Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Abstract: A packaging system for microarrays, such as microarrays of microneedles, comprising inner and outer pouches (500, 5000).

Abstract: A receiving element for receiving and transporting a component includes: a main body. A recess in the form of an indentation into which the component is insertable is formed in the main body. In an embodiment, the recess has a shape which is adapted to a contour of the component.

Abstract: A carrier tape has a central portion, and first and second rows of device pockets and dummy pockets. The device pockets are smaller in size than the dummy pockets. The pockets in each of the first and second rows are vertically aligned and are separated vertically from each other by an equal distance. Vertically aligned and adjacent pockets may be horizontally separated relative to each other by a constant dimension, a regularly or irregularly increasing or decreasing dimension, or both a regularly or irregularly increasing or decreasing dimension. Vertically aligned and adjacent pockets may also vary in positioning relative to an upper edge of the carrier tape in an increasing or decreasing regular or irregular dimension or both. The carrier tape may be layered on a reel during transportation.

Abstract: An automatic parts counter with an x-ray imaging system to image parts disposed in at least one of a component reel, component trays, cut tape; an image processing algorithm to count the image parts; and a docking interface for docking to a storage unit.

Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.

Abstract: A taping reel with a plurality of coil components packed in the tape reel, comprising a tape including a plurality of pockets arranged along a longitudinal direction and each having one of the coil components stored therein, and a reel around which the tape is wound. The coil components each include a core including a winding core part, and a coil wound around the winding core part and including a plurality of wires. The coil includes a twisted wire portion in which the plurality of wires is twisted together. The plurality of coil components includes first coil components having the twisting direction of the twisted wire portion opposite to the twisting direction of the twisted wire portion of other coil components.

Abstract: Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

Abstract: An article of footwear includes an upper member and a sole structure, with a sensor system connected to the sole structure. The sensor system includes a plurality of sensors that are configured for detecting forces exerted by a user's foot on the sensor. The sensor system also includes a port that is configured to receive a module to place the module in communication with the sensors. The port includes a housing with a chamber configured to receive the module and an interface engaged with the housing and having at least one electrical contact exposed to the chamber. Additional retaining structure and interface structure may be included.

Abstract: The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.

Abstract: A method of manufacturing an electronic device includes providing a component carrier having a laminate of at least one electrically conductive layer structure and at least one electrically insulating layer structure, providing a mounting base for mounting an electronic component on and/or in the component carrier, and integrally forming a wall structure with the component carrier prior to mounting an electronic component on the mounting base, the integrally formed wall structure at least partially surrounding the mounting base for mounting the electronic component on the mounting base and protected by the wall structure.

Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.

Abstract: A watch packaging box including a base containing a removable tray, a lid cooperating in a complementary manner with the base to close the box, the tray including compartments for receiving a watch, each delimited by a bottom and a partition, the box including, centred inside each compartment, a resilient pad pressed onto a watch by the lid in the closed position, and the box includes, in each compartment, a main orifice for passage of a sensor or tool, included in a device performing a watch testing and/or timing method, on the watch occupying the compartment, and each resilient pad includes a secondary orifice aligned with a main orifice for access of the sensor or tool to the watch.

Abstract: A carrier tape (300) with a continuous channel (310) is proposed instead of the individual separate embossed pockets (110) prevalent in conventional carrier tapes (100). The continuous channel (310) reduces or even eliminates small bridge problem typically associated with the conventional carrier tapes (100). The proposed carrier tape (300) can include dividers (330) and cutouts (340) to accommodate the devices (205) with minimum pitch without sacrificing corner relief. A cover tape (450) can be included to seal the devices (205) below the top surface of the devices (205). Further, the floor (316) of the continuous channel (310) can be lined with an adhesive (560).

Abstract: A carrier tape is provided from which LEDs can be easily picked up. A carrier tape for accommodating an LED includes a sheet defining recessed embossed portions that can accommodate the LED. The embossed portion is formed to accommodate the LED which includes a light emitting portion having light-transmissive resin and arranged on its lateral surface as viewed in plan view. The embossed portion includes a protruding part that is arranged on one of the interior surfaces of the recessed embossed portion and can face the light emitting portion of the LED. Depressed parts are provided on the both sides of the protruding part so that the depressed surfaces can be spaced away from the LED when the LED is accommodated in the embossed portion. The width of the protruding part is smaller than the width of the light emitting portion of the LED as viewed in plan view.

Abstract: A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.

Abstract: A device includes a jig having a plate with through-holes formed therein and also having a frame formed on the plate so as to be able to accommodate a plurality of semiconductor chips in spaced relationship, a foreign matter capture member having a first charge section with a first flat surface and a second charge section with a second flat surface, the second charge section being insulated from the first charge section, charging means for positively charging the first flat surface and negatively charging the second flat surface, and sliding means for causing either the jig or the foreign matter capture member to slide relative to the other in such a manner that the through-holes of the jig are spaced a predetermined distance from the first and second flat surfaces. The through-holes are formed in different regions defined and surrounded by the frame.

Abstract: Provided is a carrier tape with improved tensile strength and flexural rigidity in a longitudinal direction of a base material, including recesses that can be provided at a narrow pitch in a first surface of the base material, and manufacturable at reduced cost, as well as to provide an apparatus and a method for manufacturing such a carrier tape. A carrier tape of the present invention is constituted by a strip-shaped base material, and includes a plurality of recesses provided in a first surface of the base material and for containing electronic components, a covering unit configured to seal openings of the recesses, and a projection provided on a second surface of the base material along a longitudinal direction of the base material. A length of the projection extends over at least two of the recesses.

Abstract: Disclosed are a chip card assembling structure and a method thereof, including at least one base plate, at least one fixing element having a side forming a fixing trough corresponding to the base plate, at least one adhesive film disposed on one side of the fixing element to cover the fixing trough, and at least one thin-film chip received in the fixing trough and bonded to the adhesive film. To use the present invention, the adhesive film, together with the thin-film chip, is lifted and the base plate is placed into the fixing trough, following setting the adhesive film and the thin-film chip back to have the thin-film chip coupled to the base plate. Then, the adhesive film is lifted to remove the coupled thin-film chip and base plate, so that the relative position between the thin-film chip and the base plate is precise and correct.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.

Abstract: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.

Abstract: A new type of tape and reel tape based on the cover tape having projections extending from the bottom surface of the cover tape leaving a minimum of adhesive surface exposed to the surface mount die or packages contained in the pocket areas of the carrier tape.

Abstract: A new type of tape based on heat activated adhesive (HAA) ‘dry’ adhesive, but manufactured with limited range of adhesive coverage leaving the die areas uncovered and clear of adhesive

Abstract: A carrier tape for transporting electronic components having a linearly displaceable continuous web and a plurality of pocket structures connected to the continuous web. The pocket structures are adapted to receive the electronic components. Each of the plurality of pocket structures defines an opening to enable passage of the electronic component into the pocket structure. Each of the pocket structures define at least one tab that is adapted to retain an electronic component in the pocket structure without a closure member.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the first abutting section being mounted via an elastic unit, the first abutting section and the second abutting section delimit an electronic component receiving volume in which the electronic component is to be received in the receptacle, the elastic unit extends below a bottom side of the electronic component receiving volume, and the elastic unit is adapted to provide a clamping force for clamping the electronic component between the first abutting section and the second abutting section.

Abstract: The storage body includes a tape formed with recess portions that dip in in a thickness direction formed at intervals along the tape length direction and a cover that is superimposed on the tape and closes off openings of the recess portions. The tape is fixed to the tape by intermediate fixing portions and a pair of side fixing portions. The intermediate fixing portions are formed between the mutually adjacent recess portions. The pair of side fixing portions include overlapping portions and connect portions. The overlapping portions are formed at the two tape width direction sides of the intermediate fixing portions so as to overlap with the intermediate fixing portions along the tape length direction. The connect portions are formed with constant width connecting together the respective overlapping portions disposed in lines along the tape length direction.

Abstract: A series of electronic components formed using a carrier tape. The carrier tape is adapted to enable smoothly picking up even small-sized electronic components with a suction nozzle. The carrier tape has housing holes housing electronic components therein. The housing holes are arranged in the longitudinal direction. A top tape and a bottom tape are attached to the upper and lower surfaces of the carrier tape. Interval portions between the housing holes are provided with concave slots in their lower surfaces, thereby forming air flow paths 12. The air flow paths form air passages which enable smoothly picking up the small-sized electronic components using a suction nozzle 14.

Abstract: In a laminated ceramic electronic component, a side surface outer electrode circles around a ceramic element body, a first electrode portion includes a first side surface electrode portion on first and second side surfaces of the ceramic element body and a first wrap-around electrode portion extending from the first side surface electrode portion and wraps around portions of third and fourth side surfaces, and a second electrode portion includes a second side surface electrode portion on the third and fourth side surfaces and a second wrap-around electrode portion extending from the second side surface electrode portion and wrap around portions of the first and second side surfaces. External appearance configurations in which the first and second wrap-around electrode portions are recognizable from outside are provided to the first and second wrap-around electrode portions.

Abstract: A cover tape includes a polymer film substrate having first and second opposed major surfaces. A primer layer is disposed on the first major surface of the polymer film substrate. A static control layer is disposed on the primer layer, the static control layer comprising carbon nanotubes dispersed in a dielectric polymeric binder, wherein the static control layer has a thickness of from 0.1 to 2 microns. Adhesive strips are disposed on the static control layer adjacent opposite edges of the static control layer. Methods of making cover tapes according to the present disclosure, and component packages including them, are also disclosed.

Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140). At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.

Abstract: A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.

Abstract: A device and method for tape and reel packaging of small electronic components providing positioning mechanisms to allow one or more components to be placed in a desired orientation and alignment within a tape carrier pocket. The device is an insert fitting within the carrier pocket including positioning mechanisms such as protruding shapes, protruding ridges, and/or frame work, or the like, which engage with inner surfaces, outer surfaces, or perimeters, or a combination, of the component to be packaged. A method for tape and reel packaging including further delineation of regions within a tape carrier pocket for disposition of electronic components is also disclosed.

Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: A rigid holder is provided for supporting a flexible article. The rigid holder may include a first frame member and a second frame member which are held together through magnets.

Abstract: A semiconductor package holder includes two plates, and each plate defining a through-hole. Each of the plates has a set of first members along a periphery of the through-hole and extending into the through-hole. The first members of one of the plates are positioned to overlie the first members of the other of the plates. One of the at least two plates further has a set of second members along a periphery of the through-hole and extending into the through-hole.

Abstract: A taped component includes a career tape having an upper surface having recesses provided therein, and products stored in the recesses, respectively. Each of the recesses has a bottom on which each of the products is placed. The bottom has an aperture provided therein, and the aperture faces a position different from the center of gravity of each of the products. This taped component allows the product to be mounted efficiently.

Abstract: A package for delivery of a tacky product includes a carrier tape with a plurality of cavities separately disposed along a length thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier tape may be configured for use in tape and reel packaging systems.

Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140), At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.

Abstract: Various packages for food products are provided herein. In one embodiment, a food package includes a rectangular substantially planar rigid bottom wall; two slanted side/side walls extending angularly upwardly from the bottom wall, and a rectangular opening opposite the bottom wall, the opening larger in area than the rectangular rigid bottom wall. A top side wall and a bottom side wall extend upwardly from the bottom wall; and a flexible film extends over the opening and seals the opening. The side walls are configured to engage and hold the food product, each side wall being angularly ramped and extending downward and inward toward the bottom wall, and having at least one well which extends downwardly from the angularly upward extending side wall.

Abstract: An improved continuous adhesive backed carrier tape which eliminates the need for a lift pin to assist in removing components from the compartments in the carrier tape within which the components are adhesively retained. The improvements are achieved by utilizing a strip of continuous length containing a low tack adhesive coating within the central portion of the plastic strip located to underlie the entire bottom of each carrier tape compartment when the strip is affixed there to by either aggressive adhesive rails or by mechanical means, such as ultra sonic bonding. The unique feature is to affix low tack adhesive means underneath the compartment area of the carrier tape, sufficient to retain small, lightweight components yet an adhesion level that is low enough to enable the component to be removed using conventional vacuum pick tools without lift pin assistance.

Abstract: Provided is a carrier tape with improved tensile strength and flexural rigidity in a longitudinal direction of a base material, including recesses that can be provided at a narrow pitch in a first surface of the base material, and manufacturable at reduced cost, as well as to provide an apparatus and a method for manufacturing such a carrier tape. A carrier tape of the present invention is constituted by a strip-shaped base material, and includes a plurality of recesses provided in a first surface of the base material and for containing electronic components, a covering unit configured to seal openings of the recesses, and a projection provided on a second surface of the base material along a longitudinal direction of the base material. A length of the projection extends over at least two of the recesses.

Abstract: A food package for sliced food products to be maintained with a fluffed appearance, the package including a rigid base member forming a compartment for receiving the food product and a rigid lid sealed to the compartment. Advantageously, the base member includes a bottom wall and side wall portions that are configured to engage the food product to hold the slices in a fluffed arrangement thereof. Preferably, one or more tapered side wall portions hold the food product upwardly toward the lid and inwardly toward a center of the package. In preferred embodiments, the base member and lid provide a rigid-rigid construction of the food package. In preferred embodiments, the food package is also configured to stand-up in a vertical display orientation and does not require the food product be contained within a sealed pouch within the compartment.

Abstract: The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

Abstract: A device and method for tape and reel packaging of small electronic components providing positioning mechanisms to allow one or more components to be placed in a desired orientation and alignment within a tape carrier pocket. The device is an insert fitting within the carrier pocket comprising positioning mechanisms such as protruding shapes, protruding ridges, and/or frame work, or the like, which engage with inner surfaces, outer surfaces, or perimeters, or a combination thereof, of the component to be packaged. A method for tape and reel packaging comprising further delineation of regions within a tape carrier pocket for disposition of electronic components is also disclosed.

Abstract: An electronic device includes a housing and a circuit board contained in the housing. The housing includes a main wall, a side wall, a vertical wall, a first rib, and a second rib. The side wall is integrally formed with the main wall. The vertical wall is integrally formed with the main wall and faces to the side wall. The first rib is integrally formed with the side wall and the main wall. The first rib extends from the side wall toward the vertical wall. The first rib has a first end portion separated from the vertical wall. The second rib is integrally formed with the vertical wall and the main wall. The second rib extends from the vertical wall toward the side wall. The second rib has a second end portion separated from the side wall. The second rib faces to the first end.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.