Abstract: A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus 10 includes an object information input unit 12 for inputting processing object information on the object to be processed, a processing condition database 19 in which data on processing conditions corresponding to the processing object information is accumulated, a processing condition setting unit 16 for referring to the processing condition data in the database 19 and setting the processing condition for the object based on the processing object information, and a condition information output unit 13 for outputting processing condition information for the set processing condition.

Abstract: An improved method for laser machining features in brittle materials 8 such as glass is presented, wherein a tool path 10 related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses 12. Laser pulses 12 applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses 12 being applied adjacent to a previous pulse location.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: A laser device (10) includes a first laser source (102) for emitting laser beams with a first wavelength, a second laser source (104) for emitting laser beams with a second wavelength, a dichromic beamsplitter (110), and a flexible light waveguide (112). The dichromic beamsplitter is configured for transmitting laser beams emitted from the first laser source and changing a transmission direction of the laser beams emitted from the second laser source. The flexible light waveguide transmits the laser beams from the dichromic beamsplitter, and the flexible light waveguide has a light-input end (114) and a light-output end (116). The light-input end receives the laser beams from the dichromic beamsplitter, and the light-output outputs the laser beams to a workpiece. A laser system (30) using the same is also provided.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses and light illumination to a coated surface. Reflected light resulting from the light illumination impinging the coated surface is directed to a photosensitive detector and analyzer. The reflected light is either sensed directly from the coated surface by the photosensitive detector or the reflected light is directed along at least a portion of the common optics path to the photosensitive detector. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the coating removal apparatus is configured as a head component coupled to a body component.

Abstract: The invention provides a method of rapidly machining multiple, often similar or nearly identical, features using a LASER machining system. During LASER machining, light of a wavelength and intensity that will modify the workpiece to be machined is directed at the workpiece and interacts to produce the desired change. If several features are to be machined, the processing speed can be increased by operating on a multiplicity of features at once. In one embodiment of the invention, this is achieved by separating the LASER beam into multiple beams and machining the desired features simultaneously.

Abstract: Methods and apparatus for remotely measuring temperature of a specular surface. Method takes two measurements of P-polarized radiation emitted at or near Brewster angle from the surface. First measurement (SA) collects and detects first amount of radiation emitted directly from a surface portion using a collection optical system. Second measurement (SB) includes first amount of radiation and adds quantity of radiation collected at or near at/near Brewster angle and reflected from the surface with a retro optical system with a round-trip transmission t2 that retro-reflects a quantity of radiation received from surface portion back to same surface portion where it reflects and combines with first amount of radiation collected by collection optical system. Measurements SA and SB and t2 are used to determine surface emissivity (?). Calibration curve is used that relates ratio of the first measurement SA to surface emissivity (SA/?), to surface temperature.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the polishing platen. The conditioning arm is capable of moving across the polishing table to scan the pad radius, allowing the laser to traverse the pad radius.

Abstract: The invention provides a focus adjuster for laser beam machine which adjusts focus by detecting reflected light of a laser beam in a laser beam machine. A laser beam outputted from a laser oscillator device 550 is reflected by a mirror 570 via an output mirror 560 and introduced into a laser machining tool. The laser beam collected by a machining lens 62 is reflected by a reflector plate M1 and sensed by a reflection detector 580. Automatic focus adjustment is achieved by sensing output of the reflected light as well as changes in focal position due to contamination of the machining lens 62.

Abstract: A laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.

Abstract: A method for controlling the quality of an industrial process, of the type that comprises the steps of: providing one or more reference signals for the industrial process; acquiring one or more real signals that are indicative of the quality of said industrial process; and comparing said one or more reference signals with said one or more real signals in order to identify defects in said industrial process.

Abstract: The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to the top surface of the workpiece held on the chuck table, the laser beam application means comprising a processing laser beam oscillation means for oscillating a processing laser beam and a condenser for converging the processing laser beam oscillated by the processing laser beam oscillation means, wherein the laser beam processing machine further comprises a focal point position adjusting means for adjusting the position of the focal point of the processing laser beam converged by the condenser, a height position detection means for applying a detection laser beam to the workpiece through the focal point position adjusting means to detect the height position of the top surface of the workpiece based on its reflected light, and a control means for controlling the focal point position adjusting means based on the detection value of the height position detection means.

Abstract: A sequential lateral solidification device and a method of crystallizing silicon using the same controls a size and arrangement overlapping areas of laser beam patterns adjacently irradiated onto a substrate to within specific regions of a pixel area and a driving area outside the pixel area. The device includes a laser generating device irradiating a laser beam, a focusing lens focusing the laser beam, a mask having a pattern of transparent regions permitting the laser beam to be transmitted a laser beam pattern, a reduction lens reducing the laser beam pattern transmitted by the mask, a substrate having a pixel area and a driving area exposed to the irradiated laser beam pattern, a moveable stage having, on which the substrate is mounted, and a position sensor sensing an position of the irradiated laser beam pattern and controlling a size and arrangement overlapping areas between adjacently irradiated laser beam patterns.

Abstract: A first portion of a continuous material strip is indexed through a stamping press and the stamping press is cycled so as to undertake a stamping operation on a section of the material strip during each cycle. A length of the continuous strip is accumulated in an accumulator either upstream or downstream of the stamping press. A second portion of the strip is continuously fed at a non-zero speed through a laser micromachining station positioned such that the accumulator is between the stamping press and the laser micromachining station. The speed of the second portion of said strip is controlled so that this speed is constant for at least a portion of each cycle of the stamping press and so that the average speed of the first portion of said strip through the stamping press is equal to the average speed of the second portion of the strip through the laser micromachining station.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: A laser crystallization apparatus and a crystallization method with a high throughput are provided. Laser light having a predetermined light intensity distribution is irradiated to a semiconductor film to melt and crystallize, wherein a irradiation position is positioned very quickly and with a high positional accuracy, thereby forming the semiconductor film having a large crystal grain size. A laser crystallization apparatus according to one aspect of the present invention comprises a laser light source, a phase shifter modulating laser light to give a predetermined light intensity distribution, marks provided on the substrate, a substrate holding stage moving in a predetermined direction, mark measuring means measuring a time at which the mark passes a predetermined position, and signal generating means generating a trigger signal indicating the irradiation of the laser light based on the measured time.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A manufacturing system is disclosed. The manufacturing system may have a mount configured to hold a workpiece, a laser source configured to generate a laser beam directed toward a first side of the workpiece, and a sensor located on a second side of the workpiece. The sensor may be configured to sense a characteristic of the laser beam during penetration of the workpiece and to generate a signal in response thereto. The manufacturing system may also have a controller in communication with the laser source and the sensor. The controller may be configured to adjust parameters of the laser beam during penetration of the workpiece based on the signal.

Abstract: A method selectively processes structures on a workpiece with laser pulses. The structures are arranged in a linear pattern having approximately equal pitch. The pulses propagate along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method fires a first processing pulse when the spot coincides with a first structure location, selectively blocks or clears the propagation path during the first pulse, moves the workpiece and the spot relative to one another such that the spot moves toward a second structure location at a speed less than the product of the laser's PRF and the pitch, fires a dummy pulse before the spot reaches the second structure location, blocks the propagation path during the dummy laser pulse, fires another processing pulse when the beam spot coincides with the second structure location, and selectively blocks or clears the propagation path during the second processing pulse.

Abstract: A laser processing machine includes a measuring cell into which gas to be analyzed can flow, a means for decoupling diagnostic radiation from the laser radiation provided for material processing of a workpiece, and a sound detector for detecting the photo-acoustical effect produced in the measuring cell due to absorption of the diagnostic radiation by gas in the cell.

Abstract: In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.

Abstract: A laser anneal apparatus is provided with a laser source; a homogenizing optical system disposed in an optical path of laser light emitted from the laser source to homogenize an intensity distribution of the laser light in a section which is perpendicular to the optical path; a phase shifter disposed in the optical path of the laser light passed through the homogenizing optical system to produce an intensity distribution pattern of the laser light in the section which is perpendicular to the optical path; a photoreceptor device disposed in the optical path of the laser light passed through the phase shifter to intercept a part of the laser light and to measure a quantity of the intercepted laser light; and an image-forming optical system disposed in the optical path of the laser light passed through the photoreceptor device to focus the laser light on a substrate to be treated.

Abstract: A laser beam emitted from a laser oscillator unit passes through a first substrate and irradiates a sealing member. The sealing member irradiated with the laser beam is heated in accordance with the absorptance and thus softens and melts. The laser beam is reflected by the sealing member and the reflection reaches a detector unit. A computing unit transmits information, such as a correction value of the laser power, to a laser controlling unit on the basis of the information from the detector unit so that the melting state of the surface of the sealing member is kept constant. In this manner, the melting state of the sealing material can be maintained in an appropriate state.

Abstract: A method for producing, by a laser that scans the rear side of a transparent object, figures and text that are recessed in the transparent material and that as seen from the outside (5) appear as a raised relief (1) and for which the effect of depth (d, d?) depends on the amplitude of a signal superposed the input, frequency-controlled laser power by which the screen pattern is obtained. By an optimal fineness of scanning relative the material of the sign, the figures may obtain a very strong luminescence even at a very low input edge-illumination power. Furthermore, the invention relates to an edge-illuminated electric sign (L1, L2) with a figure produced by the manufacturing method according to the invention. Furthermore, the invention relates to a mounting system in the form of two interacting molding strips (3, 4) for mounting one or more electric signs (L1, L2) manufactured according to the invention.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: A light beam is used to cut a slot in a first side of substrate. An optical sensor monitors a surface of a second side of the substrate that is opposite the first side while cutting the slot. If the light beam breaks through the surface of the second side, the sensor detects the light beam.

Abstract: A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.

Abstract: A battery having a bundle of electrodes and separator which is made by winding a positive-electrode plate and a negative-electrode plate together with a separator therebetween, one of the positive- and negative-electrode plates being electrically connected to a power collecting body, the power collecting body being provided in and welded to an outer package can, wherein a welding portion of the outer package can and the power collecting body comprises a first layer and a second layer which are stacked in a thickness direction of the outer package can at the welding portion, and the second layer is in contact with a surface of the first layer and includes crystal grains that are minuter than crystal grains included in the first layer.

Abstract: An apparatus for controlling a machining system is provided. The apparatus include an optical unit configured to capture an image of an object based upon radiation generated from the object and an image processing unit configured to process the image and to obtain real-time estimation of parameters associated with manufacture or repair of the object. The apparatus also includes a process model configured to establish target values for the parameters associated with the manufacture or repair of the object based upon process parameters for the machining system and a controller configured to control the process parameters for the machining system based upon the estimated and target values of the parameters associated with the manufacture or repair of the object.

Abstract: Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

Abstract: A laser condensing optical system of the present invention includes a laser beam source which emits a laser beam, a condensing optical system arranged between the laser beam source and a medium, the condensing optical system condensing the laser beam in the medium and recondensing light from a condensing point, a photodetector which detects the light recondensed by the condensing optical system, and a laser divergence point moving unit which moves the position of a laser divergence point of the laser beam along an optical axis of the laser beam in accordance with the refractive index of the medium in which the laser beam is condensed and the distance from a surface of the medium to a condensing position.

Abstract: A system for thermal processing of a substrate includes a source of radiation, optics disposed between the source and the substrate to receive light from the source of radiation at the optics proximate end, and a housing holding the optics and having a void inside the housing isolated from light emitted from the source. A light detector is disposed within the void in the housing to detect light from the optics emitted into the housing and send a deterioration signal. The system further includes a power supply for the source of radiation, and a controller to control the power supply based on the deterioration signal from the light detector.

Abstract: A thermal processing system includes a source of laser radiation having an array of lasers emitting light at a laser wavelength, a substrate support, optics disposed between said source and said substrate support for forming a line beam in a substrate plane of the substrate support from the light emitted by the source of laser radiation, and scanning apparatus for effecting movement of said line beam relative to said substrate support in a direction transverse to the longitudinal axis of said line beam. The system further includes a housing encompassing said optics, a light detector disposed inside said housing for sensing an ambient light level, a power supply coupled to the source of laser radiation, and a controller governing said power supply and responsive to said light detector for interrupting said power supply upon an increase in the output of said light detector above a threshold ambient level.

Abstract: A method for controlling a robot during an interpolation of a trajectory or motion to any prescribed position, comprises the steps of a) ignoring at least one of the three originally prescribed or interpolated tool center point orientation values; b) finding new tool center point orientation values that place the wrist center point of the robot closest to its base while c) maintaining the originally prescribed or interpolated tool center point location values and d) maintaining the original prescribed or interpolated tool center point orientation values not ignored. Said method can preferably be used for carrying a load with a plurality of robots. Its main advantage is an increase of the available working volume.

Abstract: The invention relates to a method for combined laser-arc welding and to a device for combined laser-arc welding, comprising a laser unit for producing a laser beam, a welding torch for producing an arc, a supply unit for the laser unit and a supply unit for the welding torch. In order to optimize the energy balance and to adapt the combined laser-arc welding process to the respective conditions, a device is provided for controlling the laser unit according to the welding torch. The laser output is adapted to the arc output and is controlled by means of a closed control circuit.

Abstract: Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor.

Abstract: Processing food with a laser. In one embodiment, the system includes a laser that creates holes in a food item with an output beam, and includes a post processing module that enables a substance to pass through the holes. The substance may include a flavoring, a vitamin, a medicine, a gas, steam, and the like. The holes facilitate cooking, cleaning, flavorizing, medicating, off-gassing, eating, or the like. The laser system may also perforate or score a food item shell to ease cracking and access to interior material. The system may also include one or more mirrors, focus heads, delivery optics, beam scanners, or the like, to control output beam characteristics, such as focus and positioning. In another embodiment, a dynamic control system may add computerized-feedback and control to the laser system. A position system may also control a position, orientation, or other characteristic of a food target.

Abstract: A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: An operation control unit of a reception system includes a visitor ID information DB for storing therein visitor comparison information and visitor ID information including a phone number of a receiver of a visitor; an identifying unit for identifying the visitor when visitor information obtained by a camera or the like of the robot is identical to the visitor comparison information; a phone calling module for calling the phone number of a mobile terminal of the receiver via a phone network, when the visitor is identified; an informing content determining unit for determining an informing content to the receiver based on the visitor ID information, when the visitor is identified; and a speech generating part for converting the received information into a voice. The informing content is sent to the mobile terminal of the receiver via the phone network.

Abstract: When braking of a motion of a part of a first robot is assumed to be started at points in time, a first stop position of the first robot part is estimated at each point in time. When braking of a motion of a part of a second robot is assumed to be started at the points in time, an estimated second stop position of the second robot part is obtained at each point in time. When it is determined that the first stop position of the first robot part at one of the points in time and either the actual position or the second stop position of the second robot part for each interval at the one of the points in time are contained in the shared workspace, the first robot part is braked.

Abstract: Disclosed a laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.

Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.

Abstract: Systems and methods for stabilizing a CO2 laser are disclosed. The system includes a detector unit for measuring the power in a select portion of the output beam. The detector unit generates an electrical signal corresponding to the measured power. The modulation frequency of the signal used to modulate the relatively high-frequency radio-frequency (RF) pump signal is filtered from the electrical signal. The filtered electrical signal is then compared to a desired value for the output power in the output beam. Based on the comparison, a modulation control signal for modulating the RF pump signal is formed. The modulation control signal has a varying duty cycle that varies the amount of laser pump power to reduce or eliminate the measured variations in the output beam power. The result is an output beam power that remains stable over time.

Abstract: A method and an apparatus for laser marking indicia in the volume of gemstones such as diamonds, the indicia being made up of a plurality of microscopic dot-shaped marks whose build-up can be initiated by exposing naturally-occurring internal defects or impurities in the volume of a gemstone to a tightly focused train of laser pulses. Authentication data is encoded in the gemstone from the relative spatial arrangement of the dot-shaped marks that form the indicium. Taking advantage of the presence of otherwise invisible defects in the gemstone allows for inscribing indicia with laser pulses carrying energies substantially lower than the threshold energy required for inscribing in the volume of a perfect gemstone material. The marking process is then much less susceptible to inflict damages to the surface of the gemstone, and the marking can be performed using a broad variety of femtosecond laser systems.

Abstract: A hybrid compact sensing apparatus for generating signals usable for guiding a process robot as a function of an object detected in a scene. The apparatus comprises a laser light generator, two optical sensors, one or more ultrasound sensors, and a control unit, all integrated in a same housing. The laser light generator and the optical sensors form a detection arrangement having a limited detection range compared to that of the ultrasound sensors. The control unit has a processing circuit monitoring the distance of the object measured by the ultrasound sensors, and triggering on the laser light generator and triggering use of the depth profile signals produced by the optical sensors among the signals usable for guiding the process robot when the distance measured by the ultrasound sensors falls within the limited detection range. Integration of an audio and video sensing unit to the apparatus enables remote monitoring.

Abstract: A method and system for monitoring laser shock peening of a work piece. A line spectrum is obtained from radiation emitted by a plasma produced by a laser shock peening process. The shape of the line spectrum about its emission peak is compared to a defined line shape to verify proper operation of the laser shock peening process. The line shape may be a Lorentzian line shape corresponding to a desired line shape. The line shape may a Gaussian line shape corresponding to an undesired line shape. The system can also detect the failure mode that occurs when the opaque layer is broken through by detecting the plasma spectral component produced by the work piece material, along with the plasma produced by the opaque layer.

Abstract: A light beam is used to cut a slot in a first side of substrate. An optical sensor monitors a surface of a second side of the substrate that is opposite the first side while cutting the slot. If the light beam breaks through the surface of the second side, the sensor detects the light beam.