Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.

Abstract: An aqueous acid electroplating solution comprising nickel ions and one or more acetylenic compounds, specifically mono- and polyglyceryl ethers of acetylenic alcohols; acetylenic compounds useful in the electroplating solution; and processes using such solution and compounds. The invention is particularly useful for nickel plating an irregular surface such as a printed circuit board having through-holes.