Abstract: A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.

Abstract: A method for preparing at least one metal layer of an integrated circuit for visual analysis. The at least one metal layer to be visually analyzed is exposed, and a solution of nitric acid, acetic acid, and ammonium fluoride is applied to the at least one metal layer. The at least one metal layer is rinsed to substantially remove the solution, and the s integrated circuit is dried. The solution is made with one part nitric acid, three parts acetic acid, and two parts ammonium fluoride. The nitric acid is a solution of about seventy percent by weight in water, the acetic acid is glacial acetic acid, and the ammonium fluoride is a solution of about forty percent by weight in water. The solution is at a temperature of about seventy degrees Fahrenheit, and is applied to the at least one metal layer by swabbing the solution onto the layer for between about ten seconds and about fifteen seconds. The step of exposing the at least one metal layer includes sawing the integrated circuit along a desired cross section.

Abstract: Cu metallization is treated to reduce defects and effect passivation, and to reduce leakage between lines, by removing surface defects subsequent to CMP and barrier layer removal. Embodiments include the sequential steps of: CMP and barrier layer removal; buffing with a solution comprising citric acid, ammonium hydroxide and deionized water to remove copper oxide; rinsing with deionized water or an inhibitor solution, e.g., benzotriazole or 5-methyl triazole in deionized water; buffing with an abrasive slurry; and rinsing with deionized water or an inhibitor solution.

Abstract: A method of making a printed circuit board whereby a fine wiring pattern can be formed. A through hole is formed in a substrate, both surfaces of the substrate being covered with copper foil. The substrate is treated with a catalyst and plated with copper. The through hole is filled with an insulating material, and the copper layer on the substrate is etched so that the catalyst layer is not exposed, leaving a thinned copper layer. Then, the substrate surfaces are ground and leveled by removing any projecting insulating material. Thereafter, another copper layer is deposited on the surface of the substrate, including surface regions on the fill material and is circuitized to form a wiring pattern. Since the catalyst layer is not exposed when the copper layer on the substrate is thinned, a fine wiring pattern can be obtained without the problem of subsequent peeling of the wiring conductors, or the entrapment of air.

Abstract: A method of altering the topography of a trailing edge of a slider is disclosed, the slider having a substrate surface, at least one magnetic recording head imbedded in an alumina undercoat, and a vertical axis relative to the substrate surface. The steps include first applying an alumina overcoat to at least the trailing edge, followed by lapping at least the trailing edge of the slider. The slider (or sliders) is then placed on a pallet that rotates, exposing the trailing edge to an ion beam. The ion beam is generated using an etchant gas such as Argon, or a mixture of gases such as Argon and Hydrogen, or Argon and CHF3. The trailing edge (or trailing edges) are then exposed at least once to the ion beam at a predetermined milling angle and predetermined time, the milling angle being the angle made by the ion beam relative to the vertical axis. The milling angle is typically between 0° and 85°.

Abstract: Wafer-to-wafer bonding using, e.g., solder metal bonding, glass bonding or polymer (adhesive) bonding is improved by profiling one or both of the wafer surfaces being bonded to define microstructures therein. Profiling means providing other than the conventional planar bonding surface to define cavities therein. The bonding material fills the cavities in the microstructures. For instance, a system of ridges and trenches (e.g. in cross-section vertical, slanted, key-holed shaped, or diamond-shaped) are microstructures that increase the surface area of the wafers to which the bonding material can adhere. Use of the key-hole shaped or diamond-shaped profile having a negative slope at the trench interior substantially increases the bonding force.

Abstract: A thin film made of an amorphous material having a supercooled liquid phase region is formed on a substrate. Then, the thin film is processed by wet-etching, etc. to form a thin film-processed body having, for example, a one side-fixed beam like shape. Subsequently, the thin film-processed body is heated to a temperature within the supercooled liquid phase region and held at the temperature for 0.5-5 minutes. Thereafter, the thin film-processed body is cooled down to room temperature. Then, at least a part of the substrate is removed by wet-etching, etc. to form a thin film-planar structure composed of the thin film-processed body having the one side-fixed beam like shape.

Abstract: A method for splitting a piezoelectric device used in substitution for dicing for shortening the processing time as compared to a case of using the dicing to improve productivity to enable the shape of the piezoelectric device more suited to the emission shape of a solution to be achieved, and a method for manufacturing a printer device whereby a narrower nozzle pitch may be achieved. A resist 201 is formed at a pre-set position on a major surface of the piezoelectric device 43 bonded to a vibrating plate. Using this resist 201 as a mask, powders or particles are sprayed onto the piezoelectric device 43 for removing the portion of the piezoelectric device 43 not carrying the resist 201 to form the piezoelectric device 35 of a desired shape at a pre-set position.

Abstract: The material of inner ring, outer ring and rolling element is formed by a steel material having a chromium (Cr) content of 5% by weight or more. The material is then subjected to cutting. Thereafter, the material thus cut is subjected to heat treatment so that the surface hardness HRC of the worked material is 58 or more. Subsequently, the worked material is subjected to grinding. A working denatured layer present on the surface of the worked material is then removed. Subsequently, an oxide film comprising chromium atom and iron atom at a ratio (Cr/Fe) of 0.5 or more is formed on the surface of the worked material. Accordingly, it is possible to provide a rolling bearing excellent in corrosion resistance and fretting resistance.

Abstract: An object of the present invention is to provide a method for producing a display device by which a substrate is thinned efficiently. Onto one original substrate having an area for a plurality of display devices, the other original substrate is bonded via a sealing resin layer, the pair of bonded original substrates is divided and separated into a plurality of pairs of substrates of a size of each individual display device, and thereafter a substrate thinning process of thinning the substrates is performed in a state where the substrates are held by substrate holding means.

Abstract: A diamond field emitter and a fabrication method thereof, in which a pretreatment is performed on a surface of an Si substrate in order that diamond nuclei are uniformly formed on the Si substrate during a diamond deposition, an oxide film such as an SiO2 film is deposited on the pretreated surface of the Si substrate and removed after an etching process so that diamond powder can be selectively remained during the etching process, thus the effect of the surface pretreatment of the Si substrate remains in the selected portion during the etching process, and it is also possible to uniformly deposit the diamond in said portion. According to the present invention, the diamond field emitter having excellent and uniform field emission characteristic can be manufactured because the field emission is easily achieved at a tip shaped field emission section, and, moreover, the diamond placed on an upper end portion of the tip increases electron emission effect.

Abstract: The stamping process and a method of fabrication of nano-stamps with characteristic dimensions below 1 nm and up to 100 nm intended for usage in making patterns of characteristic dimensions the same as those of the nano-stamp on surface of a substrate is provided. In the process a very hard stamp is fabricated by first depositing alternating layers of two materials, one of which has very high hardness, on some sacrificial substrate via PVD, CVD or any other deposition procedure that produces alternating layers of selected thickness, from sub 1 nm to above 100 nm. The layered film is then polished to an atomically smooth finish perpendicular to the plane of the layers and etched to produce dips in the softer layers. These steps produce a grid of parallel elevations and valleys on the etched surface, which now can be used as a stamp to stamp out patterns on a substrate of lower hardness than the hardness of the elevated layers.

Abstract: A method and a system are provided for cleaning a CMP pad. The method starts by applying chemicals onto the surface of the CMP pad. The chemicals are then allowed to react with a residue that may be on the pad to produce by-products. Next, the pad surface is rinsed to substantially remove the by-products. A mechanical conditioning operation is then performed on the surface of the pad. In one example, the wafer surface can be a metal, such as copper. Where the wafer surface is copper, the chemical is most preferably HCl, and a solution includes HCl and DI water. Where the wafer surface is oxide, the chemical is most preferably NH4OH, and the solution includes NH4OH and DI water. Generally, the CMP pad can be in the form of a linear belt, in the form of an round disk, or in any other mechanical or physical configuration.

Abstract: A method of using a finishing element having a fixed abrasive finishing surface including organic boundary lubricants for finishing semiconductor wafers is described. The organic lubricants form an organic lubricating boundary layer in the operative finishing interface in a preferred coefficient of friction range. The selected coefficient of friction helps improve finishing and reduces unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.

Abstract: A fuel cell contains an electrolyte sheet sandwiched between two electrodes. One or both electrode/electrolyte interfaces includes mesoscopic three-dimensional features in a prescribed pattern. The features increase the surface area-to-volume ratio of the device and can be used as integral channels for directing the flow of reactant gases to the reaction surface area, eliminating the need for channels in sealing plates surrounding the electrodes. The electrolyte can be made by micromachining techniques that allow very precise feature definition. Both selective removal and mold-filling techniques can be used. The fuel cell provides significantly enhanced volumetric power density when compared with conventional fuel cells.

Abstract: The processes allow structuring of a metal-containing layer. The metal-containing layer is etched, using an etching mask, in a plasma-assisted etching gas atmosphere at a temperature of over 130° C. and in the presence of at least one halogen compound and at least one oxidizing agent. The concentration of the oxidizing agent is thereby set higher than the concentration of the halogen compound.

Abstract: A method for fabricating ferroelectric memory cells includes forming a first interlayer insulating film having a first opening on an underlayer, and forming a preparatory first electrode layer over the entire surface thereof. The preparatory first electrode layer is partially removed in a CMP process and a first electrode is formed by the remaining portion. Next, a second interlayer insulating film having a second opening that exposes the first electrode is formed. Portions of a preparatory ferroelectric film on the exposed surface of the first electrode and the upper surface of the second interlayer insulating film are formed mutually stepped. The portion of the preparatory ferroelectric film on the second interlayer insulating film is removed by a CMP process and the portion on the exposed surface is left remaining to form a ferroelectric film. A second electrode is formed on the ferroelectric film by CMP processing or photolithography.

Abstract: Disclosed is a process for the surface treatment of an aluminum support for printing plate which comprises a step of brush-graining with an abrasive brush and an abrasive slurry, characterized in that as the abrasive there is used aluminum hydroxide, the aluminum hydroxide which has been used in graining is dissolved in a sodium aluminate solution and the sodium aluminate solution having a raised supersaturation degree, the aluminum hydroxide which has been left undissolved and seed crystal aluminum hydroxide undergo hydrolysis reaction to produce crystalline aluminum hydroxide which is then purified and recovered.

Abstract: A method for chemical-mechanical polishing of a layer that is deposited on a surface of an integrated circuit substrate is described. The method includes: (1) immobilizing the integrated circuit substrate using a substrate holder such that the integrated circuit substrate surface is positioned against a surface of a polishing pad, which is mounted on a supporting surface; (2) a first stage of polishing the substrate surface including maintaining a predetermined difference between the rotational velocity of the polishing pad and the rotational velocity of the substrate holder allowing an endpoint of the chemical-mechanical polishing process of the layer to be detected; and (3) a second stage of polishing the substrate such that the rotational velocity of the polishing pad and the rotational velocity of the substrate holder are substantially the same to produce a substantially planar substrate surface.

Abstract: A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

Abstract: Before submitting a sample, including a first material layered upon a substrate, to an ion milling process, whereby a second material is sputtered onto the surface of the first material and the sample is then submitted to an etching process, an irregularity is formed on the surface of the first material. The overall process results in the formation of cones, or micro-tip structures, which may then be layered with a layer of low work function material, such as amorphous diamond. The irregularity in the surface of the first material may be formed by polishing, sandblasting, photolithography, or mechanical means such as scratching.

Abstract: A method for manufacturing a dielectric waveguide at a low manufacturing cost, the dielectric waveguide comprising a pair of conductor plates approximately parallel to each other and the dielectric strip provided therebetween, which can form a dielectric strip having accurate individual dimensions without generating cracks and chips during processing. The method comprises the steps of forming a resist pattern on a green sheet containing at least a powdered inorganic material and an organic binder, removing a predetermined amount of the green sheet corresponding to an opening in the resist pattern by the use of a mask, removing the resist pattern, and firing the green sheet. In the step of removing the predetermined amount of the green sheet, the rate of removal is continuously or intermittently changed along the depth direction of the green sheet.

Abstract: A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film forming method for forming a planarized ultra fine particle film from a deposited film of ultra fine particles formed by supplying the ultra fine particles to a substrate, the method comprising one or more of a planarizing step of planarizing a surface of the deposited film of the ultra fine particles supplied to the substrate.

Abstract: A circuit board having a structure including a permanent photoimageable dielectric material suitable for fabrication of vias both by laser ablation, plasma ablation, or mechanical drilling techniques and by photoimaging techniques. A process is also disclosed for the manufacture of a multi-level circuit on a substrate having a first-level circuitry pattern on at least one side. The process comprises applying a permanent photoimageable dielectric over the first-level circuitry pattern; exposing the permanent photoimageable dielectric to radiation; laminating a conductive metal layer to the dielectric; making holes in the conductive metal layer and dielectric by mechanical drilling or by laser or plasma ablation; and making a second-level circuitry pattern and filling the holes with a conductive material to electrically connect the first and second layers of circuitry.

Abstract: A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

Abstract: The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n−1— RELEASE-M(X)n−m−1 Qm, or RELEASE-M(OR)n−1—, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence −1 of M, and n−m−1 is at least 1 provides good release properties.

Abstract: A method of making a connection component for a microelectronic element includes providing a sheet comprising an electrically conductive layer, a photoresist layer overlying the conductive layer and a photoimageable dielectric layer disposed under the conductive layer. The method includes lithographically forming at least one opening in the photoresist layer to uncover a portion of the conductive layer, forming a plurality of circuit features from the conductive layer by removing the uncovered portion of the conductive layer, at least some of the circuit features being leads, and lithographically forming at least one aperture in the photoimageable dielectric layer.

Abstract: A new polish cleaning apparatus and a cleaning method are described for cleaning an HGA (head gimbal assembly) to meet the increasing requirements for cleanliness of read-write heads in the disk drive industry. The HGA polish cleaning apparatus includes an HGA polish cleaning assembly having a set of HGA carriers for effectively simultaneously polish clean a plurality of HGAs against a back and forth moving polish finger wrapped with anti-static polyester cloth. A plurality of HGAs to be polished are simultaneously loaded into the HGAs carriers which are then immersed in a polish cleaning tank containing a solution. The HGA carriers are driven by a pneumatic cylinder unit which is individually controlled by a programmable controller for exact polish cleaning. It also has a plurality of press-pins to fix the HGAs and supply proper friction between the slider ABS surface and the polish surface. The polish cleaning tank has an overflow weir, a pump, and a filter canister with a 0.

Abstract: A sputtering target is provided which provides early stabilization of the film-deposition rate of the sputtering target from its initial stage of use. The sputtering target surface subjected to erosion is formed with a surface-deformed layer. The surface-deformed layer is reduced by precision machining and removed by etching. The extent of etching is controlled so that the surface roughness (Ra) is in a range between 0.1% and 10% of the mean crystal grain diameter of the material constituting the target. The surface roughness (Ra) is defined as the mean roughness on the center line of the surface.

Abstract: Before submitting a sample, including a first material layered upon a substrate, to an ion milling process, whereby a second material is sputtered onto the surface of the first material and the sample is then submitted to an etching process, an irregularity is formed on the surface of the first material. The overall process results in the formation of cones, or micro-tip structures, which may then be layered with a layer of low work function material, such as amorphous diamond. The irregularity in the surface of the first material may be formed by polishing, sandblasting, photolithography, or mechanical means such as scratching.

Abstract: The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing a wafer having initial thickness variations between two wafer surfaces. The wafer is processed (Step 216) through a first module (300), with the first module having apparatus for performing a grinding process, a clean process and a metrology process, all preferably within a clean room environment (310). Wafer processing through the first module includes performing the grinding process, clean process and metrology process. The method further includes defining an edge profile on the wafer and processing (Step 222) the wafer through a second module (400).

Abstract: A magnetic data storage medium includes a dedicated transducing head contact zone for engaging an air bearing slider, primarily when the disk is stationary and also during disk accelerations and decelerations. The contact zone has a dual baseline texture, formed by first creating a recessed region within the transducing head contact zone, and then by forming multiple nodules or other texturing features within the recessed region. The texturing features project upwardly from a recessed surface of the recessed region, and also project above an upper surface of the disk by an amount less than the texturing feature height. Consequently, the texturing features are large enough to counteract stiction due to liquid lubricant meniscus formation, yet also have heights sufficiently low relative to the upper surface to allow reduced transducer flying heights.

Abstract: A disposable electrode strip for testing a fluid sample including a laminated strip with a first and second end, a reference electrode embedded in the laminated strip proximate to the first end, at least two working electrodes embedded in the laminated strip proximate to the first end and the reference electrode, an open path for receiving a fluid sample beginning from the first end and being sufficiently long to expose the reference electrode and the working electrodes to the fluid sample, and conductive contacts located at the second end of the laminated strip. The laminated strip has a base layer with a conductive coating, a reagent holding layer, a channel forming layer and a cover. One of the working electrodes contains a reagent substantially similar to the reagent of the reference electrode and a second working electrode contains a reagent having an enzyme.

Abstract: A method to remove metal contaminants in a substrate cleaning process. The present invention may replace or be used in conjunction with other substrate cleaning systems. This method comprises adding a citric acid solution to the liquid medium of a semiconductor substrate cleaning system. This method is described in the manner it is used in conjunction with a scrubber wherein both sides of a wafer are scrubbed.

Abstract: The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an intermediary seed layer to produce low-defect, fine conductive line printed circuit boards.

Abstract: A surface processing method by blowing submicron particles is disclosed, in which submicron particles are blown against a surface of a work to deposit a layer of the material of the particles on a surface of the work, or etching the surface of the work.

Abstract: A method of manufacturing a polarizing plate of a resonance absorption effect type wherein plural bar-like polarizing members are arranged in a light-transmittable polarizing matrix layer with major axes thereof orienting in a constant direction. The method includes a preparing process of a forming die for preparing a forming die having a concavoconvex pattern corresponding to a layout pattern of the bar-like polarizing members, a forming process of a concavoconvex pattern on a resin layer for forming a resin layer directly or indirectly on a substrate and pressing the forming die onto the resin layer so as to form a concavoconvex pattern on the resin layer, a forming process of bar-like polarizing members for forming the bar-like polarizing members in the foregoing layout pattern using the concavoconvex pattern of the resin layer, and a forming process of a polarizing matrix layer for forming the light-transmittable polarizing matrix layer so as to bury the formed bar-like polarizing members.

Abstract: A process of manufacturing a roll punch used for forming the partition walls on the rear panel of a PDP is disclosed. In the process of this invention, a forming roll is primarily coated with a mask on its external surface. The mask is, thereafter, partially removed from the forming roll, thus forming a plurality of regularly spaced mask-free parts on the forming roll. The forming roll is, thereafter, etched at the mask-free parts using ultrasonic waves within an etching tank, and so a desired roll punch having partition wall forming grooves is produced. This manufacturing process enlarges the width of the lands between the forming grooves of the roll punch, thus allowing an easy arrangement of address electrodes on the rear panel of a PDP. It is also possible to produce a desired highly precise roll punch by properly adjusting the intervals between the mask-free parts of the forming roll.

Abstract: A method for creating a roughened surface on a material exposed to light during a photolithographic process is provided. The roughened surface is created on a surface of the material via a plasma etch process. The roughened surface diffuses light incident to the material such that the diffused light causes insubstantial damage to a photoresist subsequently formed on the material.

Abstract: It is arranged such that the least common multiple of two numbers m and n of which one is prime to the other, is made as large as possible where the number m is the rotational speed (rpm) of a platen with a polishing pad affixed thereto and the number n is the rotational speed (rpm) of a carrier with a wafer mounted thereon. As a result of such arrangement, it is not until the platen completes m revolutions that a point on the polishing pad that comes into contact with a fixed point on the wafer returns to the original contact point with the fixed point at the start of polishing, and the resulting trajectory is therefore spread uniformly over the polishing pad.

Abstract: The present invention discloses a method of forming ultrasmall (nano) structures in a thin film provided on a substrate by means of a tip which is movable relative to the surface of the thin film. According to principles of the invention, the penetration depth of the tip is limited, thereby avoiding wear of the tip. Furthermore, an apparatus for carrying out the method is disclosed.

Abstract: A wiring board having a conductor layer formed on a substrate and a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface, the conductor layer having a resin inflow prevention portion which is provided adjacently to the said connecting pad disposition portion and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion, the resin inflow prevention portion being capable of overcoming the problem of prior art that an adhesive resin (resin layer) of a prepreg or an adhesive flows out onto the upper surface of the pad, due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element onto the pad.

Abstract: An acoustic lens array fabrication process includes the formation of a microlens array mold stamper through the melting of a photoresist resin deposited on formed pedestals of a substrate. Heating of the resin causes formation of semi-spherical photoresist mounds. A further processing step, such as reactive ion etching, is used to transfer the geometry of the photoresist mounds to the substrate material, thereby forming a microlens mold stamper with convex mounds. The microlens mold stamper is then pressed into an upper surface of a acoustic ink print head substrate heated to a predetermined temperature, allowing the convex mounds to form concave impressions in the acoustic ink print head substrate, thereby forming the microlens array.

Abstract: A package for a microelectronic element is made by making a microelectronic component, including embossing a metal sheet to form thin and thick regions, then etching or otherwise removing metal from the sheet in a nonselective removal process and arresting the removal process when the thin regions are removed but before the thick regions are removed. A base material may be applied to the metal sheet to form a dielectric layer for the component. The component is assembled with a microelectronic element to form the package.

Abstract: A method of removing a diffusion aluminide coating on a component designed for use in a hostile environment, such as superalloy turbine, combustor and augmentor components of a gas turbine engine. The method selectively removes an aluminide coating by stripping aluminum from the coating without causing excessive attack, alloy depletion and gross thinning of the underlying superalloy substrate. Processing steps generally include contacting the coating with a mixture that contains a halogen-containing activator and a metallic powder containing an aluminide-forming metal constituent, such as by pack cementation-type process. The mixture is then heated to a temperature sufficient to vaporize the halogen-containing activator and for a duration sufficient to cause the halogen-containing activator to provide a transfer mechanism for the removal of aluminum from at least a portion of the diffusion aluminide coating, while the metallic powder absorbs the removed aluminum.

Abstract: A method for treating a film of material, which can be defined on a substrate, e.g., silicon. The method includes providing a substrate comprising a cleaved surface, which is characterized by a predetermined surface roughness value. The substrate also has a distribution of hydrogen bearing particles defined from the cleaved surface to a region underlying said cleaved surface. The method also includes increasing a temperature of the cleaved surface to greater than about 1,000 Degrees Celsius while maintaining the cleaved surface in a etchant bearing environment to reduce the predetermined surface roughness value by about fifty percent and greater. Preferably, the value can be reduced by about eighty or ninety percent and greater, depending upon the embodiment.

Abstract: A method for manufacturing a gelatin-coated glass panel is described. In this, gelatin is first applied onto a glass panel, then a protective layer is sputtered on through a mask placed onto the gelatin layer. After removal of the mask, the gelatin can be removed, with the aid of a dry etching method, from the regions in which it is not equipped with a protective layer. The glass panel can then easily be divided by scoring and breaking. The method makes it possible to produce, on a large-scale production basis, liquid crystal displays which have either a color filter or a black matrix made of photoemulsion.

Abstract: A method for molding high precision components is provided that allows inexpensive, rapid fabrication of components using a process involving a silicon substrate, in which the mold pattern is created using multiple mask layers, a deep reactive ion etch process and photolithographic patterning techniques.

Abstract: A micro-electromechanical device, such as a micro-sensor or micromachine, includes a movable part in the form of a cantilever or diaphragm, which is formed on a substrate. In order to recover stiction in which the movable part is fixedly adhered to the substrate, a heating element is provided on a surface of the substrate which is opposed to the movable part. The heating element can be operated upon occurrence of stiction, so as to generate heat and thereby separate the movable part from the substrate and assure a proper operation of the device. The device can be produced at a relatively low cost, and achieves a stiction recovery with a high reliability, even when the device is enclosed in a package.

Abstract: A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a scribe line with excimer laser to form a groove to expose a portion of the substrate before sawing the substrate along the scribe line with a saw blade. Plasma etching or ion beam etching or sand blasting is an alternative to the excimer laser.