Abstract: This patent relates to the fabrication of diaphragm-based microstructures used primarily for sensing physical phenomena by detecting a change in deflection, resonance, or curvature of the diaphragm. The methods of fabrication described and claimed herein relate primarily to diaphragm-based diaphragms made of silicon, either single crystal or polycrystalline in form, although other materials may be used.

Abstract: A capacitance acceleration sensor and method of making same are disclosed. A capacitance acceleration sensor includes a movable electrode etched from a silicon plate which is clamped between two solid dielectric plate members of glass, silicon oxides, or oxygen oxides. Static electrodes are secured to surfaces of the dielectric members facing opposite the movable electrode, thereby providing easy manufacturing assessibility for leadout wires from these electrodes. In certain embodiments, the movable electrode is formed integrally with a monocrystalline silicon plate member which also contains an integrated circuit for generating an output acceleration signal in response to movement of the movable electrode when the assembly experiences acceleration forces.

Abstract: A process for producing a metal coated substrate with an improved resistivity to cyclic temperature stress is provided. The substrate is provided with at least one insulating layer and at least one metal layer attached to at least one side of the insulating layer. The metal layer is made at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.

Abstract: An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.

Abstract: The method of shaping a polycrystalline diamond (PCD) body (exemplarily a wafer of CVD-PCD) utilizes our discovery that the rate and amount of diamond removal from a given region of a PCD body depends, for a given metal "etchant" at a given temperature, on the thickness of the etchant layer overlying the given region, with relatively larger etchant thickness being associated with relatively higher removal rate and amount. Exemplarily, the method can be used to substantially remove thickness variations and/or film curvature from as-produced PCD films. An exemplary metal that can be used in the practice of the invention is mischmetal. The metal etchant can be molten, partially molten or solid.

Abstract: An improved electrolytic capacitor is provided by producing an anode foil which has areas which are not subject to stress during manufacturing being highly etched and those areas which are subject to stress during manufacturing being lightly etched or not etched at all. The process of the invention provides an etch mask to cover during the etch process those portions of the anode foil which will be subjected to stress during construction of the capacitor. The highly etched areas, which are very brittle, provide increased capacitance and thus improved energy density. For layered or stacked capacitors, a weld tab is covered with the etch mask to allow connection of the anode layers. Additionally, strong edges may be maintained thereby reducing the possibility of cracking that would normally occur during the stamping and assembly operations.

Abstract: An array of thermal sensor elements (16) is formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of metal contacts (60) is formed to define masked (61) and unmasked (68) regions of the substrate (46). A second layer of metal contacts (62) is formed on the first layer of contacts (60). A radiation etch mask layer (66) is formed to encapsulate the exposed portions of the second layer of contacts (62). A dry-etch mask layer (74) is formed to encapsulate the exposed portions of the first layer of contacts (60) and radiation etch mask layer (66). An initial portion of each unmasked region (68) is etched using a dry-etch process. The remaining portions of the unmasked regions (68) are exposed to an etchant (70) and irradiated with electromagnetic energy to substantially increase the reactivity between the remaining portions and the etchant (70).

Abstract: A liquid crystal device of the present invention includes a pair of substrates opposed to each other with a composite containing polymer regions and liquid crystal regions interposed therebetween, at least one of the substrates being transparent, wherein an insulator as a gap keeping member for keeping a gap between the substrates is formed in the polymer regions.

Abstract: A process for forming a light valve device comprises forming a semiconductor single crystal film to form a composite substrate by polishing a semiconductor single crystal substrate after an electric insulating substrate has been bonded thereto; forming a group of pixel electrodes for defining a pixel region and a group of switch elements for selectively energizing the pixel electrodes by integrating a pixel array portion over the composite substrate; forming a liquid crystal aligning means for the pixel region; superposing an opposed substrate over the composite substrate with a gap therebetween; and filling the gap with liquid crystal material.

Abstract: A pressure sensor (11) and its method of fabrication include etching a V-groove (19) in a first surface (16) of a first substrate (12), bonding a second substrate (24) to the first substrate (12), thinning the second substrate (24) to form a diaphragm (32) overlying the V-groove (19), and etching a port (38) from the second surface (18) of the first substrate (12) to the V-groove (19). Tetra-methyl-ammonium-hydroxide is preferably used to anisotropically etch the V-groove (19), and an anisotropic plasma reactive ion etch is preferably used to etch the port (38).

Abstract: Integrated conductor suspensions are fabricated by progressively etching a suspension shape in a preformed laminate of copper, and stainless steel adhering to an intermediate resin layer, including defining pairs of signal lines in the copper layer having exposed sides and top, and coating these exposed sides and top with an adherent layer of gold down to the resin layer against corrosion in ambient corrosive environments.

Abstract: A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

Abstract: A flat display device preferably of the PALC type in which a fragile micro-sheet covering the plasma channels is replaced by a more robust plate having etched spaced elongated cavities configured in such a way that the top portions of the plate between side walls of each cavity defining a channel and facing the bottom plate are substantially flat. Preferably, the thickness of the glass top plate separating each plasma discharge from an electro-optic pixel is made substantially uniformly thin while the side walls reinforce and greatly increase the strength of the plate making it less prone to breakage during assembly of a display panel. Preferably, the glass plate is etched by means of a plasma etching process.

Abstract: A transfer sheet material for forming retroreflective graphic images on a substrate, the sheet material comprising a monolayer of transparent microspheres; a color layer printed over the microspheres in a first graphic segment of the sheet material in an imagewise pattern, the color layer comprising a colorant in a transparent resin; a reflective layer printed over the microspheres in a second graphic segment of the sheet material in an imagewise pattern, the reflective layer comprising reflective flakes in a transparent binder, wherein the microspheres are partially embedded in at least one of the color layer and the reflective layer, individual microspheres having the reflective flakes arranged in cup-like fashion about their embedded portions; and a bonding layer printed over the color layer and the reflective layer, the bonding layer being sufficiently thick to embed all exposed surfaces of the color layer and the reflective layer and being adapted for use in securing the sheet material to a substrate.

Abstract: A bridging member extending across a cavity in a semiconductor substrate (e.g. single crystal silicon) has successive layers--a masking layer, an electrically conductive layer (e.g. polysilicon) and an insulating layer (e.g. SiO.sub.2). A first electrical contact (e.g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging member across the cavity. A pair of bumps (e.g. gold) are on the insulating layer each between the contact and one of the cavity ends. Initially the bridging member and then the contact and the bumps are formed on the substrate and then the cavity is etched in the substrate through holes in the bridging member. A pair of second electrical contacts (e.g. gold coated with ruthenium) are on the surface of an insulating substrate (e.g. pyrex glass) adjacent the semiconductor substrate. The two substrates are bonded after the contacts are cleaned.

Abstract: A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.

Abstract: The present invention relates to a method of manufacturing microstructure by the anisotropic etching and bonding of substrates so as to manufacture mechanically functioning micro-structures in various forms by uniting the same or different substrate bonding technique and selective anisotropic etching technique. This invention manufactures a pyramidal optical divider or an optical divider with a pyramidal structure located on a quadrilateral pillar by bonding one substrate on a substrate different in the direction of crystallization and anisotropically etching them thereafter. This invention manufactures variously shaped nozzles by bonding those substrates crystallized in a different direction and anisotropically etching them so that substrates bonded by one photograph transferring process may form different etching holes.

Abstract: The fluid handling devices are capable of accurately handling substantially continuous fluid flow rates as low as about 0.01 cc/day. The devices are so miniaturized, corrosion-resistant and non-toxic that they are suitable for being implanted in the human body; and are capable of being mass produced at costs so low, by using micromachining techniques, such as etching, that they may be considered to be disposable. The devices are either passive devices which consume no electrical energy at all, or are active devices which consume very small amounts of electrical energy. The devices are reliable because they may have as few as only two parts, only one which is a moving part; and because they may handle fluids at very low pressures. The fluid handling devices include active piezoelectrically driven membrane pumps; and passive fluid flow regulators, on-off valves, flow switches and filters.

Abstract: A method of producing an aperture grill of a CRT display device is disclosed. The aperture grill is of a small thickness of the order of 20 to 100 .mu.m. To a metal plate with front and rear surface resin layers are applied front slit pattern mask with a single broad slit pattern and a rear slit pattern mask with two adjacent, narrow slit patterns. With these two masks disposed in opposition, the slit patterns are printed and developed on the resist layers. Thereafter, etching is carried out on the rear surface of the metal plate via the rear resist layer, and rear cavities are formed in the metal plate. Then, a reinforcing, etchant-proof film is attached to the rear resist layer to cover the rear cavities, and thereafter etching is carried out on the front surface of the metal plate via the front resist layer, to thereby form a front cavity.

Abstract: A method of manufacturing a hot-stamped decal includes step A: preparing a metalized polyester film including a metalized layer disposed on a top surface thereof, a clear polyester sheet disposed to an under side of the metalized layer, an adhesive layer disposed to an under side of the clear polyester sheet and a release sheet disposed to an under side of the adhesive layer, step B: applying a printing process on the metalized layer to form a mark thereon composed of a printed ink layer, step C: preparing an alkaline corrosive solution, step D: flushing the top surface of the metalized layer with the alkaline solution composed of water and NaOH to the top surface of the metalized layer to corrode the metalized layer not covered by the printing ink layer, step E: flushing the top surface of the metalized layer with water and step F: drying the hot-stamped decal.

Abstract: A multi-layer superconductive interconnect structure includes a first multi-layer substrate with a first superconducting layer (SL) deposited on a first epitaxial substrate and a first glue dielectric layer (GDL) on the first SL. A second multi-layer substrate includes a second SL deposited on a second epitaxial substrate and a second GDL on said second SL. The first GDL and the second GDL are clamped and cured together to form a composite substrate.

Abstract: A two-wafer microcapillary structure is fabricated by depositing boron nitride (BN) or silicon nitride (Si.sub.3 N.sub.4) on two separate silicon wafers (e.g., crystal-plane silicon with [100] or [110] crystal orientation). Photolithography is used with a photoresist to create exposed areas in the deposition for plasma etching. A slit entry through to the silicon is created along the path desired for the ultimate microcapillary. Acetone is used to remove the photoresist. An isotropic etch, e.g., such as HF/HNO.sub.3 /CH.sub.3 COOH, then erodes away the silicon through the trench opening in the deposition layer. A channel with a half-circular cross section is then formed in the silicon along the line of the trench in the deposition layer. Wet etching is then used to remove the deposition layer. The two silicon wafers are aligned and then bonded together face-to-face to complete the microcapillary.

Abstract: A method for making a single cone disk, preferably a dressing wheel, comprising a metal base member having a main surface and head area coated by hard material grains so as to form a hard material grain layer fixed to said base member by metal bonding, in which method a pocket is formed in the back side of the head area of said base members while said metal bonded hard material grain layer is retained thereat, and thereafter the pocket is filled by hard material grains.

Abstract: The present invention discloses a method for constructing a completely micromachined MCP that is activated with thin-film dynodes wherein the interchannel regions are first dry etched in the substrate, resulting in channel pillars. The etched portions of the substrate are then back filled and the channel pillars are thereafter removed to produce a micromachined perforated microchannel plate. The technique may be employed to produce an active element for an integrated image tube or photomultiplier tube.

Abstract: An indirect cathode sleeve and manufacturing method thereof capable of substantially reducing electric power consumption of a heater disposed inside the cathode sleeve and simultaneously reducing a picture-producing time by oxidizing an inside surface of the cathode sleeve and reducing an outside surface thereof. The cathode sleeve includes a heater disposed inside the cathode sleeve; a base metal formed at the top of the cathode sleeve; an electron-emitting material layer formed at the outside surface of the base metal; and an indirect cathode sleeve including a black inside surface and a white outside surface.

Abstract: Electrical interconnect structures comprised of high temperature superconducting signal layers on a substrate bonded to one another or optionally to a base substructure containing power and ground planes and processes for their preparation are disclosed.

Abstract: A material deposition head having lithographically defined ejector units. Beneficially, each ejector unit includes a plurality of lithographically defined droplet ejectors. Furthermore, methods of fabricating such lithographically defined material deposition heads are also described.

Abstract: HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Abstract: In a micromotion mechanical structure, such as a vibration-type sensor or a step motor, comprising at least one fixed electrode and at least one movable electrode which is moved by electrostatic power applied to the fixed electrode, at least one of the electrodes is formed essentially by a single crystal semiconductor material. The single crystal semiconductor material has various merits of uniform mechanical properties, small internal stress, etc. for use in such electrodes. Such structure has been realized by attaching patterned electrode made of the material to another substrate and then removing or thinning the original substrate carrying the patterned electrodes.

Abstract: A nozzle assembly for use in atomizing and generating sprays from a fluid. The nozzle assembly includes two members joined together. In one of the two members are formed one or more nozzle outlets, one or more fluid inlets, and a plurality of channels that form filter passageways. The nozzle outlets discharge fluid jets that impinge on one another to thereby atomize the fluid. Alternatively, an impact element or a vortex-generating structure can be used in the nozzle outlet to atomize the fluid. Methods are also provided for producing the nozzle assembly by forming the inlets, outlets, and/or channels through electrical or chemical etching or other processes that selectively remove material from at least one face of a nozzle assembly member.

Abstract: A method for manufacturing a collimator comprising the steps of patterning a plurality of thin metal strips into a plurality of basic plates, and forming grooves or ridges on front and back surfaces of each basic plates. Thereafter, the thin strips are folded, mated, and welded together to form pillar cells within the collimator.

Abstract: Methods of constructing a wire interconnect structure on a substrate are described. The methods broadly comprise the steps of depositing a spacer layer on a surface of the substrate, depositing a mask layer on the spacer layer, and removing a first portion of the mask layer overlying a desired area on the substrate surface to expose the spacer layer underlying the first portion of the mask layer. The methods further comprise the step of etching the structure such that a first portion of the spacer layer overlaying the desired area is removed and such that a portion of the desired area is exposed, and the step of depositing a first conductive material on the exposed portion of the desired area such that a conductive post is formed on the substrate surface and mounted to the desired area. Some of the disclosed methods comprise additional steps for forming an interconnect structure on the opposite surface of the substrate and providing an electrical interconnect means between the two interconnect structures.

Abstract: HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Abstract: An accelerometer is fabricated by forming a proofmass and at least one associated hinge in a silicon substrate by ion implantation and the formation of an oxide support layer below the proofmass, subsequently integrally bonding two complementary proofmass and substrate structures together, and then removing the oxide support layer to leave the proofmass supported by the hinge within the body of silicon material. The proofmass may be electrically connected to a lead extending through an etched recess in one of the substrates; and the proofmass may be electrically isolated or separated from the substrates by an oxide layer and by a change in conductivity type of the semiconductor material where the hinge is structurally mounted to the substrates.

Abstract: A vibrator for a piezoelectric motor is produced by forming an elastic material into a predetermined shape, forming a piezoelectric material on the shaped elastic material for polarization and for driving, forming an electrode for polarization on the piezoelectric material, forming an electrode for driving on the surface of the electrode for polarization or on the piezoelectric material after stripping the electrode for polarization, and etching the elastic material into a predetermined shape has an elastic body and to remove the elastic body from a base. Instead of forming the piezoelectric material on the shaped elastic material for polarization and for driving, an electrode both for polarization and for driving can be formed on one face of the shaped elastic material, and the piezoelectric material can be formed on that electrode.

Abstract: A method is provided for forming inter-electrode spacers useful in flat panel display devices which comprises placing a mold on a first electrode plate. The mold has openings with corresponding diameters. The mold is coated with a conformal film which lines the openings, thereby decreasing the diameters of the openings. The openings are filled with a glass material. The conformal film is selectively removed, and the mold is separated from the electrode.

Abstract: A diamond body, such as a CVD diamond film, is etched by immersion of the body in a molten or partially molten metal, such as the rare earth metal La or Ce. While the body is being etched, various portions of a major surface of the body can be protected for various time durations by masks against the etching--whereby, after dicing the body, the resulting dies can be used as submounts for lasers with feedback.

Abstract: The present invention discloses a recording head and a method of manufacturing the recording head including an electrothermal transducer element for causing ink to be discharged through a discharge port by causing heat energy to act on the ink, a heat acting portion for causing the heat energy generated by the electrothermal transducer element to act on the ink present in an ink passage; and a substrate, either side of which has the electrothermal transducer element, and a residual side of which has the ink passage, so that the reliability is improved, an image is precisely recorded at high speed and an excellent manufacturing yield is realized.

Abstract: A method for manufacturing a LCD device includes forming a first electrode on a lower substrate so as to be connected with an external terminal on the periphery of the lower substrate and forming a liquid crystal cell on a central portion of the lower substrate. A passivation layer is thereafter formed on the overall surface of the lower substrate. A first portion of the passivation layer which overlies a contact area of the first electrode is then removed using a laser beam directed through the lower substrate at the contact area of the first electrode and the overlying passivation layer. A conductive layer of paste is formed on the contact area of the first electrode, either before or after the removal of the first portion of the passivation layer, and an upper substrate is assembled to the lower substrate so that the conductive layer forms an electrical connection between the first electrode and a common electrode formed on an inner surface of the upper substrate.

Abstract: The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Abstract: A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal struutures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

Abstract: A method for fabricating silicon injection plates is both highly precise and particularly simple. The silicon injection plate is formed by an upper silicon plate having injection holes and a lower silicon plate having a through opening and channels. The lower silicon plate is fabricated by simultaneous, double-sided etching of silicon.

Abstract: This invention includes a method of making a bridge-supported accelerometer structure. A first wafer is worked, preferably by bulk micromachining, to provide a proof mass supported by a thin membrane on all sides. The thin membrane has the same thickness as the bridges to be defined therein. The first wafer is bonded to a second wafer having a cavity formed therein. The first wafer is then worked, preferably by plasma etching, to delineate bridges in the thin membrane. The cavity in the second wafer provides damping of the proof mass which reduced bridge breakage as portions of the thin membrane are removed leaving the final bridge-supported accelerometer structure. Combining the two wafers together prior to delineating the bridge provides for handling and processing of a much less fragile structure than the first wafer alone with bridges delineated therein.

Abstract: A large aperture microlens array assembly has at least two arrays of microlenses with individual unit cell trains optically interconnecting individual microlenses in one array with related individual microlenses in another array. In each unit cell train the light entering an entrance pupil of a microlens in one array is transmitted through the exit surface of a related microlens of the other array to provide a collimated output through the exit. One array may be moved with respect to the other array for scanning a field of regard.