Component Retaining Pockets Patents (Class 206/714)
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Patent number: 7731997Abstract: Various packages for food products are provided herein. In one embodiment, a food package has a rectangular substantially planar rigid bottom wall; two slanted side/side walls extending angularly upwardly from the bottom wall, each forming an angle of from about 55 to about 75 degrees from vertical axes extending orthogonally from a plane formed by the bottom wall; and a rectangular opening opposite the bottom wall, the opening larger in area than the rectangular rigid bottom wall. A top side wall and a bottom side wall extend upwardly from the bottom wall; and a flexible film extends over the opening and seals the opening. The side walls are configured to engage and hold the food product, each side wall being angularly ramped and extending downward and inward toward the bottom wall, and having at least one wall which extends downwardly from the angularly upward extending side wall.Type: GrantFiled: February 13, 2008Date of Patent: June 8, 2010Assignee: Kraft Foods Global Brands, LLCInventors: Carolina Castellanos, Daniel Eugene Doucette
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Patent number: 7694825Abstract: A carrier tape (10) for electronic components or devices (44) includes a tape body (12) and a plurality of pockets (14) formed in the tape body (12). Each of the pockets (14) includes a sidewall (18) and a base portion (20). The base portion (20) joins the sidewall (18) at an edge portion (22). A protrusion (24) is formed in the base portion (20) of the pocket (14). The protrusion (24) is configured to maintain a separation between the edge portion (22) and a surface on which the pocket (14) rests.Type: GrantFiled: November 21, 2008Date of Patent: April 13, 2010Assignee: Freescale Semiconductor, Inc.Inventor: Mohd Razif Md Sulamin
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Patent number: 7692921Abstract: An electronic device includes a housing and a circuit board contained in the housing. The housing includes a main wall, a side wall, a vertical wall, a first rib, and a second rib. The side wall is integrally formed with the main wall. The vertical wall is integrally formed with the main wall and faces to the side wall. The first rib is integrally formed with the side wall and the main wall. The first rib extends from the side wall toward the vertical wall. The first rib has a first end portion separated from the vertical wall. The second rib is integrally formed with the vertical wall and the main wall. The second rib extends from the vertical wall toward the side wall. The second rib has a second end portion separated from the side wall. The second rib faces to the first end.Type: GrantFiled: April 26, 2006Date of Patent: April 6, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Toshio Ooe, Yuji Nakajima, Noriyasu Kawamura
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Patent number: 7654392Abstract: A carrier tape including a main body and plural pockets arranged on the main body and configured to contain goods therein is described. The pockets have depths greater than the thickness of the main body, and are arranged at equal intervals in a longitudinal direction of the main body. Plural dummy pockets are arranged on the main body and extend away from the main body no less than the pockets. The dummy pockets can be replaced with ribs having a plate shape. A container including the carrier tape and a resin cover tape which covers the pockets and the dummy pockets is also described. The container can be reeled.Type: GrantFiled: January 10, 2006Date of Patent: February 2, 2010Assignee: Ricoh Company, Ltd.Inventor: Hironobu Agari
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Patent number: 7646605Abstract: An electronic module packaging system and an electronic module packaging apparatus are disclosed. The electronic module packaging system includes an exterior packing box, an electronic module packaging apparatus, and antistatic packing foam holding the electronic module packaging apparatus within the exterior packing box. The electronic module packaging apparatus includes a top component made of an antistatic material, and a bottom component made of a conductive material. The bottom component includes multiple support members to hold an electronic module in a stable position. The top component and the bottom component may be coupled with multiple securing clips.Type: GrantFiled: August 31, 2007Date of Patent: January 12, 2010Assignee: International Business Machines CorporationInventor: Terry M. Ciccaglione
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Patent number: 7611016Abstract: A carrier tape for storing components and for preventing nesting of successive wraps of the carrier tape when round onto a roll. In particular, the carrier tape comprises a strip like portion defining a top surface of the tape, and wall portions defining a plurality of substantially similarly shaped pockets spaced along the carrier tape and opening through the top surface. The wall portions of the substantially similarly shaped pockets include a bottom wall portion, a first wall portion extending from the bottom wall portion to the top surface of the carrier tape, a first cross-beam wall portion extending from the bottom wall portion and located between adjacent pockets on the carrier tape, and a second cross-beam wall portion extending from the bottom wall portion and located between selected adjacent pockets on the carrier tape. One or more of the cross-beam wall portions have a notched opening formed at a selected location along a length of the first or second cross-beam wall portions.Type: GrantFiled: July 31, 2007Date of Patent: November 3, 2009Assignee: 3M Innovative Properties CompanyInventor: Charlie V. Wihren
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Patent number: 7600313Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.Type: GrantFiled: July 9, 2004Date of Patent: October 13, 2009Assignee: Daisho Denshi Co., Ltd.Inventors: Akihiro Kimura, Osamu Deguchi, Koji Annou, Atsushi Ishikawa
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Publication number: 20090242457Abstract: Loading a component carrier strip carrying a series of discrete components to be assembled onto circuit boards is accomplished by first inserting a free end of the component carrier strip into a slot defined by a housing (e.g., a blind slot). Then, with the component carrier strip positioned in the slot, a physical orientation of a component marking that indicates polarity is indicated to a component placement machine, e.g., by manipulating a switch, or scanning a barcode. Thereafter, the component carrier strip is removed from the slot and loaded into the component placement machine, e.g., by splicing a leading edge of the component carrier strip onto a trailing edge of a previously loaded component carrier strip.Type: ApplicationFiled: March 31, 2008Publication date: October 1, 2009Applicant: Accu-Assembly IncorporatedInventor: Yuen-Foo Michael Kou
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Patent number: 7584853Abstract: The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.Type: GrantFiled: December 22, 2005Date of Patent: September 8, 2009Assignee: TDK CorporationInventors: Akitoshi Yoshii, Taisuke Ahiko, Tooru Suda, Tsuyoshi Takashima, Yasushi Izumibe
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Publication number: 20090114564Abstract: A carrier tape structure including a belt-shaped tape body, a plurality of carrier boxes, and a plurality of protruding ribs is provided. The carrier boxes are disposed separately on the tape body, and the protruding ribs are in strip shape and are disposed between the carrier boxes. The material around the protruding ribs has lower strength so that the tape body can be bent along the peripheries of the protruding ribs. A plurality of chains is disposed along two sides of the tape body, and the chains can be hung onto a winding machine so that the carrier tape structure can be winded on the winding machine without damaging the carrier boxes.Type: ApplicationFiled: November 2, 2007Publication date: May 7, 2009Applicant: SPEED TECH CORP.Inventors: Chih-Wen Huang, Chin-Jung Chang, Robert Jiang
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Publication number: 20090071868Abstract: A carrier tape segment to carry a microelectronic component thereon. The carrier tape segment includes a tape segment body having a head portion and a tail portion, and a component carrying portion between the head portion and the tail portion. The head portion includes a first mechanical interlocking feature thereon. The tail portion includes a second mechanical interlocking feature thereon. The first mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature. The carrier tape segment is thereby configured to be linked to other carrier tape segments to form a carrier tape chain therewith.Type: ApplicationFiled: September 17, 2007Publication date: March 19, 2009Inventor: Andrew N. Contes
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Publication number: 20080314793Abstract: A component tape comprising a base tape that includes pockets configured to house electrical components for placement on a printed circuit board and a cover tape, covering the base tape wherein a portion of the cover tape is configured to engage with a tape engagement feature of a component tape feeder.Type: ApplicationFiled: June 19, 2007Publication date: December 25, 2008Applicant: HOVER-DAVIS, INC.Inventor: Peter Davis
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Publication number: 20080296201Abstract: A component carrier tape includes a longitudinal flexible strip having a plurality of component receiving pockets positioned therein. The component carrier tape further includes a plurality of indicators positioned longitudinally on the longitudinal strip and configured for indicating the position of each of the plurality of pockets. The indicators are positioned between adjacent pockets.Type: ApplicationFiled: December 18, 2006Publication date: December 4, 2008Inventors: Lahoussaine Lalouch, Geno L. Pietrobon, Torrey W. Prigge, Abderahmane Oubihi
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Patent number: 7455896Abstract: A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from ?9 to +9 nC when the cover tape has a surface resistivity of at least 1011 ?, and where the cover tape has a peeling static electrification amount of from ?3 to +3 nC when the cover tape has a surface resistivity of less than 1011 ?.Type: GrantFiled: May 27, 2002Date of Patent: November 25, 2008Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Tetsuo Fujimura, Takeshi Miyakawa, Mikio Shimizu, Satoshi Yokoyama, Masanori Higano, Masanori Ishii, Kazuhiro Kosugi, Takashi Tomizawa
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Patent number: 7445119Abstract: Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.Type: GrantFiled: April 29, 2004Date of Patent: November 4, 2008Assignee: Osram Opto Semiconductors GmbHInventors: Mathias Kaempf, Frank Singer, Jurgen Dachs, Alfred Bachler
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Publication number: 20080202981Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.Type: ApplicationFiled: February 25, 2008Publication date: August 28, 2008Applicant: FUJITSU LIMITEDInventors: Yuuzou HAMANAKA, Yukio ANDO, Keiichi SASAMURA, Kenichi YAZAKI, Yuuji HASEGAWA, Kouichi SHINYA
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Patent number: 7399657Abstract: Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires.Type: GrantFiled: July 31, 2002Date of Patent: July 15, 2008Assignee: Micron Technology, Inc.Inventors: Todd O. Bolken, Chad A. Cobbley
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Patent number: 7395932Abstract: A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.Type: GrantFiled: July 27, 2006Date of Patent: July 8, 2008Assignee: Infineon Technologies AGInventors: Boon Kiat Chew, Chye Lin Toh, Ching Yun Tye, Lee Hua Alvin Seah
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Patent number: 7389877Abstract: An apparatus for packaging electronic components, particularly integrated circuits, which includes a carrier tape into or on which the integrated circuits can be secured, a packing reel, to which is secured the carrier tape, wherein one or more components of the packing reel is composed of a plastic material and a desiccating material, and preferably a copolymer, and optionally an electrostatic dissipating product. The packing reel may further include a humidity indicating system. The apparatus may also be placed within a water and moisture-proof barrier bag for shipment purposes.Type: GrantFiled: December 6, 2004Date of Patent: June 24, 2008Assignee: Sud-Chemie Inc.Inventors: Stefan Dick, Michelle Martin, Francois Dessus
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Publication number: 20080087573Abstract: Provided are a carrier tape and a method of wrapping semiconductor devices using the carrier tape. The carrier tape may include a frame tape having perforation portions, and a pocket having a recessed bottom on which the semiconductor device may be received. The stopper may prevent the semiconductor device received in the recessed bottom from escaping from the pocket. The stopper may be capable of being attached/detached into/from the perforation portion. The carrier tape may be recyclable to be more environmentally friendly. In addition, even if a defective portion is generated on the pocket, the corresponding portion may be more easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape.Type: ApplicationFiled: October 17, 2007Publication date: April 17, 2008Inventor: Moon-soo Han
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Publication number: 20080087572Abstract: A component carrier tape having a longitudinal flexible strip; a plurality of pockets longitudinally positioned on the longitudinal strip and configured for receiving a component therein, each of the pockets separated from an adjacent pocket by a crossbar; wherein at least one crossbar includes at least one release feature.Type: ApplicationFiled: October 4, 2007Publication date: April 17, 2008Inventor: Charlie V. Wihren
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Publication number: 20080000804Abstract: Embodiments of a carrier tape having an integrated cover tape are disclosed. The carrier tape may comprise a base having a number of spaced-apart pockets. A first cover tape piece and a second cover tape piece may each be secured to the carrier tape base. Opposing inner ends of the first and second cover tape pieces extend toward the center of the carrier tape base and over portions of the pockets, and a gap exists between these opposing inner edges. The gap overlies the pockets, but this gap is sized to retain parts within the pockets when the cover tape pieces are “at rest.” A separator tool may be inserted within this gap and underneath the first and second cover tape pieces, and this separator tool may spread apart the cover tape pieces, allowing parts to be removed from or placed in the carrier tape. Other embodiments are described and claimed.Type: ApplicationFiled: June 29, 2006Publication date: January 3, 2008Inventors: David A. Carey, Andrew Contes
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Patent number: 7228622Abstract: A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.Type: GrantFiled: August 11, 2004Date of Patent: June 12, 2007Assignee: Intel CorporationInventor: Jeffrey Watson
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Patent number: 7219803Abstract: A carrier tape for holding a plurality of disks includes a thin, elongate strip of polymer material presenting a longitudinal axis and having a plurality of pockets defined therein. Each pocket is adapted to receive a separate one of the disks. The pockets are spaced apart and arranged along the longitudinal axis of the strip, and each pocket has at least one operable disk restraining structure for retaining the disk when the disk is received in the pocket.Type: GrantFiled: March 28, 2005Date of Patent: May 22, 2007Assignee: Entegris, Inc.Inventors: Ronald E. Thomas, Jr., Steven P. Kolbow, Joy A. Duban-Hu
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Patent number: 7172779Abstract: A food package for sliced food products to be maintained with a fluffed appearance, the package including a rigid base member forming a compartment for receiving the food product and a rigid lid sealed to the compartment. Advantageously, the base member includes a bottom wall and side wall portions that are configured to engage the food product to hold the slices in a fluffed arrangement thereof. Preferably, one or more tapered side wall portions hold the food product upwardly toward the lid and inwardly toward a center of the package. In preferred embodiments, the base member and lid provide a rigid-rigid construction of the food package. In preferred embodiments, the food package is also configured to stand-up in a vertical display orientation and does not require the food product be contained within a sealed pouch within the compartment.Type: GrantFiled: September 27, 2002Date of Patent: February 6, 2007Assignee: Kraft Foods Holdings, Inc.Inventors: Carolina Castellanos, Daniel Eugene Doucette
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Patent number: 7143896Abstract: An embossed carrier tape includes a plurality of device pockets (device holes) in which electronic devices are held one by one; and support portions each of which is formed at a surrounding area of each of the device pockets. The support portions are of step-shaped on which the electronic devices are put and supported.Type: GrantFiled: June 29, 2004Date of Patent: December 5, 2006Assignee: Oki Electric Industry Co., LtdInventor: Mamoru Susaki
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Patent number: 7127805Abstract: A system and apparatus are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.Type: GrantFiled: November 20, 2002Date of Patent: October 31, 2006Assignee: Intel CorporationInventor: Jeffrey Watson
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Patent number: 7112305Abstract: A method and system for economically packaging microarrays into sealed reaction chambers and storage vessels. A pocket strip is manufactured as a linear sequence of pockets, or wells, into which microarrays are positioned. A cover strip is then heat sealed to the upper surface of the pocket strip to create a linear sequence of sealed reaction chambers or storage vessels each containing a microarray. Mechanical features or optical features are included along the length of the pocket strip to facilitate mechanical translation and positioning of microarrays embedded within the microarray strip. Septa are affixed to, or embedded within, the cover strip to provide resealable ports through which solutions can be introduced into, or extracted from, the reaction chambers.Type: GrantFiled: January 31, 2001Date of Patent: September 26, 2006Assignee: Agilent Technologies, Inc.Inventors: John F. McEntee, Jay K. Bass, Roy H. Kanemoto
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Patent number: 7108899Abstract: A tray for handling and retaining a plurality of components, wherein the tray has a rigid body portion and an elastomeric contact layer. The contact layer has a planar upper surface for contacting and retaining the components, and may be formed from a thermoplastic material having a surface energy between 20 dyne/cm and 100 dyne/cm, a hardness of between about Shore A15 and Shore D75, and a surface electrical resistivity of between about 1×104 ohms/square and 1×1012 ohms/square.Type: GrantFiled: September 11, 2002Date of Patent: September 19, 2006Assignee: Entegris, Inc.Inventors: Charles W. Extrand, Ralph Henderer
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Patent number: 7097040Abstract: An improvement in adhesive backed carrier tapes where the adhesion is substantially reduced by using a UV-sensitive adhesive tape which can be irradiated to reduce the adhesion within the compartment where each device will be placed. By reducing the initial aggressive adhesion levels minimally sufficient to retain devices securely as placed, the requirement for a lift pin or pushup pin to assist in removing the component can be eliminated. The principal benefits include substantial increase in throughputs and yields accompanied by proportionate cost reduction benefits.Type: GrantFiled: August 5, 2005Date of Patent: August 29, 2006Inventor: Charles Gutentag
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Patent number: 7044304Abstract: A flexible carrier tape system suitable for transporting and/or storing an electrical component, which has an exposed metal surface sensitive to corrosion. The system comprises a container having a corrosion inhibitor therein, which is capable of reacting with the metal to form a film as an electromechanical barrier against corrosive attack; a component is placed in the container. In the preferred embodiment of the flexible carrier tape system, an elongated base strip has an upper surface and a plurality of longitudinally spaced cavities extending downwardly a predetermined depth from said upper surface for housing electrical components therein. A component in each of the cavities has at least one exposed metal surface sensitive to corrosion. An elongated cover strip for the upper base strip surface has a corrosion inhibitor deposited on that strip surface which faces the cavities.Type: GrantFiled: August 28, 2002Date of Patent: May 16, 2006Assignee: Texas Instruments IncorporatedInventors: John P. Tellkamp, Clessie A. Troxtell, Jr.
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Patent number: 7021467Abstract: A carrier tape including a main body; plural pockets arranged on the main body and configured to contain goods therein, wherein the pockets have depths greater than the thickness of the main body, and wherein the pockets are arranged at equal intervals in a longitudinal direction of the main body; and plural dummy pockets arranged on the main body, wherein the dummy pockets extend away from the main body no less than the pockets. The dummy pockets can be replaced with ribs having a plate shape. A container including the carrier tape and a resin cover tape which covers the pockets and the dummy pockets. The container can be reeled.Type: GrantFiled: April 14, 2003Date of Patent: April 4, 2006Assignee: Ricoh Company, Ltd.Inventor: Hironobu Agari
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Patent number: 6981595Abstract: A carrier tape for receiving, seating, storing and transporting components having an upper surface, a lower surface, four corners and four sidewalls. The tape includes a strip of material with a plurality of pockets. Each pocket includes a plurality of corner guides with angled engagement members for guiding, centering and supporting a component by its lower peripheral corner without any other contact between the component and the pocket. The pocket may include at least one support shelf positioned so as to contact a corner of the component upon misalignment of the component and thereby prevent further downward movement of the component in the pocket.Type: GrantFiled: May 1, 2003Date of Patent: January 3, 2006Assignee: Entegris, Inc.Inventors: Samuil Brahmbhatt, Ralph Henderer
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Patent number: 6945406Abstract: A tape carrier package (TCP) film for use with liquid crystal displays. The tape carrier package (TCP) film includes depressions and punch holes that enable fast, efficient separation of a tape carrier part, which includes driving integrated circuits, from a peripheral part. The tape carrier part has an “I” shape that is formed by depressions. Punching holes are provided along the depressions to reduce the length of the connection between the tape carrier package part and the peripheral part. The peripheral part includes a plurality of sprocket holes along the edges of the tape carrier package film.Type: GrantFiled: February 20, 2001Date of Patent: September 20, 2005Assignee: LG.Philips LCD Co., Ltd.Inventors: Hong-Sung Song, Sung-Woong Moon
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Patent number: 6926937Abstract: A tray for handling and retaining a plurality of small components comprising a rigid body portion with a plurality of pockets formed therein. Each of the pockets has an elastomeric contact surface for contacting and retaining a component. The contact surface may be formed from a thermoplastic material having a surface energy between 20 dyne/cm and 100 dyne/cm, and a surface electrical resistivity of between about 1×104 ohms/square and 1×1012 ohms/square. The material for the contact portion may be urethane, polybutylene terephthalate, polyolefin, polyethylene terephthalate, styrenic block co-polymer, styrene-butadiene rubber, polyether block polyamide, or polypropylene/crosslinked EDPM rubber.Type: GrantFiled: September 11, 2002Date of Patent: August 9, 2005Assignee: Entegris, Inc.Inventors: Charles W. Extrand, Frank Manganiello
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Patent number: 6914771Abstract: A tray for accommodating electronic components with edge portions and contacts includes a main portion for forming the tray, and a plurality of accommodation cavities formed in the tray for accommodating a plurality of electronic components therein. Each accommodation cavity includes partition walls for surrounding the electronic components, support steps extending horizontally inwardly from lower ends of the partition walls to form a first space therein and to support the edge portions of the electronic component, and descending walls extending downwardly from the support steps to define the first space. Each partition wall has a lower portion with a first inclination for a mold removing operation, and each descending wall has a second inclination greater than that of the first inclination to be able to contact and support an edge of the electronic component when falling from the edge portion.Type: GrantFiled: May 13, 2003Date of Patent: July 5, 2005Assignees: Ohkawa Mold Designs & Engineering Co., Ltd.Inventors: Hirokazu Ono, Kunihiro Teshima
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Patent number: 6892886Abstract: A carrier tape for handling electrical components includes a reinforced component restraining member. Each pocket of the carrier tape includes at least one component restraining member that resists lateral movement of a component within the pocket. The component restraining member includes a first portion having a first height or spacing from a bottom surface in the pocket. A second portion of the restraining member has a second, taller height or spacing from the bottom surface. The first, lower portion reinforces the component restraining member and strengthens it to avoid lateral deformation during shipment or handling of the carrier tape when an electrical component is placed within the pocket.Type: GrantFiled: July 12, 2002Date of Patent: May 17, 2005Assignee: e.PAK International, Inc.Inventors: Mao Shi Khoo, Ru Zheng Liu, GuangLiang Xu, Yong Fan, SongPing Chen
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Patent number: 6875493Abstract: Apparatus and methods are presented herein for protecting electronic components from damage during transport or “drop testing.” A packaging system of the present invention includes a novel cover tape bonded to a carrier tape, which cover tape includes a foam layer attached thereto on its underside. The foam layer prevents excessive movement of the electronic components within the cavities, thereby protecting the leads and other parts of the components from damage. The method for protecting the components in the cavities of the carrier tape includes attaching the foam layer on the underside of the cover tape before sealing the cover tape on the carrier tape. When the cover tape is bonded to the carrier tape with the components placed in the cavities, the foam layer prevents excessive movement of the components therein.Type: GrantFiled: December 24, 2002Date of Patent: April 5, 2005Assignee: Peak Plastic & Metal Products (International) Ltd.Inventor: Robert J. White Jr.
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Patent number: 6869040Abstract: A method, a system and an arrangement for handling component tapes in connection with mounting components onto circuit boards in a component mounting machine are disclosed, which utilizes a carrier for carrying component tapes. Each component tape is held by a component tape reel. The component mounting machine utilizes component magazines from which components, carried by the component tape, are supplied for use in a mounting process of the component mounting machine. The component tape of each component tape reel is loaded into a tape guide for guiding the component tape in the component mounting machine, and the component tape reels are arranged in the carrier, which thereaft is placed in the magazine. The tape guides are then mounted in the magazine such that the component tape loaded therein may interact with feeding devices provided in the magazine. Thereby, the magazine is loaded with components and prepared for the ensuing mounting process.Type: GrantFiled: September 6, 2002Date of Patent: March 22, 2005Assignee: Mydata Automation ABInventor: Eric Esk{dot over (a)}ng
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Publication number: 20040191033Abstract: A method and apparatus for the handling and containment of a cover tape peeled from a pocket tape in a component feeder are disclosed. A single folding pulley comprising inclined sides and an undercut at the hub folds the adhesive contaminated edges back onto themselves so as to captivate the adhesive therebetweeen. A cover tape reservoir, having an internal cavity defined by a curved perimeter and treated sides, stores the folded cover tape. The remaining reservoir capacity is monitor in software for fullness. The cover tape is corrugated to allow for maximum packing density with a minimum of voids as it is pushed into the reservoir.Type: ApplicationFiled: March 25, 2004Publication date: September 30, 2004Applicant: Delaware Capital Formation, Inc.Inventors: Louis Tandle, Gregory A. Holcomb, John Piccone
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Publication number: 20040178114Abstract: Wafer holder for semiconductor manufacturing and semiconductor manufacturing device in which the holder is installed, the wafer holder having a wafer-carrying surface whose wafer-retaining face has an enhanced isothermal rating. In the wafer holder having a wafer-carrying surface, multiple nubs having a flat portion are formed on the wafer-carrying surface; and by making the surface area of the flats on the nubs 70 mm2 or less per nub, distribution in obverse-surface temperature of a wafer set in place on the wafer holder can be brought within ±1.0%. If moreover the per-nub flat surface area is 30 mm2 or less, the temperature can be brought within ±0.5%. In addition, the total surface area of the flats on the nubs preferably is 40% or less of the wafer surface area, inasmuch as the incidence of trouble when de-chucking the wafers can be kept under control.Type: ApplicationFiled: July 28, 2003Publication date: September 16, 2004Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Manabu Hashikura
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Patent number: 6769549Abstract: An embossed carrier tape includes a plurality of device pockets (device holes) in which electronic devices are held one by one; and support portions each of which is formed at a surrounding area of each of the device pockets. The support portions are of step-shaped on which the electronic devices are put and supported.Type: GrantFiled: January 8, 2001Date of Patent: August 3, 2004Assignee: Oki Electric Industry Co., Ltd.Inventor: Mamoru Susaki
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Publication number: 20040144687Abstract: Apparatus for transporting semiconductor chips defining electronic circuitry or the like including a base layer of deformable anti-static film; a thin plastic body layer having a first surface to which the base layer adheres, the body layer having one or more cavities shaped to hold chips; and an anti-static holding layer adhering to a surface of the body layer opposite the base layer, the holding layer being less deformable than the base layer and provided with openings through which a chip defining electronic circuitry or the like may be inserted into one of the cavities and will be held in place therein by the holding layer.Type: ApplicationFiled: January 28, 2003Publication date: July 29, 2004Applicant: Passion View International CorporationInventor: Szu-Cheng Sun
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Publication number: 20040124119Abstract: Disclosed is a carrier tape for use in the parts-implanting machine for carrying parts therewith having means for being towed in the carrier tape and disposed in a longitudinal direction thereof and first means for capturing each of first parts, further comprising one or two longitudinally linear linings formed of hot-melt or sticky material and coated on one surface of the carrier tape such that each of the first part-capturing means is disposed in parallel with the linings, whereby after a cover tape is overlaid on the surface of the carrier tape, heat-staked or born down hard with each of the first parts captured by the first part-capturing means and disposed in between the carrier tape and the cover tape, and then fed into the machine by towing the means for being towed, each of the first parts is carried over to a place intended for the first parts and ready to be taken out in a cyclic manner as the carrier tape is peeled off the cover tape.Type: ApplicationFiled: December 30, 2002Publication date: July 1, 2004Inventors: Seung Bae Ahn, Jin Sung Park
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Publication number: 20040094451Abstract: In a carrier tape for supplying an electronic part to an electronic part mounting apparatus for taking out the electronic part from a tape feeder to mount to a board, a tail side connecting portion having a cutout portion is provided to a tail side of the carrier tape mounted to the tape feeder, a front side connecting portion having a chipped portion is provided to a head side of the carrier tape to be used newly, respectively, and in tape splicing operation when a reel is interchanged, the cutout portion is fitted to the chipped portion and adhesive tapes are pasted thereon from two upper and lower faces thereof. Thereby, the tail side connecting portion and the head side connecting portion can be positioned in a longitudinal direction, a width direction and a thickness direction of the tape and held to each other and can efficiently be connected without using an exclusive connecting jig.Type: ApplicationFiled: November 10, 2003Publication date: May 20, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventor: Hidehiro Saho
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Publication number: 20040094450Abstract: Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing stations to temporarily hold a carrier (40) and its components (10), such as resistors, in a fixed position during various processes, such as termination. The carriers (40) include a rigid substructure (50) and a more elastic coating (60) to provide receiving holes (46) that can be adapted to hold particular components (10). The carriers (40) can be replaced without removing the belt (72), whenever differently shaped holes (46) are desired or become too worn to reliably handle components (10), thereby reducing damage risk, replacement cost, and operational down time of the belt (72).Type: ApplicationFiled: August 15, 2003Publication date: May 20, 2004Inventors: Kenneth S. Whiteman, John D. Stackpole
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Patent number: 6729474Abstract: There is disclosed an electronic parts carrier tape in which a nesting phenomenon, in which superposed embossed portions are fitted together after winding the carrier tape on a reel, is less liable to occur. The electronic parts carrier tape includes a flexible, tape-like member having electronic part-storing embossed portions arranged at predetermined intervals in a longitudinal direction of the tape-like member. At least one rib is formed on and projects outwardly from an outer surface of a peripheral wall of each of the embossed portions. An outer dimension (X) of a bottom of the embossed portion, as seen in a cross-section of the embossed portion through the rib, is larger than a dimension (Y) of an opening in a top of the embossed portion.Type: GrantFiled: June 18, 2001Date of Patent: May 4, 2004Assignees: Sumitomo Bakelite Co., Ltd., Sumicarrier Singapore Pte., Ltd.Inventors: Tung Teck Hong, Hideto Aoki
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Publication number: 20040040886Abstract: A flexible carrier tape system suitable for transporting and/or storing an electrical component, which has an exposed metal surface sensitive to corrosion. The system comprises a container having a corrosion inhibitor therein, which is capable of reacting with the metal to form a film as an electromechanical barrier against corrosive attack; a component is placed in the container.Type: ApplicationFiled: August 28, 2002Publication date: March 4, 2004Inventors: John P. Tellkamp, Clessie A. Troxtell
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Publication number: 20040035747Abstract: A flexible temporary component-carrier tape used for storing, transporting and supplying components includes apertures for receiving and temporarily storing components, as well as at least one weakened region between at least two of the apertures. Each weakened region prevents bowing or kinking of the temporary component-carrying tape at the apertures thereof. The temporary component-carrier tape comprises a device-retaining layer including a top surface, the apertures, and, optionally, a series of advancement wheel holes adjacent to an edge thereof. Components may be enclosed in the temporary component-carrier tape aperture by attaching a cover layer to a surface of the device-retaining layer and at least partially over the apertures. Methods for making and using the temporary component-carrying tape are also disclosed.Type: ApplicationFiled: August 21, 2002Publication date: February 26, 2004Inventor: Michael S. Butler
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Patent number: 6688472Abstract: A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the recess toward a bottom area of the recess. The pair of projections have respective support surfaces facing to each other in the first direction. A distance between the support surfaces of the pair in the first direction decreases in the second direction in such a manner that each of the support surfaces contacts simultaneously the electric device to prevent the electric device from moving in the first direction.Type: GrantFiled: January 3, 2002Date of Patent: February 10, 2004Assignees: Sumitomo Bakelite Company Limited, Sumicarrier Singapore Pte. Ltd.Inventors: Tung Teck Hong, Hideto Aoki