Abstract: A location of grid lines in an image of a laser-annealed semiconductor wafer is determined. An area covered by the grid lines can be filled using a new gray value. The new gray value can be based on a second gray scale value of a neighborhood around the area. The neighborhood is outside of the area covered by the grid lines.

Abstract: Disclosed is a filter and a filter case using CDI, and a water purifier and a water softener using the filter case. Specifically, the filter case comprises: a case having a cylindrical shape and including a receiving space formed therein; a first cover having an inlet formed in the center thereof and configured to close one side of the case; and a second cover having an outlet formed in the center thereof and configured to close the other side of the case.

Abstract: A water remediation and treatment device that includes a process channel having fluid inlet and a fluid outlet; at least one tube unit in fluid communication with the process channel, the tube unit defining an interior chamber defining an interior fluid flow path, at least one anode and at least one cathode contained in the interior chamber and positioned in the interior fluid flow path; and at least one device configured to remove material accumulated on the surface of the cathode and/or the electrode during water treatment.

Abstract: An apparatus, a method, and an electrolytic solution are described for electropolishing metallic stents made, for example, of high-strength medical alloys. The apparatus may include an electropolishing container made from material of low thermal conductivity. The apparatus may include at least one spiral cathode for optimization of solution agitation and/or voltage distribution in the electrolytic solution. Further, an electrolytic solution including at least dimethylsulfate is described. A method for improved electropolishing to consistently produce smooth surfaces is also described.

Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Abstract: The present invention relates to a method of electrochemical polishing of surfaces of cobalt or cobalt alloys. It employs an electrolyte comprising glycolic acid and at least one alkane-sulfonic acid with an alkyl residue that has 1 to 3 carbon atoms. This electrolyte is also one aspect of the present invention. In one embodiment, at least one alkane-sulfonic acid comprises methane-sulfonic acid. The electrolyte and the method using this electrolyte are suitable in particular for surfaces of cobalt or cobalt alloys, including cobalt-chromium alloys such as stellite.

Abstract: An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.

Abstract: An apparatus, a method, and an electrolytic solution are described for electropolishing metallic stents made, for example, of high-strength medical alloys. The apparatus may include an electropolishing container made from material of low thermal conductivity. The apparatus may include at least one spiral cathode for optimization of solution agitation and/or voltage distribution in the electrolytic solution. Further, an electrolytic solution including at least dimethylsulfate is described. A method for improved electropolishing to consistently produce smooth surfaces is also described.

Abstract: An electrocoagulation device for removal of contaminants from a treatment stream including an elongated fluid treatment path in contact with a plurality of electrode plates, and a power supply electrically connected to the plates, wherein the device is configured so that it can provide a variety of electric field regimes to the treatment stream as it passes along the treatment path, and so that it can provide a variety of flow regimes along the fluid treatment path.

Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.

Abstract: A method and apparatus for removing conductive material from a microelectronic substrate is disclosed. One method includes disposing an electrolytic liquid between a conductive material of a substrate and at least one electrode, with the electrolytic liquid having about 80% water or less. The substrate can be contacted with a polishing pad material, and the conductive material can be electrically coupled to a source of varying electrical signals via the electrolytic liquid and the electrode. The method can further include applying a varying electrical signal to the conductive material, moving at least one of the polishing pad material and the substrate relative to the other, and removing at least a portion of the conductive material while the electrolytic liquid is adjacent to the conductive material. By limiting/controlling the amount of water in the electrolytic liquid, an embodiment of the method can remove the conductive material with a reduced downforce.

Abstract: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.

Abstract: An electrochemical method is provided for producing trenches for trench capacitors in p-doped silicon with a very high diameter/depth aspect ratio for large scale integrated semiconductor memories. Trenches (macropores) having a diameter of less than about 100 nm and a depth of more than 10 ?m can be produced on p-doped silicon having a very low resistivity at a high etching rate.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions.

Abstract: A method for planarizing an element using an electrochemical polishing process includes contacting a patterned substrate with a polishing solution including 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) while applying an electric potential to the substrate. The patterned substrate is preferably a copper electroplated trenched silicon wafer. The potential is maintained within a predetermined limiting current plateau. The resulting electrochemical reaction is limited by mass transport of the copper, and creates a salt film along the copper surface. The copper layer becomes planar due to ohmic leveling, migration smoothing, and diffusion smoothing. Using HEDP enables the planarization of the copper surface without causing dishing or without completely removing the copper from the wafer.

Abstract: An electrolyte solution containing an alkylene glycol and a chloride salt is useful for electropolishing metal substrates. An electropolishing method using the electrolyte solution is effective for polishing a varied of metals, including titanium and noble metals. The method avoids the handling and disposal challenges associated with previous methods using etching solutions containing hydrofluoric acid. A method of recycling the spent electrolyte solution is also described.

Abstract: The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates.

Abstract: The present invention relates to a polishing liquid for polishing the surface of a substrate having a copper film and fine recesses filled with the copper, comprising, at least one water-soluble inorganic acid or its salt, or water-soluble organic acid or its salt, and at least one hydroxyquinoline.

Abstract: An electrolyte solution containing an alkylene glycol and a chloride salt is useful for electropolishing metal substrates. An electropolishing method using the electrolyte solution is effective for polishing a varied of metals, including titanium and noble metals. The method avoids the handling and disposal challenges associated with previous methods using etching solutions containing hydrofluoric acid. A method of recycling the spent electrolyte solution is also described.

Abstract: A bath composition for the electropolishing of a metal surface made of nonalloyed titanium is disclosed. The bath composition may comprise sulfuric acid of 2 to 40% by volume, hydrofluoric acid of 10 to 18% by volume and acetic acid of 42 to 62% by volume.

Abstract: This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution can comprise a phosphoric acid solution and a hypophosphite-containing compound. The polishing solution can also comprise a polyol, a polyol ether and an organic acid.

Abstract: A surface active, viscosity modifying agent is used to promote additional tunnel initiation during the etching of high purity cubicity anode foil, preferably aluminum anode foil, to render it suitable for use in electrolytic capacitors. The anode foil is etched in the electrolyte bath composition by passing a charge rough the bath, resulting in an anode foil having a higher capacitance than foils etched using known methods or etching compositions. The etched anode foil is suitable for use in an electrolytic capacitor.