Abstract: An anode assembly including a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface.

Abstract: The present invention provides an apparatus or a method for forming a thin zinc oxide film on a conductive base member by immersing the conductive base member and a counter electrode in an aqueous solution and supplying a current between the conductive base member and the counter electrode, in which (a) a distance between the counter electrode and the base member is 50 mm or more at an end portion of the counter electrode and is 3 mm to 40 mm at a central portion of the counter electrode, and (b) an end portion of the counter electrode is folded by an angle of −1° to −90° with respect to the conductive base member. Thus the thin zinc oxide film of satisfactory film quality can be formed on the conductive base member for a long time with a satisfactory yield, and inexpensive and stable production of the thin zinc oxide film can be realized.

Abstract: A method of plating which improves the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture at a center of a mesh anode electrode of a plating apparatus produces an electric field density distribution between the mesh anode electrode and a wafer that is lower in the central portion of the wafer than at the edge portion of the wafer.

Abstract: A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and maintaining an electrical contact with a product being processed in a transport system employed for selective electrolytic metallization and deposition, coating or etching. The method of making and maintaining an electrical contact with a product being processed may be utilizing a fluid head arrangement.

Abstract: This invention provides an apparatus for producing an electrode foil for use in aluminum electrolytic capacitors with which a high capacitance is obtained while the distortion of the foil and the leakage current can be controlled. At least two electrode plates as cathode are disposed in an electrolytic tank containing an electrolytic solution, and a direct current is supplied between an aluminum foil as anode and the electrode plates. Anodization is conducted continuously by turning the direction of the aluminum foil via rollers and conveying the foil between the electrode plates. During this treatment, the length and the position of the effective sections of the electrode plates are adjusted to keep the length to be at most two-thirds of the distance between an area near the surface of the electrolytic solution and the upper part of the bottom roller, so that the peak value of the anodizing current density appears not at the surface of the electrolytic solution but in the electrolytic solution.

Abstract: A process for sulfurizing treatment of ferrous articles comprises positioning an electrolysis crucible containing a molten-salt bath of potassium thiocyanate and sodium thiocyanate and a pretreatment crucible containing a molten-salt bath of substantially the same composition adjacent to each other, assembling a unitary body by setting a plurality of the articles on a conductive support member in electrical contact therewith and attaching a cathode material to the support member to be out of contact with the articles and electrically insulated from the support member, immersing the unitary body in the bath contained in the pretreatment crucible, maintaining this bath temperature at substantially a prescribe bath temperature during ensuing electrolysis to bring the temperature of the unitary body near the prescribed temperature, transferring the unitary body from the pretreatment crucible to the bath in the electrolysis crucible while maintaining its temperature, and treating the articles by electrolysis.

Abstract: The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.

Abstract: Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.

Abstract: Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.

Abstract: A siphon and method of immersion and removal of an object to be plated in a liquid for siphoning the liquid from a blind hole in the object. The siphon has a short leg in the blind hole and a long leg exterior of the hole and extending downwardly below the short leg. The siphon may be either non-conductive or conductive. If conductive, it can also serve as an auxiliary electrode in the plating process.