Abstract: This invention provides flame retardant compositions comprised of or formed from components comprising a sulfur-containing compound and at least one isocyanate-reactive brominated flame retardant.

Abstract: A welding structure of metal members includes a first member having a first opposing surface, a second member having a second opposing surface, and a welding portion fixing the first member and the second member to each other. A gap is formed between the first opposing surface and the second opposing surface. R1>R2 is satisfied where R1 represents a width of the welding portion in the gap and R2 represents a width of the welding portion on the first opposing surface of the first member. T2>T1 is satisfied where T2 represents a thickness of the second member in the portion where the welding portion is formed and T1 represents a thickness of the first member in the portion where the welding portion is formed. 0.8?D1/T1?1.2 is satisfied where D1 represents a depth of the welding portion in the second member from the second opposing surface.

Abstract: In a deposition method of Ni—P—B system plating film, electroplating is performed in a plating bath containing Ni ions, phosphorous acid ions, alkylamine borane, acetic acid, at least one sort of a primary brightening agent, and a secondary brightening agent including at least one sort of a surface active agent. In the above-mentioned plating bath, concentration of alkylamine borane in said plating bath is 1.37 mmol/L or more, and concentration of acetic acid in said plating bath is 0.70 mol/L or more and less than 2.80 mol/L. Thereby, plating film having high hardness of Hv 700 or more can be deposited with high manufacturing efficiency without baking processing, while reducing occurrence of poor appearance, such as burning and abnormal precipitation, even when current density is increased to 80 A/dm2 or more to raise deposition rate.

Abstract: A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

Abstract: Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.

Abstract: A nickel-plated steel sheet for manufacturing a pipe having corrosion resistance against fuel vapor; and a pipe and a fuel supply pipe. In the pipe and fuel supply pipe, a nickel plating layer having a plating thickness of 0.5 to 10 ?m is formed on an inner surface of a pipe formed of a steel sheet thus having corrosion resistance against fuel vapor. In the fuel supply pipe formed of a steel sheet for supplying fuel to a fuel tank, the fuel supply pipe includes: a large-diameter pipe portion through which the fuel passes; and a small-diameter pipe portion which makes an upper portion of the large-diameter pipe portion and a lower portion of the large-diameter pipe portion communicate with each other for ventilation, and a nickel plating layer having a plating thickness of 0.5 to 10 ?m is formed on an inner surface of at least the small-diameter pipe portion.

Abstract: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.

Abstract: A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.

Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. As exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. An exemplary article may comprise a biaxially textured base material, and at least one biaxially textured layer selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer is formed by electrodeposition on the biaxially textured base material.

Abstract: Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.

Abstract: An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.

Abstract: The surface of cutters for dentistry is rendered passive to electroplating by immersion in a concentrated aqueous solution of nitric acid for a certain period of time. This is followed by painting a length including the surface marked out by the slots, the surface inside the slots and the surface at the tip, using an electrically insulating paint resistant to acids. Each cutter is then ground using a grinding wheel with rotating disk having an abrasive edge shaped like the continuous profile of the painted surface. Grinding removes the paint together with a micrometric layer of metal from the surface except for that inside the slots. The shank is ground and painted for a length adjacent to the slots.

Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Abstract: In one embodiment, an electrochemical system includes an interconnector busbar including a substrate and a coating contacting the substrate, the coating including a layer of electroplated elemental nickel.

Abstract: An electrolytic bath for electrodeposition includes nickel salt, phosphoric acid, phosphonic acid, and boric acid in solution. A method for producing an electrolytic bath includes the steps of mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid, and adding nickel carbonate in order to increase the pH value.

Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: A method for the pre-treatment of titanium components for the subsequent coating thereof is provided. The method includes at least the following steps: a) etching of the component in an acidic solution containing fluoride and nitric acid (HNO3); b) activation pickling of the etched component in a solution containing at least sodium nitrate (NaNO3) and tetrafluoroboric acid (HBF4); and c) activation of the activation-pickled component in a bath containing acid or in an acidic bath containing nickel.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.

Abstract: The invention relates to the field of materials science and material physics and relates to a coated magnetic alloy material, which can be used, for example, as a magnetic cooling material for cooling purposes. The object of the present invention is to disclose a coated magnetic alloy material, which has improved mechanical and/or chemical properties. The object is attained with a magnetic alloy material with a NaZn13 type crystal structure and a composition according to the formula RaFe100-a-x-y-zTxMyLz and the surface of which is coated with a material composed of at least one element from the group Al, Si, C, Sn, Ti, V, Cd, Cr, Mn, W, Co, Ni, Cu, Zn, Pd, Ag, Pt, Au or combinations thereof The object is furthermore attained by a method in which the magnetic alloy material is coated by means of a method from the liquid phase.

Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.

Abstract: Boric acid is replenished in an electroplating bath via a replenishment solution comprising boric acid dissolved in pure water, in which the solubility at room temperature is comparable to that in the plating bath at operating temperature. The replenishment solution may be used to replace all or part of the water lost by evaporation. An automated device may be used to replenish boric acid in the electroplating bath.

Abstract: A lead acid electric storage battery uses conventional lead-acid secondary battery chemistry. The battery may be a sealed battery, an unsealed battery or a conventional multi-cellbattery. It has 12 to 25 cells in a single case. The case is less than 12 inches long and may be less than 6 inches long. The battery has a set of positive battery grids (plates) which are constructed with a core of thin titanium expanded metal having a thickness preferably, for start batteries etc. in the range 0.1 mm to 0.7 mm and most preferably 0.2 mm to 0.4 mm. The grid cores are of a titanium alloy containing a platinum group metal. The cores are coated with hot melt dip lead and are not lead electroplated. The grid cores expand and contract, with temperature changes, much less than conventional lead grids.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.

Abstract: Disclosed is a battery casing, comprising one or more sub-layers as constitutional elements, wherein at least one region selected from the group consisting of a surface of the casing and the sub-layers of the casing is coated partially or totally with a metal having a grain size of 50 nm or less. A battery comprising the same casing is also disclosed. The casing efficiently inhibits degradation of the safety of a battery, caused by internal or external factors, and thus provides a battery with excellent safety.

Abstract: The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.

Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.

Abstract: A method, including placing a substrate of a battery in a bath consisting of a metal M chosen from a metal group consisting of Fe, Ni, Co, Cu, W, V, and Mn, an oxidant selected from an oxidant group consisting of oxygen and sulfur, and a polymer. The method also includes applying an electrical current so as to form on the substrate a metal M compound cathode having a nanoscale grain structure.

Abstract: The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.

Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).

Abstract: A bonded assembly includes a member, and a substrate comprising beryllium, the substrate configured to be bonded to the member. The bonded assembly includes a first barrier applied to a surface of the substrate, a second barrier applied to a surface of the first barrier, a bonding material disposed between the second barrier and the member, and wherein the second barrier is configured to prevent dissolution of the first barrier into the bonding material.

Abstract: A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.

Abstract: A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.

Abstract: Disclosed is an electronic component comprising a connecting terminal part having a surface of an electroconductive base material and a germanium-containing nickel plating film provided on the surface. In the electronic component, the plating film provided on the surface of the electroconductive base material in the connecting terminal part possesses excellent heat resistance and solder wettability.

Abstract: When depositing a metal or a compound of the metal from a liquid crystal phase comprising a metal compound, e.g. a metal salt, by electrochemical means, high concentrations of the salt may be employed by using an ionic surfactant in place of the commonly used non-ionic surfactant.

Abstract: The invention relates to a lubricating metal coating and to a process for its preparation. The material constituting the coating in a composite material comprising a metal matrix within which talc particles are distributed as lamellae, the metal matrix being composed of a metal chosen from Fe, Co, Ni, Mn, Cr, Cu, W, Mo, Zn, Au, Ag, Pb or Sn or of an alloy of these metals or of a metal/semimetal alloy. The coating is obtained by a process consisting in carrying out an electrolytic deposition using a solution of precursors of the metal matrix of the coating which additionally comprises talc particles in suspension, which particles are modified at the surface by irreversible adsorption of a cellulose-derived compound by replacement of all or part of the hydroxyl groups.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The present invention provides a coating method, in which a composite coating layer is formed on a surface of an alloy base member by utilizing a rotary electrode device. The coating method includes the steps of: preparing an electrolytic solution containing A ion wherein A is Co or Ni; preparing a MCrAlY powder wherein M denotes at least one element selected from the group consisting of Ni and Co, and the MCrAlY powder contains at least Ni when A is Co or the MCrAlY powder contains at least Co when A is Ni; preparing a dispersion liquid by dispersing the MCrAlY powder into the electrolytic solution; immerging the cylindrical rotary electrode and the alloy base member into the dispersion liquid; and electrolyzing the surface of the alloy base member while the cylindrical rotary electrode covered with the nonwoven fabric layer is rolled on the on the surface of the alloy base member thereby to form the composite coating layer onto the surface of the alloy base member.

Abstract: A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.

Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.

Abstract: There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside carbon nanotubes for storage and the production of energy. There is also disclosed a method of generating various reactions by confining the volatile materials inside the crystalline void structure and releasing the confined volatile material. In this embodiment, the released volatile material may be combined with a different material to initiate or sustain a chemical, thermal, nuclear, electrical, mechanical, or biological reaction.

Abstract: Disclosed are methods for treating metal substrates, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The methods include depositing an electropositive metal onto at least a portion of the substrate, and then contacting the substrate with a pretreatment composition that is substantially free of crystalline phosphates and chromates. The present invention also relates to coated substrates produced thereby.