Less Than 50 Weight Percent Water Patents (Class 205/675)
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Patent number: 9163322Abstract: A refurbishing method, refurbishing apparatus and refurbished article are provided. The refurbishing method includes accessing a plurality of rotatable components attached to a turbine assembly, the turbine assembly being a portion of a turbomachine, providing a predetermined volume of a buffered electrolytic solution in an electro-polishing tank, coupling the plurality of rotatable components to a power supply, immersing an immersion portion of at least one of the plurality of rotatable components in the buffered electrolytic solution, passing an electrical energy through the immersion portion of at least one of the plurality of rotatable components while the immersion portion is immersed in the buffered electrolytic solution, wherein an electrical flux to the immersion portion electro-polishes the immersion portion, separating the immersion portion from the buffered electrolytic solution, and applying a corrosion inhibitor to the plurality of rotatable components.Type: GrantFiled: July 1, 2013Date of Patent: October 20, 2015Assignee: General Electric CompanyInventors: Paul Stephen DiMascio, Alston Ilford Scipio, Dale J. Davis, Sanji Ekanayake
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Patent number: 8617380Abstract: Substantially anhydrous electropolishing electrolyte solutions. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and at least one water sequestering agent. Suitable examples of water sequestering agent include, but are not limited to, polyfunctional alcohols. Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.Type: GrantFiled: October 12, 2011Date of Patent: December 31, 2013Assignee: Abbott Cardiovascular Systems, Inc.Inventors: Sophia L. Wong, Nicholas R Haluck, Patrick C Vien
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Patent number: 8617379Abstract: A substantially anhydrous electropolishing electrolyte solution that includes at least one sulfate salt. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and at least one sulfate salt. The at least one sulfate salt can act as a source of sulfate ions to replenish sulfate ions consumed in the electropolishing process. Anhydrous sulfate salts can also act as water scavengers by reacting with water to form sulfate salt hydrates. Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.Type: GrantFiled: October 12, 2011Date of Patent: December 31, 2013Assignee: Abbott Cardiovascular Systems, Inc.Inventors: Sophia L. Wong, William E. Webler
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Patent number: 8613849Abstract: Substantially anhydrous electropolishing electrolyte solutions. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and phosphorous pentoxide (“P2O5”). Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.Type: GrantFiled: October 12, 2011Date of Patent: December 24, 2013Assignee: Abbott Cardiovascular Systems, Inc.Inventors: Sophia L. Wong, William E. Webler, Jr., Dariush Davalian
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Patent number: 8603318Abstract: An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with a surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to a dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.Type: GrantFiled: May 2, 2011Date of Patent: December 10, 2013Assignee: Micron Technology, Inc.Inventors: Rita J. Klein, Dale W. Collins, Paul Morgan, Joseph N. Greeley, Nishant Sinha
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Publication number: 20130092556Abstract: A substantially anhydrous electropolishing electrolyte solution that includes at least one sulfate salt. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and at least one sulfate salt. The at least one sulfate salt can act as a source of sulfate ions to replenish sulfate ions consumed in the electropolishing process. Anhydrous sulfate salts can also act as water scavengers by reacting with water to form sulfate salt hydrates. Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Applicant: ABBOTT CARDIOVASCULAR SYSTEMS, INC.Inventors: Sophia L. Wong, William E. Webler
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Publication number: 20110203940Abstract: An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.Type: ApplicationFiled: May 2, 2011Publication date: August 25, 2011Inventors: Rita J. Klein, Dale W. Collins, Paul Morgan, Joseph N. Greeley, Nishant Sinha
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Publication number: 20110198227Abstract: Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for use in electrodeposition, batteries, conductive polymers and descaling processes.Type: ApplicationFiled: March 23, 2011Publication date: August 18, 2011Applicant: Arkema Inc.Inventors: Nicholas M. Martyak, Martin Nosowitz, Gary S. Smith, Patrick Kendall Janney, Jean-Marie Ollivier
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Patent number: 7807039Abstract: The present invention relates to electrolytes for electrochemically polishing workpieces consisting of titanium, titanium alloys, niobium, niobium alloys, tantalum and tantalum alloys, which electrolytes contain sulfuric acid, ammonium bifluoride and at least one hydroxycarboxylic acid, and a method for electrochemical polishing.Type: GrantFiled: April 30, 2004Date of Patent: October 5, 2010Assignee: Poligrat-Holding GmbHInventors: Siegfried Piesslinger-Schweiger, Razmik Abedian, Olaf Böhme
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Patent number: 7501051Abstract: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.Type: GrantFiled: February 4, 2005Date of Patent: March 10, 2009Assignee: BASF AktiengesellschaftInventors: Jia Min Shieh, Sue Hong Liu, Bau Tong Dai
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Publication number: 20080289970Abstract: The present invention relates to a method of electrochemical polishing of surfaces of cobalt or cobalt alloys. It employs an electrolyte comprising glycolic acid and at least one alkane-sulfonic acid with an alkyl residue that has 1 to 3 carbon atoms. This electrolyte is also one aspect of the present invention. In one embodiment, at least one alkane-sulfonic acid comprises methane-sulfonic acid. The electrolyte and the method using this electrolyte are suitable in particular for surfaces of cobalt or cobalt alloys, including cobalt-chromium alloys such as stellite.Type: ApplicationFiled: September 24, 2007Publication date: November 27, 2008Applicant: POLIGRAT GMBHInventors: Siegfried PIESSLINGER-SCHWEIGER, Olaf BOHME
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Patent number: 6884338Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.Type: GrantFiled: December 16, 2002Date of Patent: April 26, 2005Assignee: 3M Innovative Properties CompanyInventors: Susrut Kesari, William M. Lamanna, Michael J. Parent, Lawrence A. Zazzera
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Patent number: 6858124Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions.Type: GrantFiled: December 16, 2002Date of Patent: February 22, 2005Assignee: 3M Innovative Properties CompanyInventors: Lawrence A. Zazzera, Michael J. Parent, William M. Lamanna, Susrut Kesari
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Patent number: 6858126Abstract: A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium persulfate and titanium (111) chloride. Anode foils etched according to the method of the invention maintain high capacitance gains, electrical porosity and strength. The electrical porosity of the etched foils is sufficiently high such that the overall Equivalent Series Resistance (ESR) is not increased in multilayer anodes configurations. Also described is a low pH electrolyte bath composition. Anode foils etched according to the present invention and electrolytic capacitors incorporating the etched anode foils are also disclosed.Type: GrantFiled: November 6, 2002Date of Patent: February 22, 2005Assignee: Pacesetter, Inc.Inventors: Ralph Jason Hemphill, Thomas Flavian Strange
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Patent number: 6783657Abstract: The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates.Type: GrantFiled: August 29, 2002Date of Patent: August 31, 2004Assignee: Micron Technology, Inc.Inventors: Eugene P. Marsh, Stefan Uhlenbrock, Donald L. Westmoreland
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Publication number: 20040045837Abstract: A method for treating the surface of an object to be treated and an apparatus thereof, suitably applied, for example, to electrochemical treatment on an object to be treated, capable of avoiding contact between the object and the atmosphere, uniformly activating the surface of the object with precision, obtaining a good precipitation of metal ion, rationally carrying out the supply and discharge of the surface treatment fluid and the treatment solution, attaining effective utilization thereof and prohibiting the discharge of the same to the outside of the system, realizing a reasonable system, enhancing productivity and achieving mass production, rationally and safely carrying out the electrochemical treatment operation, miniaturizing the equipment and achieving the cot reduction, and providing a convenient maintenance.Type: ApplicationFiled: May 14, 2003Publication date: March 11, 2004Inventors: Hideo Yoshida, Seizo Miyata, Masato Sone, Nobuyoshi Sato
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Patent number: 6610194Abstract: A bath composition for the electropolishing of a metal surface made of nonalloyed titanium is disclosed. The bath composition may comprise sulfuric acid of 2 to 40% by volume, hydrofluoric acid of 10 to 18% by volume and acetic acid of 42 to 62% by volume.Type: GrantFiled: December 19, 2001Date of Patent: August 26, 2003Assignee: European Organization for Nuclear Research (CERN)Inventor: Jean Guerin
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Patent number: 6579439Abstract: This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution can comprise a phosphoric acid solution and a hypophosphite-containing compound. The polishing solution can also comprise a polyol, a polyol ether and an organic acid.Type: GrantFiled: January 11, 2002Date of Patent: June 17, 2003Assignee: Southern Industrial Chemicals, Inc.Inventor: Wayne D. Chandler
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Patent number: 6527938Abstract: A process for creating surface microporosity on a titanium (or other metal) medical device includes creating a surface oxide layer on the device; placing the device, which is connected to a negative terminal of an electrical power supply, into a calcium chloride bath; connecting the positive terminal of the power supply to an anode immersed in or containing calcium chloride thereby forming an electrolytic cell; passing current through the cell; removing the device from the bath; and cooling and rinsing the device to remove any surface salt. If necessary, the device is etched to remove metal oxide which may have formed during the cooling process. The resulting device has a microporous surface structure. Alternatively, only a designated surface portion of a medical device is made microporous, either by applying a non-oxidizing mask, removing a portion of the oxide layer, or subtracting a portion of a microporous surface.Type: GrantFiled: June 21, 2001Date of Patent: March 4, 2003Assignee: Syntheon, LLCInventors: Thomas O. Bales, Scott L. Jahrmarkt
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Patent number: 6238810Abstract: A surface active, viscosity modifying agent is used to promote additional tunnel initiation during the etching of high purity cubicity anode foil, preferably aluminum anode foil, to render it suitable for use in electrolytic capacitors. The anode foil is etched in the electrolyte bath composition by passing a charge rough the bath, resulting in an anode foil having a higher capacitance than foils etched using known methods or etching compositions. The etched anode foil is suitable for use in an electrolytic capacitor.Type: GrantFiled: April 7, 1999Date of Patent: May 29, 2001Assignee: Pacesetter, Inc.Inventors: Thomas Flavian Strange, Ralph Jason Hemphill
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Patent number: 6168706Abstract: Aluminum anode foil is etched using a process of treating the foil in an electrolyte bath composition comprising aluminum chloride hexahydrate, hydrochloric acid, sulfuric acid and perchloric acid or perchlorate. The anode foil is etched in the electrolyte bath composition by passing a direct current (DC) through the bath, resulting in an aluminum anode foil having a higher capacitance and/or metal strength than using known methods or etching compositions. The etched anode foil is suitable for use in an electrolytic capacitor.Type: GrantFiled: December 11, 1998Date of Patent: January 2, 2001Assignee: Pacesetter, Inc.Inventors: Ralph Jason Hemphill, Thomas Flavian Strange
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Patent number: 6074546Abstract: A method is provided for photochemical polishing of a silicon wafer using electromagnetic waves within the spectrum of 150 to 2000 nanometers wavelength. A photochemical polishing apparatus is also disclosed in which the electromagnetic waves are provided by a waveguide in close proximity to the surface of a silicon wafer electrode.Type: GrantFiled: August 21, 1997Date of Patent: June 13, 2000Assignee: Rodel Holdings, Inc.Inventors: Lizhong Sun, James Shen, Lee Melbourne Cook
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Patent number: 5997713Abstract: An element with elongated, high aspect ratio channels such as microchannel plate is fabricated by electrochemical etching of a p-type silicon element in a electrolyte to form channels extending through the element. The electrolyte may be an aqueous electrolyte. For use as a microchannel plate, the; the silicon surfaces of the channels can be converted to insulating silicon dioxide, and a dynode material with a high electron emissivity can be deposited onto the insulating surfaces of the channels. New dynode materials are also disclosed.Type: GrantFiled: May 8, 1998Date of Patent: December 7, 1999Assignee: NanoSciences CorporationInventors: Charles P. Beetz, Jr., Robert W. Boerstler, John Steinbeck, David R. Winn