Abstract: A laser apparatus (100) for performing the laser machining operation by condensing the laser light output from a laser oscillator (3) is disclosed. A laser output value calculation unit calculates a laser output value (L1) based on a command value (L0) issued to a laser oscillator (2). A temperature change estimating unit (31) estimates the temperature change or the temperature (Te) of specified component element(s) (7a, 7b) of the laser apparatus based on the elapsed time (t) and the laser output value calculated by the laser output value calculation unit. An adjusting unit (32) adjusts the conditions for controlling the laser or the conditions for laser machining based on the temperature change or the temperature of the specified component element estimated by the temperature change estimating unit. A stable laser machining operation is performed without a temperature sensor. The laser output value (L1) may be measured by a laser power sensor (5).

Abstract: A laser processing method for cutting, by laser beam, a cutting path (A0) of a workpiece having a corner (B) between a first cutting path (A1) and a second cutting path (A2) is provided. The workpiece is cut under the first cutting conditions (X) from the first cutting path to the corner, and under the second cutting conditions smaller in cutting ability than the first cutting conditions for a predetermined section (A21) on the second cutting path from the corner. The workpiece is cut under the first cutting conditions on the second cutting path after finished the predetermined section. The cutting conditions are continuously changed at the time of switching from the first cutting conditions to the second cutting conditions and/or from the second cutting conditions to the first cutting conditions. In this way, a processing defect is prevented while suppressing the delay of the cutting time at the time of cutting along the cutting path including the corner.

Abstract: A method and system increase the quality of results achieved by laser micromachining systems. Data relating to parameters controlling laser micromachining process are recorded during the micromachining process, identified by the feature associated with the parameters used to micromachine, and stored on the system. The stored data can be either retrieved during the micromachining process to enable real time control or retrieved after workpiece processing to conduct statistical process control.

Abstract: Methods and systems operate a machine having a laser characterized by a PRF (pulse repetition frequency) parameter that specifies a PRF at which pulses produced by the laser have desirable pulse properties for irradiating structures on or within a workpiece. The structures are arranged on the workpiece in a linear pattern having an approximately equal pitch between adjacent structures. The laser emits a laser pulse that propagates along a laser beam propagation path terminating at a laser beam spot on the workpiece. The method is effective to move the laser beam spot across the structures along the linear pattern at a speed greater than the product of the PRF and the pitch to selectively irradiate selected ones of the structures with the laser without substantially degrading the desirable pulse properties.

Abstract: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

Abstract: In a first embodiment a spark plug satisfying the relations: t?0.3 mm and St/Sw?7 in which t is the axial-direction shortest distance between a leading end surface 41a of a precious metal tip 41 and a joint portion 43, St is the surface area of the precious metal tip 41 and a joint portion 43 between the precious metal tip 41 and the ground electrode body 4a, and Sw is the area of the joint portion 43 between the ground electrode body 4a and the precious metal tip 41. In a second embodiment, the spark plug satisfies the relations t?0.3 mm and La>Lb; and in a third embodiment the spark plug satisfies the relations t>T and La>Lb, where T, La and Lb are as defined in the specification. The relation t?0.3 mm is specific to the first and second embodiments, and the relation St/Sw?7 is specific to the first embodiment only.

Abstract: A laser beam processing apparatus includes a laser oscillator for producing a laser beam for processing a processing object, a focus head for focusing the laser beam output from the laser oscillator onto the processing object, a photo detector for detecting light emanating from the processing object in response to irradiation with the laser beam and a reference light generated from a reference light generating unit via a nozzle attached to the focus head, a correlation adjusting unit for adjusting correlation between the light detected during the processing and processing state of the processing object from the reference light detected by the photo detector, and a control unit for controlling the laser oscillator by monitoring the processing situation of the processing object from the light detected during the processing and that is adjusted by the correlation adjusting unit.

Abstract: In a master oscillator power amplifier, a driver (208) of a diode laser (202) is specially controlled to generate a set of two or more injection laser pulses that are injected into a power amplifier (204) operated in an unsaturated state to generate a set (50) of laser pulses (52) that replicate the temporal power profile of the injection laser pulses to remove a conductive link (22) and/or its overlying passivation layer (44) in a memory or other IC chip. Each set (50) includes at least one specially tailored pulse (52) and/or two or more pulses (50) having different temporal power profiles. The duration of the set (50) is short enough to be treated as a single “pulse” by conventional positioning systems (380) to perform on-the-fly link removal without stopping.

Abstract: The invention pertains to a large format, plotter-style automated laser engraver which can be used to engrave various materials. A cabinet body supports a substantially flat work surface which can be raised or lowered as desired. A gantry assembly is mounted in close proximity to such work surface, and facilitates movement of a focused laser assembly to any x/y coordinate along the work surface. A computer controlled wireless focus mechanism is used to regulate the vertical distance between the focused laser assembly and the work surface. Air is provided to cool the work surface during the engraving process.

Abstract: A laser-working method is disclosed, which includes the steps of splitting a single pulse laser beam having a time width of not more than 500 picoseconds into plural pulse laser beams; subjecting said plural pulse laser beams to time delaying, and adjusting a working surface-irradiating shape, an intensity distribution and a working surface-irradiating position of each of the plural pulse laser beams; working a target object to be irradiated, while the respective working surface-irradiating shapes of said plural laser beams are partially or entirely spatially overlapped with each other or one another; and setting to a time interval of from a pulse width to 1 nanosecond a time period during which each of the pulse laser beams is irradiated.

Abstract: When a working condition is set, if an operator sets the working condition, a control device (1) obtains an expected load factor of a laser oscillator (2) based on the set working condition, and displays the load factor as a working condition check bar (8) on a display device (3). The operator adjusts the working condition so that a load factor of the laser oscillator (2) stays within a predetermined range while watching the working condition check bar (8) and determines an appropriate working condition. Therefore, it is possible to prevent excessive load from being applied to the laser oscillator (2) at the time of actual working.

Abstract: Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.

Abstract: A first electrode part in a rod shape is placed on an upper side, and a second electrode part in a rod shape having a higher melting point than that of the first electrode part is placed on a lower side, so that ends of the first and second electrode parts are brought into contact. Contact ends or vicinities thereof are irradiated with a laser beam, so that the electrode parts are welded. Here, a region irradiated with the laser beam is in a long narrow shape having a minor axis directed in a vertical direction and a major axis directed in a horizontal direction. This makes it possible to manufacture an electrode with a consistent high quality with a high yield.

Abstract: A laser machining apparatus capable of changing a laser output condition at a desired machining position and time without regard to interpolation period (ITP). When the remaining motion command amount in the former of successive blocks, used for the interpolation period Q0 between these blocks, is less than a motion command amount corresponding to a command speed in the ITP, such deficiency is supplemented by a motion command for the latter block, thus maintaining a moving speed unchanged. The laser output condition is changed between the blocks. In an ITP Q?1, a CNC sets the time period and the laser output condition in laser output control signal generating unit which changes the laser output condition when the time period has elapsed from the start of the ITP Q0, making it possible to change the laser output condition at an arbitrary time without being limited by the ITP.

Abstract: It is disclosed a method for fabricating, modifying or repairing of single crystal or directionally solidified articles. Two single crystal or directionally solidified prefabricated parts are joint by isothermally brazing using a brazing material. After that an epitaxial or non-epitaxial layer on the surface of the created article and of the braze joint is applied using a laser metal forming process.

Abstract: Wafer level techniques for marking the back surfaces of integrated circuit devices are described. The back surface of the wafer is laser marked while being supported by a mount tape. In some embodiments, the mount tape is sufficiently transparent that the laser light passes through the mount tape and marks the back surface of the wafer. In other embodiments, the laser may actually burn the mounting tape (or portions thereof) during the marking process. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.

Abstract: A real time method for quality control testing of a laser shock peening process of production workpieces by analysis of natural frequency shifts during the laser shock peening process. One particular embodiment includes laser shock peening surface of the production workpiece by firing a plurality of laser beam pulses on the surface and forming a plurality of corresponding plasmas, each one of the plasmas pulses having a duration in which the plasma causes a region having deep compressive residual stresses to form beneath the surface, measuring at least one natural frequency of the workpiece for each of the laser beam pulses, calculating natural frequency shifts from a baseline natural frequency for the measured natural frequencies for at least a portion of the laser beam pulses, and using the natural frequency shifts for accepting or rejecting the workpiece with respect to pass or fail criteria.

Abstract: In a laser welding method, occurrence of weld defects is effectively prevented, and a high-quality weld joint is provided, and in addition, a wide range of material processes including a laser-using de p-penetration welding technique can be implemented. In keyhole welding using a laser performing output pulse modulation, the welding is conducted in accordance with a frequency conforming to a natural frequency of a metal molten pool.

Abstract: A method of controlling a robot (32) includes the steps of selecting an initial configuration from at least one of a first, second, and third sets to position a TCP at a starting point (44) along a path (33) and selecting a final configuration different than the initial configuration to position the TCP at an ending point (46). Next, the TCP moves from the starting point (44) while maintaining the initial configuration, approaches the singularity between a first point (48) and a second point (50), and selects one of the axes in response to reaching the first point (48). The angle for the selected axis is interpolated from the first point (48) to the second point (50). After the interpolation, the angles about the remaining axes are determined and positions the arms in the final configuration when the TCP reaches the second point (50) and moves to the ending point (46) while maintaining the final configuration.

Abstract: Pulse-position synchronized deposition of a material in miniature structure manufacturing processes is carried out in a fabrication tool including a material carrier element, a source of energy generating pulses of energy, a substrate, and a control unit operatively coupled to the source of energy, substrate, and the material carrier element. The control unit exposes a first area of the material carrier element to a first pulse of energy, pauses the exposure while initiating relative motion between the source of energy and the substrate at a predetermined first speed and relative motion between the material carrier element and the energy source at a predetermined second speed which is a function of the first speed, and slowing (or stopping) relative motion between the energy source, material carrier element, and the substrate, while exposing the unablated area of the material carrier element adjacent to previously ablated area to a second pulse of energy.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: The invention relates to a method of producing a welding seam with a single laser pulse, the laser pulse and the work piece being moved relative to each other at a high velocity. This results in the length of the welding seam formed being primarily the product of pulse duration of the laser pulse and the relative velocity of work piece and laser pulse. The invention also relates to a method in which the work piece moved at high velocity relative to the laser beam is subjected along the welding seam to be formed to repeated applications of a single laser pulse. In that case the length of the welding seam is defined principally of the product of pulse duration of the laser pulse and the relative velocity of the work piece and laser pulse divided by the number of applications.

Abstract: The present invention relates to a laser processing apparatus for plasma-induced ablation having a laser light source for generating a processing laser beam, a focussing means for focussing the processing laser beam and an optical detection device for detecting the plasma radiation generated during an ablation, in which case the laser processing apparatus comprises an evaluation and/or control unit, the optical detection device being designed in such a way that it can output to the evaluation and/or control unit a signal dependent on the intensity of the detected plasma radiation, and the laser processing apparatus is designed in such a way that it can automatically be switched from a processing mode into a quiescent mode and/or from the quiescent mode into the processing mode, in a manner dependent on said signal.

Abstract: The invention relates to a laser spot welding process for executing a spot weld in two successive steps, namely a first step of preparing the surface state of the material to be welded and a second step of welding as such. The luminous energy (BR) reflected by the weld region of the material is measured in real time during the first step and then processed by a controller circuit (37) connected to a control circuit (30) of the laser source (31). In this way, the characteristics (LM) of the laser beam are adjusted in real time as a function of the measurements effected to allow effective control of the quality of the weld obtained, and in particular of its dimensions.

Abstract: A laser machining apparatus capable of effecting a feedback control of a laser output from an early stage of operation and detecting an abnormality of the laser output quickly and precisely. A laser output command issued from a laser output commanding section is subjected to a feedback control and inputted to a laser pumping power supply for a laser oscillator. An output of a laser power sensor is amplified by an amplifier and compared with an output of a measurement simulating section for estimating the measured value of the laser output. A difference of the measured value and the simulated value of the laser output is inputted to the feedback control section and also to an output abnormality detecting section. A measurement input estimating section calculates an average power which should be outputted in a normal condition of the laser machining based on data of the laser output command. A fist order delay system can be adopted as the measurement simulating section.

Abstract: A method for processing workpieces by means of high-energy radiation, wherein the radiation is focused by a processing optic onto a processing site. The light radiation emanating form the workpiece is received by the same processing optic and is analyzed by a detector. An optical measurement with respect to the surface of the workpiece is performed in a processing area of the workpiece by means of an external source of measuring light, utilizing measuring light reflected from the processing area. The same processing optic is used to focus radiation onto the processing site and to receive radiation emanating from the workpiece at the processing site.

Abstract: The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: A method and a device for the longitudinal welding of profiles (2,5, 13) is provided in which a profile (13) that is to be provided with a weld seam (22, 23) is guided through a welding device (1), and in the welding device (1) a welding head (14, 15) produces a weld point (20, 21) on the profile (13), in order to manufacture a weld seam (22, 23). The profile movement is braked at selectable intervals from an essentially constant production speed down to the point at which the profile (13) is at a standstill, and is subsequently accelerated back to the production speed, while the application of welding energy to the profile (13) is switched off below a threshold transport speed.

Abstract: An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.

Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.

Abstract: An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser having a first wavelength for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a fiber amplifier subsystem for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.

Abstract: A system and method for aligning a microfilter in an optical circuit and thereby providing sub-beam impingement intensity control from a set of highly proximate sub-beams generated from a parallel process laser system removing a portion from a workpiece (exit holes in inkjet nozzle plates). The energy of laser-generated sub-beams to the target (cutting) point is attenuated to a level sufficient for maintaining operation of a charge-coupled-device camera below saturation when the sub-beams are incident on the camera, the CCD camera monitors the sub-beams and directs output to either a monitor or control computer. The microfilter is then adjusted to provide an optimal sub-beam pattern.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 &mgr;m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.

Abstract: A method for manufacturing a liquid-discharging recording head can prevent deviation in the dimensions and the pitch of grooves, serving as liquid channels, and holes, serving as discharging ports, and generation of burrs around discharging ports while maintaining the grooves and the holes to desired sizes and without increasing a time required for the processing when forming the grooves and the holes by projecting a laser beam. When performing ablation processing of the liquid-channel grooves or the discharging ports in a top-plate blank by projecting the laser beam, the processing is performed by changing the energy density per unit time of the laser beam continuously or stepwise by adjusting the oscillation voltage or the oscillation frequency of the laser beam, attenuating the laser beam, or moving a substance to be processed along the optical axis.

Abstract: A laser machining apparatus capable of effecting a feedback control of a laser output from an early stage of operation and detecting an abnormality of the laser output quickly and precisely. A laser output command issued from a laser output commanding section is subjected to a feedback control and inputted to a laser pumping power supply for a laser oscillator. An output of a laser power sensor is amplified by an amplifier and compared with an output of a measurement simulating section for estimating the measured value of the laser output. A difference of the measured value and the simulated value of the laser output is inputted to the feedback control section and also to an output abnormality detecting section. A measurement input estimating section calculates an average power which should be outputted in a normal condition of the laser machining based on data of the laser output command. A fist order delay system can be adopted as the measurement simulating section.

Abstract: The present invention relates to a laser processing apparatus for plasma-induced ablation having a laser light source for generating a processing laser beam, a focussing means for focussing the processing laser beam and an optical detection device for detecting the plasma radiation generated during an ablation, in which case the laser processing apparatus comprises an evaluation and/or control unit, the optical detection device being designed in such a way that it can output to the evaluation and/or control unit a signal dependent on the intensity of the detected plasma radiation, and the laser processing apparatus is designed in such a way that it can automatically be switched from a processing mode into a quiescent mode and/or from the quiescent mode into the processing mode, in a manner dependent on said signal.

Abstract: A marking device for the creation of an optical mark onto an object has a laser connected to a power supply unit to create a laser beam and a speed acquisition device for determining a positioning speed at which the laser beam follows a repetitive pattern upon the object. The power supply unit has a controlling unit connected to the speed acquisition device which controls the intensity of the laser beam based upon the positioning speed. When the positioning speed decreases the lower predetermined value, the laser beam power is reduced and, if the positioning speed decreases below a minimum positioning speed, the laser beam is switched off.

Abstract: A heating apparatus includes: (i) a laser providing at least one beam of light capable of heating a small area of an object; (ii) a laser driver adapted to adjust optical power of this beam of light; (iii) a photo-detector adapted to detect and measure thermal radiation from the small area; and (iv) a control loop operatively linked to the laser driver and the photo-detector, the control loop providing a signal to the laser driver to adjust optical power of the beam of light based on amount thermal radiation detected by the photo-detector. According to one embodiment of the present the laser is a CO2 laser and the small area is less than 0.25 mm in width. According to another embodiment it is a Nd: YAG laser.

Abstract: A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.

Abstract: This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs.

Abstract: When determining coordinates of a point of an object (2) in a reference system of coordinates and the orientation of the object in the space in a measuring position assumed by the object, the object is moved from a start position having known coordinates and a known orientation to a measuring position while detecting this movement. Said coordinates and the orientation of the object in the measuring position are calculated from information from this detection and about the start position. Furthermore, the acceleration and retardation of the object are measured during the movement, and the coordinates and the orientation of the object in the measuring position are calculated from information from this measurement.

Abstract: In hardening with laser beam by irradiating laser beam. 29 on a workpiece 27, oscillating the laser beam so as to heat a workpiece with a hardening width W1, laser beam output in both end portions (times (1), (5), (6), (10) of FIG. 4, for instance) of amplitude of the laser beam is made lower than one of a center portion (times (3), (4), (7), (8) of FIG. 4, for instance) of the amplitude. Relative moving velocity of the laser beam with respect to workpiece is decreased, and the quantity of giving energy of the laser beam in both end portions of the amplitude where the density of giving energy of laser beam is high is decreased so as to equalize quantity of aiming energy in the whole hardening cycle. By doing so, a proper hardening action is possible.

Abstract: A method of laser marking, suitable for the marking of hard transparent materials without causing microcracking, comprises arranging a sample of target material and a sample of markable material such that they are spaced apart; directing irradiation having an energy fluence above the ablation threshold of the target material onto the target material so that some of it is ablated and thrown onto a surface of the markable material; and subjecting the surface of the markable material to irradiation having an energy fluence below the ablation threshold of the markable material to induce an interaction between the ablated material and the surface which marks the surface with the ablated material. Different colours of mark can be obtained by using different target materials, and the tone of the mark can be controlled as desired. Apparatus for implementing the method permits control of the method in real time.

Abstract: An apparatus and method for controlling twist curvature of a disc head slider is provided, where the slider has a bearing surface, a back surface, which is opposite to the bearing surface, a longitudinal axis and a transverse axis. The apparatus obtains a measure of the twist curvature of the bearing surface and selectively alters material stresses in a working surface of the slider. The material stresses are altered asymmetrically with respect to the longitudinal axis and the transverse axis based on the measure of the twist curvature to induce a change in the twist curvature.

Abstract: A method of manipulating data in a method for forming a three-dimensional object layer by layer from an ink jettable, solidifiable material by providing data corresponding to a plurality of polygons defining the outer surfaces of a plurality of three-demiensional objects and providing sets of x, y, and z coordinates corresponding to each layer and identifying x and y coordinates with each z coordinate such that directional values and counter values are determined for each y coordinate in a first set of coordinates generated. A second set of y coordinates are generated according to a formula that permits the determined layers to be processed to form a three-dimensional object.

Abstract: The invention relates to a method of producing plastic film having a predefinable outline and/or even or uneven thickness, by machining preformed plastic film for separation and/or ablation. The method is used especially for producing flexible flaps for artificial heart valves. To produce a film having local variations in thickness and smooth edges where the piece of film has been cut, the invention provides for the plastic film to be separated and/or for specific areas to be ablated to the desired thickness by means of a laser beam.

Abstract: An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.

Abstract: The laser duty cycle in a direct metal deposition (DMD™) system is monitored and used to control another device to keep the duty cycle within a desired range. In the preferred embodiment, the duty cycle is used to control powder flowrate to keep the duty cycle between 75 to 95%. For example, the powder flowrate may be increased or decreased by stepping up or stepping down the angular velocity of the feed-rod. The duty cycle of the laser is preferably measured by sampling the output signal of the feedback device at a sufficiently high rate, at least twice as fast as the on/off switching speed of the feedback device. The sampled data is stored in a memory buffer, and an algorithm is used to calculate the duty cycle over a period of time specified by the operator. The current duty cycle is preferably displayed on the screen of the operator's computer along with the values of the periodic measurements stored in the process history database.

Abstract: A semiconductor laser heating apparatus has a measuring instrument for measuring an optical-power output relative to a current to be supplied to the semiconductor laser. The heating apparatus also has a calculator for calculating a correction coefficient of the optical-power output based on the measured data, and has a controller for correcting a supply current to the semiconductor laser relative to a value determined by an optical-power output determiner based on the calculation result. The heating apparatus employing optical fibers as an output terminal thus can always produce a desirable heating condition regardless of the optical-power output deteriorated with the lapse of time.

Abstract: The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidisation of the molding compound by ambient air.