Abstract: The invention relates to a method for depositing a diamond coating onto a substrate, said method resulting in the production of a coating characterised by a novel morphology of the diamond in the form of pyramids containing submicronic grains. The method is carried out by chemical vapour deposition by controlling the applied electric field.

Abstract: The method of manufacturing a nozzle plate includes: a lyophobic film forming step of preparing a nozzle plate having a recess-shaped counterbore section and a nozzle opened in a bottom surface of the counterbore section, and forming a lyophobic film on a surface of the nozzle plate including the bottom surface of the counterbore section of the nozzle plate and at least a portion of an inner wall of the nozzle; an abutting step of preparing a protective plate having a projecting section, and abutting a top surface of the projecting section of the protective plate against the bottom surface of the counterbore section of the nozzle plate in such a manner that the top surface of the projecting section of the protective plate makes tight contact with an opening edge of the nozzle on a liquid ejection side of the nozzle plate; a lyophobic film removing step of removing the lyophobic film from the inner wall of the nozzle of the nozzle plate by etching the nozzle plate from a liquid supply side which is opposite to

Abstract: A method for inspecting semiconductor wafers patterned by a photomask includes loading a first wafer and scanning a first image of the first wafer, loading a second wafer and scanning a second image of the second wafer, comparing the first and second images, and classifying a difference detected between the first and second images as a potential defect on the photomask. The potential defect includes a haze defect on the photomask.

Abstract: Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.

Abstract: This invention provides novel super-liquidphobic nanofibers and structures comprising such nanofibers, as well as methods and uses for such nanofibers.

Abstract: A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle.

Abstract: A method of manufacturing a liquid ejection head and a liquid ejection head capable of preventing corrosion of electrodes are provided. The method of manufacturing a liquid ejection head includes: a step of forming porous silicon areas in portions of a silicon substrate where the liquid paths are to be formed; a step of forming in layers in the porous silicon areas a protective layer, a heating resistor layer, an electrode layer and a heat accumulation layer; a step of forming ink ejection openings in the silicon substrate; and a step of removing the porous silicon areas.

Abstract: Provided are a plastic microfluid control device having a multi-step microchannel and a method of manufacturing the same. The device includes a lower substrate, and a fluid channel substrate contacting the lower substrate and having a multi-step microchannel having at least two depths in a side coupling to the lower substrate. Thus, the device can precisely control the fluid flow by controlling capillary force in a depth direction of the channel by controlling the fluid using the multi-step microchannel having various channel depths. A multi-step micropattern is formed by repeating photolithography and transferred, thereby easily forming the multi-step microchannel having an even surface and a precisely controlled height.

Abstract: A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution containing hydrogen peroxide and a basic solution to produce a nanoscale roughened surface consisting of nanopitting superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.

Abstract: Endoprostheses include an endoprosthesis wall that includes a surface layer that includes a metallic material and that defines a plurality of discrete pores. A porous material is disposed in one or more pores of the surface layer. The endoprostheses can, for example, deliver a therapeutic agent, such as a drug, in a controlled manner over an extended period of time.

Abstract: Systems, techniques and applications for nanoscale coating structures and materials that are superhydrophobic with a water contact angle greater than about 140° or 160° and/or superoleophobic with an oil contact angle greater than about 140° or 160°. The nanostructured coatings can include Si or metallic, ceramic or polymeric nanowires that may have a re-entrant or mushroom-like tip geometry. The nanowired coatings can be used in various self-cleaning applications ranging from glass windows for high-rise buildings and non-wash automobiles to pipeline inner surface coatings and surface coatings for biomedical implants.

Abstract: A patterning process comprises (a) providing at least one substrate having at least one major surface; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound; (c) applying the patterning composition to the major surface of the substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of the major surface; and (d) etching at least a portion of the unfunctionalized region.

Abstract: In a process for the fabrication of a radiation-absorbing optical element that contains a substrate (1) of plastic, a layer with a graduated refractive index (4) is fabricated on at least one surface (2) of the substrate (1) using a plasma etching process, after which a metal layer (7) is applied on top of the layer with a graduated refractive index (4).

Abstract: A surface treatment method includes: removing a fluorocarbon-containing reaction product from a surface of a workpiece by oxygen gas plasma processing. The workpiece includes a plurality of layers. The fluorocarbon-containing reaction product is deposited by successively etching the layers of the workpiece. The method further includes after removing the reaction product, removing an oxide-containing reaction product from the surface of the workpiece using hydrogen fluoride gas.

Abstract: Small phase change memory cells may be formed by forming a segmented heater over a substrate. A stop layer may be formed over the heater layer and segmented with the heater layer. Then, sidewall spacers may be formed over the segmented heater to define an aperture between the sidewall spacers that may act as a mask for etching the stop layer over the segmented heater. As a result of the etching using the sidewall spacers as a mask, sublithographic pore may be formed over the heater. Phase change material may be formed within the pore.

Abstract: Disclosed is a method of manufacturing a wire for straightening irregular teeth, which is not harmful to a human body and preserves the color of the teeth. The method of manufacturing a wire for straightening irregular teeth includes manufacturing a metal wire with metal alloy; physically or chemically etching a surface of the metal wire and then performing heat treatment; coating the surface of the metal wire with a metal material, Teflon, epoxy or urethane to show white or ivory and then performing heat treatment; forming a transparent parylene film on the metal material, Teflon, epoxy or urethane and then performing heat treatment; and removing one side of the foregoing coating layer from the surface of the metal wire, and then applying surface treatment to the one side with the coating layer removed.

Abstract: There is provided a method for continual preparation of granular polycrystalline silicon using a fluidized bed reactor, enabling a stable, long-term operation of the reactor by effective removal of silicon deposit accumulated on the inner wall of the reactor tube. The method comprises (i) a silicon particle preparation step, wherein silicon deposition occurs on the surface of the silicon particles, while silicon deposit is accumulated on the inner wall of the reactor tube encompassing the reaction zone; (ii) a silicon particle partial discharging step, wherein a part of the silicon particles remaining inside the reactor tube is discharged out of the fluidized bed reactor so that the height of the bed of the silicon particles does not exceed the height of the reaction gas outlet; and (iii) a silicon deposit removal step, wherein the silicon deposit is removed by supplying an etching gas into the reaction zone.

Abstract: A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.

Abstract: A wafer carrier includes a body defining a central axis, a generally planar top surface perpendicular to the central axis, and pockets recessed below the top surface for receiving wafers. The body can include a lip projecting upwardly around the periphery of the top surface. The lip can define a lip surface sloping upwardly from the planar top surface in a radially outward direction away from the central axis. The body can be adapted for mounting on a spindle of a processing apparatus so that the central axis of the body is coaxial with the spindle. The lip can improve the pattern of gas flow over the top surface of the wafer carrier.

Abstract: A method of anisotropic plasma etching of a silicon wafer, maintained at a temperature from ?40° C. to ?120° C., comprising alternated and repeated steps of: etching with injection of a fluorinated gas, into the plasma reactor, and passivation with injection of silicon tetrafluoride, SiF4, and of oxygen into the plasma reactor, the flow rate of the gases in the plasma reactor being on the order of from 10% to 25% of the gas flow rate during the etch step.

Abstract: This is provided a hydrophobic or superhydrophobic surface configuration and method of forming a hydrophobic or superhydrophobic material on a metallic substrate. The surface configuration comprises a metallic substrate having a carbon nanotube/carbon fibers configuration grown thereon, with the carbon nanotubes/carbon fibers configuration having a heirarchial structure formed to have a predetermined roughness in association with the surface. The method comprises providing a metallic substrate having a predetermined configuration, and growing a plurality of carbon nanotubes/fibers or other nanostructures formed into a predetermined architecture supported on the substrate.

Abstract: A nozzle plate containing multiple micro-orifices for the cascade impactor and a method for manufacturing the same are disclosed. The nozzle plate is formed by a series of semiconductor processes, including lithography, etching and electroplating. The nozzle plate comprises a plate body and a plurality of micro-orifices formed on the plate body. The orifice has a diameter which gradually expands in the direction away from the bottom of the plate body to achieve a smooth inner surface, allowing particles to pass therethrough smoothly without being clogged in the nozzle plate.

Abstract: An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesive layer. A circuit pattern is formed by etching on the copper foil in this state, followed by an external shape machining step of executing separation treatment reaching the metallic base material in predetermined positions including the openings. After that, a part of the insulating layer is cut off along the edge of the opening to obtain a circuit board with the end of the metallic base material exposed.

Abstract: A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.

Abstract: A method and system is provided for monitoring manufacturing equipment and, more particularly, for monitoring manufacturing equipment in a semiconductor fabrication facility using existing tool elements. The method includes operating a tool working at an operating mode such that at least one of its control parameters is outside of a normal operating range, and measuring the at least on of the control parameters of the tool working at the operating mode outside of the normal operating range. The method further includes detecting a change to a condition of the tool based on the measuring of the at least one control parameter.

Abstract: A method for making a liquid barrier includes forming a liquid barrier layer on a substrate, forming a mask layer on the liquid barrier layer such that part of the liquid barrier remains exposed, forming a contact layer on the exposed liquid barrier layer, and removing the mask layer to expose the part of the liquid barrier layer which was covered by the mask layer. A liquid wetting boundary is formed when the wettability on the liquid barrier surface area is less than the wettability of the contact surface area.

Abstract: A defect distribution in the vicinity of a surface of a glass substrate is inspected by a positron annihilation gamma ray measurement. A buffer layer including a brittle layer and/or a coating layer is created on the surface of the glass substrate. The brittle layer is formed by irradiating a gas cluster ion on the surface to deteriorate the glass. The coating layer is formed by coating the surface with a soft substance. Next, a thickness of the created buffer layer is measured by a positron annihilation gamma ray measurement. The surface of the glass substrate is then cleaned. To create a slurry, abrasive particles for the slurry are uniformly scattered on a polishing implement for polishing the glass substrate and a liquid component for the slurry is added thereto. The glass substrate is then chemically mechanically polished from the buffer layer with the slurry.

Abstract: A method is provided for depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The wear resistant surface of the medical implant device may be formed by a Laser Based Metal Deposition (LBMD) method such as Laser Engineered Net Shaping (LENS). The wear resistant surface may include a blend of multiple different biocompatible materials. Further, functionally graded layers of biocompatible materials may be used to form the wear resistant surface. Usage of a porous material for the base may promote bone ingrowth to allow the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity, particularly when applied to bearing surfaces such as artificial joint bearing surfaces or a dental implant bearing surfaces. An antimicrobial material such as silver may be deposited in combination with a metal to form an antimicrobial surface deposit.

Abstract: A silicon-containing film on a substrate is subjected to a plasma process using a process gas containing fluorine and carbon, and is thereafter subjected to plasma process using an ammonia gas, whereby ammonium silicofluoride having toxicity and hygroscopic property is adhered to the substrate. The harmful ammonium silicofluoride is removed by the inventive method. After conducting the plasma process using an ammonia gas, the substrate is heated to a temperature not lower than the decomposition temperature of the ammonium silicofluoride to decompose the ammonium silicofluoride in a process container in which the plasma process was conducted, or in a process container connected with the processing vessel which the plasma process was conducted therein and is isolated from a clean room atmosphere.

Abstract: Disclosed is a multi-inductively coupled plasma reactor and method thereof. In a multi-inductively coupled plasma reacting method, an etching method to increase a specific portion of a substrate to be processed includes etching a specific portion of a substrate to be processed; and depositing a passivation layer on a surface of the specific portion etched, wherein the etching and depositing steps are repeatedly proceeded, and one of both steps is executed when there is plasma formed by a central plasma source and a peripheral plasma source. According to the multi-inductively coupled plasma reactor and method thereof of the invention, it is possible that plasma is uniformly processed on the entire area of the substrate since the central plasma source and the peripheral source are provided separately.

Abstract: A heat exchange structure including a primary face including non-through holes formed in the face. The inner surface of the holes and the surface of the primary face outside the holes are covered with nanoparticles. The inside of the holes have a non-wettability property relative to a given liquid and the surface of the face between the holes have a wettability property relative to the liquid.

Abstract: Disclosed is a method of preparing a support structure suitable for use, e.g., in microscopic studies, comprising a free standing atomically thin film (e.g. graphene) suspended across an opening in the support structure. The method in one aspect comprises the steps of preparing a thin film which is an atomically thin film (e.g., graphene) on a surface of a solid substrate to form a graphene-layered substrate; attaching the graphene layer to a hole-containing support mesh; removing the solid support, thereby transferring the graphene layer from the substrate to the carbonaceous hole-containing layer on the support mesh; and then removing contaminants to obtain said structure. In another aspect, the present method does not involve a transfer, but comprises a lithography and etching process in which the atomically thin layer is applied to a support which is marked with a lithographic pattern and selectively etched, leaving the free standing film.

Abstract: Methods and structures relating to the formation of mixed SAMs for preventing undesirable growth or nucleation on exposed surfaces inside a reactor are described. A mixed SAM can be formed on surfaces for which nucleation is not desired by introducing a first SAM precursor having molecules of a first length and a second SAM precursor having molecules of a second length shorter than the first. Examples of exposed surfaces for which a mixed SAM can be provided over include reactor surfaces and select surfaces of integrated circuit structures, such as insulator and dielectric layers.

Abstract: Method of bonding a layer (S) of silicone to a substrate (4?) of methacrylic polymer; the method involves positioning between the methacrylate polymer and the silicone a layer (9) of an organosilane having the formula R1Si(R2)3, in which R2 is OH and R1 is a methacrylic residue.

Abstract: In an embodiment, a method for manufacturing a thin layer chromatography (“TLC”) plate is disclosed. The method includes forming a layer of elongated nanostructures (e.g., carbon nanotubes), and at least partially coating the elongated nanostructures with a coating. The coating includes a stationary phase and/or precursor of a stationary phase for use in chromatography. The stationary phase may be functionalized with hydroxyl groups by exposure to acidified water vapor or immersion in a concentrated acid bath (e.g., HCl and methanol). At least a portion of the elongated nanostructures may be removed after being coated. Embodiments for TLC plates and related methods are also disclosed.

Abstract: The invention provides a system and method for alignment of nanoparticles on a substrate. The system includes: a substrate; a plurality of polypeptide templates formed on the substrate; and a plurality of nanoparticles formed on the polypeptide templates. The method includes: providing a substrate; forming a plurality of polypeptide templates on the substrate; and forming a plurality of nanoparticles on the polypeptide templates.

Abstract: A stator for a helicoidal down-hole drilling motor is formed with a through-hole, in addition to the main stator bore. The through-hole can be a straight hole extending parallel to the axis of the stator, or a hole of helical form, the helix extending about the axis of the stator. The through-hole can be used to accommodate a communications cable extending through the through-hole, and/or the through-hole can be connected to a fluid supply. The stator is produced from metal-based powder by producing an insert of accurate dimensions corresponding to the dimensions of a bore to be created in the finished stator, the bore having a length of at least 750 mm, supporting the insert within a mould cavity, filling the mould cavity with metal-based powder, subjecting the powder to isostatic pressing, and subsequently removing the material of the insert.

Abstract: A method for patterning a material during fabrication of a semiconductor device provides for the selective formation of either asymmetrical features or symmetrical features using a symmetrical photomask, depending on which process flow is chosen. The resulting features which are fabricated use spacers formed around a patterned material. If one particular etch is used to remove a base material, symmetrical features result. If two particular etches are used to remove the base material, asymmetrical features remain.

Abstract: Generally disclosed is a golf ball having a core and a cover layer. The cover layer includes areas that are hard corresponding to the dimples, and areas that are soft corresponding to the land between the dimples. The cover layer may be selectively treated, such as by heating, to achieve a difference in hardness using a single cover layer material. Alternatively, the cover layer may be selectively coated with a coating material having a different hardness. As a result of the arrangement of the hard dimples and the soft land, the golf ball achieves reduced spin, and greater distances, when struck with a larger force (such as during a dive) while also achieving increased spin, and better control, when struck with a smaller force (such as during a chip).

Abstract: A base plate having a surface on which a plurality of hydroxyl groups can be introduced, a metallic membrane disposed on the base plate and having a plurality of wells reaching the base plate, and a crosslinkable polymer membrane disposed on the metallic membrane are included.

Abstract: Generally disclosed is a golf ball having a core and a cover layer. The cover layer includes areas that are hard corresponding to the dimples, and areas that are soft corresponding to the land between the dimples. The cover layer may be selectively treated, such as by heating, to achieve a difference in hardness using a single cover layer material. Alternatively, the cover layer may be selectively coated with a coating material having a different hardness. As a result of the arrangement of the hard dimples and the soft land, the golf ball achieves reduced spin, and greater distances, when struck with a larger force (such as during a dive) while also achieving increased spin, and better control, when struck with a smaller force (such as during a chip).

Abstract: A micro- or nano-fluidic chip fabricated with a Norland Optical Adhesive (NOA), an acrylated polyurethane-based UV-polymerizable optical adhesive. The micro- or nano-fluidic chip has sequentially an inlet, a channel, and an outlet. The channel has a pillar in the region of the outlet to prevent beads from flowing out, and the surface of the channels in the micro- or nano-fluidic chip is hydrophilic, which generates spontaneous flow in the channels by a capillary force without any extra external pumping.

Abstract: A process of preparing a plurality of nanostructures, each being composed of at least one target material is disclosed. The process comprises sequentially electrodepositing a first material and the at least one target material into pores of a porous membrane having a nanometric pore diameter, to thereby obtain within the pores nanometric rods, each of the nanometric rods having a plurality of segments where any two adjacent segments are made of different materials. The process further comprises and etching the membrane and the first material, thereby obtaining the nanostructures.

Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.

Abstract: A method for etching features in a dielectric layer is provided. A mask is formed over the dielectric layer. A protective silicon-containing coating is formed on exposed surfaces of the mask. The features are etched through the mask and protective silicon-containing coating. The features may be partially etched before the protective silicon-containing coating is formed.

Abstract: A method for encapsulating structures (11) (typically MEMS structures) supported by a carrier substrate (12) (typically made of glass or silicon), includes: application, on the carrier substrate (12), of at least one cover (7) supported by a mould (1, 2, 6), the mould including a catching layer (6), each cover (7) being in contact with the catching layer (6); then fastening of at least one cover (7) onto the carrier substrate (12); and then separation of the mould (1, 2, 6) from the at least one cover (7). The catching layer (6) includes a fluoropolymer. Preferably, the mould (1, 2, 6) is mechanically separated from the at least one cover (7), by pulling the mould (1, 2, 6) away from the at least one cover (7). Thus, the mould (1) can be reused, which considerably simplifies encapsulating operations carried out on an industrial scale.

Abstract: The invention relates to a method for producing a slotted guide, in which: a) a layer of a material having a refractive index less than that of silicon, for example Material having a refractive index less than that of silicon (26), is formed on an etching barrier layer (22), b) two parallel trenches are etched into said material having a refractive index less than that of silicon, with the etching barrier on said etching barrier layer, these two trenches being separated by a wall of said material having a refractive index less than that of silicon (36), c) the trenches thus made are filled with silicon (42, 44).

Abstract: The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may be contacted with at least a portion of the surface of the positioned implantable medical device. In an embodiment, the fluid may be capable of dissolving at least a portion of the polymer at or near the surface of the implantable medical device. The method may further include allowing the fluid to modify at least a portion of the surface of the positioned medical device. A majority of the contacted fluid may be removed from the surface of the implantable medical device. In certain embodiments, the modified portion of the surface may be substantially less thrombogenetic and substantially more mechanically stable than an unmodified surface.

Abstract: A printing plate for gravure printing includes; a base body, a first convex portion disposed having a first height on the base body, a concave portion disposed between adjacent regions of the first convex portion, and a second convex portion disposed in the concave portion and having a second height smaller than that of the first height, wherein the concave portion includes a first concave portion and a second concave portion and a width of the second concave portion is larger than that of the first concave portion, and the second convex portion is disposed within the second concave portion.

Abstract: A substrate section for a flexible display device is disclosed. The substrate section includes: a first substrate, a second substrate disposed above a center region of the first substrate, a reinforcing layer disposed between the first and second substrates, configured to reinforce adhesion between the first and second substrates, and a barrier layer disposed above the second substrate and surrounding side surfaces of the second substrate and of the reinforcing layer.