Abstract: A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X1—CO—O—R11, X1—SO2—O—R11, X1—PO(OR11)2, X1—SO—O—R11 functional groups, wherein X1 is a divalent group selected from (i) a chemical bond (ii) aryl, (iii) C1 to C12 alkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group —X11—X12—, (v) an alkylaryl group —X12—X11—, and (vi) —(O—C2H3R12)mO—, R11 is selected from H and C1 to C4 alkyl. R12 is selected from H and C1 to C4 alkyl, X12 is a divalent aryl group, X11 is a divalent C1 to C15 alkandiyl group.

Abstract: Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: A method for cleaning anode media, the method comprising removing the anode media from an electroplating system, and removing scale coatings from substrates of the anode media by vibrational polishing the anode media with abrasive particles.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfateions; b) a soluble salt of chloroacefic acid, acetic acid, glycolic acid, proprionic acid, benzoic acid, salicylic acid or chlorobenzoic acid; and c) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. The plating bath described herein is at least substantially free of coumarin and produces desirable leveling characteristics. The bath also requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Abstract: A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film.

Abstract: A nickel plating bath for plating a semi-bright nickel deposit on a substrate comprising a) nickel sulfate ions; b) a soluble salt of chloroacetic acid, acetic acid, glycol acid or proprionic acid; and d) at least one diol selected from the group consisting of hexyne diol, butyne diol and combinations of the foregoing. The semi-bright nickel plating bath described herein produces sulfur-free semi-bright deposits over a very wide current density range. It does not contain coumarin but produces desirable leveling characteristics. The bath requires no aldehydes to achieve simultaneous thickness and electrolytic potential (STEP) and has extremely low stress and excellent ductility.

Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.

Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.

Abstract: Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an aromatic azo compound residue. Electrolysis is then carried out. According to the present invention, the content of the fine particles present in a composite plating film composed of the fine particles and a metal can be increased.

Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Abstract: This invention relates to a low density high surface area copper powder having an apparent density in the range of about 0.20 to about 0.60 gram per cubic centimeter, and a surface area of at least about 0.5 square meter per gram. This invention also relates to an electrodeposition process for making the foregoing copper powder by electrodepositing the copper powder from an electrolyte solution using a critical combination of process parameters. These critical parameters include: a copper ion concentration for the electrolyte solution in the range of about 2 to about 7 grams per liter; a free chloride ion concentration for the electrolyte solution in the range of about 8 to about 20 ppm; an impurity level for the electrolyte solution of no more than about 1.0 gram per liter; and an electrolyte solution that is free of organic additives.

Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.

Abstract: Nickel-plated shaped parts are produced by galvanic precipitation of nickel from aqueous-acid baths which contain as essential constituents one or several nickel salts, one or several inorganic acids and one or several brighteners. As brighteners are used thiourea salts having general formula (I), in which R.sup.1 to R.sup.4 stand for hydrogen, C.sub.1 to C.sub.18 -alkyl, which may be substituted by carboxyl groups, C.sub.1 to C.sub.4 -alkoxycarbonyl groups or cyano groups, C.sub.2 to C.sub.12 -alkenyl, C.sub.2 to C.sub.12 -alkinyl, C.sub.5 to C.sub.8 -cycloalkyl, C.sub.7 to C.sub.12 -phenylalkyl or phenyl, which may be substituted by one or two C.sub.1 to C.sub.4 -alkyl residues, C.sub.1 to C.sub.4 -alkoxy residues, halogen atoms, hydroxyl groups, phenyl groups, phenyl residues or C.sub.1 to C.sub.4 alkoxycarbonyl groups; Y sands for a chemical bond or for linear or branched alkylene, alkenylene or alkinylene having each up to 20 C.

Abstract: Nickelized shaped articles are produced by electrodeposition of nickel from aqueous acidic baths containing as essential constituents one or more nickel salts, one or more inorganic acids and one or more brighteners by a procedure in which the brighteners used are phosphonium salts I ##STR1## where R.sup.1 to R.sup.3 are each C.sub.1 -C.sub.18 -alkyl, which may be carboxyl-, C.sub.1 -C.sub.4 -alkoxycarbonyl- or cyano-substituted, C.sub.2 -C.sub.12 -alkenyl, C.sub.2 -C.sub.12 -alkynyl, C.sub.5 -C.sub.8 -cycloalkyl, C.sub.7 -C.sub.12 -phenylalkyl, phenyl, which may be substituted by one or two substituents selected from the group consisting of C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy, halogen, hydroxyl, phenyl and C.sub.1 -C.sub.4 -alkoxycarbonyl, or mono- or di(C.sub.1 -C.sub.4 -alkyl)amino,R.sup.4 and R.sup.5 are each hydrogen or C.sub.1 -C.sub.4 -alkyl,A is hydrogen or a group of the formula --CO--H, --CO--R.sup.6, --CO--OH, --CO--OR.sup.6, --CO--CH.sub.2 --CO--OR.sup.6, --O--CO--H, --O--CO--R.sup.

Abstract: A closely adherent metal coating having a uniform thickness and substantially free from pinholes is formed on the porous surface of a bonded magnet to improve its oxidation and corrosion resistance without lowering its magnetic properties. The coating is formed by electroplating from an aqueous solution not containing chlorine, and having a pH of 5 or above. More particularly, the solution contains mainly nickel sulfate, an electrolyte in the form of an organic acid salt not containing chlorine, and a basic electrolyte not containing chlorine, and forms a nickel coating on the magnet surface.

Abstract: Engine components of steel or superalloy subject to wear from alternating friction at medium temperatures in the region of 700.degree. C. are provided with a protective wear-resistant coating bya) electrophoretic deposition of a metal-ceramic structure comprising a mixture of from 85% to 50% of metallic powder and from 15% to 59% of ceramic powder, the metallic powder being a cobalt-based superalloy of type KC 25 NW or of M Cr Al Y wherein M represents at least one metal chosen from the group consisting of Ni, Co and Fe with the possible addition of Ta, and the ceramic powder being an oxide such as Al.sub.2 O.sub.3 or Cr.sub.2 O.sub.3, a carbide such as SiC or Cr.sub.3 C.sub.2, a nitride such as BN or TiN, or a boride such as TiB.sub.2 ;b) electrolytic pre-nickeling said deposit in an electrolysis bath at a pH between 6 and 8, andc) electrolytic nickeling said pre-nickeled deposit in an acid bath of sulphamate type.