant and an oil content that has been emulsified by the action of the surfactant can be freed of the oil content by a method including feeding the wastewater into the anode compartment, for electrolysis, of a diaphragm electrolyzer having an anode and a cathode provided in the anode compartment and a cathode compartment, respectively, which are spaced apart by a porous diaphragm and which are supplied with a dc voltage between the anode and the cathode, passing part of the electrolyzed wastewater through the diaphragm so that it enters the cathode compartment, discharging the influent from the cathode compartment, discharging the remainder of the electrolyzed wastewater from the anode compartment and introducing the same into the intermediate portion of a gas-liquid separator, withdrawing part of the influent from the top of the gas-liquid separator and introducing the same into a layer packed with an adhering material, where it is brought into contact with the adhering material,

Abstract: The present invention relates to composite articles including a surface layer of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of friction and low insertion force and fretting corrosion in separable electronic connectors, and to methods for preparing the plated articles. The polymeric particles have a size between about 0.1 to 0.45 .mu.m in diameter to reduce the coefficient of friction of the resultant deposit to about 0.45 or below. Also, the deposit has excellent electrical properties and can be successfully soldered. The invention also relates to a solution for plating the surface layer of the composite articles, which surface layer reduces insertion force and fretting corrosion of separable electronic connectors.

Abstract: Process for continuous manufacture of an electrical conductor consisting of an at least partially aluminium-based central core coated by continuous electrodeposition with at least one metal layer, including pretreatment of the surface of the core, characterized in that the following are subsequently performed successively on the core,a) an electrochemical deposition of copper in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing KCN, CuCN, K.sub.2 CO.sub.3 and KNaC.sub.4 H.sub.4 O.sub.6 with a current intensity of between 1 and 10 A/dm.sup.2 ;b) rinsing at ambient temperature;c) an electrochemical deposition of tin in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing essentially tin dissolved in methanesulphonic acid and, optionally, additives, with a current intensity of between 1 and 100 A/dm.sup.2 ;d) rinsing with water at 60.degree. C.

Abstract: It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.

Abstract: An object is to provide practical silver plating technique, high-speed silver plating technique and silver strike plating technique which have, respectively, substantially the same performance as cyanide baths without use of any toxic cyanide. A hydantoin compound of the following general formula is contained as a complex-forming agent ##STR1## [wherein R.sub.1, R.sub.3 and R.sub.5 independently represent hydrogen, an alkyl group having 1-5 carbon atoms, an aryl group or an alcohol].

Abstract: A method of treating a seasoned fixing solution comprising desilvering a fixing solution containing a chelating compound represented by Formula IMOOC(CH.sub.2)m(X)p((CH.sub.2).sub.n COOM).sub.q (I)where X is N, or C--OH;n and m are independently 0, 1, or 2;if X is N then p is 0 or 1 and q is 1 or 2;if X is C-OH then p is 0, 1 or 2 and q is 1 or 2; andM is a cationic counterion; andfurther containing a carryover amount of a bleaching agent which is a complex of ferric ion and a tridentate or a tetradentate ligand.

Abstract: A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.

Abstract: A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.

Abstract: Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.

Abstract: An acidic pretreating solution for silver plating, which comprises as an agent for preventing the silver deposition by displacement, an inorganic acid and/or an organic acid, and a silver plating process which uses this pretreating solution. The pretreating solution provides long lasting preventive effect against silver deposition by displacement and the resulting silver plated layer firmly adheres to a metal substrate surface.

Abstract: A method for electroplating sliver is described which comprises a plating and/or stripping solution of an alkali hydroxide and ethylenediamine having a basic pH in the range of about 7.5 to 13, and having an ethylenediamine concentration of about 5 to 33% by volume, the electroplating (at the cathode) and/or stripping (at the anode) being performed with an applied DC potential across the electrodes of about 2 to 6 volts.

Abstract: A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.