Abstract: A pipe protection device which is provided at a supply-side coupler provided at an end portion of a supply pipe which supplies a heat exchange medium to a heat exchange unit, and a discharge-side coupler provided at an end portion of a discharge pipe from which the heat exchange medium, which is supplied from the supply pipe to the heat exchange unit, is discharged, includes a supply-side support part having a recess along a contour of part of the supply pipe, a discharge-side support part having a recess along a contour of part of the discharge pipe, and a connecting part which supports the supply-side support part and the discharge-side support part at a predetermined interval and connects the supply-side support part and the discharge-side support part to a housing constituting a server.

Abstract: A reticle carrier described herein is configured to quickly discharge the residual charge on a reticle so as to reduce, minimize, and/or prevent particles in the reticle carrier from being attracted to and/or transferred to the reticle. In particular, the reticle carrier may be configured to provide reduced capacitance between an inner baseplate of the reticle carrier and the reticle. The reduction in capacitance may reduce the resistance-capacitance (RC) time constant for discharging the residual charge on the reticle, which may increase the discharge speed for discharging the residual charge through support pins of the reticle carrier. The increase in discharge speed may reduce the likelihood that an electrostatic force in the reticle carrier may attract particles in the reticle carrier to the reticle.

Abstract: A carrier spacer includes an annular main body, a first tapered part formed on an inner peripheral part of a front surface of the main body, a second tapered part formed on the inner peripheral part of a reverse surface of the main body, a flat surface formed on the outer peripheral side of the first tapered part on the front surface of the main body and holding the reverse surface of the outer peripheral part of a semiconductor wafer, a peripheral edge part formed on the outer peripheral side of the flat surface of the main body and provided with a step having a height position higher than a height position of the flat surface, an arcuate cutout part formed from the peripheral edge part to the flat surface of the main body, and a pair of handles protruding from the peripheral edge part toward the outer peripheral side.

Abstract: Provided is a substrate storing container in which a latching mechanism includes an engagement latch 32, an engagement latch lifting/lowering cam 35 that causes the engagement latch 32 to advance to and retreat from an engagement concave portion and causes the engagement latch 32 in the engagement concave portion to move toward/away from the other end portion of a container main body by advancing and retreating in a direction in which the engagement latch 32 advances and retreats, and a rotating cam 31, and the engagement latch lifting/lowering cam 35 includes an engagement latch connection portion 357 that causes the engagement latch 32 to be engaged with the engagement concave portion and thereafter causes the engagement latch 32 to approach the other end portion of the container main body by moving in a direction in which the engagement latch 32 approaches the engagement concave portion.

Abstract: A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.

Abstract: Provided is a wafer container including a frame having a first sidewall and a second sidewall extending along a YZ plane; a plurality of first support structures disposed on the first sidewall and arranged along a Z direction; and a plurality of second support structures disposed on the second sidewall and arranged along the Z direction. One of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder. The wafer holder includes a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along a X direction. A method for holding at least one wafer is also provided.

Abstract: The disclosure relates to a door opener to open a door of a cassette with substrates, the opener having a first wall to engage with the cassette and having a first opening to transfer the door and the substrates and a second wall opposite the first wall and having a second opening to transfer substrates. The door opener may have a closure device to hold the door of the cassette and having first and second sides and moveable in a chamber formed between the first and second wall. The opener may have a first actuator to move the closure device in a first direction from a first closing position where the first side closes against the first wall to a second closing position where the second side closes against the second wall, and from the second closing position to a transport position in between the first and second closing positions.

Abstract: Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).

Abstract: A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.

Abstract: A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

Abstract: A substrate processing method includes an intermediate processing step of processing the pattern forming surface by the intermediate processing liquid after a chemical liquid processing step, a filler discharging step of discharging a filler after the intermediate processing step, a filler spreading step of spreading the filler, a solidified film forming step of solidifying the filler, a lower position disposing step of making a blocking member be disposed at a lower position prior to start of the chemical liquid processing step, and a blocking member elevating step of starting elevation of the blocking member toward an upper position in a state where the pattern forming surface is covered with the intermediate processing liquid. The chemical liquid is discharged from a central nozzle. Spreading of the filler is started in a state where the blocking member is positioned at the upper position.

Abstract: A dummy wafer storage cassette for storing dummy wafers. The dummy wafer storage cassette may have more than 30 wafer slots for accommodating dummy wafers. The dummy wafer cassette may have substantially the same outer dimensions as a standardized wafer cassette with 25 wafer slots and a pitch of the wafer slots of the dummy wafer storage cassette may be smaller than a pitch between the wafer slots in the standardized wafer cassette.

Abstract: A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

Abstract: Provided is a substrate storage container including a valve(s) capable of controlling flow of gas without using a metallic member. The valve(s) are attached to a substrate storage container and include: a cylindrical body having an open edge and an interior space; a stopcock portion partitioning the interior space into a first space and a second space and extending to the open edge; and an elastic body covering the open edge and the stopcock portion. The first space has a first communication hole communicating with an outside of the container body. The second space has a second communication hole communicating with an inside of the container body. The elastic body controls flow of gas relative to the container body by closely contacting the stopcock portion or separating from the stopcock portion.

Abstract: A wafer shipper utilizing wafer support rings for supporting individual wafers therein. The wafer support rings can support wafers of various thicknesses without affecting the height of the stack, and provide containment of the resident wafers within the rings during an impact event. The wafers and the rings cooperate to define voids between the wafers that act as cushions in an impact event for dampening the shock imparted on the wafers during an impact event. Likewise, some embodiments include structure that defines enclosed gas pockets between the uppermost and the lowermost wafers of the stack for dampening the effects of an impact. Various embodiments include structure that prevents wafers from “jumping” out of the wafer support rings during an impact event. Some embodiments include structure for supporting wafer flats.

Abstract: A substrate retainer (110) is provided which presents a substantially uniform contact face (128) that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face (128) is allowed to deflect and compress in order to eliminates the prospect of substrates (114) being damaged by or becoming inadvertently pinched within the substrate retainer (110) or from being pressed too hard by the uniform contact face (128). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.

Abstract: The disclosure is related to a method for producing at least one semiconductor component coupled to a target substrate, where a coupon comprising one or more constituent layers of the at least one semiconductor component is transferred to the target substrate by transfer printing. The coupon is embedded in a portion of a support layer thereby forming an enlarged coupon provided with solid alignment markers on the underside thereof. Corresponding hollow alignment markers exist on the location of the target substrate where the coupon is to be placed. The alignment markers engage to thereby align the coupon to the target location. The disclosure is equally related to a device assembly obtainable by the method.

Abstract: A purge tower assembly for a substrate container. The assembly may include a purge interface body, including a base portion and a top portion, for mounting to a bottom plate of a substrate container. The base portion may include a substantially tubular base sidewall and the top portion may have a top sidewall positioned on the top edge of the base portion. The top portion may include an inlet nozzle for mounting through a rearward inlet in the bottom plate. The inlet nozzle may have a substantially tubular sidewall extending upwardly from the top sidewall and defining an interior of the inlet nozzle. The base portion and the top sidewall may define an offset conduit portion disposed connected to the base portion and the inlet nozzle, the base portion and the inlet nozzle in fluid communication via the offset conduit portion.

Abstract: In various embodiments, a wafer box is provided. The wafer box may include a housing with a receiving space for receiving a stack comprising a plurality of wafers, each arranged above a housing base. The wafers are to be arranged with their main surfaces parallel to the housing base. The receiving space is delimited by the housing base and side walls arranged thereon. The wafer box may further include at least one base opening, arranged in the housing base, for receiving a guide structure of a wafer stacking aid. The guide structure is to be arranged in such a way that, on a side of the housing base on which the side walls are arranged, it extends out of the housing base in order to limit tilting of a wafer raised or lowered in the receiving space in a manner guided by the guide structure.

Abstract: A mask transmission equipment is provided. The mask transmission equipment includes a wafer transmission container and a supporting bracket. The wafer transmission container includes a plurality of first positioning grooves and a plurality of second positioning grooves. The first positioning grooves face the second positioning grooves. The first positioning grooves and the second positioning grooves are adapted to position a plurality of wafers. The supporting bracket is disposed in the wafer transmission container. The supporting bracket includes a first supporting unit, a second supporting unit, a first wing and a second wing. The first supporting unit is stacked on the second supporting unit. The first wing is disposed on a first side of the supporting bracket. The second wing is disposed on a second side of the supporting bracket. The first side is opposite to the second side.

Abstract: Disclosed is a gas purge filter used in a housing container provided with a container main body and a lid body. The gas purge filter has a filter housing having a ventilation space where gas outside the housing container and gas of a housing space can be ventilated, and a pad formed outside the housing space of the filter housing to cover an outer peripheral face of a nozzle portion that forms a part of the ventilation space. The pad is formed of an elastic body.

Abstract: A liquid sample drying device, dried sample test piece and the preparation method for the dried sample test piece are provided. The liquid sample drying device includes two substrates, at least one spacer and a clamping member. Each of the two substrates includes a surface. The two surfaces face each other. The at least one spacer is located in between the substrates so as to form a sample region between the surfaces for receiving a liquid sample. The clamping member touches the two substrates so as to temporarily clamp and fix the two substrates and the at least one spacer together.

Abstract: A container for storing and transporting a probe card, the container having a container body having an interior surface configured to define: an interior space for housing the probe card, and an opening sized to allow insertion and removal of the probe card into and out of the interior space; a lid configured to be removably fitted to the opening of the container body to close the opening; and a probe card support insert connected to the interior surface of the container body, wherein the probe card support insert has a probe card support surface configured to support a more probe card housed in the interior space of the container body, wherein the interior surface of the container body and the probe card support insert are configured to be removably connected.

Abstract: A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.

Abstract: A manufacturing method of a microstructure includes providing a patch manufacturing sheet formed in a state in which a bottom layer is exposed on an upper part thereof; providing the patch manufacturing sheet on a first process substrate and a second process substrate; spotting a viscous composition at a plurality of positions spaced apart from each other on the bottom layer of the patch manufacturing sheet provided on only the first process substrate, or provided on both of the first process substrate and the second process substrate; contacting the patch manufacturing sheet provided on the second process substrate or the viscous composition to the viscous composition spotted on the patch manufacturing sheet provided on the first process substrate; moving relatively the second process substrate with respect to the first process substrate to stretch the viscous composition and to coagulate the stretched viscous composition; and cutting the coagulated viscous composition.

Abstract: A reticle protection device capable of keeping a reticle therein is provided with an inner pod capable of keeping the reticle therein; an outer pod capable of keeping the inner pod therein; an electroconductive movable contact portion provided on at least one of the inner pod and the outer pod and being capable of coining into contact with an electroconductive film of the reticle; and a leaf spring for achieving electric conduction of the contact portion to at least one of the inner pod and the outer pod. The reticle is kept in the inner pod and the inner pod is kept in the outer pod, thereby enabling stable grounding of the reticle.

Abstract: The present invention relates to a pot for a cosmetic product, the pot being opened by rotating a lid thereby bringing about a relative rotation between a cover and a mounting plate forming the lid, and thereby causing the pivoting of coupling elements which, in a closed position of the pot, are engaged in at least one cutout formed in a neck of a base of the pot.

Abstract: A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an expedient manner providing robust connections and cost efficiencies. A container portion has an open front and receives on a bottom surface a base plate secured by twist lock connectors that also provide recesses for purge grommets. Kinematic coupling components readily and robustly lock onto the base plate. Interior wafer support components latch onto brackets on the side walls utilizing a separate locking insert with holding tabs and locking detents. A wafer retainer provides support and counters enhanced wafer sag associated with 450 mm wafers when the door is installed and seated.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.

Abstract: An improved system and method for purging a microenvironment to desired levels of relative humidity, oxygen, or particulates through the implementation of a purge gas delivery apparatus and method that provides even distribution of the purging gas within the microenvironment. A substrate container has a tower therein with a fluid flow passageway extending the length of the tower. Apertures with porous media between the aperture and fluid flow passageway regulate the volume and pressure of air discharging at each aperture. Alternatively, the tower may be formed of a porous tubular polymeric material. A sleeve may direct the discharge purge gas in the interior.

Abstract: A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.

Abstract: The tip face 411 of the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322 have a positional relationship of facing each other, and a bottom portion space 413 is formed between the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322. A pair of side faces 412 of the base portion 41 inserted into the retaining groove 321 and the pair of groove side faces 323 have a positional relationship of facing each other, and side face spaces 324 which are in communication with an opening of the retaining groove 321 are respectively formed between the pair of side faces 412 of the base portion 41 inserted into the retaining groove and the pair of groove side faces 323, and the bottom portion space is in communication with the side face space.

Abstract: A semiconductor device manufacturing method which improves working efficiency. The method includes the step of transporting by air a package as a sealed moisture-proof bag which contains a case housing a semiconductor wafer laminate, in which the semiconductor wafer laminate has a plurality of semiconductor wafers stacked with a protective sheet interposed between semiconductor wafers. In order to facilitate separation of the protective sheet from the semiconductor wafers after unpacking the package, the protective sheet has a plurality of convex parts, a plurality of concave parts, and a flat part between a convex part and a concave part. A hole penetrating the protective sheet is made in each convex part and the center of the hole is located off the apex of the convex part.

Abstract: A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.

Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.

Abstract: A substrate container includes a housing, rack members, housing-side support members for supporting ends of substrates, a moving mechanism for moving the substrates, a lid, and lid-side support members for supporting ends of the substrates. The housing-side support members have deepest portions for supporting the ends of the substrates to be immovable upward. In a state where the lid is attached to the housing, the housing-side support members and lid-side support members clamp the ends of the substrates in between, with lower surfaces of the substrates out of contact with the rack members, and the housing-side support members support the ends of the substrates in the deepest portions. When the lid detaches from the housing, the moving mechanism moves the substrates supported in the deepest portions to disengage the ends of the substrates from the deepest portions, and places the substrates in a substantially horizontal position on the rack members.

Abstract: A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.

Abstract: The present invention relates to a latch guide assembly configured on the bottom of a wafer carrier. The latch guide assembly comprises a guide module having at least one guiding groove, a latch module having at least one side plate and at least one recess on the at least one side plate, and at least one rolling unit configured between the at least one guiding groove and the at least one recess. The latch module combines with the guide module via the at least one rolling unit and moves along with the guide module. The latch guide assembly provides a precise moving mechanism to lock/unlock the wafer carrier and reduces both the failure rate and dust production.

Abstract: A door which closes an opening in a container body of a thin plate container. A door body has latch passage holes in the circumference thereof, which correspond to latch recesses in an inner circumferential surface of the opening, and a component installation space. A rotary cam is received in the component installation space and is rotated by manipulation. Latch arms, each having one end connected to the rotary cam in the component installation space, reciprocate depending on a direction of rotation of the rotary cam so that free end areas thereof enter or exit the latch recesses through the latch passage holes. When the rotary cam rotates in a locking direction, the latch arms move along straight lines until at least portions of the free end areas are inserted into the latch recesses and then pivot so that the free end areas are pressed toward the container body.

Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.

Abstract: Provided is a wafer stocker that can prevent the inflow of an external atmosphere, maintain a wafer storage space at a desired atmosphere with a relatively small amount of gas, and prevent dust from being attached to a wafer surface. A shutter portion, including multiple shield plates having the same height as an interval between shelf plates disposed in a storage container, is disposed with a slight space from a body portion, and by supplying clean gas into the storage container, a clean atmosphere of a higher pressure than an external environment is maintained, and a shutter portion is opened and closed by moving up and down the shield plate independently from the shelf plate that supports a wafer.

Abstract: A reticle pod includes an outer pod shell and an outer pod door disposed under the outer pod shell. The outer pod door has at least one gas control hole. A seal ring is disposed between the outer pod shell and the outer pod door. A valve is disposed in each gas control hole. The outer pod shell and the outer pod door are configured to form an enclosure space in order to store a reticle. The seal ring seals the gap between the outer pod shell and the outer pod door. The at least one valve is configured to control gas flow in and out of the enclosure space.

Abstract: A tray for retaining sliders, such as during washing and/or transporting process steps. The tray has a planar body comprising a top surface having a plurality of cavities therein, an opposite bottom surface having a plurality of recesses therein, and a perimeter. Each cavity is oppositely aligned with a respective recess, with each cavity and its respective recess connected by a passage through the body.

Abstract: The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.

Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.

Abstract: The suppression of resin leakage is combined with the suppression of damage to the functional wiring area of a wiring board in forming an encapsulation resin. A method for manufacturing a semiconductor device includes the step of clamping a wiring board with a first mold and a second mold. The second mold includes: a flat portion contacting a wiring board; a recessed portion forming a cavity to form an encapsulation resin; and a projecting portion formed at a location spaced apart from the recessed portion on the flat portion, the projecting portion projecting on the first mold side, and extending along the first edge of the wiring board.

Abstract: A workpiece carrier comprises a first plate having a first outer diameter, a first inner diameter, and a first recess extending a first distance from the first inner diameter toward the first outer diameter. The workpiece carrier further comprises a second plate having a second outer diameter, a second inner diameter, and a second recess extending a second distance from the second inner diameter toward the second outer diameter. A plurality of mating features associated with the first plate and second plate are configured to selectively fix a position of a first workpiece between the first plate and second plate within the first recess and second recess.

Abstract: A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly.

Abstract: A support structure for supporting an exchangeable object in a lithographic exposure apparatus includes a first support structure part and a second support structure part, the first support structure part being arranged to support the object, and the second support structure part being arranged to, at least in part, support the first support structure part. At least one of the first support structure part and the second support structure part has an open-box structure. The first support structure part and the second support structure part are configured to be attached to one another in such a way that the first support structure part and the second support structure together form a closed-box structure.