Abstract: An electrolysis cell, includes a cathode space with a cathode, an anode space with an anode, and a salt bridge space, which is arranged between the cathode and the anode, wherein the cathode space and the salt bridge space are delimited from one another by the cathode and the salt bridge space and the anode space are delimited from one another by the anode, and the cathode and the anode are formed as a gas diffusion electrode. An electrolysis plant has a corresponding electrolysis cell and a method for carries out electrochemical reactions with the electrolysis cell or electrolysis plant.

Abstract: An etching method includes forming a protective layer containing a tin atom on a surface of a substrate. The substrate has a region to be etched and a mask provided on the region. The etching method further includes etching the region in the substrate using the mask.

Abstract: A non alpha controlled Tin including Tin and a trace amount of Polonium may be converted to a low alpha emission Tin by concentrating and removing at least some of the Polonium. The non alpha controlled Tin may be a raw material or a solder bump upon a semiconductor wafer, chip, or carrier. The Polonium may be concentrated by oxidizing an exterior portion of the non alpha controlled Tin. If the non alpha controlled Tin is a raw material, the oxidized exterior portion of the non alpha controlled Tin may be stripped. If the non alpha controlled Tin is a solder bump, the oxidized exterior portion of the solder bump may be removed by applying flux to the solder bump, reflowing the solder bump to dissolve the oxidized exterior portion and the concentrated Po into the flux, and cleaning the flux from the solder bump.

Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.

Abstract: An electrorefining process is disclosed for producing high purity tin having reduced short-term and long-term alpha particle emissions and reduced lead levels. The process may use a mixed acidic electrolytic solution including at least a first electrolyte that provides sulfate ions in the mixed electrolytic solution, such as sulfuric acid, and a second electrolyte that provides halide ions in the mixed electrolytic solution, such as hydrochloric acid.

Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.

Abstract: Provided is an anode for electroplating which uses an aqueous solution as an electrolytic solution, and the anode which is low in potential when compared with a conventional anode, able to decrease an electrolytic voltage and an electric energy consumption rate and may also be used as an anode for electroplating various types of metals, and which is low in cost. Also provided is a method for electroplating which uses an aqueous solution as an electrolytic solution, in which the anode is low in potential and electrolytic voltage, thereby making it possible to decrease the electric energy consumption rate. The anode for electroplating of the present invention is an anode for electroplating which uses an aqueous solution as an electrolytic solution, in which a catalytic layer containing amorphous ruthenium oxide and amorphous tantalum oxide is formed on a conductive substrate.

Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.

Abstract: An electrode wire for electro-discharge machining includes a core wire including a first metal including copper and having one of phases ?, ?+??, and ??, a first alloy layer formed at a boundary region between the core wire and a second metal plated on an outer surface of the core wire due to mutual diffusion between the core wire and the second metal and having a phase ??, and a second alloy layer formed due to diffusion of the first metal to the second metal and having a phase ? and/a phase ?. A core wire material is erupted onto a surface of the electrode wire for electro-discharge machining, which includes the core wire, the first alloy layer, and the second alloy layer, along cracks appearing on the second alloy layer, so that a plurality of grains are formed on the surface of the electrode wire.

Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.

Abstract: The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol.

Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.

Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.

Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.

Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.

Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.

Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: A method of making colloidal sphere templates and the sphere-templated porous materials made from the templates. The templated porous materials or thin films comprise micron and submicron-scaled spheres in ordered, disordered, or partially ordered arrays. The invention is useful in the synthesis of submicron porous, metallic tin-based and other high capacity anode materials with controlled pore structures for application in rechargeable lithium-ion batteries. The expected benefits of the resulting nanostructured metal films include a large increase in lithium storage capacity, rate capability, and improved stability with electrochemical cycling.

Abstract: Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H2 evolution in H2SO4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H2SO4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.

Abstract: A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method.

Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.

Abstract: An anode casing having a bright tin or bright tin alloy surface layer at least on an inside surface of the casing, preferably on the entire surface of the anode casing, and to an electrochemical cell containing the anode casing. Methods for preparing anode casings and electrochemical cells containing the anode casings are disclosed. In a preferred embodiment, the anode casings are plated at high current density utilizing a variable contact rack plating process, wherein portions of a clamp assembly of the device variably or alternately contact different portions of the anode casing so the entire surface of the anode casing is plated. The bright tin-plated surface is a high hydrogen-overvoltage metal that reduces gassing in cells using the casings.

Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Abstract: To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.

Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: Proposed is a method for collecting valuable metal from an ITO scrap including a step of collecting tin by subjecting the ITO scrap to electrolysis. Further proposed is a method for collecting valuable metal from an ITO scrap including the steps of providing an ITO electrolytic bath and a tin collecting bath, dissolving the ITO scrap in the electrolytic bath, and thereafter collecting tin in the tin collecting bath. Additionally proposed is a method for collecting valuable metal from an ITO scrap including the steps of dissolving the ITO scrap by subjecting it to electrolysis as an anode in electrolyte, precipitating only tin contained in the solution as tin itself or a substance containing tin, extracting the precipitate, placing it in a collecting bath, re-dissolving this to obtain a solution of tin hydroxide, and performing electrolysis or neutralization thereto in order to collect tin.

Abstract: In a plated member (3) that has a pure Sn plating layer (2) of a lead-free material on a surface of a base material 1, the orientation indices of a (101) plane and a (112) plane of the pure Sn plating layer are increased to values higher than the orientation indices of the other crystal orientation planes.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: Proposed is a method for collecting valuable metal from an ITO scrap including a step of collecting tin by subjecting the ITO scrap to electrolysis. Further proposed is a method for collecting valuable metal from an ITO scrap including the steps of providing an ITO electrolytic bath and a tin collecting bath, dissolving the ITO scrap in the electrolytic bath, and thereafter collecting tin in the tin collecting bath. Additionally proposed is a method for collecting valuable metal from an ITO scrap including the steps of dissolving the ITO scrap by subjecting it to electrolysis as an anode in electrolyte, precipitating only tin contained in the solution as tin itself or a substance containing tin, extracting the precipitate, placing it in a collecting bath, re-dissolving this to obtain a solution of tin hydroxide, and performing electrolysis or neutralization thereto in order to collect tin.

Abstract: Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper: 2 mass %), tin-bismuth alloy (content of bismuth: 2 mass %) and the like can be cited. The substrate is composed of, for example, Cu alloy or the like. Within the tin plating film, plural crystal grains are arranged irregularly. Further, plural gap portions exist within the tin plating film. An external stress is reduced even if a bending process or the like are performed subsequently, because the gap portions exist within the tin plating film. Consequently, growths of whiskers accompanied by the external stress are suppressed.

Abstract: A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.

Abstract: When depositing a metal or a compound of the metal from a liquid crystal phase comprising a metal compound, e.g. a metal salt, by electrochemical means, high concentrations of the salt may be employed by using an ionic surfactant in place of the commonly used non-ionic surfactant.

Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.

Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.

Abstract: A tin-plated steel sheet includes a plating layer containing tin on at least one surface of a steel sheet, and a chemical conversion coating containing P and tin on the plating layer is provided. In the steel sheet, a coated amount of the chemical conversion coating per surface is 1.0 to 50 mg/m2 in terms of P, an atomic ratio Sn/P obtained from the intensity of a P2p peak and that of a Sn3d peak is 1.0 to 1.5, the intensities being measured at the surface using an x-ray photoelectron spectroscopic method, and an atomic ratio O/P obtained from the intensity of the P2p peak and that of an O1s peak is 4.0 to 9.0. The phosphoric acid-based chemical conversion coating of the tin-plated steel sheet can suppress degradation in performance, which is caused by the growth of a tin oxide layer on the surface, instead of a conventional chromate coating.

Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.

Abstract: It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, for example tin, aimed at restoring both the concentration of said metals, and the pH in galvanic baths used in electroplating processes with insoluble anodes. The cell of the invention comprises an anodic compartment, wherein the metal to be dissolved acts as a consumable anode, and a cathodic compartment, containing a cathode for hydrogen evolution, separated by a cation-exchange membrane. The coupling of the cell of the invention with the electroplating cell allows a strong simplification of the overall process and a sensible reduction in the relevant costs.

Abstract: A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically active coating. The electrode may find use in an electroplating system containing organic substituents in which the consumption of the organic substituent is significantly decreased or in systems where it is desirable to suppress the oxidation of a species in an electrochemical cell.

Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.

Abstract: Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.

Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.