Abstract: A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.

Abstract: A chemical conversion solution contains greater than 18 to 200 g/L or less of aluminum phosphate monobasic and has a pH of 1.5 to 2.4. A method for producing a tinned steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet such that the mass per unit area of Sn is 0.05 to 20 g/m2, immersing the steel sheet in the chemical conversion solution or cathodically electrolyzing the steel sheet at a current density of 10 A/dm2 or less in the chemical conversion solution; and drying the steel sheet to form a chemical conversion coating.

Abstract: There is provided a method by which various compounds (1) having a carboxyl group in the molecule have the carboxyl group converted to a (dioxolenon-4-yl)methyl ester at low cost, in a simple way and at high yield. The process for producing compounds of formula (3) according to the reaction scheme shown below comprises reacting carboxylic acids of formula (1) with 4-chloromethyldioxolenone compounds of formula (2) in a solvent in the presence of both a phase transfer catalyst and a metal iodide: [where Q represents an organic group, M represents a hydrogen atom, an alkali metal, an alkaline earth metal or a transition metal, R1 and R2 represent a hydrogen atom, an optionally substituted (C1-6 alkyl group or phenyl group)].

Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.

Abstract: The present invention relates to a method for treating spent tin or tin/lead stripping solution used in the electronic industry, particularly in the manufacture of printed circuit boards or a lead frames. Said method comprises (i) electrolytically reducing copper ions in the solution to copper at a low temperature; (ii) electrolytically oxidizing Sn2+ and Pb2+ in the solution at a high temperature to form solid tin and lead oxides and hydroxides; (iii) separating solid tin and lead oxides and hydroxides from the solution; (iv) dissolving tin and lead oxides and hydroxides obtained in step (iii) in a strong alkali or acidic solution; and (v) electrolytically reducing the alkali or acidic solution obtained in step (iv) at a high temperature to recover metallic tin and lead. Also, the filtrate obtained in step (iii) above is useful for preparing fresh tin or tin/lead stripping solution.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.

Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.

Abstract: A process for plating aluminum alloy substrates (10), such as 390 aluminum alloy pistons (12), with iron comprises (a) plating on the aluminum substrate a layer of zincate from a zincate bath; (b) plating on the zincate layer a layer (14) of nickel from an electroless nickel bath; (c) plating on the nickel layer a layer (16) of iron from an iron ammonium sulfate bath; and (d) plating on the iron layer a layer (18) of tin from an alkaline tin bath. During the electroless plating, the zincate layer, which protects the underlying aluminum against oxidation, is sacrificed. All of these baths are environmentally much safer than cyanide and chloride. They are also cost effective and can be utilized in a totally closed loop plating system.

Abstract: Stannous electrolytic tinplating baths utilized in flat-rolled steel tinplating operations contain non-filterable lead in solution at undesirable levels because of the lead content of commercially available tin anode materials. As taught herein, lead in the electrolyte is controllably incapacitated for deposition with the tin by chemical treatment of the bath which establishes, in solid phase, an insoluble bivalent metal compound having an affinity for lead which is adsorbed. In a preferred halogen-system embodiment, calcium fluoride presents an extended surface area for adhesion of lead and not only incapacitates lead in the bath for deposition purposes but also enables separation of such adsorbed lead from the plating bath as part of sludge removal.

Abstract: Surfactants made by the successive ethoxylation and propoxylation of diamines are effective in providing a fine-grain tin coating in high-speed strip-steel plating operations under conditions of high current density. Surfactants prepared by successive propoxylation and ethoxylation are also effective.

Abstract: A method for the electrolytic pin plating of a steel plate using an insoluble anode, said anode being an insoluble electrode comprising a corrosion-resistant metal substrate having provided thereon a coating containing a platinum group metal or an oxide thereof, said anode being enclosed with a diaphragm.

Abstract: A brightener is added in the ratio of 0.5-5 g per 1 l of electric plating bath of pH 4-8 containing citric acid or citrate for tin or tin alloy plating. The brightener contains a water soluble reaction product obtained by reacting polyamine such as pentaethylenehexamine, aliphatic aldehyde such as formaldehyde, and aromatic carboxylic acid such as methyl benzoate.