For A Semiconductor Wafer Patents (Class 206/710)
  • Patent number: 10261109
    Abstract: A container for storing and transporting a probe card, the container having a container body having an interior surface configured to define: an interior space for housing the probe card, and an opening sized to allow insertion and removal of the probe card into and out of the interior space; a lid configured to be removably fitted to the opening of the container body to close the opening; and a probe card support insert connected to the interior surface of the container body, wherein the probe card support insert has a probe card support surface configured to support a more probe card housed in the interior space of the container body, wherein the interior surface of the container body and the probe card support insert are configured to be removably connected.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 16, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Christopher Belfi, Amy Kraus
  • Patent number: 10242899
    Abstract: A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: March 26, 2019
    Inventors: Chien-Ming Kuo, Hung-Ching Chang
  • Patent number: 10231879
    Abstract: A manufacturing method of a microstructure includes providing a patch manufacturing sheet formed in a state in which a bottom layer is exposed on an upper part thereof; providing the patch manufacturing sheet on a first process substrate and a second process substrate; spotting a viscous composition at a plurality of positions spaced apart from each other on the bottom layer of the patch manufacturing sheet provided on only the first process substrate, or provided on both of the first process substrate and the second process substrate; contacting the patch manufacturing sheet provided on the second process substrate or the viscous composition to the viscous composition spotted on the patch manufacturing sheet provided on the first process substrate; moving relatively the second process substrate with respect to the first process substrate to stretch the viscous composition and to coagulate the stretched viscous composition; and cutting the coagulated viscous composition.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: March 19, 2019
    Assignee: RAPHAS CO., LTD.
    Inventors: Hong Kee Kim, Jung Dong Kim, Jung Hyun Bae, Yang Gi Lee, So Hyun Park, Do Hyeon Jeong
  • Patent number: 10234766
    Abstract: A reticle protection device capable of keeping a reticle therein is provided with an inner pod capable of keeping the reticle therein; an outer pod capable of keeping the inner pod therein; an electroconductive movable contact portion provided on at least one of the inner pod and the outer pod and being capable of coining into contact with an electroconductive film of the reticle; and a leaf spring for achieving electric conduction of the contact portion to at least one of the inner pod and the outer pod. The reticle is kept in the inner pod and the inner pod is kept in the outer pod, thereby enabling stable grounding of the reticle.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: March 19, 2019
    Assignee: NIKON CORPORATION
    Inventor: Kazuya Ota
  • Patent number: 10154718
    Abstract: The present invention relates to a pot for a cosmetic product, the pot being opened by rotating a lid thereby bringing about a relative rotation between a cover and a mounting plate forming the lid, and thereby causing the pivoting of coupling elements which, in a closed position of the pot, are engaged in at least one cutout formed in a neck of a base of the pot.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: December 18, 2018
    Assignee: CHANEL PARFUMS BEAUTE
    Inventors: Christian Salciarini, Julien Chandelier, Gregory Perbal
  • Patent number: 10147624
    Abstract: A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an expedient manner providing robust connections and cost efficiencies. A container portion has an open front and receives on a bottom surface a base plate secured by twist lock connectors that also provide recesses for purge grommets. Kinematic coupling components readily and robustly lock onto the base plate. Interior wafer support components latch onto brackets on the side walls utilizing a separate locking insert with holding tabs and locking detents. A wafer retainer provides support and counters enhanced wafer sag associated with 450 mm wafers when the door is installed and seated.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: December 4, 2018
    Assignee: Entegris, Inc.
    Inventors: Michael S. Adams, Barry Gregerson, Matthew A Fuller
  • Patent number: 10062597
    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: August 28, 2018
    Assignee: FormFactor Beaverton, Inc.
    Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
  • Patent number: 10043696
    Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: August 7, 2018
    Assignee: Entegris, Inc.
    Inventors: James A. Watson, John Burns, Martin L. Forbes, Matthew A. Fuller, Mark V. Smith
  • Patent number: 10032660
    Abstract: An improved system and method for purging a microenvironment to desired levels of relative humidity, oxygen, or particulates through the implementation of a purge gas delivery apparatus and method that provides even distribution of the purging gas within the microenvironment. A substrate container has a tower therein with a fluid flow passageway extending the length of the tower. Apertures with porous media between the aperture and fluid flow passageway regulate the volume and pressure of air discharging at each aperture. Alternatively, the tower may be formed of a porous tubular polymeric material. A sleeve may direct the discharge purge gas in the interior.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: July 24, 2018
    Assignee: Entegris, Inc.
    Inventors: John Burns, Mark Smith, Matthew Fuller
  • Patent number: 9892948
    Abstract: A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: February 13, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Jen Lu, Ming-Hsien Lee, Chih-Hung Huang, Chuan-Pu Chen
  • Patent number: 9887116
    Abstract: The tip face 411 of the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322 have a positional relationship of facing each other, and a bottom portion space 413 is formed between the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322. A pair of side faces 412 of the base portion 41 inserted into the retaining groove 321 and the pair of groove side faces 323 have a positional relationship of facing each other, and side face spaces 324 which are in communication with an opening of the retaining groove 321 are respectively formed between the pair of side faces 412 of the base portion 41 inserted into the retaining groove and the pair of groove side faces 323, and the bottom portion space is in communication with the side face space.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 6, 2018
    Assignee: MIRAIAL CO., LTD.
    Inventors: Kazunori Ozawa, Kazuya Inoue, Minoru Tomita
  • Patent number: 9831129
    Abstract: A semiconductor device manufacturing method which improves working efficiency. The method includes the step of transporting by air a package as a sealed moisture-proof bag which contains a case housing a semiconductor wafer laminate, in which the semiconductor wafer laminate has a plurality of semiconductor wafers stacked with a protective sheet interposed between semiconductor wafers. In order to facilitate separation of the protective sheet from the semiconductor wafers after unpacking the package, the protective sheet has a plurality of convex parts, a plurality of concave parts, and a flat part between a convex part and a concave part. A hole penetrating the protective sheet is made in each convex part and the center of the hole is located off the apex of the convex part.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: November 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Yoshihiko Shimanuki
  • Patent number: 9698084
    Abstract: A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: July 4, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tetsuichiro Kasahara, Naoya Sakai, Hideki Kobayashi, Masayuki Okushi
  • Patent number: 9698033
    Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 4, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9576831
    Abstract: A substrate container includes a housing, rack members, housing-side support members for supporting ends of substrates, a moving mechanism for moving the substrates, a lid, and lid-side support members for supporting ends of the substrates. The housing-side support members have deepest portions for supporting the ends of the substrates to be immovable upward. In a state where the lid is attached to the housing, the housing-side support members and lid-side support members clamp the ends of the substrates in between, with lower surfaces of the substrates out of contact with the rack members, and the housing-side support members support the ends of the substrates in the deepest portions. When the lid detaches from the housing, the moving mechanism moves the substrates supported in the deepest portions to disengage the ends of the substrates from the deepest portions, and places the substrates in a substantially horizontal position on the rack members.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: February 21, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Akito Hatano, Koji Hashimoto, Kazuhiro Honsho, Mitsukazu Takahashi
  • Patent number: 9520310
    Abstract: A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: December 13, 2016
    Assignee: Entegris, Inc.
    Inventors: Barry Gregerson, Matthew A. Fuller
  • Patent number: 9514971
    Abstract: A door which closes an opening in a container body of a thin plate container. A door body has latch passage holes in the circumference thereof, which correspond to latch recesses in an inner circumferential surface of the opening, and a component installation space. A rotary cam is received in the component installation space and is rotated by manipulation. Latch arms, each having one end connected to the rotary cam in the component installation space, reciprocate depending on a direction of rotation of the rotary cam so that free end areas thereof enter or exit the latch recesses through the latch passage holes. When the rotary cam rotates in a locking direction, the latch arms move along straight lines until at least portions of the free end areas are inserted into the latch recesses and then pivot so that the free end areas are pressed toward the container body.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: December 6, 2016
    Assignee: 3S KOREA CO., LTD.
    Inventors: Joung Woo Phark, Jae Heung Yoo
  • Patent number: 9512876
    Abstract: The present invention relates to a latch guide assembly configured on the bottom of a wafer carrier. The latch guide assembly comprises a guide module having at least one guiding groove, a latch module having at least one side plate and at least one recess on the at least one side plate, and at least one rolling unit configured between the at least one guiding groove and the at least one recess. The latch module combines with the guide module via the at least one rolling unit and moves along with the guide module. The latch guide assembly provides a precise moving mechanism to lock/unlock the wafer carrier and reduces both the failure rate and dust production.
    Type: Grant
    Filed: December 28, 2014
    Date of Patent: December 6, 2016
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Hsiao-Chia Lo, Chih-Ming Lin
  • Patent number: 9455169
    Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: September 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: You-Hua Chou, Chih-Wei Huang, Yii-Cheng Lin
  • Patent number: 9437466
    Abstract: Provided is a wafer stocker that can prevent the inflow of an external atmosphere, maintain a wafer storage space at a desired atmosphere with a relatively small amount of gas, and prevent dust from being attached to a wafer surface. A shutter portion, including multiple shield plates having the same height as an interval between shelf plates disposed in a storage container, is disposed with a slight space from a body portion, and by supplying clean gas into the storage container, a clean atmosphere of a higher pressure than an external environment is maintained, and a shutter portion is opened and closed by moving up and down the shield plate independently from the shelf plate that supports a wafer.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: September 6, 2016
    Assignee: RORZE CORPORATION
    Inventors: Fumio Sakiya, Katsunori Sakata
  • Patent number: 9412632
    Abstract: A reticle pod includes an outer pod shell and an outer pod door disposed under the outer pod shell. The outer pod door has at least one gas control hole. A seal ring is disposed between the outer pod shell and the outer pod door. A valve is disposed in each gas control hole. The outer pod shell and the outer pod door are configured to form an enclosure space in order to store a reticle. The seal ring seals the gap between the outer pod shell and the outer pod door. The at least one valve is configured to control gas flow in and out of the enclosure space.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: August 9, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yen Lee, Jeng-Horng Cheng, Jui-Ching Wu
  • Patent number: 9406325
    Abstract: A tray for retaining sliders, such as during washing and/or transporting process steps. The tray has a planar body comprising a top surface having a plurality of cavities therein, an opposite bottom surface having a plurality of recesses therein, and a perimeter. Each cavity is oppositely aligned with a respective recess, with each cavity and its respective recess connected by a passage through the body.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: August 2, 2016
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Glenn Charles Johnson, Binh Dinh Tran, Gary Singer
  • Patent number: 9396980
    Abstract: The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: July 19, 2016
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chien-Feng Wang, Shao-Wei Lu, Po-Tin Lee
  • Patent number: 9184077
    Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: November 10, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Sung-Chun Yang, Ying-Chi Peng, Yao-Pin Yang
  • Patent number: 9087826
    Abstract: The suppression of resin leakage is combined with the suppression of damage to the functional wiring area of a wiring board in forming an encapsulation resin. A method for manufacturing a semiconductor device includes the step of clamping a wiring board with a first mold and a second mold. The second mold includes: a flat portion contacting a wiring board; a recessed portion forming a cavity to form an encapsulation resin; and a projecting portion formed at a location spaced apart from the recessed portion on the flat portion, the projecting portion projecting on the first mold side, and extending along the first edge of the wiring board.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: July 21, 2015
    Assignee: Renesas Electronics Corporation
    Inventor: Takamitsu Noda
  • Patent number: 9064673
    Abstract: A workpiece carrier comprises a first plate having a first outer diameter, a first inner diameter, and a first recess extending a first distance from the first inner diameter toward the first outer diameter. The workpiece carrier further comprises a second plate having a second outer diameter, a second inner diameter, and a second recess extending a second distance from the second inner diameter toward the second outer diameter. A plurality of mating features associated with the first plate and second plate are configured to selectively fix a position of a first workpiece between the first plate and second plate within the first recess and second recess.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: June 23, 2015
    Assignee: Axcelis Technologies, Inc.
    Inventors: William Davis Lee, Kevin J. Hoyt, David Shanner, Jason Beringer
  • Patent number: 9064917
    Abstract: A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: June 23, 2015
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chen-Wei Ku, Sheng-Yuan Wang, Cheng-Ju Lee
  • Patent number: 9052612
    Abstract: A support structure for supporting an exchangeable object in a lithographic exposure apparatus includes a first support structure part and a second support structure part, the first support structure part being arranged to support the object, and the second support structure part being arranged to, at least in part, support the first support structure part. At least one of the first support structure part and the second support structure part has an open-box structure. The first support structure part and the second support structure part are configured to be attached to one another in such a way that the first support structure part and the second support structure together form a closed-box structure.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: June 9, 2015
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Marcus Martinus Petrus Adrianus Vermeulen, Johannes Henricus Wilhelmus Jacobs, Joost Jeroen Ottens
  • Patent number: 9028938
    Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: May 12, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Junpei Fujiwara, Masatoshi Kawata
  • Publication number: 20150122698
    Abstract: A stepped elastic positioning structure for a semiconductor carrier includes a plurality of transversely and longitudinally arranged walls and a plurality of recesses defined by the walls. On the walls of the semiconductor carrier is formed a plurality of L-shaped stop blocks, each of the stop blocks has an elastically deformable free end which is capable of elastically restricting the semiconductor in the recess, and improving the easiness for putting in or taking out the semiconductor. The end of each of the stop blocks is a stepped structure, plus the elastic deformability of the stop blocks, which makes the recess capable of holding different sized semiconductors.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventor: Yu-Nan Lo
  • Patent number: 9022216
    Abstract: A reticle pod with drain structure comprises an outer container and an inner container, wherein an upper cover of inner container is disposed with a plurality of retainers, and a plurality of supporters disposed on the outer container are used to press the retainers for fastening and stabilizing the reticle in the inner container and thus ensuring safety and stability of the reticle in the reticle pod. Collision risks of the reticle in the reticle pod due to vacillation of reticle pod during transportation can be reduced. Cost of reticles also can be greatly decreased. Further, a plurality of drain holes is disposed on a lower cover of the outer container for draining the remained water in the outer container. It will be done without disassembling the lower cover of outer container for reducing the contamination opportunity in the pod and preventing from wasting of labor and time for disassembling.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: May 5, 2015
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chen-Wei Ku, Pao-Yi Lu, Chin-Ming Lin, Jain-Pin Sheng
  • Publication number: 20150114878
    Abstract: An elastic positioning structure for a semiconductor carrier is provided with a plurality of stop blocks formed on and extending along the walls of the semiconductor carrier, the fixed end and the elastic free end of the respective stop blocks are located at the same level, so that the fixed end can still serve as a restricting structure to restrict the semiconductor, even when the free end of the stop blocks lose elasticity. The positioning structure has a narrow top and wide bottom, and the recess of the semiconductor carrier is narrow at the top and wide at the bottom, so that the semiconductor can be easily taken out and put into the recess, and can be well restricted in recess without disengaging therefrom.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Inventor: Yu-Nan LO
  • Publication number: 20150101959
    Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 16, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: You-Hua Chou, Chih-Wei Huang, Yil-Cheng Lin
  • Publication number: 20150098788
    Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 9, 2015
    Inventors: Shinji WAKABAYASHI, Keisuke KONDOH, Sensho KOBAYASHI
  • Publication number: 20150083638
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Patent number: 8989901
    Abstract: A transfer system includes a substrate positioning device, robots having a first robot and a second robot; and robot control devices, the robot control devices including a first robot control device to which the first robot and the substrate positioning device are connected and a second robot control device to which the second robot is connected. The first robot control device includes an acquiring unit configured to acquire, from the substrate positioning device, at least an absolute deviation amount between the rotation center of the mounting table and a center position of the substrate positioned, and a transmitting unit configured to transmit correction information relying on the absolute deviation amount acquired by the acquiring unit, to the second robot control device to which the second robot is connected.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: March 24, 2015
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Takashi Minami, Shinichi Katsuda
  • Patent number: 8978718
    Abstract: To generate a gas-curtain for a load-port-apparatus and to supply a purge-gas into a pod by a single gas source, provided is a gas purge device including: purge nozzles extending along an outer side of side edges of the opening portion; a curtain nozzle arranged above an upper edge of the opening portion; a gas supply pipe arranged in parallel to each purge nozzle, for supplying an inert gas to the purge nozzle and the curtain nozzle, the gas being supplied from the gas supply pipe to the purge nozzle in a direction orthogonal to an extending direction of the gas supply pipe; and a conductance adjusting unit arranged at an end portion of the gas supply pipe, for generating a pressure loss in a gas flow in a configuration in which the gas is supplied to the curtain nozzle at the end portion of the gas supply pipe.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: March 17, 2015
    Assignee: TDK Corporation
    Inventors: Jun Emoto, Tadamasa Iwamoto, Toshihiko Miyajima
  • Publication number: 20150021230
    Abstract: A loadport has a port door and a frame with an opening through which the port door interfaces with a container door of a container for holding semiconductor workpieces. In one embodiment, a movable closure mechanism is connected to the port door and is defined to be movable in a controlled manner relative to both the port door and the frame. In this embodiment, a stationary closure mechanism is disposed on the frame proximate to the opening. In another embodiment, a stationary closure mechanism is connected to the port door, and a movable closure mechanism is disposed on the frame proximate to the opening. In both embodiments, the movable closure mechanism is defined to engage with the stationary closure mechanism such that movement of the movable closure mechanism to engage with the stationary closure mechanism applies a closing force between the port door and the container door.
    Type: Application
    Filed: October 7, 2014
    Publication date: January 22, 2015
    Inventor: Anthony C. Bonora
  • Publication number: 20150014191
    Abstract: To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed space 3 through the shell body, the door and the on-off valve.
    Type: Application
    Filed: April 1, 2013
    Publication date: January 15, 2015
    Inventors: Tsutomu Suzuki, Satoshi Odashima, Hiroshi Mimura, Osamu Ogawa
  • Patent number: 8919563
    Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: December 30, 2014
    Assignee: Entegris, Inc.
    Inventors: Barry Gregerson, Michael Shawn Adams, Jason Todd Steffens
  • Publication number: 20140374307
    Abstract: A system and method for controlling transportation of a substrate of a liquid crystal panel is disclosed. Said method comprises: putting the substrate of the liquid crystal panel into a transport apparatus; humidifying the transport apparatus having the substrate of the liquid crystal panel placed thereinto by utilizing a humidifying apparatus to form a mist in the transport apparatus; and transporting the substrate of the liquid crystal panel by utilizing the humidified transport apparatus. The present invention prevents the substrate of the liquid crystal panel from being damaged by electrostatic charges and ensures product percent of pass.
    Type: Application
    Filed: March 15, 2012
    Publication date: December 25, 2014
    Applicant: Shenzhen China Star Optoelectronics Technology Co. Ltd.
    Inventors: Minghu Qi, Chun-hao Wu, Kun-hsien Lin, Yongqiang Wang, Zhenghong Chen, Weibing Yang, Erqing Zhu, Zhenhua Guo
  • Patent number: 8915368
    Abstract: A liquid crystal display (LCD) glass substrate storage tray includes a frame. Each surface of the frame is configured with a plate, the frame and the plates enclose to form a closed box, and the plate on surface of the frame where an opening for the LCD glass substrate to be selected and placed is located forms a box door that is installable or removable from the frame.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: December 23, 2014
    Inventor: Rui Fang
  • Patent number: 8910792
    Abstract: The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: December 16, 2014
    Assignee: Miraial Co., Ltd.
    Inventor: Tsuyoshi Nagashima
  • Publication number: 20140360915
    Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventors: James D. PYLANT, Alan L. WABER
  • Patent number: 8893753
    Abstract: The substrate storage pod includes a pod case for housing a substrate, and an opening, a lid member which closes and seals the opening, a buffer space which is defined in the lid member, an air-supply port for supplying a replacement gas into the buffer space; and multiple holes which are arranged so as to establish communication between the buffer space and an inner plate of the lid member in a state of being fit-inserted to the opening of the pod case, for sending out the replacement gas into the hollow inner space, the replacement gas having been supplied into the buffer space, the inner plate facing the hollow inner space of the pod case. With this, pressure variation of the replacement gas in supply pipes is blocked, and hence replacement-gas flow in a stable laminar state free from disturbance can be obtained.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: November 25, 2014
    Assignee: TDK Corporation
    Inventors: Tsutomu Okabe, Hiroshi Igarashi
  • Patent number: 8888086
    Abstract: An apparatus is provided for protecting a surface of interest from particle contamination, and particularly, during transitioning of the surface between atmospheric pressure and vacuum. The apparatus includes a chamber configured to receive the surface, and a protector plate configured to reside within the chamber with the surface, and inhibit particle contamination of the surface. A support mechanism is also provided suspending the protector plate away from an inner surface of the chamber. The support mechanism holds the protector plate within the chamber in spaced, opposing relation to the surface to provide a gap between the protector plate and the surface which presents a diffusion barrier to particle migration into the gap and onto the surface, thereby inhibiting particle contamination of the surface.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: November 18, 2014
    Assignee: Sematech, Inc.
    Inventor: Abbas Rastegar
  • Patent number: 8881906
    Abstract: The present invention discloses a pod which includes a lower cover member, an upper cover member and a guiding locking piece. The guiding locking piece deployed on one side of the upper cover member of pod, the overall structure of which is formed by a flat base linking to a first slope that links to a second slope, two openings deployed on two side areas of the overall structure, and an upper locking piece and a lower locking piece deployed in each of two openings. When the mask is placed into the lower cover member of pod and is covered by the upper cover member, the mask is pushed to certain position and supported and locked by the upper locking piece and the lower locking piece.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: November 11, 2014
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventor: Ming Lung Chiu
  • Patent number: 8876173
    Abstract: The substrate storage pod includes an engagement portion in an outer side surface of a lid of the pod, and an insertion slot through which the engagement portion can be accessed from an external space; the insertion slot is formed in a flange portion arranged around the periphery of an opening in the pod and into which the lid can be fitted, and a latch mechanism supported so as to be slidable in a direction parallel to a flange side wall in a pod main body-surface of the flange portion. An engaging portion of the latch mechanism reaches the engagement portion via the insertion slot. The engagement portion is switched between an engaged state and a non-engaged state in response to movement of the latch mechanism.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: November 4, 2014
    Assignee: TDK Corporation
    Inventors: Hiroshi Igarashi, Toshihiko Miyajima, Tsutomu Okabe
  • Publication number: 20140319020
    Abstract: A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.
    Type: Application
    Filed: April 28, 2014
    Publication date: October 30, 2014
    Inventors: Barry GREGERSON, Matthew A. FULLER
  • Patent number: 8870014
    Abstract: A mask box having a buckling structure includes a base, a cover and a plurality of buckling elements. The base is configured to support a mask and has a plurality of troughs. The cover covers the base and has a plurality of pivotal portions. The buckling elements are positioned to correspond to the troughs. Each buckling element includes an engaging block and an elastic arm connected to the pivotal portion. The engaging block moves away from the periphery of the cover when the engaging block is subjected to an external force. The engaging block is buckled into the trough via an elastic restoring force of the at least one elastic arm when the external force is removed. By this arrangement, the assembly of the buckling elements is simplified and its product cost is reduced. Further, the present invention conforms to the requirements for environmental protection.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: October 28, 2014
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chih-Ming Lin, Kuan-Lun Pan