Abstract: Disclosed are a tray for aligning semiconductor packages, a test handler using the same, and a method of aligning the semiconductor packages, and a test method using the same. According to the present inventive concept, the tray for aligning the semiconductor packages includes a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.

Abstract: A substrate container having a limit structure includes a box, at least one limit structure and a door. The limit structure is disposed on a side wall of the box and has a plurality of limit grooves. Each limit groove has a first inclined surface and a second inclined surface. The angle of inclination of the second inclined plane relative to a horizontal plane corresponds to a coefficient of friction between materials of the substrate and the limit structure to lower the friction between the substrate and the second inclined plane of the limit groove, so that the substrate can ascend along the second inclined plane to get into the limit groove for the door to be closed smoothly. Through the limit structure to position the substrate, the present invention can prevent the substrate from shaking in the substrate container.

Abstract: An apparatus for storing a substrate on which a pattern is formed includes a main body storing the substrate, a first pad located at the bottom of the main body and including a first groove supporting one edge of the substrate, a second pad neighboring the first pad and including a second groove supporting the center of the substrate, and a third pad spaced from the first pad, the second pad being disposed between the first and third pads, the third pad including a third groove supporting the other edge of the substrate.

Abstract: A cassette assembly for storing a plurality of platelike workpieces. The cassette assembly includes a first cassette, a second cassette stacked on the first cassette, and a fixing unit for fixing the first cassette and the second cassette to each other in the stacked condition. Both of the cassettes include a first side plate having workpiece supporting grooves, and a second side plate arranged parallel to the first side plate. The second side plate has workpiece supporting grooves respectively opposed to the workpiece supporting grooves of the first side plate, a top plate for connecting the upper ends of the first and second side plates, a bottom plate for connecting the lower ends of the first and second side plates, and a load/unload opening formed near the front ends of the first and second side plates, the top plate, and the bottom plate for loading and unloading the workpieces.

Abstract: The present invention comprises a workpiece container for storing at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector according to the present invention may engage these extended portions or “grip zones” of the workpiece.

Abstract: A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer.

Abstract: The present invention provides a method, system, and components for protecting reticles and specifically for minimizing haze formation on reticles during storage and use. By substantially continually maintaining a purge in a storage housing having a reduced humidity level on reticles or by temporarily storing the reticle in a container in proximity to a desiccant or getter when not being purged, haze formation can be eliminated, minimized, or sufficiently controlled. Moreover, a filter media in the container may be positioned to be “recharged” during the substantially continual purging of the reticle, a reduced desirable humidity level can be readily maintained in the reticle container when the container is not currently being purged. Additionally, the system of the invention can comprise an ionizer associated with the purge system. For example, the ionizer can be associated with at least one of the plurality of purge lines of the purge system.

Abstract: A media carrier, adapted to hold a plurality of pieces of magnetic media, is disclosed. This media carrier can be placed on the workpiece support, or platen, allowing the magnetic media to be processed. In some embodiments, the media carrier is designed such that only one side of the magnetic media is exposed, requiring a robot or other equipment to invert each piece of media in the carrier to process the second side. In other embodiments, the media carrier is designed such that both sides of the magnetic media are exposed. In this scenario, the media carrier is inverted on the platen to allow processing of the second side.

Abstract: A wafer carrier includes a body, a door and a plurality of stages. The body has at least a sidewall and a wafer receiving cavity for receiving at least a wafer, wherein the wafer receiving cavity extends into the body from an opening formed on the sidewall. The door is disposed out of the opening. The stages are in contact with the sidewall for supporting the body, respectively.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A main body may have a cavity for storing a plurality of parallel semiconductor wafers and an opening for transferring one or more semiconductor wafer into or from the cavity. A covering body may be mounted detachably to the opening in order to close the opening. A gasket may seal between an edge portion of the covering body and an edge portion of the opening. The gasket may be configured such that, when the opening is closed by the covering body, a size of a deformation margin of the gasket is formed to be smaller in a region that seals a vertical edge portion of the opening orthogonal to the face of each semiconductor wafer than in a region that seals a horizontal edge portion of the opening parallel to the face of each the semiconductor wafer.

Abstract: The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.

Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.

Abstract: An improved wafer container is provided for use with automated equipment. The container includes a top lid that engages with a bottom base to form a housing having an inner cavity for storing semiconductor wafers. The lid includes a handling member that interfaces with automated equipment for engaging the lid with the base and removing the lid from the base. The container includes latches that can be actuated between a locked position and an unlocked position by automated equipment. The container can hold multiple stacked wafer separator rings, each of which has automation tabs extending outwardly from the ring outer rim. The automation tabs allow for automated equipment to transfer the wafer separators rings between the container and a staging area.

Abstract: A separate supporting body for supporting semiconductor wafers of ?450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

Abstract: An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a rear wall connecting the rear edges of right and left side walls and extend laterally and parallel to each other at vertical spacings in such a manner as to be associated with right and left accommodating grooves.

Abstract: In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.

Abstract: A wafer container that reduces or alleviates one or more of the problems associated with excessive container wall deflection due to loading and excessive particulate generation, particularly as those problems are experienced with containers for 450 mm diameter and larger wafers. The container has an enclosure and door with interlocking features to enable transfer of tension load to the door to minimize deflection of container surfaces. The container may include a gasketing arrangement compatible with the interlock feature. The container may include a removable door guide that improves centering of the door during door installation, and that is made of low particle generating material to reduce particulates.

Abstract: Disclosed is a substrate processing apparatus which can inhibit the occurrence of spots, such as watermarks, by reducing the remaining of the liquid that has been used for liquid treatment, inhibit the turn-over of the wafer, and improve throughput. In the disclosed substrate processing apparatus including a carrying means for carrying a semiconductor wafer W while vertically holding the wafer, a wafer boat (a carrying means) includes lower holders holding the bottom portion of the wafer, and a couple of left/right upper holders for holding the bottom outer edges of the wafer when the wafer is turned over. The lower holder includes a holding groove part and a turn-over prevention groove part, which are integrally formed with each other.

Abstract: A front opening wafer container suitable for 450 mm wafers utilizes a wafer cushion on the front door with varying inclinations on the inside surface of a lower leg of V-shaped wafer cushion engagement portions on the door. Such provides enhanced performance. More specifically, in an embodiment of the invention, a front opening wafer container has, in cross section, horizontal V-shaped groove with the inside surface of the lower leg of the V having with at least two surface portions with different inclinations from horizontal. The surface portion adjacent the apex, where the edge of the wafer seats, having a lesser inclination from horizontal than a surface portion more distal from apex.

Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween. The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.

Abstract: A container for holding a plurality of substrates includes an enclosure portion defining an interior space. The enclosure has a pluralit of slots for receiving the substrates, and a door (26) for sealingly closing an open side A cushion (62) is received on the door.

Abstract: A wafer container, comprising: a container body, the container body having a plurality of slot portions on two opposite sidewalls of the interior of the container body for horizontally sustaining a plurality of wafers, each slot portion having a horizontal carrying portion, an opening being formed on one side of the container body for exporting and importing a plurality of wafers; and a door, said door having an inner surface and a outer surface, the inner surface being joined with the opening of the container body for protecting the plurality of wafers therein, the characteristic in that: an elasticity module is disposed on the inner wall of the rear end of the container body opposite to the opening, the elasticity module having a rectangular body and a convex portion bending toward the interior of the container body being respectively formed on two longer opposite sides of the rectangular body.

Abstract: A mask blank container adapted to house a mask blank with a resist film. The container comprises a container body 5 for receiving the mask blank; a cap member 6 to be put on the container body; and a fixing member 9 adapted to fix the container body and the cap member to each other when the cap member is put on the container body. The container body and the cap member have fitting portions 51 and 61 made of a resin material and fitted to each other, respectively. The fixing member comprises a first member 91 having an engaging portion 91 a to be engaged with the fitting portion of the cap member, and a second member 92 having an engaging portion 93 to be engaged with the fitting portion of the container body. A distance between the engaging portions of the first and the second members is desired to be variable.

Abstract: A wafer transport pod for storing or transporting semiconductor wafers during semiconductor wafer processing includes a body having a top panel, a bottom panel, a back panel, two side panels and a front panel. The two side panels are configured for receiving the semiconductor wafers therebetween, The two side panels have a plurality of separately hermetically sealed partitions inside the body, any two of the sealed partitions for sealing a wafer therebetween and for preventing wafer contamination. The front panel provides ingress and egress for the semiconductor wafers to and from the wafer transport pod.

Abstract: A wafer container includes a container body, which comprises a plurality of sidewalls, a bottom, and a top to define a space for containing wafers, an opening being formed on one sidewall, and a door with an outer surface and an inner surface. The top of the container body is disposed with a robotic flange which comprises a foolproof structure and a hemi-circular snap-hook portion that are disposed at the center and its circumference of a lower surface of the robotic flange facing the top. The foolproof structure has a geometric hole for a protruding portion on the top of the container body to be plugged in. After the protruding portion is plugged into the geometric hole, the robotic flange is further rotated along the container body about 180 degrees for the hemi-circular snap-hook portion to be engaged in a hemi-circular supporting portion on the top of the container body.

Abstract: In a transfer system for wafers, etc., a coupling chamber corresponding to a port is formed only when a transfer box comes in tight contact with an apparatus as a transfer target in the transfer box is transferred into the apparatus, so that the transfer target will be transferred into the apparatus together with the coupling chamber, thereby simplifying the structures of the transfer box and apparatus and also allowing the transfer target to be transferred into the apparatus without fail.

Abstract: When a lid (20) is attached to a substrate removal/insertion opening (2) in a container body (1), a placement piece forcible displacement means (22) forcibly moves a substrate placement piece (4), which is provided in a region in the vicinity of the substrate removal/insertion opening (2), to a displacement position which does not overlap with a disc-shaped substrate (W). Thus, even if the disc-shaped substrate (W) is increased in diameter, there is no risk of the stored disc-shaped substrate (W) coming into contact with the substrate placement piece (4) due to factors such as vibration or impact, thus the disc-shaped substrate (W) can be stored more safely.

Abstract: A disk placement and storage assembly for storage of disks includes a disk cassette and a disk slotter. The disk cassette includes a pair of side wall portions spanning between a pair of end portions, defining a disk receiving region. The side wall portions include a plurality of vertical slots for holding the disks. The disk slotter includes a top plate having a plurality of horizontal slots spanning across top surfaces of the disk cassette when the disk slotter is releasably coupled to the disk cassette, each one of the horizontal slots arranged and dimensioned to receive a disk as the disk is inserted through a horizontal slot in the disk slotter and into a pair of laterally opposing vertical slots of the disk cassette, each one of the plurality of horizontal slots located above and aligned with a pair of laterally opposing vertical slots in the disk cassette.

Abstract: Wafer protecting grooves (10) are provided on an innermost wall (1b) of a container body (1). The wafer protecting grooves have a cross-sectional configuration in the shape of undulations having bottoms (10b), which are most distant from an opening (1a), at respective positions facing the outer edges of semiconductor wafers (W), and having an opening width wider than the thickness of each semiconductor wafer (W). In a normal state, an imaginary line (Q) connecting together the tops of the undulations is inward of or at the same position as the outer edges of the semiconductor wafers (W) facing the imaginary line. Thus, it is possible to obtain superior impact resistance that makes the semiconductor wafers (W) in the container body (1) unlikely to be damaged even when a large impact is applied thereto by a fall or other handling errors.

Abstract: A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, and a long slot is disposed on one side of the outgassing channel, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals.

Abstract: A Front Opening Unified Pod (FOUP) having a purgeable supporting module disposed at the junction of each sidewall and the backwall of the container, the characteristic of the FOUP being in that: the purgeable supporting module has a buffer gas chamber and a gas inlet is disposed at one end of the buffer gas chamber and connected to a gas valve on the bottom surface, an outgassing channel is disposed on the purgeable supporting module facing the opening of the FOUP, a long slot is disposed on one side of the outgassing channel and a kind of porous material is disposed in the long slot, an airflow channel being disposed between and thus connecting the outgassing channel and the buffer gas chamber, and a plurality of supporting ribs being vertically disposed on one side of the long slot at intervals.

Abstract: An arrangement comprising: at least one power semiconductor module and a transport packaging. The power semiconductor module has a base element, a housing and connection elements. The transport packaging has a cover layer, an interlayer with a respective cutout assigned to the power semiconductor module, and a cover film. The cover layer is generally planar, and has a first main surface facing the power semiconductor module. The interlayer is arranged on the first main surface of the cover layer. The power semiconductor module is arranged in the cutout, on the first main surface of the cover layer, wherein the base element of the power semiconductor module is disposed on the first main surface of the cover layer. The cover film bears on and covers substantial parts of the housing of the power semiconductor module. The cover film is connected to the first main surface of the interlayer.

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface.

Abstract: An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers respectively, and extend the wafer support to approximately the entire circumference of each wafer.

Abstract: The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.

Abstract: A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.

Abstract: When a lid (20) is attached to a substrate removal/insertion opening (2) in a container body (1), a placement piece forcible displacement means (22) forcibly moves a substrate placement piece (4), which is provided in a region in the vicinity of the substrate removal/insertion opening (2), to a displacement position which does not overlap with a disc-shaped substrate (W). Thus, even if the disc-shaped substrate (W) is increased in diameter, there is no risk of the stored disc-shaped substrate (W) coming into contact with the substrate placement piece (4) due to factors such as vibration or impact, thus the disc-shaped substrate (W) can be stored more safely.

Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

Abstract: A substrate storage container includes: a container body of a front open box type for holding a multiple number of semiconductor wafers supported in alignment by supporting ribs; a bottom plate removably attached to the bottom of the container body; and a pair of conveyor contact rails integrally formed along both the left and right sides of this bottom plate. These conveyor contact rails inhibit vibrations and impacts acting on the semiconductor wafers when the sealed container body is conveyed by a conveyor.

Abstract: A retainer includes a frame, a pair of first elastic parts projected from a pair of opposing parts of the frame so as to approach to each other, and a second elastic part that is supported at the bent free ends of the paired first elastic parts to hold a substrate. The outside end of the second elastic part is positioned outside the free end of the first elastic part and closer to the opposing part of the frame. Also, first and second holds for holding the rim of the substrate are formed apart from each other. The second hold is positioned on the outer end side of the second elastic part from the first hold.

Abstract: A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.

Abstract: A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.

Abstract: An arrangement comprising at least one power semiconductor module and a transport packaging, wherein the power semiconductor module has a base element, a housing and connection elements and the transport packaging has a generally planar cover layer, a cover film and at least one trough-like plastic shaped body for each power semiconductor module. The at least one plastic shaped body only partly encloses the respective power semiconductor module and a part of the plastic shaped body does not directly contact the power semiconductor module. Furthermore, a first side of the at least one power semiconductor module becomes situated directly or indirectly on the first main surface of the cover layer, while the cover film covers the further sides of the power semiconductor module directly and/or indirectly, and bears at least partly against the plastic shaped body.

Abstract: The present invention relates a sealing apparatus with interlocking air inflation device for wafer carrier and a sealing method thereof, wherein the sealing apparatus is disposed between a wafer container and a cover of a wafer carrier, used for sealing the cover and the wafer container when the cover is closed to the wafer container. The sealing apparatus comprises: at least one latch set, at least one interlocked cam, an air inflation sealing member, and at least one air intake/outtake valve, wherein the interlocked cam is adopted for connecting an interlocking device having an air inflation member, and the interlocking device can be used to drive the interlocked cam for making the latch set bolt the cover and the wafer container, and inflate the air inflation sealing member through the air inflation member thereof and the air intake/outtake valve in order to inflate and expand the air inflation sealing member.

Abstract: The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.