Utilizing Sulfamate-containing Bath Patents (Class 205/273)
  • Publication number: 20150041329
    Abstract: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.
    Type: Application
    Filed: April 10, 2014
    Publication date: February 12, 2015
    Inventor: Mohammad Sakhawat HUSSAIN
  • Patent number: 7794578
    Abstract: A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: September 14, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Akira Matsuda, Yuuji Suzuki, Hideo Otsuka, Yuuki Kikuchi, Sadao Matsumoto
  • Publication number: 20100089613
    Abstract: Disclosed is an electronic component comprising a connecting terminal part having a surface of an electroconductive base material and a germanium-containing nickel plating film provided on the surface. In the electronic component, the plating film provided on the surface of the electroconductive base material in the connecting terminal part possesses excellent heat resistance and solder wettability.
    Type: Application
    Filed: March 10, 2009
    Publication date: April 15, 2010
    Inventors: Mamoru Takayanagi, Kazuhiro Oda, Takayoshi Michino, Takehiko Suzuki
  • Publication number: 20090242418
    Abstract: The present invention provides a coating method, in which a composite coating layer is formed on a surface of an alloy base member by utilizing a rotary electrode device. The coating method includes the steps of: preparing an electrolytic solution containing A ion wherein A is Co or Ni; preparing a MCrAlY powder wherein M denotes at least one element selected from the group consisting of Ni and Co, and the MCrAlY powder contains at least Ni when A is Co or the MCrAlY powder contains at least Co when A is Ni; preparing a dispersion liquid by dispersing the MCrAlY powder into the electrolytic solution; immerging the cylindrical rotary electrode and the alloy base member into the dispersion liquid; and electrolyzing the surface of the alloy base member while the cylindrical rotary electrode covered with the nonwoven fabric layer is rolled on the on the surface of the alloy base member thereby to form the composite coating layer onto the surface of the alloy base member.
    Type: Application
    Filed: March 24, 2009
    Publication date: October 1, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Masahiro Saito, Yomei Yoshioka, Kazuhiro Kitayama, Hiroaki Okamoto, Yoshiaki Sakai
  • Patent number: 6277510
    Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.
    Type: Grant
    Filed: January 10, 2000
    Date of Patent: August 21, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Huang Chang, Wei-Wen Yeh, Shu-Chin Chou, Chen-Ron Lin
  • Patent number: 6190789
    Abstract: A slide member having a highly lubricative and highly abrasion-resistant plating layer formed on the sliding surface thereof. The plating layer contains fine particles of graphite selected from flake graphite, vein graphite and/or amorphous graphite in its metallic matrix. The plating layer has a hardness of not less than 550 in terms of Hv and is produced by using a plating solution containing naphthalene sulfanate of formalin condensate as surface active agent. The matrix is preferable to be a Ni—P type metallic matrix and the dispersed fine particles of graphite are preferable having a size of 0.1 to 20 &mgr;m and are contained by 0.1 to 10 wt % relative to the matrix.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: February 20, 2001
    Assignee: Nihon Parkerizing Co., Ltd.
    Inventors: Masaaki Beppu, Eiji Hirai, Seiki Mori
  • Patent number: 6090263
    Abstract: A process for depositing a conformable nickel coating on a lead frame is disclosed. The metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 .mu.m to about 300 .mu.m. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 .mu.m. The conformable nickel coating is formed using an electroplating bath containing nickel as a nickel complex, a nickel salt, a buffer and a fluorochemical wetting agent.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: July 18, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Joseph Anthony Abys, Chonglun Fan, Igor Veljko Kadija
  • Patent number: 5911865
    Abstract: A method of electroplating particulates in a metallic ion containing electrolyte within an electroplating device having an anode and cathode plate by repeating the steps of stirring the particulates, allowing sedimentation of the particulates to occur by gravity until a sedimentation layer of loosely contacted particles is formed on the cathode plate of a suitable thickness and applying an electromotive potential across said anode and cathode plate to create an electric current in said electrolyte for electroplating metallic ions on the surface of the particulates in said sedimentation layer wherein the steps of stirring, sedimentation and electroplating are performed in sequence over repeated cycles which are maintained essentially independent of one another with the step of electroplating being interrupted during the steps of stirring and sedimentation and with the step of stirring immediately following the step of electroplating.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: June 15, 1999
    Inventor: Pay Yih
  • Patent number: 5897763
    Abstract: A method of electrodepositing nickel and nickel alloys on a metal surface of a substrate wherein a Watts or other nickel deposition electrolyte is used as the bath in the presence of a conventional base brightener. According to the invention, an ethylene-oxide adduct or propylene-oxide adduct or ethyleneoxide/propylene-oxide adduct is added in an amount less than 5 mg/l and the deposition is carried out at 40 to 75.degree. C. and the concentration of the adduct and the temperature are so selected that during operation and with visual inspection there is no cloudiness nor any diffuse scattering of light incident upon the bath.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: April 27, 1999
    Assignee: LPW-Chemie GmbH
    Inventors: Carmen Elligsen, Gerd Schongen, Detlef Kowczyk
  • Patent number: 5788824
    Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: August 4, 1998
    Assignees: Usinor Sacilor (Societe Anonyme), Thyssen Stahl Aktiengesellschaft
    Inventors: Jean-Claude Catonne, Christian Allely, Remy Nicolle, Gerard Raisson
  • Patent number: 5779873
    Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: July 14, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Henry Hon Law, Lynn Frances Schneemeyer, Te-Sung Wu
  • Patent number: 5759243
    Abstract: Methods for electrodepositing a metal-carbon coating on a substrate comprng immersing the substrate in an aqueous electrolyte, and passing a sufficient current through the electrolyte to effect electrolyte deposition of a metal-carbon alloy on the substrate. The aqueous electrolyte comprises from about 0.2 to about 0.6 mol/l of metal ions selected from the group consisting of iron, nickel, nickel-tungsten mixture and cobalt-tungsten mixture, greater than about 1.4 mol/l of an amidosulfonic acid or a salt thereof, ammonium ions, formic acid or a salt thereof, and water.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: June 2, 1998
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: Christian E. Johnson, David Lashmore, Elaine Soltani
  • Patent number: 5672262
    Abstract: Methods for electrodepositing a metal-carbon coating on a substrate comprng immersing the substrate in an aqueous electrolyte, and passing a sufficient current through the electrolyte to effect electrolyte deposition of a metal-carbon alloy on the substrate. The aqueous electrolyte comprises from about 0.2 to about 0.6 mol/l of metal ions selected from the group consisting of iron, nickel, nickel-tungsten mixture and cobalt-tungsten mixture, greater than about 1.4 mol/l of an amidosulfonic acid or a salt thereof, ammonium ions, formic acid or a salt thereof, and water.
    Type: Grant
    Filed: March 27, 1995
    Date of Patent: September 30, 1997
    Assignee: The United States of America, as represented by the Secretary of Commerce
    Inventors: Christian E. Johnson, David Lashmore, Elaine Soltani
  • Patent number: 5647967
    Abstract: A plating liquid for forming a nickel plating layer containing a dispersed substance and phosphorus having 1.0 g/l or more of sodium is desirably utilized in the high speed plating process. Other important aspects of the invention include a plating method using the aforementioned plating liquid, characterized in that a voltage is impressed while permitting the plating liquid to flow between a surface to be plated of a workpiece at a plating liquid flow rate of 1.0-3.0 m/sec and an electric current density of 20-200 A/dm.sup.2, and an engine cylinder having a plated interior surface characterized in that the plating layer of the cylinder is formed by a high speed plating treatment using the aforementioned plating liquid.
    Type: Grant
    Filed: September 1, 1994
    Date of Patent: July 15, 1997
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Yasuyuki Murase, Masaaki Isobe
  • Patent number: 5643434
    Abstract: Process for the electrolytic deposition of composite nickel onto the face of a part of a motor vehicle, in particular the bore of a casing or engine block of an internal combustion engine comprising at least three successive stages, the first being an electrochemical activation stage where the part is brought to anodic polarity in a bath containing a halogenated acid salt of nickel, the second being a stage of superactivation of the surface and the third being a stage of electrolytic deposition of a nickel layer containing particles of solid substances where the part is brought to cathodic polarity in a nickel-plating bath containing a charge of solid particles of which the diameter is advantageously between 0.5 and 5 microns and which can be of silicon carbide or any other hardening element, optionally mixed with particles of graphite.
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: July 1, 1997
    Assignee: Aluminum Pechiney
    Inventors: Mohamed Benmalek, Marc Santarini
  • Patent number: 5632878
    Abstract: An electroformed tool that has a uniform air-releasing hole system with high strength and a simple and convenient method to manufacture it has been created. The method includes conducting electroforming by mixing a non-leveling agent with an electrolytic solution and forming an electroformed layer which has a continuous air-releasing hole structure.
    Type: Grant
    Filed: October 17, 1995
    Date of Patent: May 27, 1997
    Assignee: FET Engineering, Inc.
    Inventor: Minoru Kitano
  • Patent number: 5078837
    Abstract: Engine components of steel or superalloy subject to wear from alternating friction at medium temperatures in the region of 700.degree. C. are provided with a protective wear-resistant coating bya) electrophoretic deposition of a metal-ceramic structure comprising a mixture of from 85% to 50% of metallic powder and from 15% to 59% of ceramic powder, the metallic powder being a cobalt-based superalloy of type KC 25 NW or of M Cr Al Y wherein M represents at least one metal chosen from the group consisting of Ni, Co and Fe with the possible addition of Ta, and the ceramic powder being an oxide such as Al.sub.2 O.sub.3 or Cr.sub.2 O.sub.3, a carbide such as SiC or Cr.sub.3 C.sub.2, a nitride such as BN or TiN, or a boride such as TiB.sub.2 ;b) electrolytic pre-nickeling said deposit in an electrolysis bath at a pH between 6 and 8, andc) electrolytic nickeling said pre-nickeled deposit in an acid bath of sulphamate type.
    Type: Grant
    Filed: March 22, 1991
    Date of Patent: January 7, 1992
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "S.N.E.C.M.A."
    Inventors: Martine Descamp, Yves C. Louis, Michel M. Ruimi
  • Patent number: RE33800
    Abstract: This invention relates to an improved method for electroplating a layer of nickel into titanium base alloy substrates. It is particularly useful in electroplating a layer of nickel onto titanium alloys which contain refractory metal elements, such as the alloy Ti-8Al-1V-1Mo. The method includes the steps of etching the surface of the substrate with a solution containing hydrofluoric acid and hydrochloric acid, followed by electroplating the etched surface in a nickel sulfamate solution.
    Type: Grant
    Filed: December 27, 1990
    Date of Patent: January 21, 1992
    Assignee: United Technologies Corporation
    Inventors: Donald E. Fornwalt, Gary M. Lomasney, Kostas Routsis