For A Semiconductor Wafer Patents (Class 206/710)
  • Patent number: 11335615
    Abstract: Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 17, 2022
    Assignee: ACHILLES CORPORATION
    Inventors: Masayuki Nishijima, Kenichi Hirose
  • Patent number: 11292637
    Abstract: A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 5, 2022
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, En-Nien Shen, Yung-Chin Pan, Chih-Ming Lin, Cheng-En Chung, Po-Ting Lee
  • Patent number: 11217467
    Abstract: A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: January 4, 2022
    Assignee: Infineon Technologies AG
    Inventors: Michael Daginnus-Metzen, Evelin Palko, Benedikt Reuber, Charles Rimbert-Riviere
  • Patent number: 11152204
    Abstract: A substrate processing method includes an intermediate processing step of processing the pattern forming surface by the intermediate processing liquid after a chemical liquid processing step, a filler discharging step of discharging a filler after the intermediate processing step, a filler spreading step of spreading the filler, a solidified film forming step of solidifying the filler, a lower position disposing step of making a blocking member be disposed at a lower position prior to start of the chemical liquid processing step, and a blocking member elevating step of starting elevation of the blocking member toward an upper position in a state where the pattern forming surface is covered with the intermediate processing liquid. The chemical liquid is discharged from a central nozzle. Spreading of the filler is started in a state where the blocking member is positioned at the upper position.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 19, 2021
    Inventors: Hitoshi Nakai, Tsutomu Osuka, Naohiko Yoshihara, Yasunori Kanematsu, Manabu Okutani, Kenji Amahisa, Masayuki Hayashi
  • Patent number: 11121014
    Abstract: A dummy wafer storage cassette for storing dummy wafers. The dummy wafer storage cassette may have more than 30 wafer slots for accommodating dummy wafers. The dummy wafer cassette may have substantially the same outer dimensions as a standardized wafer cassette with 25 wafer slots and a pitch of the wafer slots of the dummy wafer storage cassette may be smaller than a pitch between the wafer slots in the standardized wafer cassette.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 14, 2021
    Assignee: ASM IP HOLDING B.V.
    Inventors: Chris G. M. de Ridder, Theodorus G. M. Oosterlaken, Adriaan Garssen
  • Patent number: 11104496
    Abstract: A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: August 31, 2021
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Chia-Ho Chuang, Hsing-Min Wen, Hsin-Min Hsueh, Yi-Hsuan Lee, Ming-Chien Chiu
  • Patent number: 11075099
    Abstract: Provided is a substrate storage container including a valve(s) capable of controlling flow of gas without using a metallic member. The valve(s) are attached to a substrate storage container and include: a cylindrical body having an open edge and an interior space; a stopcock portion partitioning the interior space into a first space and a second space and extending to the open edge; and an elastic body covering the open edge and the stopcock portion. The first space has a first communication hole communicating with an outside of the container body. The second space has a second communication hole communicating with an inside of the container body. The elastic body controls flow of gas relative to the container body by closely contacting the stopcock portion or separating from the stopcock portion.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: July 27, 2021
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Osamu Ogawa
  • Patent number: 10896834
    Abstract: A wafer shipper utilizing wafer support rings for supporting individual wafers therein. The wafer support rings can support wafers of various thicknesses without affecting the height of the stack, and provide containment of the resident wafers within the rings during an impact event. The wafers and the rings cooperate to define voids between the wafers that act as cushions in an impact event for dampening the shock imparted on the wafers during an impact event. Likewise, some embodiments include structure that defines enclosed gas pockets between the uppermost and the lowermost wafers of the stack for dampening the effects of an impact. Various embodiments include structure that prevents wafers from “jumping” out of the wafer support rings during an impact event. Some embodiments include structure for supporting wafer flats.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: January 19, 2021
    Assignee: ENTEGRIS, INC.
    Inventors: Eric A. Kirkland, Russell V. Raschke
  • Patent number: 10872795
    Abstract: A substrate retainer (110) is provided which presents a substantially uniform contact face (128) that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face (128) is allowed to deflect and compress in order to eliminates the prospect of substrates (114) being damaged by or becoming inadvertently pinched within the substrate retainer (110) or from being pressed too hard by the uniform contact face (128). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: December 22, 2020
    Assignee: ENTEGRIS, INC.
    Inventors: Matthew A. Fuller, Colton J. Harr
  • Patent number: 10847673
    Abstract: The disclosure is related to a method for producing at least one semiconductor component coupled to a target substrate, where a coupon comprising one or more constituent layers of the at least one semiconductor component is transferred to the target substrate by transfer printing. The coupon is embedded in a portion of a support layer thereby forming an enlarged coupon provided with solid alignment markers on the underside thereof. Corresponding hollow alignment markers exist on the location of the target substrate where the coupon is to be placed. The alignment markers engage to thereby align the coupon to the target location. The disclosure is equally related to a device assembly obtainable by the method.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: November 24, 2020
    Assignees: IMEC VZW, UNIVERSITEIT GENT
    Inventor: Gunther Roelkens
  • Patent number: 10672637
    Abstract: A purge tower assembly for a substrate container. The assembly may include a purge interface body, including a base portion and a top portion, for mounting to a bottom plate of a substrate container. The base portion may include a substantially tubular base sidewall and the top portion may have a top sidewall positioned on the top edge of the base portion. The top portion may include an inlet nozzle for mounting through a rearward inlet in the bottom plate. The inlet nozzle may have a substantially tubular sidewall extending upwardly from the top sidewall and defining an interior of the inlet nozzle. The base portion and the top sidewall may define an offset conduit portion disposed connected to the base portion and the inlet nozzle, the base portion and the inlet nozzle in fluid communication via the offset conduit portion.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: June 2, 2020
    Assignee: Entegris, Inc.
    Inventors: Kyle Glavan, Jeffery J. King, Matthew Fuller
  • Patent number: 10546767
    Abstract: In various embodiments, a wafer box is provided. The wafer box may include a housing with a receiving space for receiving a stack comprising a plurality of wafers, each arranged above a housing base. The wafers are to be arranged with their main surfaces parallel to the housing base. The receiving space is delimited by the housing base and side walls arranged thereon. The wafer box may further include at least one base opening, arranged in the housing base, for receiving a guide structure of a wafer stacking aid. The guide structure is to be arranged in such a way that, on a side of the housing base on which the side walls are arranged, it extends out of the housing base in order to limit tilting of a wafer raised or lowered in the receiving space in a manner guided by the guide structure.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 28, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Nina Wenger, Manfred Mengel, Andreas Niederhofer, Holger Tamme
  • Patent number: 10483140
    Abstract: A mask transmission equipment is provided. The mask transmission equipment includes a wafer transmission container and a supporting bracket. The wafer transmission container includes a plurality of first positioning grooves and a plurality of second positioning grooves. The first positioning grooves face the second positioning grooves. The first positioning grooves and the second positioning grooves are adapted to position a plurality of wafers. The supporting bracket is disposed in the wafer transmission container. The supporting bracket includes a first supporting unit, a second supporting unit, a first wing and a second wing. The first supporting unit is stacked on the second supporting unit. The first wing is disposed on a first side of the supporting bracket. The second wing is disposed on a second side of the supporting bracket. The first side is opposite to the second side.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: November 19, 2019
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Chia-Lu Hsu, Yao-Nan Su, Chen-Ya Cheng
  • Patent number: 10453723
    Abstract: Disclosed is a gas purge filter used in a housing container provided with a container main body and a lid body. The gas purge filter has a filter housing having a ventilation space where gas outside the housing container and gas of a housing space can be ventilated, and a pad formed outside the housing space of the filter housing to cover an outer peripheral face of a nozzle portion that forms a part of the ventilation space. The pad is formed of an elastic body.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: October 22, 2019
    Assignee: Miraial Co., Ltd.
    Inventors: Nobuyuki Kasama, Tsuyoshi Nagashima
  • Patent number: 10416050
    Abstract: A liquid sample drying device, dried sample test piece and the preparation method for the dried sample test piece are provided. The liquid sample drying device includes two substrates, at least one spacer and a clamping member. Each of the two substrates includes a surface. The two surfaces face each other. The at least one spacer is located in between the substrates so as to form a sample region between the surfaces for receiving a liquid sample. The clamping member touches the two substrates so as to temporarily clamp and fix the two substrates and the at least one spacer together.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: September 17, 2019
    Assignee: Materials Analysis Technology, Inc.
    Inventors: Lin-Ai Tai, Yu-Ching Chen, Chih-Jung Sun, Pin Chang
  • Patent number: 10261109
    Abstract: A container for storing and transporting a probe card, the container having a container body having an interior surface configured to define: an interior space for housing the probe card, and an opening sized to allow insertion and removal of the probe card into and out of the interior space; a lid configured to be removably fitted to the opening of the container body to close the opening; and a probe card support insert connected to the interior surface of the container body, wherein the probe card support insert has a probe card support surface configured to support a more probe card housed in the interior space of the container body, wherein the interior surface of the container body and the probe card support insert are configured to be removably connected.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 16, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Christopher Belfi, Amy Kraus
  • Patent number: 10242899
    Abstract: A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: March 26, 2019
    Inventors: Chien-Ming Kuo, Hung-Ching Chang
  • Patent number: 10234766
    Abstract: A reticle protection device capable of keeping a reticle therein is provided with an inner pod capable of keeping the reticle therein; an outer pod capable of keeping the inner pod therein; an electroconductive movable contact portion provided on at least one of the inner pod and the outer pod and being capable of coining into contact with an electroconductive film of the reticle; and a leaf spring for achieving electric conduction of the contact portion to at least one of the inner pod and the outer pod. The reticle is kept in the inner pod and the inner pod is kept in the outer pod, thereby enabling stable grounding of the reticle.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: March 19, 2019
    Assignee: NIKON CORPORATION
    Inventor: Kazuya Ota
  • Patent number: 10231879
    Abstract: A manufacturing method of a microstructure includes providing a patch manufacturing sheet formed in a state in which a bottom layer is exposed on an upper part thereof; providing the patch manufacturing sheet on a first process substrate and a second process substrate; spotting a viscous composition at a plurality of positions spaced apart from each other on the bottom layer of the patch manufacturing sheet provided on only the first process substrate, or provided on both of the first process substrate and the second process substrate; contacting the patch manufacturing sheet provided on the second process substrate or the viscous composition to the viscous composition spotted on the patch manufacturing sheet provided on the first process substrate; moving relatively the second process substrate with respect to the first process substrate to stretch the viscous composition and to coagulate the stretched viscous composition; and cutting the coagulated viscous composition.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: March 19, 2019
    Assignee: RAPHAS CO., LTD.
    Inventors: Hong Kee Kim, Jung Dong Kim, Jung Hyun Bae, Yang Gi Lee, So Hyun Park, Do Hyeon Jeong
  • Patent number: 10154718
    Abstract: The present invention relates to a pot for a cosmetic product, the pot being opened by rotating a lid thereby bringing about a relative rotation between a cover and a mounting plate forming the lid, and thereby causing the pivoting of coupling elements which, in a closed position of the pot, are engaged in at least one cutout formed in a neck of a base of the pot.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: December 18, 2018
    Assignee: CHANEL PARFUMS BEAUTE
    Inventors: Christian Salciarini, Julien Chandelier, Gregory Perbal
  • Patent number: 10147624
    Abstract: A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an expedient manner providing robust connections and cost efficiencies. A container portion has an open front and receives on a bottom surface a base plate secured by twist lock connectors that also provide recesses for purge grommets. Kinematic coupling components readily and robustly lock onto the base plate. Interior wafer support components latch onto brackets on the side walls utilizing a separate locking insert with holding tabs and locking detents. A wafer retainer provides support and counters enhanced wafer sag associated with 450 mm wafers when the door is installed and seated.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: December 4, 2018
    Assignee: Entegris, Inc.
    Inventors: Michael S. Adams, Barry Gregerson, Matthew A Fuller
  • Patent number: 10062597
    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: August 28, 2018
    Assignee: FormFactor Beaverton, Inc.
    Inventors: Michael E. Simmons, Kazuki Negishi, Ryan Garrison, Philip Wolf
  • Patent number: 10043696
    Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: August 7, 2018
    Assignee: Entegris, Inc.
    Inventors: James A. Watson, John Burns, Martin L. Forbes, Matthew A. Fuller, Mark V. Smith
  • Patent number: 10032660
    Abstract: An improved system and method for purging a microenvironment to desired levels of relative humidity, oxygen, or particulates through the implementation of a purge gas delivery apparatus and method that provides even distribution of the purging gas within the microenvironment. A substrate container has a tower therein with a fluid flow passageway extending the length of the tower. Apertures with porous media between the aperture and fluid flow passageway regulate the volume and pressure of air discharging at each aperture. Alternatively, the tower may be formed of a porous tubular polymeric material. A sleeve may direct the discharge purge gas in the interior.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: July 24, 2018
    Assignee: Entegris, Inc.
    Inventors: John Burns, Mark Smith, Matthew Fuller
  • Patent number: 9892948
    Abstract: A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: February 13, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hung-Jen Lu, Ming-Hsien Lee, Chih-Hung Huang, Chuan-Pu Chen
  • Patent number: 9887116
    Abstract: The tip face 411 of the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322 have a positional relationship of facing each other, and a bottom portion space 413 is formed between the base portion 41 inserted into the retaining groove 321 and the groove bottom face 322. A pair of side faces 412 of the base portion 41 inserted into the retaining groove 321 and the pair of groove side faces 323 have a positional relationship of facing each other, and side face spaces 324 which are in communication with an opening of the retaining groove 321 are respectively formed between the pair of side faces 412 of the base portion 41 inserted into the retaining groove and the pair of groove side faces 323, and the bottom portion space is in communication with the side face space.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 6, 2018
    Assignee: MIRAIAL CO., LTD.
    Inventors: Kazunori Ozawa, Kazuya Inoue, Minoru Tomita
  • Patent number: 9831129
    Abstract: A semiconductor device manufacturing method which improves working efficiency. The method includes the step of transporting by air a package as a sealed moisture-proof bag which contains a case housing a semiconductor wafer laminate, in which the semiconductor wafer laminate has a plurality of semiconductor wafers stacked with a protective sheet interposed between semiconductor wafers. In order to facilitate separation of the protective sheet from the semiconductor wafers after unpacking the package, the protective sheet has a plurality of convex parts, a plurality of concave parts, and a flat part between a convex part and a concave part. A hole penetrating the protective sheet is made in each convex part and the center of the hole is located off the apex of the convex part.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: November 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Yoshihiko Shimanuki
  • Patent number: 9698084
    Abstract: A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: July 4, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tetsuichiro Kasahara, Naoya Sakai, Hideki Kobayashi, Masayuki Okushi
  • Patent number: 9698033
    Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 4, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9576831
    Abstract: A substrate container includes a housing, rack members, housing-side support members for supporting ends of substrates, a moving mechanism for moving the substrates, a lid, and lid-side support members for supporting ends of the substrates. The housing-side support members have deepest portions for supporting the ends of the substrates to be immovable upward. In a state where the lid is attached to the housing, the housing-side support members and lid-side support members clamp the ends of the substrates in between, with lower surfaces of the substrates out of contact with the rack members, and the housing-side support members support the ends of the substrates in the deepest portions. When the lid detaches from the housing, the moving mechanism moves the substrates supported in the deepest portions to disengage the ends of the substrates from the deepest portions, and places the substrates in a substantially horizontal position on the rack members.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: February 21, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Akito Hatano, Koji Hashimoto, Kazuhiro Honsho, Mitsukazu Takahashi
  • Patent number: 9520310
    Abstract: A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: December 13, 2016
    Assignee: Entegris, Inc.
    Inventors: Barry Gregerson, Matthew A. Fuller
  • Patent number: 9512876
    Abstract: The present invention relates to a latch guide assembly configured on the bottom of a wafer carrier. The latch guide assembly comprises a guide module having at least one guiding groove, a latch module having at least one side plate and at least one recess on the at least one side plate, and at least one rolling unit configured between the at least one guiding groove and the at least one recess. The latch module combines with the guide module via the at least one rolling unit and moves along with the guide module. The latch guide assembly provides a precise moving mechanism to lock/unlock the wafer carrier and reduces both the failure rate and dust production.
    Type: Grant
    Filed: December 28, 2014
    Date of Patent: December 6, 2016
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Hsiao-Chia Lo, Chih-Ming Lin
  • Patent number: 9514971
    Abstract: A door which closes an opening in a container body of a thin plate container. A door body has latch passage holes in the circumference thereof, which correspond to latch recesses in an inner circumferential surface of the opening, and a component installation space. A rotary cam is received in the component installation space and is rotated by manipulation. Latch arms, each having one end connected to the rotary cam in the component installation space, reciprocate depending on a direction of rotation of the rotary cam so that free end areas thereof enter or exit the latch recesses through the latch passage holes. When the rotary cam rotates in a locking direction, the latch arms move along straight lines until at least portions of the free end areas are inserted into the latch recesses and then pivot so that the free end areas are pressed toward the container body.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: December 6, 2016
    Assignee: 3S KOREA CO., LTD.
    Inventors: Joung Woo Phark, Jae Heung Yoo
  • Patent number: 9455169
    Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: September 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: You-Hua Chou, Chih-Wei Huang, Yii-Cheng Lin
  • Patent number: 9437466
    Abstract: Provided is a wafer stocker that can prevent the inflow of an external atmosphere, maintain a wafer storage space at a desired atmosphere with a relatively small amount of gas, and prevent dust from being attached to a wafer surface. A shutter portion, including multiple shield plates having the same height as an interval between shelf plates disposed in a storage container, is disposed with a slight space from a body portion, and by supplying clean gas into the storage container, a clean atmosphere of a higher pressure than an external environment is maintained, and a shutter portion is opened and closed by moving up and down the shield plate independently from the shelf plate that supports a wafer.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: September 6, 2016
    Assignee: RORZE CORPORATION
    Inventors: Fumio Sakiya, Katsunori Sakata
  • Patent number: 9412632
    Abstract: A reticle pod includes an outer pod shell and an outer pod door disposed under the outer pod shell. The outer pod door has at least one gas control hole. A seal ring is disposed between the outer pod shell and the outer pod door. A valve is disposed in each gas control hole. The outer pod shell and the outer pod door are configured to form an enclosure space in order to store a reticle. The seal ring seals the gap between the outer pod shell and the outer pod door. The at least one valve is configured to control gas flow in and out of the enclosure space.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: August 9, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yen Lee, Jeng-Horng Cheng, Jui-Ching Wu
  • Patent number: 9406325
    Abstract: A tray for retaining sliders, such as during washing and/or transporting process steps. The tray has a planar body comprising a top surface having a plurality of cavities therein, an opposite bottom surface having a plurality of recesses therein, and a perimeter. Each cavity is oppositely aligned with a respective recess, with each cavity and its respective recess connected by a passage through the body.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: August 2, 2016
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Glenn Charles Johnson, Binh Dinh Tran, Gary Singer
  • Patent number: 9396980
    Abstract: The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: July 19, 2016
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chien-Feng Wang, Shao-Wei Lu, Po-Tin Lee
  • Patent number: 9184077
    Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: November 10, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Sung-Chun Yang, Ying-Chi Peng, Yao-Pin Yang
  • Patent number: 9087826
    Abstract: The suppression of resin leakage is combined with the suppression of damage to the functional wiring area of a wiring board in forming an encapsulation resin. A method for manufacturing a semiconductor device includes the step of clamping a wiring board with a first mold and a second mold. The second mold includes: a flat portion contacting a wiring board; a recessed portion forming a cavity to form an encapsulation resin; and a projecting portion formed at a location spaced apart from the recessed portion on the flat portion, the projecting portion projecting on the first mold side, and extending along the first edge of the wiring board.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: July 21, 2015
    Assignee: Renesas Electronics Corporation
    Inventor: Takamitsu Noda
  • Patent number: 9064917
    Abstract: A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: June 23, 2015
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chen-Wei Ku, Sheng-Yuan Wang, Cheng-Ju Lee
  • Patent number: 9064673
    Abstract: A workpiece carrier comprises a first plate having a first outer diameter, a first inner diameter, and a first recess extending a first distance from the first inner diameter toward the first outer diameter. The workpiece carrier further comprises a second plate having a second outer diameter, a second inner diameter, and a second recess extending a second distance from the second inner diameter toward the second outer diameter. A plurality of mating features associated with the first plate and second plate are configured to selectively fix a position of a first workpiece between the first plate and second plate within the first recess and second recess.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: June 23, 2015
    Assignee: Axcelis Technologies, Inc.
    Inventors: William Davis Lee, Kevin J. Hoyt, David Shanner, Jason Beringer
  • Patent number: 9052612
    Abstract: A support structure for supporting an exchangeable object in a lithographic exposure apparatus includes a first support structure part and a second support structure part, the first support structure part being arranged to support the object, and the second support structure part being arranged to, at least in part, support the first support structure part. At least one of the first support structure part and the second support structure part has an open-box structure. The first support structure part and the second support structure part are configured to be attached to one another in such a way that the first support structure part and the second support structure together form a closed-box structure.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: June 9, 2015
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Marcus Martinus Petrus Adrianus Vermeulen, Johannes Henricus Wilhelmus Jacobs, Joost Jeroen Ottens
  • Patent number: 9028938
    Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: May 12, 2015
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Junpei Fujiwara, Masatoshi Kawata
  • Publication number: 20150122698
    Abstract: A stepped elastic positioning structure for a semiconductor carrier includes a plurality of transversely and longitudinally arranged walls and a plurality of recesses defined by the walls. On the walls of the semiconductor carrier is formed a plurality of L-shaped stop blocks, each of the stop blocks has an elastically deformable free end which is capable of elastically restricting the semiconductor in the recess, and improving the easiness for putting in or taking out the semiconductor. The end of each of the stop blocks is a stepped structure, plus the elastic deformability of the stop blocks, which makes the recess capable of holding different sized semiconductors.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 7, 2015
    Inventor: Yu-Nan Lo
  • Patent number: 9022216
    Abstract: A reticle pod with drain structure comprises an outer container and an inner container, wherein an upper cover of inner container is disposed with a plurality of retainers, and a plurality of supporters disposed on the outer container are used to press the retainers for fastening and stabilizing the reticle in the inner container and thus ensuring safety and stability of the reticle in the reticle pod. Collision risks of the reticle in the reticle pod due to vacillation of reticle pod during transportation can be reduced. Cost of reticles also can be greatly decreased. Further, a plurality of drain holes is disposed on a lower cover of the outer container for draining the remained water in the outer container. It will be done without disassembling the lower cover of outer container for reducing the contamination opportunity in the pod and preventing from wasting of labor and time for disassembling.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: May 5, 2015
    Assignee: Gudeng Precision Industrial Co., Ltd.
    Inventors: Chen-Wei Ku, Pao-Yi Lu, Chin-Ming Lin, Jain-Pin Sheng
  • Publication number: 20150114878
    Abstract: An elastic positioning structure for a semiconductor carrier is provided with a plurality of stop blocks formed on and extending along the walls of the semiconductor carrier, the fixed end and the elastic free end of the respective stop blocks are located at the same level, so that the fixed end can still serve as a restricting structure to restrict the semiconductor, even when the free end of the stop blocks lose elasticity. The positioning structure has a narrow top and wide bottom, and the recess of the semiconductor carrier is narrow at the top and wide at the bottom, so that the semiconductor can be easily taken out and put into the recess, and can be well restricted in recess without disengaging therefrom.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Inventor: Yu-Nan LO
  • Publication number: 20150101959
    Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 16, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: You-Hua Chou, Chih-Wei Huang, Yil-Cheng Lin
  • Publication number: 20150098788
    Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 9, 2015
    Inventors: Shinji WAKABAYASHI, Keisuke KONDOH, Sensho KOBAYASHI
  • Publication number: 20150083638
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante