Abstract: A system and method for rapid atomic layer etching (ALET) including a pulsed plasma source, with a spiral coil electrode, a cooled Faraday shield, a counter electrode disposed at the top of the tube, a gas inlet and a reaction chamber including a substrate support and a boundary electrode. The method includes positioning an etchable substrate in a plasma etching chamber, forming a product layer on the surface of the substrate, removing a portion of the product layer by pulsing a plasma source, then repeating the steps of forming a product layer and removing a portion of the product layer to form an etched substrate.

Abstract: This invention provides a device for determining the concentration of an analyte like glucose, cholesterol, free fatty acids, triglycerides, proteins, ketones, phenylalanine or enzymes, in a physiological or aqueous fluid like blood, serum, plasma, saliva, urine, interstitial and/or intra-cellular fluid, the device having an integrated calibration and quality control system suitable for dry reagent test strips with a very small sample volume of about 0.5 ?L based on to a new sample distribution system. The production of the inventive analyte test element involves only a small number of uncomplicated production steps enabling an inexpensive production of the strips.

Abstract: A method for manufacturing a printing plate includes forming first trenches having a first depth into an insulative substrate, forming an organic film over the insulative substrate including the first trenches, and forming second trenches having a width smaller than that of the first trenches into the organic film, the second trenches formed at positions corresponding to the first trenches by selectively removing the organic film.

Abstract: A method for forming a bump of a probe card is disclosed. In accordance with the method, a bump having a high aspect ratio for supporting a probe tip and a probe beam is formed using a semiconductor substrate as a mold eliminating a need for a photoresist film.

Abstract: A substrate processing apparatus includes an evacuatable process chamber configured to receive a substrate carrier having at least one substrate, a plasma generating module, a gas feed, a gas discharge and a vapor etching module provided in the process chamber. A substrate processing method includes introducing a substrate carrier including at least one substrate into an evacuatable process chamber, generating a plasma in a plasma process using a plasma generating module in a gas or a gas mixture, performing a vapor etching of the at least one substrate before, after or alternatingly with the plasma process and performing at least one of a coating, etching, surface modification and cleaning of the substrate.

Abstract: A chemical-mechanical polishing process for forming a conductive interconnect includes the steps of providing a semiconductor substrate having a first conductive line thereon, and then forming at least one dielectric layer over the substrate and the first conductive line. Next, a chemical-mechanical polishing method is used to polish the surface of the dielectric layer. Thereafter, a cap layer is formed over the polished dielectric layer. The method of forming the cap layer includes depositing silicon oxide using a chemical vapor deposition method with silicane (SiH.sub.4) or tetra-ethyl-ortho-silicate (TEOS) as the main reactive agent. Alternatively, the cap layer can be formed by depositing silicon nitride using a chemical vapor deposition method with silicane or silicon dichlorohydride (SiH.sub.2Cl.sub.2) as the main reactive agent.

Abstract: A single molecule detection platform is disclosed. The single molecule detection platform comprises a light-transmissive substrate, a plurality of spherical particles and a thin film. The surface of the light-transmissive substrate is etched to form a plurality of cone-shaped structures. Each spherical particle is disposed on top of each cone-shaped structure. The sizes of the plurality of spherical particles are suitable to allow only a single protein to be attached to each spherical particle. The thin film is deposited on the surface of the plurality of cone-shaped structures and acts as a reflective layer of one-dimensional waveguide. The plurality of spherical particles is not covered by the thin film.

Abstract: A die includes abase body and a modified surface layer. The base body includes tungsten carbide particles bonded by a bonding phase. The modified surface layer includes tungsten carbide particles and a filling material filled among the tungsten carbide particles to bond the tungsten carbide particles to each other. The filling material comprises copper. The modified surface layer is formed on at least a part of a surface of the base body.

Abstract: A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the present method. The present method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: A method for depositing a single crystalline silicon film comprises: providing a substrate disposed within a chamber; introducing to the chamber under chemical vapor deposition conditions a silicon precursor, a chlorine-containing etchant and an inhibitor source for decelerating reactions between the silicon precursor and the chlorine-containing etchant; and selectively depositing a doped crystalline Si-containing film onto the substrate.

Abstract: The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.

Abstract: The invention relates to a composite balance (45, 45?) formed in a layer of silicon-based material (21) and including a hub (39, 39?) connected to a felloe (37, 37?) by at least one arm (40, 41, 42, 43). According to the invention, the felloe (37, 37?) includes at least one additional part approximately in the shape of a notched ring (23, 23?) of higher the than the silicon-based material, which increases the inertia of the balance. The invention also relates to a method 1 of manufacturing this type of balance. The invention concerns the field of timepiece movements.

Abstract: The present invention relates to water-repellent glass including: glass including pores formed to have a diameter of 200 nm or less on a surface; and a water-repellent coating layer disposed at least on one side of the glass, and a method of manufacturing the water-repellent glass.

Abstract: A graphene sheet including graphene comprising ten or fewer wrinkles per 1,000 square micrometers of the graphene.

Abstract: Provided are a template used for nanoimprint lithography and a method for fabricating the same. A raised first deposition layer pattern including at least one downwardly sloped side surface is formed on a substrate. A second deposition layer pattern covering the side surface of the raised first deposition layer pattern and progressively decreasing in width downward along the side surface of the raised first deposition layer pattern is formed. A third deposition layer is formed on the entire surface of a structure on which the second deposition layer pattern. A second deposition layer nano pattern between the raised first deposition layer pattern and a planarized third deposition layer is formed by planarizing the third deposition layer to expose upper surfaces of the raised first deposition layer pattern and the second deposition layer pattern.

Abstract: A method and apparatus are provided for formation of a composite material on a substrate. The composite material includes carbon nanotubes and/or nanofibers, and composite intrinsic and doped silicon structures. In one embodiment, the substrates are in the form of an elongated sheet or web of material, and the apparatus includes supply and take-up rolls to support the web prior to and after formation of the composite materials. The web is guided through various processing chambers to form the composite materials. In another embodiment, the large scale substrates comprise discrete substrates. The discrete substrates are supported on a conveyor system or, alternatively, are handled by robots that route the substrates through the processing chambers to form the composite materials on the substrates. The composite materials are useful in the formation of energy storage devices and/or photovoltaic devices.

Abstract: The use of an ammonium hydroxide spike to a hot tetra methyl ammonium hydroxide (TMAH) solution to form an insitu poly oxide decapping step in a polysilicon (poly) etch process, results in a single step rapid poly etch process having uniform etch initiation and a high etch selectivity, that may be used in manufacturing a variety of electronic devices such as integrated circuits (ICs) and micro electro-mechanical (MEM) devices. The etching solution is formed by adding 35% ammonium hydroxide solution to a hot 12.5% TMAH solution at about 70° C. at a rate of 1% by volume, every hour. Such an etch solution and method provides a simple, inexpensive, single step self initiating poly etch that has etch stop ratios of over 200 to 1 over underlying insulator layers and TiN layers.

Abstract: The invention is related to a process to apply a heater function to a plastic glass that was made of a polycarbonate. The process includes a sputtering process that allows producing high performance heater function on a plastic glass. Another aspect of the invention is the plastic glass mirrors produced by the inventive process.

Abstract: A gas supply device 3 includes a device body 31 forming a substantially conical gas-conducting space 32 for conducting gases therethrough from a diametrally reduced end 32a of the space 32 to a diametrally enlarged end 32b thereof, gas introduction ports 61a to 63a, 61b to 63b, and 64, each provided near the diametrally reduced end 32a of the gas-conducting space 32 in the device body 31 to introduce the gases into the gas-conducting space 32, and a plurality of partitioning members 41 to 46 provided in the gas-conducting space 32 of the device body 31 to partition the gas-conducting space 32 concentrically. The partitioning members 42 to 46 arranged adjacently to each other at a radially outer side of the gas-conducting space 32 are greater than the adjacently arranged partitioning members 41 to 45 at a radially inner side in dimensionally diverging rate per partitioning member.

Abstract: A method comprises an opposing step of arranging a light-shielding film 50 having a recessed surface 52 and a pinhole 54 formed within the recessed surface 52 such that an end face 54X of the pinhole 54 of the light-shielding film 50 on the recessed surface 52 side and a light exit surface 4B oppose each other, while the shortest distance A52 between the light-shielding film 50 and a medium-opposing surface S in a thickness direction of the light-shielding film 50 is shorter than the shortest distance A54 between the end face 54X of the pinhole 54 on the side opposite from a transparent substrate 58 and the light exit surface 4B; a light-emitting step of causing a light-emitting device 3 to emit emission light 3A; and a detecting step of detecting the light transmitted through the pinhole 54 after being emitted from the light exit surface 4B.

Abstract: Provided are a method for antireflection treatment of a zinc oxide film and a method for manufacturing a solar cell using the same. In the anti-reflection treatment, a substrate is prepared, then a polycrystalline zinc oxide film is formed on the substrate. A surface of the polycrystalline zinc oxide film is textured. Here, the roughening of the surface of the polycrystalline zinc oxide film comprises wet-etching the polycrystalline zinc oxide film on the substrate using an etching solution mixed with nitric acid and hydrogen peroxide.

Abstract: The molecule is prepared by capping phospholipid on a single gold nanoparticle (GNP). Since the thiol-related molecule bounded on GNP shows the characteristic of surface-enhanced Raman scattering (SERS), the phospholipid-capped gold nanoparticle (PLGNP) can be formed as a nanoprobe applied on the detection device integrating optics and chemistry and used in the fields of biomedicine, medical diagnosis and environment for detecting, such as solutions containing salts or proteins.

Abstract: Engineered proteins are used in the assembly of two-dimensional and three-dimensional nanostructure assemblies, based on systematic design and production of protein node structures that can be interconnected, for example, with streptavidin or streptavidin-incorporating struts to produce structures with defined dimensions and geometry. Nanostructure assemblies having utility as functional devices or as resists for the patterning of substrates have architectures including polygons, polyhedra, two-dimensional lattices, and three-dimensional lattices.

Abstract: The invention provides a chemical-mechanical polishing composition consisting essentially of flumed alumina, alpha alumina, silica, a nonionic surfactant, an additive compound selected from the group consisting of glycine, alanine, iminodiacetic acid, and maleic acid, hydrogen peroxide, and water. The invention further provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.

Abstract: Self-assembling materials, such as block copolymers, are used as mandrels for pitch multiplication. The copolymers are deposited over a substrate and directed to self-assemble into a desired pattern. One of the blocks forming the block copolymers is selectively removed. The remaining blocks are used as mandrels for pitch multiplication. Spacer material is blanket deposited over the blocks. The spacer material is subjected to a spacer etch to form spacers on sidewalls of the mandrels. The mandrels are selectively removed to leave free-standing spacers. The spacers may be used as pitch-multiplied mask features to define a pattern in an underlying substrate.

Abstract: An internal filter includes a lower substrate and an upper substrate. Fluid passages are formed by etching grooves into the surface(s) of the upper and/or lower substrates, and/or in one or more intermediate layers. The filter pores extending between the fluid passages are formed by etching second grooves that fluidly connect the fluid passages. Two or more sets of the one or two intermediate layers can be implemented to provide additional filter passages and/or pores. Each set can be connected to a separate fluid source and/or a separate microfluidic device. In another internal filter, the inlet and outlet passages and the filter pores are formed on the same upper or lower substrate. The inlet and outlet passages are partially formed in a first step. In a second step, the inlet and outlet passages are completed at the same time that the filter pores are formed.

Abstract: The present invention provides a method for producing carbon nanotubes comprising (a) providing a substrate; (b) coating a catalyst layer on said substrate; (e) heating the substrate from step (b); (d) continuously supplying a carbon source to grow carbon nanotubes; (e) interrupting the supplement of the carbon source and supplying an oxidizing gas; and (f) resupplying the carbon source to make the carbon nanotubes obtained from step (d) to re-grow at a higher growth rate. The present invention also provides carbon nanotubes fabricated by the above-mentioned method. The carbon nanotubes have extremely excellent field emission properties.

Abstract: A method for fabrication of passive electronic components includes disposing a sacrificial layer on a carrier and forming a curable resin layer on top of the sacrificial layer and patterning the curable resin to form a cured resin template having multiple pattern levels. A metal material is deposited into the first pattern level to form a first structure. A dielectric material is then formed on exposed portions of the first structure. A nonselective subtractive process is used to expose the sacrificial layer in a bottom of the second pattern level and metal material is deposited into the second pattern level and built up to include a portion which crosses over the dielectric material.

Abstract: Scaffold-supported metal or pseudometallic film covers suitable for use as medical devices are disclosed together with methods of fabricating the devices. Methods for making the medical devices consist of either providing or forming a scaffold, then depositing a metallic or pseudometallic film cover onto the scaffold in such a manner as to form an integral, substantially monolithic junction between the deposited cover material and the scaffold.

Abstract: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.

Abstract: The described embodiments relate to a polymer adhesive film having a micro-pattern arranged on a first surface of the polymer adhesive film for application to wounded tissue to promote directional cell growth. The micro-pattern is sized to allow cells of the wounded tissue to grow directionally within the micro-pattern to promote rapid and complete healing.

Abstract: A method for making a device housing comprises: providing a metal substrate; etching grooves on a portion of the surface of the metal substrate; forming a metallic coating on the surface of the metal substrate and in the grooves; and removing the metallic coating formed on the surface of the metal substrate not comprising the grooves. A device housing made by the method is also described there.

Abstract: Methods for resputtering and plasma etching include an operation of generating an ultra-high density plasma using an ultra-high magnetic field. For example, a plasma density of at least about 1013 electrons/cm3 is achieved by confining a plasma using a magnetic field of at least about 1 Tesla. The ultra-high density plasma is used to create a high flux of low energy ions at the wafer surface. The formed high density low energy plasma can be used to sputter etch a diffusion barrier or a seed layer material in the presence of an exposed low-k dielectric layer. For example, a diffusion barrier material can be etched with a high etch rate to deposition rate (E/D) ratio (e.g., with E/D>2) without substantially damaging an exposed dielectric layer. Resputtering and plasma etching can be performed, for example, in iPVD and in plasma pre-clean tools, equipped with magnets configured for confining a plasma.

Abstract: Method and plasma treatment apparatus for treatment of a substrate surface (1) using an atmospheric pressure plasma. An atmospheric pressure plasma is provided in a treatment space (5) between a first electrode (2) and a second electrode (3). Furthermore, a substrate (1) and a mask web (7) in contact with the substrate (1) are provided. A plasma generating power is applied to the first and second electrode (2, 3) for treatment of surface areas of the substrate (1) exposed by the mask web (7), in which the substrate (1) and mask web (7) are moved synchronously through the treatment space (5).

Abstract: A novel method of forming large atomically flat areas is described in which a crystalline substrate having a stepped surface is exposed to a vapor of another material to deposit a material onto the substrate, which material under appropriate conditions self arranges to form 3D islands across the substrate surface. These islands are atomically flat at their top surface, and conform to the stepped surface of the substrate below at the island-substrate interface. Thereafter, the deposited materials are etched away, in the etch process the atomically flat surface areas of the islands transferred to the underlying substrate. Thereafter the substrate may be cleaned and annealed to remove any remaining unwanted contaminants, and eliminate any residual defects that may have remained in the substrate surface as a result of pre-existing imperfections of the substrate.

Abstract: A deposition mask capable of forming layers with different thicknesses and a method of fabricating the same are disclosed. In one embodiment, the deposition mask includes i) a plurality of regions spaced apart from each other, wherein the plurality of regions comprise at least a first region and a second region and ii) first and second surfaces opposing each other, wherein the first surface is configured to receive a deposition material. Also, a though-hole is defined in each of the plurality of regions, and wherein at least one of the through-holes in the first surface of the mask is divided into a plurality of sub-regions. Further, the number of a sub-region or sub-regions of the first region is different from that of the second region.

Abstract: A method for fabricating a 3D (three-dimensional) structure is disclosed to provide hydrophobicity to a surface of a 3D structure by using a dipping method in which a predetermined-shaped structure is immersed in a molten metal solution. The method includes: immersing a predetermined-shaped structure in a molten metal solution to coat a molten metal material on the surface of the predetermined-shaped structure; anodizing a metal base coated with the molten metal material; coating a polymer material on an outer surface of the metal-coated base to form a negative replica structure; covering an outer surface of the negative replica structure with an outer formation material; and removing the metal-coated base from the negative replica structure and the outer formation material.

Abstract: A method of forming a micro pattern of a semiconductor device includes forming an etch target layer, a hard mask layer, a Bottom Anti-Reflective Coating (BARC) layer and a first photoresist pattern over a semiconductor substrate. An organic layer is formed on a surface of the first photoresist pattern. A second photoresist layer is formed over the BARC layer and the organic layer. An etch process is performed so that the second photoresist layer remains on the BARC layer between the first photoresist patterns and becomes a second photoresist pattern. The organic layer on the first photoresist pattern and between the first and second photoresist patterns is removed. The BARC layer formed below the organic layer is removed. The hard mask layer is etched using the first and second photoresist patterns as an etch mask. The etch target layer is etched using a hard mask pattern as an etch mask.

Abstract: A method of imaging and identifying materials, contamination, fabrication errors, and defects on and below the surface of an integrated circuit (IC) is described. The method may be used in areas smaller than one micron in diameter, and may remove IC layers, either selectively or non-selectively, until a desired depth is obtained. An energetic beam, such as an electron beam, is directed at a selected IC location. The IC has a layer of a solid, fluid or gaseous reactive material, such as a directed stream of a fluorocarbon, formed over the surface of the IC. The energetic beam disassociates the reactive material in or on the region into chemical radicals that chemically attack the surface. The surface may be examined as various layers are selectively removed in the controlled area spot etch, and SEM imaging may then be used to diagnose problems.

Abstract: A method of forming a microchannel as well as a thin film structure including same is made by forming a first thin film on a side of a substrate, forming a fugitive second thin film on the first thin film such that the second thin film defines a precursor of the elongated microchannel and a plurality of extensions connected to and extending transversely relative to the precursor along a length thereof A third thin film is formed on the first thin film and the fugitive second thin film such that the second thin film resides between the first thin film and the third thin film. A respective access site is formed in a region of the third thin film residing on a respective extension and penetrating to the fugitive second thin film. The fugitive second thin film forming the precursor is selectively removed from between the first thin film and the third thin film using an etching medium introduced through the access sites, thereby forming the microchannel between the first thin film and the third thin film.

Abstract: Abstract: The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.

Abstract: An easy and high-efficient tip probe manufacturing method is provided. The manufacturing method of a tip type probe having a metal film on side surfaces of a truncated pyramid formed of a top surface and the side surfaces includes the steps of: forming an etching mask of a shape similar to a shape of the top surface on a substrate; forming the truncated pyramid by subjecting the substrate to isotropic etching using the etching mask as a mask member; stopping the isotropic etching after an area of the top surface becomes smaller than an area of the etching mask; and forming the metal film by allowing film forming particles to round about and enter into a space between the etching mask and the side surfaces.

Abstract: The invention provides an improved apparatus and method for removing oxidized and embedded scale from sheet metal by high pressure spraying a diluted hydrochloric acid water mixture onto the surface of the sheet metal. The contaminated water/acid solution is then re-circulated to remove ferrous chloride from the acid and water solution. The cleansed acid and water solution are recycled for reuse. The sheet metal is rinsed with hot water, dried, oiled and rolled. The rinse water is re-circulated to remove acid droplets and the acid droplets are recycled to an acid storage tank. Any contaminants removed from the rinse water are recycled to a combination filter and reverse osmosis system. The clean rinse water is reused to rinse further sheet metal.

Abstract: A method of derivatizing a fluid-impervious surface with a mixed monolayer to create a surface energy gradient comprising the steps of a) Exposing a base surface to a first solution comprising a plurality of molecules of the formula X1-J1-M1 wherein X1 and M1 represent separate functional groups and J1 represents a spacer moiety that, together, are able to promote formation from solution of a self-assembled monolayer for sufficient time to form a monolayer surface having a substantially uniform surface energy on the base surface. b) Removing a portion of the monolayer formed in (a) such that a portion of the base surface is again fully or partially exposed. c) Exposing the portion of the base surface from (b) to a second solution comprising a plurality of molecules of the formula X2-J2-M2 wherein the functional group M2 has a different surface energy from that of the functional group M1 such that a surface energy gradient is formed.

Abstract: A novel application of the atomic layer deposition (ALD) process for producing a conformal coating on a razor blade is disclosed where a uniform, conformal, dense coating is deposited on an entire surface of a blade flank and at least a portion or an entire surface of a blade body. To improve the shaving ability of the coated blade edge (e.g., decrease the blade tip radius), the ALD-produced coating may be etched during, after, or both during and after, the ALD process.

Abstract: Provided is a method of manufacturing a sensor structure, where vertically-well-aligned nanotubes are formed and the sensor structure having an excellent performance can be manufactured at the room temperature at low cost by using the nanotubes. The method of manufacturing a sensor structure includes: (a) forming a lower electrode on a substrate; (b) forming an organic template having a pore structure on the lower electrode; (c) forming a metal oxide thin film in the organic template; (d) forming a metal oxide nanotube structure, in which nanotubes are vertically aligned and upper portions thereof are connected to each other, by removing the organic template through a dry etching method; and (e) forming an upper electrode on the upper portions of the nanotubes.

Abstract: A MEMS device includes a mirror substrate (200), an electrode substrate (301) arranged so as to face the mirror substrate (200), a mirror (230) serving as a movable member rotatably supported in an opening portion of the mirror substrate (200) via support members, a driving electrode (101) arranged on an insulating film (104) on a surface of the electrode substrate (301) facing the mirror substrate (200) so as to face the mirror (230) across a gap and drive the mirror (230), and a lower electrode (103) made of a metal or a semiconductor and formed under the insulating film (104) exposed to the gap so as to be in contact with the insulating film (104).

Abstract: A method is used for forming a concavo-convex textured structure on a housing of an electronic device. The method includes providing a CAM (Computer-Aided Manufacturing) drawing corresponding to the concavo-convex textured structure, inputting the CAM drawing into a CNC (Computer Numerical Control) milling machine, disposing a workpiece on the CNC milling machine, and utilizing the CNC milling machine to mill the concavo-convex textured structure on the workpiece according to the CAM drawing, and utilizing the workpiece to manufacture the housing of the electronic device.

Abstract: A prescribed pattern is formed on a thin metal plate by photolithography. The thin metal plate is etched by using the pattern as a mask to form a plurality of through-holes having diameters greater than diameters of probes, in the thin metal plate. The etching is performed on a plurality of the thin metal plates. After the pattern is removed, the plurality of thin metal plates are laminated by conforming the through-holes of each of the thin metal plates to guide pins of a guide. The laminated plurality of thin metal plates are bonded by diffusion bonding. An insulating film is formed on surfaces of the thin metal plates and an inner surface of each of the through-holes. A film thickness of the insulating film is adjusted so that inner diameters of the through-holes whereupon the insulating film is formed match with the diameters of the probes.