Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.
Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.
Type:
Grant
Filed:
September 1, 2010
Date of Patent:
November 20, 2012
Assignee:
Lam Research Corporation
Inventors:
Fred D. Egley, Michael S. Kang, Anthony L. Chen, Jack Kuo, Hong Shih, Duane Outka, Bruno Morel
Abstract: Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.
Abstract: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.
Type:
Grant
Filed:
February 4, 2005
Date of Patent:
March 10, 2009
Assignee:
BASF Aktiengesellschaft
Inventors:
Jia Min Shieh, Sue Hong Liu, Bau Tong Dai
Abstract: The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates.
Type:
Grant
Filed:
August 29, 2002
Date of Patent:
August 31, 2004
Assignee:
Micron Technology, Inc.
Inventors:
Eugene P. Marsh, Stefan Uhlenbrock, Donald L. Westmoreland
Abstract: An electrolytic solution formulation for an electropolishing process comprises at least an acid solution and an organic additive. The acid solution includes phosphoric acid or a mixture of phosphoric acid and sulfuric acid solutions, which can form a passivation layer on the surface of the metal layer. The additive comprises at least an acid group, wherein the diffusion of the organic additive is controlled in which a concentration gradient is formed in the opening of the metal layer. The electropolishing rate at the top of the opening is thereby faster than that at the bottom of the opening. The organic additive is selected from a monocarboxylic acid compound, a dicarboxylic acid compound, a tricarboxylic acid compound, a heterocyclic carboxylic acid compound or a sulfonic acid compound.
Abstract: This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution can comprise a phosphoric acid solution and a hypophosphite-containing compound. The polishing solution can also comprise a polyol, a polyol ether and an organic acid.