Abstract: A packing device (1) is for accommodating electrical connectors (2). The packing device includes a body (10), and a plurality of cavities (11) defined in the body. Each cavity is bounded by a bottom wall having a higher front end (12) and a lower rear end (13), a front wall (14) adjacent the front end, and a rear wall (15) adjacent the rear end. A through slot (18) is defined in the front end. When the packing device filled. with electrical connectors reaches a corner or curve of an assembly line, a rearward one of two adjacent cavities tilts. The front wall at the rearward cavity bends into the slot at the rearward cavity, instead of contacting and bending or distorting the rear wall at the adjacent forward cavity. Thus, the electrical connector in the forward cavity can be reliably picked up by a suction machine of the assembly, line.

Abstract: A carrier tape for receiving, seating, storing and transporting components having an upper surface, a lower surface, four corners and four sidewalls. The tape includes a strip of material with a plurality of pockets. Each pocket includes a plurality of corner guides with angled engagement members for guiding, centering and supporting a component by its lower peripheral corner without any other contact between the component and the pocket. The pocket may include at least one support shelf positioned so as to contact a corner of the component upon misalignment of the component and thereby prevent further downward movement of the component in the pocket.

Abstract: A connecting member, used for serially connecting two carrier tapes, comprises a base film, a belt-like reference band substantially fixed on the base film, a bonding tape adhering on the base film, and a cover film covering the bonding tape. A straight reference face is provided on a longitudinal side of the reference band closely to the bonding tape.

Abstract: A carrier tape for handling electrical components includes a reinforced component restraining member. Each pocket of the carrier tape includes at least one component restraining member that resists lateral movement of a component within the pocket. The component restraining member includes a first portion having a first height or spacing from a bottom surface in the pocket. A second portion of the restraining member has a second, taller height or spacing from the bottom surface. The first, lower portion reinforces the component restraining member and strengthens it to avoid lateral deformation during shipment or handling of the carrier tape when an electrical component is placed within the pocket.

Abstract: A chip tray includes a raised storage area formed integrally on a base. Multiple rectangular chip compartments and multiple notches are defined in the raised storage area. Each notch in each corner of the chip compartment communicates with the compartment. When rectangular chips are placed in the chip compartments, each corner of the chips is positioned in the corresponding notch. Therefore the corners of the chip are positioned in the notches to prevent damage to the corners of the chips from ramming into the chip tray.

Abstract: A carrier tape including a main body; plural pockets arranged on the main body and configured to contain goods therein, wherein the pockets have depths greater than the thickness of the main body, and wherein the pockets are arranged at equal intervals in a longitudinal direction of the main body; and plural dummy pockets arranged on the main body, wherein the dummy pockets extend away from the main body no less than the pockets. The dummy pockets can be replaced with ribs having a plate shape. A container including the carrier tape and a resin cover tape which covers the pockets and the dummy pockets. The container can be reeled.

Abstract: A chip tray includes a first member (11) having an adhesive (13) on an upper face thereof and a second member (12) having upper and lower faces and at least one chip carrying section (14) having a through hole (15) extending downwardly from a bottom of the chip carrying section to the lower face of the second member. The second member is placed upon the first member such that the upper face of the first member is opposed to the lower face of the second member.

Abstract: A semiconductor wafer (70) that includes a support body (72), at least one thin die (20, 60), and a plurality of tethers (78, 178). The support body (72) is made of a semiconductor material. The thin die (20, 60) has a circuit (21) formed thereon and has an outer perimeter (74) defined by an open trench (76). The open trench (76) separates the thin die (20, 60) from the support body (72). The tethers (78, 178) extend across the open trench (76) and between the support body (72) and the thin die (20, 60). A method of making a thin die (20, 60) on a wafer (70) where the wafer (70) has a support body (72), a topside (82) and a backside (90). A circuit (21) is formed on the topside (82) of the wafer (70).

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: A carrier tape for an IC device includes a slot for receiving the IC device. The slot is defined by a bottom wall and two pairs of opposite sidewalls. The sidewalls are substantially vertical to the bottom wall. A bevel wall located between the bottom wall and one of the sidewalls.

Abstract: A carrier tape (1) includes a plurality of sockets (10) for accommodating products, and a connecting wall (20) connecting the sockets with each other. Each socket includes a bottom wall (14) and sidewalls (12) extending upwardly from edges of the bottom wall. The bottom walls form reinforcing portions (146) thereon which improve the strength of the carrier tape.

Abstract: A packaging strip has a series of receiving cavities formed thereon for each receiving an electronic component therein. Each of the receiving cavities is internally provided along peripheral edges with ribs and near a central area with a stepped land portion. The electronic component is received in the receiving cavity with its peripheral edges rested on the ribs, so that most part of the electronic component is suspended in the receiving cavity and a distance is kept between contacts at a bottom surface of the electronic component and a bottom of the receiving cavity. The stepped land portion restricts the electronic component from moving in the receiving cavity. When the packaging strip is wound into a roll and compresses the receiving cavities, the land portions arch to elevate the electronic components, protecting contacts of the electronic components from damage due to collision with the receiving cavity.

Abstract: A packaging strip has a series of receiving cavities formed thereon for each receiving an electronic component therein. Each of the receiving cavities is internally provided along peripheral edges with ribs and near a central area with a stepped land portion. The electronic component is received in the receiving cavity with its peripheral edges rested on the ribs, so that most part of the electronic component is suspended in the receiving cavity and a distance is kept between contacts at a bottom surface of the electronic component and a bottom of the receiving cavity. The stepped land portion restricts the electronic component from moving in the receiving cavity. When the packaging strip is wound into a roll and compresses the receiving cavities, the land portions arch to elevate the electronic components, protecting contacts of the electronic components from damage due to collision with the receiving cavity.

Abstract: It is to provide an embossed carrier tape and a sheet for an embossed carrier tape suitable for high-speed mounting.

Abstract: A system for inspection components that are sealed within tape is provided. The system includes a light source that can illuminate the components through a tape layer. A polarizer is used to polarize light from the light source, the components, and the tape layer, so as to reduce glare and reflected light. An image system receives light from the polarizer and stores image data for each component.

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: Apparatus and methods are presented herein for protecting electronic components from damage during transport or “drop testing.” A packaging system of the present invention includes a novel cover tape bonded to a carrier tape, which cover tape includes a foam layer attached thereto on its underside. The foam layer prevents excessive movement of the electronic components within the cavities, thereby protecting the leads and other parts of the components from damage. The method for protecting the components in the cavities of the carrier tape includes attaching the foam layer on the underside of the cover tape before sealing the cover tape on the carrier tape. When the cover tape is bonded to the carrier tape with the components placed in the cavities, the foam layer prevents excessive movement of the components therein.

Abstract: An embossed carrier tape used for carrying electronic devices, includes a plurality of pockets in which the electronic devices are held. Each of the pockets includes a plurality of inner side surfaces which are separated by ridge lines. Each of the pockets is shaped so that corners of the electronic device are not in contact with the ridge lines thereof.

Abstract: A cover tape for an electronic component carrier including a polyester substrate, a layer of an electrically conductive coating comprising a dispersion of a conductive polymer selected from the group consisting of polythiophenes and polyanilines, said polymer having a conjugated polymer backbone and polymeric polyanion compounds, and a binder coated on at least a portion of at least one major surface of the substrate, and a layer containing a polymeric pressure-sensitive adhesive composition, where the tape having a degree of clarity of from about 80% to about 99%, and a surface resistance of from about 1×104 to about 1×1012 Ohm.

Abstract: Apparatus and methods are presented herein for uniformly sealing and peeling a cover tape to/from a carrier tape. The carrier tapes of the present invention include surface transitions that minimizes/eliminates surface irregularities and distortions such that the cover tapes can be uniformly sealed and peeled from the carrier tapes. The surface transitions act as physical barriers to prevent propagation of surface irregularities and distortions from the thermoformed pocket area into the heat bonding zones. The surface transitions also act as stiffening members to keep the heat bonding zones as flat as possible during subsequent handling of the carrier tape. The surface transitions may be in the form of continuous or intermittent ribs, step portions, or single or double sided grooves. Depressed portions in between the pockets can also be used to minimize the presence of surface distortions on the bonding zones.

Abstract: A flexible carrier tape system, suitable for housing components and for winding on a reel in high density, is disclosed, comprising an elongated base strip having a plurality of longitudinally spaced cavities with side walls having a step-like groove near the surface around the cavity, comprising further an elongated cover strip having a width matching the width of the cavity including the widths of the grooves, the cover strip sealed onto the base strip so that the cover strip rests on the step-like grooves. In one embodiment, the sealed cover strip forms a substantially uniform plane with the upper surface of the base strip. The thickness consumed by each tape winding becomes a minimum so that a high density of components can be stored and transported.

Abstract: An electronic component package for containing a plurality of electronic components. The package including structure that provides at least two configurations. In the first configuration, the package functions as a sufficiently rigid tray for supporting and protecting the plurality of components during storage, shipping and handling of the package. In the second configuration, the package functions as a flexible carrier tape for feeding the components into and through automated component handling and placement equipment. The structure includes package edges interconnected to and extending along a plurality of tray sections in which the components are housed. In one embodiment, the package edges connect to a cover to provide the first rigid tray configuration. In another embodiment, the package edges include flexible edge wings that rotate into position and are secured to provide the first rigid tray configuration.

Abstract: A flexible carrier tape system, suitable for housing components and for winding on a reel in high density, is disclosed, comprising an elongated base strip having a plurality of longitudinally spaced cavities with side walls having a step-like groove near the surface around the cavity, comprising further an elongated cover strip having a width matching the width of the cavity including the widths of the grooves, the cover strip sealed onto the base strip so that the cover strip rests on the step-like grooves. In one embodiment, the sealed cover strip forms a substantially uniform plane with the upper surface of the base strip. The thickness consumed by each tape winding becomes a minimum so that a high density of components can be stored and transported.

Abstract: In a parts storing tape, a first stepped part which has the predetermined height and is more extended than the other inner side faces of a recessed part in the width direction and the longitudinal direction of the above parts storing tape is provided at each corner part of the recessed part. Thereby, even if the corner part of a storing part is more projecting outside than the other peripheral part, the above storing part can be supported without that its corner parts contact or stick in the inner side faces of the parts storing tape by each of the first stepped parts. At the same time, in a tape-shaped parts package, a tape-shaped cover and a parts packaging apparatus, projecting parts which have resilience and are elastic in the direction of thickness of the above tape-shaped cover are provided or can be provided respectively corresponding to each recessed part of the parts storing tape on the surface opposite to the parts storing tape of the tape-shaped cover.

Abstract: A container for receiving an electric device in a recess thereof has a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction directed from a top opening area of a recess toward a bottom area of the recess,

Abstract: A structure and method for protecting encapsulated semiconductor integrated microcircuit dice during shipping. The structure secures the position of the encapsulated die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the packaged dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate encapsulated die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed encapsulated die.

Abstract: A component engagement member (7, 27) is provided at an opening part of a container having a storage recess (5, 25) for storing a component (10, 30). The component engagement member is releasably engaged with at least a part of an upper face of the component stored in the storage recess, thereby holding the component at a predetermined position. An inspection hole (11, 31) is opened at a part of the storage recess so as to allow inspection of the component stored in the storage recess from outside. An inspection member such as an inspection pin or the like can be inserted through the inspection hole from outside of a component storage unit and brought in contact with a connecting terminal of the stored component, thereby achieving inspection to the stored component.

Abstract: A system for inspection components that are sealed within tape is provided. The system includes a light source that can illuminate the components through a tape layer. A polarizer is used to polarize light from the light source, the components, and the tape layer, so as to reduce glare and reflected light. An image system receives light from the polarizer and stores image data for each component.

Abstract: Components (62-65) are consecutively taken out from a plurality of component feeders (52) which supply a multiplicity of components to a component feeding position (52a) in succession, transferred to a prescribed assembling position (54a, 154a, 157a), and assembled into a product (61), which is then transferred to and held in each of a multiplicity of holding recesses provided in a product storing means (53, 153). This method allows the components to be assembled into a product by a component assembling apparatus of compact and simple construction, as well as permits the assembled product to be held and carried in the holding recesses of the product storing means to the next step of the process.

Abstract: A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die or integrated circuit (IC) chips for automated assembly processing. The carrier tape system is comprised of a longitudinally elongated flexible carrier tape frame with a plurality of spaced apart aperture cavities and a pair of pressure sensitive adhesive tape rails affixed to one surface of the carrier tape frame with the adhesive surfaces facing into the aperture cavities of the carrier tape frame. Each PSA tape rail has a longitudinal linear side edge and a configured side edge, where the linear side edge is affixed to the surface of the of the carrier tape frame and the configured side edge extends into and overlaps the aperture cavities for adhesioning the back side of the small components. With the configured side edges of PSA tape rails, a range or adhesion levels can be achieved with the PSA tape rails in one fixed gap width location.

Abstract: There is disclosed an electronic parts carrier tape in which a nesting phenomenon, in which superposed embossed portions are fitted together after winding the carrier tape on a reel, is less liable to occur. The electronic parts carrier tape includes a flexible, tape-like member having electronic part-storing embossed portions arranged at predetermined intervals in a longitudinal direction of the tape-like member. At least one rib is formed on and projects outwardly from an outer surface of a peripheral wall of each of the embossed portions. An outer dimension (X) of a bottom of the embossed portion, as seen in a cross-section of the embossed portion through the rib, is larger than a dimension (Y) of an opening in a top of the embossed portion.

Abstract: An embossed carrier tape used for carrying electronic devices, includes a plurality of pockets (device holes) in which the electronic devices are held one by one. Each of the pockets (device holes) includes a plurality of inner side surfaces which are separated by ridge lines. Each of the pockets (device holes) is shaped so that corners of the electronic device are not in contact with the ridge lines thereof.

Abstract: An embossed carrier tape includes a plurality of device pockets (device holes) in which electronic devices are held one by one; and support portions each of which is formed at a surrounding area of each of the device pockets. The support portions are of step-shaped on which the electronic devices are put and supported.

Abstract: The present invention is a part retainer for housing and retaining various electronic and mechanical parts wherein a retaining unit has an engaging piece that stably stops at both a position at which it protrudes toward the opening of a part housing space and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece prevents the part housed in the housing space from falling out.

Abstract: A component tape includes a carrier tape with an elongate cover tape applied over pockets of the carrier tape. The component tape includes information printed on a portion of the component tape. The printed information includes a count or quantity of electronic components carried by the component tape, where the count at a particular location on the component tape indicates the position of the corresponding electronic component on the component tape. An indicator is printed corresponding to each quantity count that indicates which component position of the tape corresponds to the printed count. The printed information may also include a variety of information associated with the components, information comprising part number, tolerance and value description, batch number, lot number, component manufacturer, and component vendor. The printed information is produced by direct marking, as with laser etching or printing, or by imaging.

Abstract: A component tape includes a carrier tape with an elongate cover tape applied over pockets of the carrier tape. The component tape includes information printed on a portion of the component tape. The printed information includes a count or quantity of electronic components carried by the component tape, where the count at a particular location on the component tape indicates the position of the corresponding electronic component on the component tape. An indicator is printed corresponding to each quantity count that indicates which component position of the tape corresponds to the printed count. The printed information may also include a variety of information associated with the components, information comprising part number, tolerance and value description, batch number, lot number, component manufacturer, and component vendor. The printed information is produced by direct marking, as with laser etching or printing, or by imaging.

Abstract: A semiconductor apparatus includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of IC chips that are provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, and further includes thick film reinforcing tapes with sprocket holes for transport use provided at uniform spaces, the reinforcing tapes being provided on both side portions of the insulating tape, in the lengthwise direction.

Abstract: A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged.

Abstract: A microchip carrier tape has a plurality of sets of pockets for accommodating microchips. Each set of pockets has side walls and end walls joined to bottom walls. The side walls in selected pockets have recesses at the juncture of the side walls with end walls. The bottom walls of the pockets have extensions that inhibit nesting or copulation of portions of the tape that are superimposed when wound on a reel.

Abstract: A method for fabricating a carrier tape having a row of pockets, including forming carrier tape sections by injection molding so that each of the carrier tape sections has at least one pocket for accommodating an article therein, and joining the carrier tape sections in the form of a tape. The first carrier tape section is first injection molded, and the second carrier tape section is then injection molded such that one side of the first carrier tape section is in contact with one side of the second carrier tape section. A further carrier tape section is then injection molded such that one side of the second carrier tape section is in contact with a side of the further carrier tape section, whereby the carrier tape sections are successively joined together.

Abstract: The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

Abstract: The present invention is a part retainer for housing and retaining various electronic and mechanical parts (27) wherein a retaining unit (2) has an engaging piece (7) that stably stops at both a position at which it protrudes toward the opening of a part housing space (5) and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece (7) prevents the part (27) housed in the housing space (5) from jumping out.

Abstract: In a parts storing tape, a first stepped part which has the predetermined height and is more extended than the other inner side faces of a recessed part in the width direction and the longitudinal direction of the above parts storing tape is provided at each corner part of the recessed part. Thereby, even if the corner part of a storing part is more projecting outside than the other peripheral part, the above storing part can be supported without that its corner parts contact or stick in the inner side faces of the parts storing tape by each of the first stepped parts. At the same time, in a tape-shaped parts package, a tape-shaped cover and a parts packaging apparatus, projecting parts which have resilience and are elastic in the direction of thickness of the above tape-shaped cover are provided or can be provided respectively corresponding to each recessed part of the parts storing tape on the surface opposite to the parts storing tape of the tape-shaped cover.

Abstract: A lightweight packing reel for storing encapsulated semiconductor devices which may be baked for extended periods of time at temperatures sufficiently high to desorb moisture from the packages, and which allows efficient flow of heat and air through the tape and reel assemblage is provided.

Abstract: A carrier tape capable of being formed by means of a die apparatus readily manufactured and exhibiting increased durability. The carrier tape is formed thereon with a plurality of receiving recesses for respectively receiving semiconductor packages therein in a manner to be spaced from each other at predetermined intervals in a longitudinal direction thereof. The receiving recesses are each provided at four corners thereof with shelf sections in a manner to be expanded outwardly from an opening of the receiving recess in a plane direction, so that the shelf sections may have an increased area. The shelf sections act to support a periphery of a bottom surface of the semiconductor package thereon. The receiving recess is also provided with positioning sections for positioning the semiconductor package in the plane direction while keeping sides of the semiconductor package in contact therewith. The positioning sections are respectively arranged between an adjacent two of the shelf sections.

Abstract: An embossed carrier tape capable of accurately accomplishing an automatic inspection of leads or the like of an electronic component by means of a camera. The carrier tape is formed with a plurality of receiving recesses in which electronic components are to be received, respectively. The receiving recesses are each formed at a lower portion of each of side surfaces thereof opposite to leads of the electronic component with an inclined surface. Such construction results in the leads being abutted against the inclined surface, to thereby be subjected to positional regulation if the electronic component is undesirably moved during inspection thereof. This permits a reflected image of the leads from the side surface of the receiving recess to be substantially separated from a directly-viewed image thereof during an inspection of the electronic component by image processing using a camera, to thereby ensure accurate judgment of any defect of the electronic component, such as bending of the leads or the like.

Abstract: A component carrier for holding a component includes a carrier substrate and a pocket recessed in the substrate for holding the component in its interior. The pocket has a wall and a floor, and the wall includes a series of elongated arcuate channels. The channels are concave relative to the pocket interior and extend substantially perpendicular to the pocket floor. The wall is substantially flat between the channels. A substantially continuous pedestal projects from the pocket floor. The pedestal has (i) an upper surface for supporting the component, (ii) a pair of support walls extending from the pocket floor and terminating in the support surface, and (iii) a notched portion intermediate the pedestal and defined by a lateral support member extending between the support walls and spaced from the pocket floor, for absorbing lateral components of compressive forces applied to the pedestal.

Abstract: A connecting hole is provided at one end of holder units oriented in a direction of connection of the holder units, and at the other end a connecting protrusion is provided which fits into the connecting hole and projects in a direction perpendicular to the direction of connection for engagement. The connecting protrusion is constructed by a pair of engagement pieces (15) disposed in parallel spaced relation in a direction perpendicular to the direction of connection and deformable toward each other. Locking protrusions are provided at a front end outer surfaces of the engagement pieces, which are adapted to engage peripheral edges of longitudinally opposite ends of the connecting hole for preventing dislocation. At one end of the holder unit in the direction of connection of the holder units there is provided a connection positioning hole and at the other end there is provided a connection positioning portion having a connecting protrusion which fits into the connection positioning hole.

Abstract: The carrier including a plurality of storage sections for individually accommodating electronic parts and a plurality of connecting sections for connecting the adjacent storage sections with each other. Each storage section is provided with a bottom wall and a side wall for defining a recess, and a support section for supporting the electronic part. The support section includes one rib continuously extending on the bottom wall along a generally rectangular profile, and a plurality of columnar projections projecting from the bottom wall to a height generally identical to one another and lower than a height of the rib. The bottom wall includes a first surface extending between the side wall and the rib to define a first region of the recess, and a second surface extending inside the rib to define a second region of the recess shallower than the first region. The columnar projections are arranged in a distributed manner on the second surface of the bottom wall.

Abstract: An electronic components packing system includes a base packing material provided with body containing portions for containing the bodies of electronic components, and lead wire containing portions, formed at respective body containing portions, for containing lead wires extending from the respective bodies of electronic components. A top tape is attached on the top of the base packing material preventing electronic components contained in the base packing material from bouncing out. This packing system maintains electronic components in such a manner that the positions of respective electronic components are fixed so that the electronic components do not touch each other.