Abstract: A method of etching a substrate comprises: contacting a substrate having a thickness with an etchant disposed in a vessel for a period of time until the thickness has reduced by at least 2 ?m and at an average rate of 1 ?m per minute to 6.7 ?m per minute, the etchant having a temperature of 170° C. to 300° C. and comprising a molten mixture of two or more alkali hydroxides; and ceasing contacting the substrate with the etchant. The etchant in some instances comprises a molten mixture of NaOH and KOH. For example, the etchant in some instances includes a molten mixture of 24 wt. % to 72 wt. % NaOH, and 76 wt. % to 28 wt. % KOH. In some instances, the method alters the weight percentage of Na+, K+ and Li+ in the composition of the surface of the substrate by less than 1%.

Abstract: A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the article having an anti-glare surface includes, for example, forming a protective film on selected portions of at least one surface of the article; contacting the at least one surface with a liquid etchant; and removing the protective film from the surface of the article to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed.

Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.

Abstract: A method for manufacturing a glass substrate for a magnetic disk comprises a surface grinding step of processing a mirror-surface plate glass, having a main surface in the form of a mirror surface, to a required flatness and surface roughness using fixed abrasive particles. The method comprises, before the surface grinding step using the fixed abrasive particles, a surface roughening step of roughening the surface of the mirror-surface plate glass by frosting.

Abstract: Provided is an etching composition for electively removing silicon dioxide at a high etch rate, more particularly, a composition for wet etching of silicon dioxide, including 1 to 40 wt % of hydrogen fluoride (HF); 5 to 40 wt % of ammonium hydrogen fluoride (NH4HF2); and water, and further including a surfactant to improve selectivity of the silicon dioxide and a silicon nitride film. Since the composition for wet etching of silicon dioxide has the high etch selectivity of the silicon dioxide to the silicon nitride film, it is useful for selectively removing silicon dioxide.

Abstract: A method for texturing a glass substrate includes cleaning the glass substrate with at least one surfactant and etching the glass substrate using a caustic solution. The percentage of caustic solution is provided by controlling a fluid flow and temperature to control the depth of the etching. The method also includes acid cleaning the etched glass substrate to remove glass residuals and surfactants.

Abstract: There are provided an aqueous solution for separation of a conductive ceramics sintered body in which a conductive ceramic sintered body separated form a glass can be collected in a recyclable condition, and a separating method therefor, and an aqueous solution for separation with which a dark ceramics sintered body, a conductive ceramics sintered body and a glass are separately collected from a glass with a dark ceramics sintered body in which a conductive ceramics sintered body is formed on the dark ceramics sintered body, and a separating method therefor. A treatment liquid having an etching ability for at least one of a glass and a conductive ceramic sintered body is prepared as an aqueous solution 20 for separation of the conductive ceramics sintered body, then the aqueous solution 20 for separation is filled in a container 11, and a glass with a conductive ceramics sintered body 30 is immersed into the aqueous solution 20 for separation in the container 11.

Abstract: The present invention discloses a method for treating at least a portion of a surface of a glass article which comprises the following steps, whatever their order: application of a water solution comprising at least one high-pH solid material on said portion of the glass article; heating of said glass article to a temperature at least equal to the evaporation temperature of water.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: Provided is a method for surface frosting of glass product, wherein a glass product is first immersed in a pre-treatment solution having a composition including water (H2O) 60-80 wt %, hydrofluoric acid (HF) 10-20 wt %, and nitric acid (HNO3) 10-20 wt % for approximately 5 seconds to remove grease/oil and/or contamination from a surface of the glass product, then immersed in a frosting solution having a composition including nitric acid (HNO3) 15-40 wt %, ammonium hydrofluoride (NH4HF2) 30-60 wt %, hydrofluoric acid (HF) 0-10 wt %, water (H2O) 0-45 wt %, and hydrochloric acid (HCl) 0-1 wt % for approximately 1-5 minutes, and finally rinsed with water. As such, the surface of the glass product so treated forms a surface texture that provides smooth tactility of hand touch and shows an outer appearance of a scale like pattern formed on the surface of the glass product.

Abstract: A method for flattening a glass substrate includes the steps of preparing plural kinds of etching liquids different from one another in an etching rate, preparing the glass substrate, and etching the glass substrate at least one time with each of the etching liquids and executing the etching a plurality of times in total. When the etchings are executed the plurality of times, an etching rate of the glass substrate with one etching liquid used for one etching of plural etchings is slower than that of the glass substrate with the another etching liquid used for another etching executed after the one etching process of the plural etching processes.

Abstract: A method of fabricating spacers for use in a flat panel device includes: preparing a core glass having a low solubility in a chemical etching solution and a tube glass having a high solubility in the chemical etching solution and having a larger inner diameter than an outer diameter of the core glass; inserting the core glass into the tube glass to obtain a cylindrical glass; drawing the cylindrical glass at a predetermined temperature until the core glass has a predetermined diameter; cutting the drawn cylindrical glass to a predetermined length; and removing the tube glass in the cylindrical glass using the chemical etching solution.

Abstract: A method for removing damages of a dual damascene structure after plasma etching is disclosed. The method comprises the use of sublimation processes to deposit reactive material onto the damaged regions and conditions to achieve a controlled removal of the damaged region. Furthermore a semiconductor structure comprising a dual damascene structure that has been treated by the method is disclosed.

Abstract: A method for preparing a decorative glass using a glass etching composition, wherein a frosting of elaborate patterns and designs is applied on the surface of the glass having an arbitrary shape, such a plane, a curved plane or a tube, by utilizing the silk-screen process or the like, using a glass etching composition characterized as comprising 1 to 20 w/v % (preferably, 2 to 5 w/v %) of a fluoride, 20 to 80 v/v % (preferably, 20 to 50 v/v %) of water and 20 to 80 v/v % (preferably, 50 to 80 v/v %) of an organic solvent miscible with water or another glass etching composition comprising the former composition and an additive. The glass etching composition is free from the problems of the danger to a human body and environmental pollution.

Abstract: Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.

Abstract: A glass etching composition free from health hazard and environmental pollution, and a frosting method using the composition for a glass surface are provided.

Abstract: A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water source; (b) deionizing the water to produce deionized water; (c) adding a buffer to the deionized water at a concentration effective to eliminate fluctuations in the amount of residues on the electronic substrate. The electronic substrate is rinsed with the buffered rinsing fluid.

Abstract: A method of use for a reusable monitor wafer, having multiple crystal original pits (COP) on its surface, used for monitoring and measuring particle amounts in a chemical vapor deposition (CVD) process. First, a silicon oxide layer is formed on the surface of a monitor wafer. A first cleaning process and a thin film deposition process, forming a thin film layer on a surface of the silicon oxide layer, are then performed, respectively. Thereafter, a particle measurement process is performed to measure particle amounts on the surface of the thin film layer. After removing the thin film layer and the silicon oxide layer on the monitor wafer, respectively, a second cleaning process is performed.

Abstract: Glass bottles having undergone high-frequency heat sealing, to depress the dispersion of sealing strength as low as possible and to improve the ease of both sealing and unsealing. A rough surface having minute unevenness is formed in the proximity of the apical part of the mouth of a glass bottle, wherein the apical part contacts with a sealing material. Since (1) a contact area between the sealing material and the glass surface decreases, and the quantity of heat taken by the glass from the sealing material decreases, (2) a bond area increases; and (3) an anchor effect is generated, the sealing strength increases, and simultaneously the dispersion of the sealing strength decreases.

Abstract: An apparatus for etching a glass substrate includes a first bath containing an etchant, at least one porous panel having a plurality of jet holes in the first bath, the porous panel containing the etchant to jet the etchant against the glass substrate, a container storing the etchant, and a pump supplying the etchant from the container to the porous panel, the pump being connected to the container and the porous panel.

Abstract: A diffuser master is provided which is manufactured mechanically instead of holographically. The master can be made from a suitable substrate including relatively hard materials such as plastic, glass or metal. A substrate having a first side is worked to form a diffuser surface relief structure thereon. The substrate can be buffed using a buffing agent of a selected grit in order to form surface scratches in the first side of the substrate. The substrate can also be blasted with shot particles in order to form indentations and depressions in the first side. The substrate can alternatively be acid or alkali etched in order to form surface irregularities in the first side. The scratches, depressions or irregularities can be formed in order to create a desired surface relief and hence desired diffuser output characteristics.