Abstract: The present disclosure provides abrasive articles that include an abrasive layer having a contact surface, a first layer coupled to the abrasive layer, and a second layer coupled to the first layer. The first layer is configured to provide contact pressure to the abrasive layer, such as through a higher hardness than the second layer. The second layer is configured to provide conformability to the abrasive layer, such as through a higher compressibility than the first layer. The resulting abrasive articles may exert a consistent contact pressure against a substrate with increased conformability around the substrate, reduced hysteresis, improved removal rate consistency, and/or improved lifetime over abrasive articles that do not use the multiple layer construction described above.

Abstract: A manufacturing method of a mask sheet includes a film formation step for forming a metal layer provided with a plurality of openings on a mask substrate, and a shaping step for shaping the metal layer using pulse electrolysis.

Abstract: A method for 3D printing includes printing a first metallic material on a substrate as a support structure (48). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (46), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

Abstract: A forming method includes: forming a formed article including a first part and a second part using a first metal for the first part and a second metal for the second part; and removing the second part from the formed article by immersing the formed article in an electrolyte solution and causing a current to flow in the second part.

Abstract: An LTPS array substrate, a method for manufacturing the same, and a display device are disclosed. According to the method, a flat layer is formed on an electrode. The flat layer is formed through washing, baking to remove water, hydrophobization treatment, photoresist coating, drying in vacuum, pre-baking, exposing, developing, baking, and aching procedures in sequence, and the baking procedure comprises at least baking for twice with different temperatures. According to the method, the organic film of the flat layer can be preliminarily solidified. In this manner, the problem that the taper angle at via hole position is too small, which is resulted from the liquidity of photoresist material of the flat layer, can be solved.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a perfluoroalkylsulfonate, a sulfate, a halide, and an oxidizing agent. The anode foil is etched in the electrolyte bath composition by passing a direct current charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.

Abstract: A method to fabricate a fluid bearing spindle includes creating a hollow cylindrical bore through a solid workpiece. The hollow cylindrical bore has a journal bearing portion including first and second distal tapered bearing segments separated by a central bearing segment having a constant radius. Each of the first and second distal tapered bearing segments has a tapered bearing radius that increases with distance from the central bearing segment to a maximum tapered bearing radius that is in the range of 0.5 microns to 1.5 microns greater than the constant radius. Subsequently, a cylindrical spindle shaft is inserted into the hollow cylindrical bore. In an alternative embodiment, a cylindrical outer surface of the spindle shaft includes the tapered bearing segments, rather than the hollow cylindrical bore.

Abstract: The invention refers to a method for the electrochemical machining of work pieces, such as, for example, nozzles, in particular nozzles with a blind hole. The invention also refers to a device for the electrochemical machining of work pieces. The invention is characterized by a relative movement, in particular a rotary movement during the machining between work piece and cathode. The device is characterized in that cathode and/or work piece are supported rotatably on bearings for a relative movement.

Abstract: A method for etching a selected area of a conductive metal oxide layer deposited on a support is provided. The method comprises removing the area via electrochemical route in the presence of a polarized microelectrode and an electrochemical solution. In addition, an etched layer obtained with the foregoing method is provided.

Abstract: A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.

Abstract: A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a non-magnetic matrix into the regions where the cobalt has been removed. Deposition may either be electrodeposition, collimated vacuum deposition, or other methods depending upon the composition of the non-magnetic matrix being deposited. The method may be performed in a single electrochemical cell.

Abstract: A method of removing a metal detail from a dielectric material of an article may include placing the article in an electrolyte bath such that at least a portion of the metal detail is submerged. The metal detail may be coupled to a dielectric material. The method may further include positioning at least one cathode in the electrolyte bath in spaced relation to the metal detail, and passing electrical current through the metal detail. The method may additionally include deplating the metal detail from the dielectric material in response to passing the electrical current through the metal detail.

Abstract: Disclosed is a method for etching graphene using a DNA sample of a predetermined DNA shape. The DNA sample is preferably placed onto a reaction area of a piece of highly oriented pyrolytic graphite (HOPG), and both the DNA sample and HOPG are then preferably placed into a humidity-controlled chamber. Humidity is preferably applied to the HOPG to produce a film of water across the surface of the DNA sample. Electrical voltage is also applied to the HOPG to create potential energy for the etching process. After the etching is completed, the reaction area is typically rinsed with deionized water.

Abstract: A method for etching Carbon Nanotube (CNT) sheet material for electrical circuit and thin film thermal structures. The method includes: forming an mask on a sheet of electrically conductive CNT material; and electrochemically removing unmasked portions of the CNT material.

Abstract: This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

Abstract: The preferentially electropolished stent system and method of manufacture includes a stent delivery system including a catheter; a balloon operably attached to the catheter; and a stent disposed on the balloon. The stent includes an elongate body having an abluminal surface and a luminal surface; wherein the abluminal surface has an abluminal average roughness less than or equal to 0.030 microns; and the luminal surface has at least one rough portion having an luminal average roughness greater than or equal to 0.036 microns.

Abstract: This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

Abstract: A surface treatment method for metal substrate includes: a metal substrate is provided; a first color layer is deposited on the metal substrate, the first color layer being a TiC layer or a TiN layer; a second color layer is deposited on the first color layer, the first color layer being a CrC layer or a CrN layer, the color of the first color layer being different from the color of the second color layer; forming a shielding layer on partially of the second color layer; electrochemical etching the metal substrate, the second color layer not covered with the shielding layer being removed to form a recessed portion, the recessed portion being extend through the second color layer. A coated article for manufactured by the surface treatment method is also provided.

Abstract: The invention at hand relates to a method for processing and repairing a metal component with at least one finished or nearly finished partial component surface and at least one working surface to be further processed by means of an electrochemical treatment process and abutting the at least one finished or nearly finished partial component surface, with the process comprising the following steps: a) application of an electrically conductive layer on at least one area of the at least one finished or nearly finished partial component surface abutting the working surface to be processed, with the layer containing a metal or a metal alloy that has a similar or the same as, or a desiredly different electrochemical erosion behavior than the metal component; and b) electrochemical treatment of the working surface and of the layer, with the layer being completely or nearly completely eroded. The invention moreover relates to a component of a gas turbine or of a high or low pressure compressor.

Abstract: An apparatus for separating water from a water-in-oil mixture having an elongated inlet vessel with a lower outlet end and an upper inlet end, the length thereof being a multiple of the largest vessel cross-sectional dimension. A separation vessel having an oil outlet and a divergent water outlet has an inlet passageway in communication with the inlet vessel lower outlet end. At least one electrode is positioned within the inlet vessel by which a mixture flowing therethrough is subjected to an electric field.

Abstract: The invention relates to a method for processing a structured surface of an embossing tool, in which the entire surface is provided with a first metallic coating (6) and said surface having, in selected regions (7, 8, 9, 10, 11), at least one additional metallic coating that has a differing degree of lustre. To improve the optical properties of the material boards produced using the embossing tools, particularly if reproducing a wood texture, the invention suggests that additional differing degrees of lustre should be produced in multiple selected regions (7, 8, 9, 10, 11) on the first coating (6), and be produced by a combination of metallic coatings and mechanical or chemical after-treatments. Therefore, for example, a wood pore with a defined structure can be substantially better reproduced, and the optical and haptic properties of the wood composite board produced using the press plates can thus be improved.

Abstract: A nanoscale lithographic method in which a reusable conductive mask, having a pattern of conductive surfaces and insulating surfaces, is positioned upon a substrate whose surface contains an electrically responsive resist layer over a buried conductive layer. When an electric field is applied between the conductive mask and buried conductive layer, the resist layer is altered in portions adjacent the conductive areas of the mask. Selective processing is performed on the surface of the substrate, after mask removal, to remove portions of the resist layer according to the pattern transferred from the mask. The substrate may be a target substrate, or the substrate may be utilized for a lithographic masking step of another substrate. In one aspect of the invention the electrodes to which the charge is applied are divided, such as into a plurality of rows and columns wherein any desired pattern may be created without the need to fabricate specific masks.

Abstract: Disclosed herein is a method of manufacturing a laterally graded porous silicon optical filter through diffusion-limited etching. The change in resonance frequency of the porous silicon layer in a taper axis direction is adjusted using the diffusion of reactive ions in an etchant under conditions of use of a related etch mask pattern. It is possible to manufacture an optical band-pass filter having a resonance frequency that linearly changes using a tapered etch window opening.

Abstract: A coating method for forming a pattern on a workpiece is provided. First, a workpiece surface is provided. Second, a mask having a shape conforming to a predetermined pattern is provided. Next, the workpiece surface includes a first portion exposed outside and a second portion shielded by the mask. A shielding layer is formed on the exposed first portion of the workpiece surface. The mask is removed from the workpiece to expose the second portion. A coating layer over the shielding layer and the exposed second portion is formed. The coating layer consists of a first part overlaying the shielding layer and a second part overlaying the second portion. The mask is attached onto the coating layer and aligned with the second portion of the workpiece surface. The first part of the coating layer, the shielding layer, and the mask are then removed.

Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.

Abstract: A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a non-magnetic matrix into the regions where the cobalt has been removed. Deposition may either be electrodeposition, collimated vacuum deposition, or other methods depending upon the composition of the non-magnetic matrix being deposited. The method may be performed in a single electrochemical cell.

Abstract: Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.

Abstract: An outer blade cutting wheel (1) comprising a base and a blade section (11) of metal or alloy-bonded abrasive grains is dressed by clamping the cutting wheel between a pair of circular jigs (2) such that the blade section (11) projects beyond the jigs, immersing the cutting wheel in an electropolishing liquid, positioning counter electrodes (4, 5, 6) relative to the blade section, and effecting electropolishing for thereby removing part of the metal or alloy bond and chips received in chip pockets until abrasive grains are exposed on the blade section surface.

Abstract: This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.

Abstract: [Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum. [Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes 26 (aluminum portions) separated by aluminum oxide 24.

Abstract: This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

Abstract: The present invention relates to an electrolytic machining method. For increasing size precision of electrolytic machining method, a metallic mask layer is formed on the surface of a workpiece whose material has high conductivity or volume electrochemical equivalent, whereby the metallic mask layer can be used as a sacrificial layer of electrolytic machining and simultaneously protects the non-machining region of the workpiece so as to reduce lateral machining of the workpiece Consequently, the size precision of electrolytic machining is enhanced. In addition, the feasibility of electrolytically machining a miniature interval between two machined structures is increased as well. In addition, the present invention provides a semifinished electrolytic workpiece, comprising a workpiece and a metallic mask layer formed on the surface of the workpiece. The conductivity or volume electrochemical equivalent of the metallic mask layer is smaller than that of the workpiece.

Abstract: Disclosed herein is a method for patterning a metal layer, which includes the following steps. A substrate having a metal layer thereon is provided. A patterned conductive polymeric layer is formed on the metal layer, wherein a portion of the metal layer is exposed by the patterned conductive polymeric layer. The substrate having the patterned conductive polymer layer is disposed in an electrolytic cell, so that the exposed portion of the metal layer is immersed in the electrolytic solution of the electrolytic cell. The anode of the electrolytic cell is electrically coupled to the patterned conductive polymeric layer, while the cathode of the electrolytic cell is immersed in the electrolytic solution. Sequentially, an electrical potential is applied across the anode and the cathode to perform an electrolysis reaction so that the exposed portion of the metal layer is dissolved in the electrolytic solution.

Abstract: A patterned magnetic recording media and method thereof is provided. A recording layer comprises a continuous surface of more-noble elements and less-noble elements, such as CoXYZ, wherein X can be Pt, Pd, Ru, Rh, Ir, Os, or Au, wherein Y can be null or Cr, and wherein Z can be null, Cu, Ta, Ti, O, B, Ag, or TiO2. The recording layer is masked, shielding areas for recording domains and exposing areas between the recording domains. A voltage bias establishes the substrate as an anode in the presence of Pt cathode, in an electrolyte bath. Ions of the less-noble element are anodically removed predominantly from the exposed areas of the recording layer for a controlled time. The controlled time minimizes oxidation of the nobler element and reduces undercutting of the recording domains. The article produced can have separating areas with surfaces substantially formed of the more-noble element.

Abstract: This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

Abstract: A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.

Abstract: Textured surface having micro recesses such that the outer surface overhangs the micro recesses. Embodiments of the textured surface include sharp edges for promoting bone deposition and growth within the micro recesses, protrusions of varying depth from the surface that include overhangs, and micro recesses that are at least partially defined by complex ellipsoids.

Abstract: A patterned magnetic recording media and method thereof is provided. A recording layer comprises a continuous surface of more-noble elements and less-noble elements, such as CoXYZ, wherein X can be Pt, Pd, Ru, Rh, Ir, Os, or Au, wherein Y can be null or Cr, and wherein Z can be null, Cu, Ta, Ti, O, B, Ag, or TiO2. The recording layer is masked, shielding areas for recording domains and exposing areas between the recording domains. A voltage bias establishes the substrate as an anode in the presence of Pt cathode, in an electrolyte bath. Ions of the less-noble element are anodically removed predominantly from the exposed areas of the recording layer for a controlled time. The controlled time minimizes oxidation of the nobler element and reduces undercutting of the recording domains. The article produced can have separating areas with surfaces substantially formed of the more-noble element.

Abstract: In a lithographic process suitable for use in the manufacture of electronic components, oxidative reactions are employed to reproducibly fabricate patterns having micro- or nano-scale dimensions. An electrically-conductive template is fabricated to have a nanometer-scale sharp edge and describe a pattern having a micron-scale length. The oxidative reaction is mediated by a water meniscus connecting the sharp edge of the template and an oxidizable substrate. One suitable substrate is graphene. The template can be controllably positioned using a light lever method.

Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.

Abstract: An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having slots or openings therein to expose portions of a metallic device, such as a stent, to an electrolytic solution to remove metal from the exposed portion.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. In comparison with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the parasitic capacitive reactance effect caused by two contact ends of the conventional resistors is also avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Abstract: An electrolytic processing apparatus, prior to carrying out plating directly on, e.g., a ruthenium film of a substrate using the ruthenium film as a seed layer, can securely remove a passive layer formed on a surface of the ruthenium film even when the substrate is a large-sized high-resistance substrate, such as a 300-mm wafer, thereby reducing the terminal effect during the subsequent plating, improving the quality of a plated film and enabling filling of a void-free plated film into a fine interconnect pattern.

Abstract: A method and apparatus is described for gradually transitioning a slider from operation over a patterned data zone to landing on a patterned CSS zone. The ratio of raised area width to recessed area width of a pattern in a transition zone and/or CSS zone may be varied across the radial dimension of the disk. By changing the ratio of raised area width to recessed area width of the pattern in the transition from slider operation over the data zone to landing in the CSS zone, it is possible to gradually change the height of the slider from flying to non-flying conditions.

Abstract: A semiconductor substrate is anodized to be shaped into an optical lens. Prior to being anodized, the substrate is finished with an anode pattern on its bottom surface so as to be consolidated into a unitary structure in which the anode pattern is precisely reproduced on the substrate. The anodization utilizes an electrolytic solution which etches out oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. The anode pattern brings about an in-plane distribution of varying electric field intensity by which the porous layer develops into a shape complementary to a desired lens profile. Upon completion of the anodization, the semiconductor substrate is shaped into the lens by etching out the porous layer and the anode pattern from the substrate.

Abstract: A process for electrochemically etching a layer with electric conduction properties, of the doped metal oxide type, on a transparent substrate of the glass type, fitted with a mask capable of being removed after etching. The process brings at least one region to be etched of the layer into contact with an electrically conducting solution, immerses an electrode in the solution and places the electrode facing and at a distance from the region, and applies an electrical voltage between the electrode and the layer to be etched. The electrode has an oblong shape such that the etching is carried out on several regions of the layer over a width of the substrate.