Abstract: A positioning member is a carrier positioning member that is fixed to a base and that positions, on the base, a carrier storing a plurality of plate-shaped loads such that front faces or rear faces thereof face the base. The positioning member comprises two front-side stoppers that come into contact with two opening edge parts being end parts of an opening in the carrier, and restrict movement of the carrier to a front side, and two rear-side stoppers that come into contact with two plate-shaped end parts formed on a rear side in the carrier, and restrict movement of the carrier to the rear side and movement in a direction vertical to the base.

Abstract: A substrate container includes a container portion having an open side or bottom, and a door to sealingly close the open side or bottom, one of the door and the container portion defining access structure. The substrate container additionally includes a check-valve assembly, the check-valve assembly being retained with respect to the access structure to provide fluid communication with an interior of the substrate container. The check-valve assembly includes a grommet, the grommet being formed of an elastomeric material. A valve seat is disposed within the grommet, the valve seat being integrally formed with the grommet according to one aspect, and being formed of a separate piece according to another aspect. An elastomeric valve member, specifically an elastomeric umbrella valve member according to one aspect, is disposed within the grommet and held to engage the valve seat, thereby restricting fluid flow through the check-valve assembly with respect to the interior of the substrate container.

Abstract: A substrate storing container includes a filter unit having a housing that forms a ventilation path and a filter. The housing includes an outer housing portion and an inner housing portion at least partially disposed inside the outer housing portion and fastened to the outer housing portion. The inner housing portion has a male thread portion at a part disposed inside the outer housing portion. The outer housing portion has a female thread portion that meshes with the male thread portion. The inner housing portion has first engagement portions at a part that is disposed inside the outer housing portion and where the male thread portion does not exist. The outer housing portion has second engagement portions that engage with the first engagement portions at a part where the female thread portion does not exist. The first engagement portions and the second engagement portions are configured to be visually identifiable.

Abstract: A method includes transferring a tool monitoring device to a load port of a tool. An environmental parameter of the load port is monitored by the tool monitoring device. The tool monitoring device is removed from the load port after the environmental parameter of the load port is monitored. A door of the tool in front of the load port is closed. The door of the tool is kept closed during a period from a time of transferring the tool monitoring device to the load port to a time of removing the tool monitoring device from the load port.

Abstract: The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.

Abstract: A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

Abstract: A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.

Abstract: A substrate container including a plate, a shell, a connector, and a seal, where the connector is threaded and secured via a nut, and the seal contacts each of the shell, plate, and connector. The plate has a recess accommodating an end of the connector and the nut. Field-serviceable, removable purge modules including check valves may be used with the substrate container, and may be secured to the substrate container in the recess in the plate. Filters may be secured to the connector or included in the purge modules. These filters may have diameters larger than an internal diameter of the connector.

Abstract: The present disclosure provides devices, machines and methods for incubating or washing a biological sample membrane or gel automated processing of biological samples. This disclosure provides a device comprising a washing cassette, a sample holder, a poking gear and a washing basin assembly. The disclosure also provides machines comprising the device and methods using the device.

Abstract: There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.

Abstract: A cassette for receiving at least one substrate for a display device includes a base; and a first wall extending in a direction generally perpendicular to an upper surface of the base and a plurality of first projections extending from the first wall in a first direction and arranged in a second direction generally perpendicular to the first direction at substantially regular intervals. A first opening is defined between adjacent first projections to receive one end of a first substrate, the first opening includes a first portion having a first width in the second direction and a second portion having a second width greater than the first width, and the first portion is disposed closer to the first wall than the second portion.

Abstract: There is provided a method for molding a substrate storing container 1 including a container main body molding step of molding a container main body 2 in a state where a direction P2 perpendicular to a plane P1 passing through the entire periphery of an end edge of an opening circumferential portion 28 of the container main body 2 is inclined in a direction forming a predetermined angle a2, with respect to a horizontal direction L1 which is a movement direction of the movable die M1 with respect to the fixed die M2, and a pullout step of pulling the container main body 2 molded in the mold space M0 out from the movable die M1 by moving the movable die M1 so as to retreat from the fixed die M2.

Abstract: Embodiments of substrate transfer apparatus are provided herein. In some embodiments, an apparatus for storing and transporting at least one substrate in a vacuum includes a carrying case for storing one or more substrates, wherein the carrying case includes a vacuum port and a plurality of holders to hold one or more substrates within an inner volume of the carrying case; and a vacuum source in fluid connection with the carrying case via the vacuum port.

Abstract: Corrosion resistance of valves is enhanced, while ensuring the check valve function of the valves against an inflow of outside air. Disclosed is a substrate storage container that includes: a container body for storing at least one substrate; a lid for closing an opening of the container body; and at least one valve for controlling gas flow to the container body or from the container body. The at least one valve includes an elastic, non-metallic seal lip in a communication passage that extends in a first direction and communicates between an outside of the container body and an inside of the container body. The seal lip has an umbrella-like form which closes on one side in the first direction and opens on the other side in the first direction, the seal lip abutting an inner peripheral wall of the communication passage on the other side.

Abstract: A substrate container that utilizes a rocker linkage or a linear cam arrangement in latch mechanism that is actuated by a rotary cam. The rocker linkage or linear cam is mounted to an interior panel of a door of the substrate container and may be disposed proximate an edge portion of the interior panel. The rocker linkage or linear cam may be configured to exert an axial force component on a housing of the substrate container to seat the door against a seal member. The rocker linkage or linear cam also transfers the axial latching forces to the door to reduce transfer of forces to the cam. The rocker linkage or linear cam may be arranged to transfer axial forces in a radially outward direction when the latch mechanism is engaged, to prevent push back on the rotary cam.

Abstract: A purging nozzle unit of a gas supply device according to the present invention including: a housing that is capable of passing a predetermined gas so as to replace the internal atmosphere of a FOUP with the predetermined gas; a nozzle coming into intimate contact with the proximity of a port that is provided on one face of the FOUP, the nozzle being pressed to thereby open the port; an operation adjustment space configured to increase or decrease so as to operate the nozzle between a use posture in which the predetermined gas can be supplied into the target container via the port and a standby posture in which the predetermined gas cannot be supplied into the target container via the port; and a gas introducing part configured to export or import compression air relative to the operation adjustment space to thereby control an operation of the nozzle.

Abstract: A lid body side substrate receiving portion includes a lower side substrate guiding inclined face and an upper side substrate guiding inclined face. In a direction in which a groove extends while a container main body opening portion is closed by a lid body, a length of the lower side substrate guiding inclined face in the upper-lower direction becomes longer as approaching a center of the container main body opening portion.

Abstract: The present disclosure relates to a semiconductor device manufacturing system. The semiconductor device manufacturing system includes a processing module and a transfer module. The processing module includes a processing chamber that is configured to process a semiconductor wafer and a gate valve that is configured to provide access to the processing chamber. The transfer module includes a transfer chamber that is coupled to the processing chamber and a liner that is coupled to an inner surface of the transfer chamber. The liner is configured to reduce a volume of the transfer chamber prior to or during a transfer chamber pressure adjustment operation of the transfer module.

Abstract: Heights of wafers in a front opening unified pod are identified by using an end effector and a front sensor arranged thereon, such that the end effector can be positioned at the appropriate height when retrieving one of the wafers, so as to avoid colliding with a wafer stored inside the front opening unified pod. Wafer backside properties can also be detected by the end effector, so as to report defects and contaminants on the wafer.

Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.

Abstract: A wafer container includes a container body and a door. The container body has a pair of upright side walls, a top wall, a bottom wall and a rear wall cooperatively defining a container space with a front access opening. The door is removably engaged with the container body to close and seal the front access opening, and includes a front door panel, a rear door panel, and sealing means which is disposed at a periphery of the front door panel and configured to seal the gap between the door and the container body when the door is engaged with the container body to close the front access opening.

Abstract: Various embodiments provide a wafer box. The wafer box may include a housing with a receiving space for receiving at least one wafer arranged above a housing base, at least one fixing structure which is connected to the housing base and which extends from the housing base, and at least one fixing device which is fastenable to the at least one fixing structure at a variable distance from the housing base. The fixing device and the fixing structure are designed such that the at least one wafer for arrangement in the receiving space can be fixed in a position by means of the at least one fixing device fastened to the fixing structure.

Abstract: A storage device and a photoresist coating and developing machine having a storage device are disclosed. The storage device includes a frame and a plurality of layers of support plates disposed in sequence in the frame in a height direction of the frame, being used for receiving substrates to be exposed. The frame is provided with a plurality of layers of support members respectively associated with the plurality of layers of support plates, and each layer of the support plates is slidably mounted on the support member.

Abstract: A load port provided adjacent to a wafer transport chamber for taking in and out a wafer W between the wafer transport chamber and a FOUP, includes a plate-shaped part that constitutes a part of a wall of the wafer transport chamber, and has an opening for opening the wafer transport chamber; a door part for opening and closing the opening; a mounting table that is configured to mount a wafer storage container so as to oppose a lid part for opening and closing an internal space to the door part, and to move to and from the plate-shaped part; and an elastic part that is provided on the mounting table side of the plate-shaped part along the peripheral edge of the opening, wherein the elastic part elastically contacts the periphery of the lid part in the wafer storage container by moving the mounting table toward the plate-shaped part.

Abstract: A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. The apparatus includes a holding unit for the frame unit, a moving unit for the holding unit, and a control unit. The holding unit includes a pair of gripping portions for gripping a front portion of the ring frame at two separate positions, and an abutting portion adapted to abut against the outer circumference of the ring frame. The ring frame is gripped, partially drawn from the cassette, and released. The abutting portion is brought into abutment against the outer circumference of the ring frame so as to move the ring frame into the cassette. The ring frame is gripped again, raised, and transferred to the predetermined position.

Abstract: The lower lid includes a bottom plate that supports the substrate storing container and a lower lid peripheral wall that extends upwards from a periphery of the bottom plate. The sleeve member has a tubular shape having an axial center that extends in the vertical direction. The upper lid has a top plate and an upper lid peripheral wall that extends downwards. The lower lid includes device positioning portions. The device positioning portions can engage the positioned portion of the lifting device that lifts, from the lower lid, the substrate storing container which is supported by the lower lid in a state of the upper lid being removed therefrom.

Abstract: A wafer container that reduces or alleviates one or more of the problems associated with excessive container wall deflection due to loading and excessive particulate generation, particularly as those problems are experienced with containers for 450 mm diameter and larger wafers. The container has an enclosure and door with interlocking features to enable transfer of tension load to the door to minimize deflection of container surfaces. The container may include a gasketing arrangement compatible with the interlock feature. The container may include a removable door guide that improves centering of the door during door installation, and that is made of low particle generating material to reduce particulates.

Abstract: An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers respectively, and extend the wafer support to approximately the entire circumference of each wafer.

Abstract: A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

Abstract: Systems, methods, and components include an improved universal disk container for use in transporting, storing and processing data storage disks or other disk-shaped articles. A disk shipping system and method for shipping disks allows stocking a minimal number of components while still allowing packaging and shipment of different thickness of disks and different capacities of disks in a container. A universal disk cassette includes slots having a narrowed lower portion configured for handling different disks of the same diameter but different thicknesses while preventing disk to disk contact when the disks are tilted. A universal top cover is configured for cassettes loaded with different thicknesses of disks. The universal top cover can readily accommodate disks that are tilted in the cassette, and with vacuum bagging, more securely fix the disks in place in the container.

Abstract: A material handling apparatus adapted to support a plurality of disc-shaped platters, such as but not limited to a cassette assembly adapted to support data recording media or substrates during manufacturing. In some embodiments, a cassette assembly includes a base cassette with a base and opposing sidewalls configured to support an outermost perimeter of each of a first plurality of disc-shaped platters having a first diameter. An insert contactingly engages the base cassette. The insert has a plurality of spaced apart grooves to contactingly support an outermost perimeter of each of a second plurality of disc-shaped platters having a different, second diameter.

Abstract: A wafer container an enclosure portion including a top wall, a bottom wall, a pair of side walls, a back wall, and a door frame opposite the back wall, the door frame defining a front opening, and a wafer support structure including two side wafer supports 5 each side wafer support including a removable backstop. The invention includes maintaining wafer containers by replacing the removable backstop. The invention includes converting shipping containers that ship large diameter wafers vertically to containers to be used in fabrication facilities that store wafers horizontally for robotic pickup for processing.

Abstract: A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.

Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.

Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract: A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers. The system includes a wafer container enclosure defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; and a first removable wafer cushion attachable to the rear side of the front door adjacent the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves and slots.

Abstract: A wafer container for holding a spaced stack of thin wafers, comprising an H-bar carrier, a base portion for receiving same, a base wafer cushion attached at the bottom wall positioned below the H-bar carrier, the cushion having a plurality of ribs defining slots each with a bottom wafer seating region having a curvature and a pair of ends, each of the ends having a flare whereby the seating region flares outwardly at the ends, a cover portion that connects with the base portion to form a closed interior. The cover portion having an uppermost wall a wafer cushion secured thereto. The cover wafer cushion having a row of wafer engaging finger portions, the finger portions Y shaped and having two legs extending from a support portion and alternatingly extending from opposing support portions, the finger portions may be S shaped with a wafer pad flared in two direction.

Abstract: Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: Provided is a wafer stocker that can prevent the inflow of an external atmosphere, maintain a wafer storage space at a desired atmosphere with a relatively small amount of gas, and prevent dust from being attached to a wafer surface. A shutter portion, including multiple shield plates having the same height as an interval between shelf plates disposed in a storage container, is disposed with a slight space from a body portion, and by supplying clean gas into the storage container, a clean atmosphere of a higher pressure than an external environment is maintained, and a shutter portion is opened and closed by moving up and down the shield plate independently from the shelf plate that supports a wafer.

Abstract: The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.

Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

Abstract: A mask box having a buckling structure includes a base, a cover and a plurality of buckling elements. The base is configured to support a mask and has a plurality of troughs. The cover covers the base and has a plurality of pivotal portions. The buckling elements are positioned to correspond to the troughs. Each buckling element includes an engaging block and an elastic arm connected to the pivotal portion. The engaging block moves away from the periphery of the cover when the engaging block is subjected to an external force. The engaging block is buckled into the trough via an elastic restoring force of the at least one elastic arm when the external force is removed. By this arrangement, the assembly of the buckling elements is simplified and its product cost is reduced. Further, the present invention conforms to the requirements for environmental protection.

Abstract: The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.