Having Plural Grooves For Retaining Wafers Patents (Class 206/711)
  • Patent number: 11211274
    Abstract: A substrate container that utilizes a rocker linkage or a linear cam arrangement in latch mechanism that is actuated by a rotary cam. The rocker linkage or linear cam is mounted to an interior panel of a door of the substrate container and may be disposed proximate an edge portion of the interior panel. The rocker linkage or linear cam may be configured to exert an axial force component on a housing of the substrate container to seat the door against a seal member. The rocker linkage or linear cam also transfers the axial latching forces to the door to reduce transfer of forces to the cam. The rocker linkage or linear cam may be arranged to transfer axial forces in a radially outward direction when the latch mechanism is engaged, to prevent push back on the rotary cam.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: December 28, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Russ V. Raschke, Jason Steffens
  • Patent number: 11139188
    Abstract: A purging nozzle unit of a gas supply device according to the present invention including: a housing that is capable of passing a predetermined gas so as to replace the internal atmosphere of a FOUP with the predetermined gas; a nozzle coming into intimate contact with the proximity of a port that is provided on one face of the FOUP, the nozzle being pressed to thereby open the port; an operation adjustment space configured to increase or decrease so as to operate the nozzle between a use posture in which the predetermined gas can be supplied into the target container via the port and a standby posture in which the predetermined gas cannot be supplied into the target container via the port; and a gas introducing part configured to export or import compression air relative to the operation adjustment space to thereby control an operation of the nozzle.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 5, 2021
    Assignee: SINFONIA TECHNOLOGY CO., LTD.
    Inventors: Yasushi Taniyama, Toshimitsu Morihana
  • Patent number: 11101155
    Abstract: A lid body side substrate receiving portion includes a lower side substrate guiding inclined face and an upper side substrate guiding inclined face. In a direction in which a groove extends while a container main body opening portion is closed by a lid body, a length of the lower side substrate guiding inclined face in the upper-lower direction becomes longer as approaching a center of the container main body opening portion.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: August 24, 2021
    Assignee: MIRAIAL CO., LTD.
    Inventor: Kyohei Sato
  • Patent number: 11031264
    Abstract: The present disclosure relates to a semiconductor device manufacturing system. The semiconductor device manufacturing system includes a processing module and a transfer module. The processing module includes a processing chamber that is configured to process a semiconductor wafer and a gate valve that is configured to provide access to the processing chamber. The transfer module includes a transfer chamber that is coupled to the processing chamber and a liner that is coupled to an inner surface of the transfer chamber. The liner is configured to reduce a volume of the transfer chamber prior to or during a transfer chamber pressure adjustment operation of the transfer module.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semoconductor Manufacturing Co., Ltd.
    Inventors: Yan-Hong Liu, Che-Fu Chen
  • Patent number: 11004713
    Abstract: Heights of wafers in a front opening unified pod are identified by using an end effector and a front sensor arranged thereon, such that the end effector can be positioned at the appropriate height when retrieving one of the wafers, so as to avoid colliding with a wafer stored inside the front opening unified pod. Wafer backside properties can also be detected by the end effector, so as to report defects and contaminants on the wafer.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Hua Houng, Che-Fu Chen
  • Patent number: 10854490
    Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Ming-Hsien Tsai, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Patent number: 10847394
    Abstract: A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 24, 2020
    Assignee: CHUNG KING ENTERPRISE CO., LTD.
    Inventors: Ming-Long Chiu, Tsung-Yi Yang, Yen-Fang Chen, Chia-Ling Li
  • Patent number: 10535542
    Abstract: Various embodiments provide a wafer box. The wafer box may include a housing with a receiving space for receiving at least one wafer arranged above a housing base, at least one fixing structure which is connected to the housing base and which extends from the housing base, and at least one fixing device which is fastenable to the at least one fixing structure at a variable distance from the housing base. The fixing device and the fixing structure are designed such that the at least one wafer for arrangement in the receiving space can be fixed in a position by means of the at least one fixing device fastened to the fixing structure.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 14, 2020
    Assignee: Infineon Technologies AG
    Inventors: Andreas Niederhofer, Manfred Mengel, Holger Tamme, Nina Wenger
  • Patent number: 10446424
    Abstract: A storage device and a photoresist coating and developing machine having a storage device are disclosed. The storage device includes a frame and a plurality of layers of support plates disposed in sequence in the frame in a height direction of the frame, being used for receiving substrates to be exposed. The frame is provided with a plurality of layers of support members respectively associated with the plurality of layers of support plates, and each layer of the support plates is slidably mounted on the support member.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: October 15, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS CO., LTD.
    Inventors: Zhichao Wang, Xiangyu Song, Yongbing Guan, Bingqiang Liu, Kun Cao
  • Patent number: 10340168
    Abstract: A load port provided adjacent to a wafer transport chamber for taking in and out a wafer W between the wafer transport chamber and a FOUP, includes a plate-shaped part that constitutes a part of a wall of the wafer transport chamber, and has an opening for opening the wafer transport chamber; a door part for opening and closing the opening; a mounting table that is configured to mount a wafer storage container so as to oppose a lid part for opening and closing an internal space to the door part, and to move to and from the plate-shaped part; and an elastic part that is provided on the mounting table side of the plate-shaped part along the peripheral edge of the opening, wherein the elastic part elastically contacts the periphery of the lid part in the wafer storage container by moving the mounting table toward the plate-shaped part.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: July 2, 2019
    Assignee: SINFONIA TECHNOLOGY CO., LTD.
    Inventors: Mitsutoshi Ochiai, Takaaki Nakano
  • Patent number: 10242904
    Abstract: A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. The apparatus includes a holding unit for the frame unit, a moving unit for the holding unit, and a control unit. The holding unit includes a pair of gripping portions for gripping a front portion of the ring frame at two separate positions, and an abutting portion adapted to abut against the outer circumference of the ring frame. The ring frame is gripped, partially drawn from the cassette, and released. The abutting portion is brought into abutment against the outer circumference of the ring frame so as to move the ring frame into the cassette. The ring frame is gripped again, raised, and transferred to the predetermined position.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: March 26, 2019
    Assignee: Disco Corporation
    Inventors: Masahiro Tsukamoto, Ken Togashi
  • Patent number: 9966288
    Abstract: The lower lid includes a bottom plate that supports the substrate storing container and a lower lid peripheral wall that extends upwards from a periphery of the bottom plate. The sleeve member has a tubular shape having an axial center that extends in the vertical direction. The upper lid has a top plate and an upper lid peripheral wall that extends downwards. The lower lid includes device positioning portions. The device positioning portions can engage the positioned portion of the lifting device that lifts, from the lower lid, the substrate storing container which is supported by the lower lid in a state of the upper lid being removed therefrom.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: May 8, 2018
    Assignee: MIRAIAL CO., LTD.
    Inventor: Tsuyoshi Nagashima
  • Patent number: 9673075
    Abstract: A wafer container that reduces or alleviates one or more of the problems associated with excessive container wall deflection due to loading and excessive particulate generation, particularly as those problems are experienced with containers for 450 mm diameter and larger wafers. The container has an enclosure and door with interlocking features to enable transfer of tension load to the door to minimize deflection of container surfaces. The container may include a gasketing arrangement compatible with the interlock feature. The container may include a removable door guide that improves centering of the door during door installation, and that is made of low particle generating material to reduce particulates.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: June 6, 2017
    Assignee: ENTEGRIS, INC.
    Inventors: Barry Gregerson, Matthew A. Fuller, Michael S. Adams
  • Patent number: 9472431
    Abstract: An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers respectively, and extend the wafer support to approximately the entire circumference of each wafer.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: October 18, 2016
    Assignee: ENTEGRIS, INC.
    Inventors: Barry Gregerson, Jason Steffens, Russ V. Raschke
  • Patent number: 9184079
    Abstract: A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: November 10, 2015
    Assignee: ATS AUTOMATION TOOLING SYSTEMS INC.
    Inventors: Frederic Rivollier, Ryan Chubb
  • Patent number: 9142260
    Abstract: Systems, methods, and components include an improved universal disk container for use in transporting, storing and processing data storage disks or other disk-shaped articles. A disk shipping system and method for shipping disks allows stocking a minimal number of components while still allowing packaging and shipment of different thickness of disks and different capacities of disks in a container. A universal disk cassette includes slots having a narrowed lower portion configured for handling different disks of the same diameter but different thicknesses while preventing disk to disk contact when the disks are tilted. A universal top cover is configured for cassettes loaded with different thicknesses of disks. The universal top cover can readily accommodate disks that are tilted in the cassette, and with vacuum bagging, more securely fix the disks in place in the container.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: September 22, 2015
    Assignee: Entegris, Inc.
    Inventors: Garry Anderson, Saiful Hailri, Gian Ping (Vincent) Chua
  • Patent number: 9117863
    Abstract: A material handling apparatus adapted to support a plurality of disc-shaped platters, such as but not limited to a cassette assembly adapted to support data recording media or substrates during manufacturing. In some embodiments, a cassette assembly includes a base cassette with a base and opposing sidewalls configured to support an outermost perimeter of each of a first plurality of disc-shaped platters having a first diameter. An insert contactingly engages the base cassette. The insert has a plurality of spaced apart grooves to contactingly support an outermost perimeter of each of a second plurality of disc-shaped platters having a different, second diameter.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: August 25, 2015
    Assignee: Seagate Technology LLC
    Inventors: David V. Dougherty, Ian J. Beresford, Donald E. Curtiss, Thomas Y. Chang
  • Publication number: 20150129459
    Abstract: A wafer container an enclosure portion including a top wall, a bottom wall, a pair of side walls, a back wall, and a door frame opposite the back wall, the door frame defining a front opening, and a wafer support structure including two side wafer supports 5 each side wafer support including a removable backstop. The invention includes maintaining wafer containers by replacing the removable backstop. The invention includes converting shipping containers that ship large diameter wafers vertically to containers to be used in fabrication facilities that store wafers horizontally for robotic pickup for processing.
    Type: Application
    Filed: May 6, 2013
    Publication date: May 14, 2015
    Inventors: Matthew A. Fuller, John Burns
  • Publication number: 20150122699
    Abstract: A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.
    Type: Application
    Filed: May 6, 2013
    Publication date: May 7, 2015
    Inventors: Barry Gregerson, Matthew A. Fuller
  • Publication number: 20150090630
    Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Sung-Chun YANG, Ying-Chi PENG, Yao-Pin YANG
  • Publication number: 20150083639
    Abstract: A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers. The system includes a wafer container enclosure defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; and a first removable wafer cushion attachable to the rear side of the front door adjacent the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves and slots.
    Type: Application
    Filed: May 6, 2013
    Publication date: March 26, 2015
    Inventor: Barry Gregerson
  • Publication number: 20150083640
    Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
    Type: Application
    Filed: December 2, 2014
    Publication date: March 26, 2015
    Inventors: Barry GREGERSON, Michael S. ADAMS, Jason T. STEFFENS
  • Publication number: 20150068949
    Abstract: A wafer container for holding a spaced stack of thin wafers, comprising an H-bar carrier, a base portion for receiving same, a base wafer cushion attached at the bottom wall positioned below the H-bar carrier, the cushion having a plurality of ribs defining slots each with a bottom wafer seating region having a curvature and a pair of ends, each of the ends having a flare whereby the seating region flares outwardly at the ends, a cover portion that connects with the base portion to form a closed interior. The cover portion having an uppermost wall a wafer cushion secured thereto. The cover wafer cushion having a row of wafer engaging finger portions, the finger portions Y shaped and having two legs extending from a support portion and alternatingly extending from opposing support portions, the finger portions may be S shaped with a wafer pad flared in two direction.
    Type: Application
    Filed: April 9, 2013
    Publication date: March 12, 2015
    Applicant: ENTEGRIS, INC
    Inventors: Russ V. Raschke, Barry Gregerson, Jason Todd Steffens
  • Publication number: 20150068948
    Abstract: Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.
    Type: Application
    Filed: May 19, 2014
    Publication date: March 12, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yi Koan HONG, Byung Lyul PARK, Jumyong PARK, Jisoon PARK, Kyu-Ha LEE, Siyoung CHOI
  • Patent number: 8960442
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: February 24, 2015
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Publication number: 20150041360
    Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.
    Type: Application
    Filed: July 21, 2014
    Publication date: February 12, 2015
    Inventors: James A. WATSON, John BURNS, Martin L. FORBES, Matthew A. FULLER, Mark V. SMITH
  • Publication number: 20150041359
    Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.
    Type: Application
    Filed: May 19, 2014
    Publication date: February 12, 2015
    Applicant: Entegris, Inc.
    Inventors: Anthony Mathius Tieben, John Lystad, David L. Halbmaier
  • Publication number: 20150030416
    Abstract: Provided is a wafer stocker that can prevent the inflow of an external atmosphere, maintain a wafer storage space at a desired atmosphere with a relatively small amount of gas, and prevent dust from being attached to a wafer surface. A shutter portion, including multiple shield plates having the same height as an interval between shelf plates disposed in a storage container, is disposed with a slight space from a body portion, and by supplying clean gas into the storage container, a clean atmosphere of a higher pressure than an external environment is maintained, and a shutter portion is opened and closed by moving up and down the shield plate independently from the shelf plate that supports a wafer.
    Type: Application
    Filed: October 14, 2014
    Publication date: January 29, 2015
    Inventors: Fumio SAKIYA, Katsunori SAKATA
  • Publication number: 20150008154
    Abstract: The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.
    Type: Application
    Filed: September 23, 2014
    Publication date: January 8, 2015
    Inventors: Ray G. Brooks, Timothy Wayne Brooks
  • Patent number: 8919563
    Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: December 30, 2014
    Assignee: Entegris, Inc.
    Inventors: Barry Gregerson, Michael Shawn Adams, Jason Todd Steffens
  • Publication number: 20140367307
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Application
    Filed: November 8, 2011
    Publication date: December 18, 2014
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Patent number: 8910792
    Abstract: The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: December 16, 2014
    Assignee: Miraial Co., Ltd.
    Inventor: Tsuyoshi Nagashima
  • Patent number: 8905239
    Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: December 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doojin Kim, Hyungjin Lee, Youngsik Kim, Sungbok Hong, Yongmin Kim, Chulmin Kim
  • Patent number: 8881907
    Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: November 11, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Hiroki Yamagishi, Toshiyuki Kamada
  • Patent number: 8870014
    Abstract: A mask box having a buckling structure includes a base, a cover and a plurality of buckling elements. The base is configured to support a mask and has a plurality of troughs. The cover covers the base and has a plurality of pivotal portions. The buckling elements are positioned to correspond to the troughs. Each buckling element includes an engaging block and an elastic arm connected to the pivotal portion. The engaging block moves away from the periphery of the cover when the engaging block is subjected to an external force. The engaging block is buckled into the trough via an elastic restoring force of the at least one elastic arm when the external force is removed. By this arrangement, the assembly of the buckling elements is simplified and its product cost is reduced. Further, the present invention conforms to the requirements for environmental protection.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: October 28, 2014
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chih-Ming Lin, Kuan-Lun Pan
  • Publication number: 20140299508
    Abstract: The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.
    Type: Application
    Filed: April 7, 2014
    Publication date: October 9, 2014
    Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: CHIEN-FENG WANG, SHAO-WEI LU, PO-TIN LEE
  • Publication number: 20140262928
    Abstract: Disclosed are a tray for aligning semiconductor packages, a test handler using the same, and a method of aligning the semiconductor packages, and a test method using the same. According to the present inventive concept, the tray for aligning the semiconductor packages includes a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 18, 2014
    Inventors: Jong Won HAN, Sang Il KIM
  • Publication number: 20140238896
    Abstract: A substrate container having a limit structure includes a box, at least one limit structure and a door. The limit structure is disposed on a side wall of the box and has a plurality of limit grooves. Each limit groove has a first inclined surface and a second inclined surface. The angle of inclination of the second inclined plane relative to a horizontal plane corresponds to a coefficient of friction between materials of the substrate and the limit structure to lower the friction between the substrate and the second inclined plane of the limit groove, so that the substrate can ascend along the second inclined plane to get into the limit groove for the door to be closed smoothly. Through the limit structure to position the substrate, the present invention can prevent the substrate from shaking in the substrate container.
    Type: Application
    Filed: April 16, 2013
    Publication date: August 28, 2014
    Applicant: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: CHI-TE HUANG, CHIEN-FENG WANG, SHAO-WEI LU, TIEN-JUI LIN
  • Publication number: 20140231306
    Abstract: An apparatus for storing a substrate on which a pattern is formed includes a main body storing the substrate, a first pad located at the bottom of the main body and including a first groove supporting one edge of the substrate, a second pad neighboring the first pad and including a second groove supporting the center of the substrate, and a third pad spaced from the first pad, the second pad being disposed between the first and third pads, the third pad including a third groove supporting the other edge of the substrate.
    Type: Application
    Filed: February 20, 2014
    Publication date: August 21, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: Ji-Eun KIM, Dong-Yoon SO, Han-Soo KIM
  • Publication number: 20140231305
    Abstract: A cassette assembly for storing a plurality of platelike workpieces. The cassette assembly includes a first cassette, a second cassette stacked on the first cassette, and a fixing unit for fixing the first cassette and the second cassette to each other in the stacked condition. Both of the cassettes include a first side plate having workpiece supporting grooves, and a second side plate arranged parallel to the first side plate. The second side plate has workpiece supporting grooves respectively opposed to the workpiece supporting grooves of the first side plate, a top plate for connecting the upper ends of the first and second side plates, a bottom plate for connecting the lower ends of the first and second side plates, and a load/unload opening formed near the front ends of the first and second side plates, the top plate, and the bottom plate for loading and unloading the workpieces.
    Type: Application
    Filed: January 30, 2014
    Publication date: August 21, 2014
    Applicant: Disco Corporation
    Inventors: Nobukazu Dejima, Masaya Takeuchi, Seiki Ohishi, Yuji Okimoto, Naoya Tokumitsu, Takeshi Komaba
  • Patent number: 8800774
    Abstract: The present invention comprises a workpiece container for storing at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector according to the present invention may engage these extended portions or “grip zones” of the workpiece.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: August 12, 2014
    Assignee: Brooks Automation, Inc.
    Inventor: Anthony C. Bonora
  • Publication number: 20140197068
    Abstract: A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer.
    Type: Application
    Filed: December 23, 2013
    Publication date: July 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Ho CHO, Hyeog-Ki KIM, Kwang-Shin LIM
  • Patent number: 8776841
    Abstract: The present invention provides a method, system, and components for protecting reticles and specifically for minimizing haze formation on reticles during storage and use. By substantially continually maintaining a purge in a storage housing having a reduced humidity level on reticles or by temporarily storing the reticle in a container in proximity to a desiccant or getter when not being purged, haze formation can be eliminated, minimized, or sufficiently controlled. Moreover, a filter media in the container may be positioned to be “recharged” during the substantially continual purging of the reticle, a reduced desirable humidity level can be readily maintained in the reticle container when the container is not currently being purged. Additionally, the system of the invention can comprise an ionizer associated with the purge system. For example, the ionizer can be associated with at least one of the plurality of purge lines of the purge system.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: July 15, 2014
    Assignee: Entegris, Inc.
    Inventors: Oleg P. Kishkovich, Xavier Gabarre, William M. Goodwin, James Lo, Troy Scoggins
  • Patent number: 8746666
    Abstract: A media carrier, adapted to hold a plurality of pieces of magnetic media, is disclosed. This media carrier can be placed on the workpiece support, or platen, allowing the magnetic media to be processed. In some embodiments, the media carrier is designed such that only one side of the magnetic media is exposed, requiring a robot or other equipment to invert each piece of media in the carrier to process the second side. In other embodiments, the media carrier is designed such that both sides of the magnetic media are exposed. In this scenario, the media carrier is inverted on the platen to allow processing of the second side.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: June 10, 2014
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Richard Hertel, Julian Blake, Edward Macintosh, Alexander Kontos, Frank Sinclair, Christopher Rowland, Mayur Jagtap, Sankar Ganesh Kolappan
  • Publication number: 20140151264
    Abstract: A wafer carrier includes a body, a door and a plurality of stages. The body has at least a sidewall and a wafer receiving cavity for receiving at least a wafer, wherein the wafer receiving cavity extends into the body from an opening formed on the sidewall. The door is disposed out of the opening. The stages are in contact with the sidewall for supporting the body, respectively.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 5, 2014
    Inventor: Tian-Sing HUANG
  • Patent number: 8727125
    Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: May 20, 2014
    Assignee: Entegris, Inc.
    Inventors: Anthony Mathius Tieben, John Lystad, David L. Halbmaier
  • Patent number: 8720693
    Abstract: A main body may have a cavity for storing a plurality of parallel semiconductor wafers and an opening for transferring one or more semiconductor wafer into or from the cavity. A covering body may be mounted detachably to the opening in order to close the opening. A gasket may seal between an edge portion of the covering body and an edge portion of the opening. The gasket may be configured such that, when the opening is closed by the covering body, a size of a deformation margin of the gasket is formed to be smaller in a region that seals a vertical edge portion of the opening orthogonal to the face of each semiconductor wafer than in a region that seals a horizontal edge portion of the opening parallel to the face of each the semiconductor wafer.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: May 13, 2014
    Assignee: Miraial Co., Ltd.
    Inventor: Tsuyoshi Nagashima
  • Patent number: 8708145
    Abstract: The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: April 29, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yicheng Kuo, Shihhsiang Chen, Gang Yu, Jiahe Cheng, Zhilin Zhao
  • Patent number: 8689812
    Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: April 8, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Vinay K. Shah, Eric Englhardt, Jeffrey C. Hudgens, Martin R. Elliott
  • Publication number: 20140076774
    Abstract: An improved wafer container is provided for use with automated equipment. The container includes a top lid that engages with a bottom base to form a housing having an inner cavity for storing semiconductor wafers. The lid includes a handling member that interfaces with automated equipment for engaging the lid with the base and removing the lid from the base. The container includes latches that can be actuated between a locked position and an unlocked position by automated equipment. The container can hold multiple stacked wafer separator rings, each of which has automation tabs extending outwardly from the ring outer rim. The automation tabs allow for automated equipment to transfer the wafer separators rings between the container and a staging area.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 20, 2014
    Inventor: Kurt F. Kaashoek