Abstract: An optical compensation system for a laser beam and an excimer laser annealing device are provided in the present disclosure. The optical compensation system for the laser beam includes a laser source, a beam splitter and a reversion assembly. The laser beam emitted by the laser source enters the beam splitter, and is divided by the beam splitter into a first light beam and a second light beam having different transmission paths. The second light beam is reversed and reflected by the reversion assembly, enters the beam splitter, and exits from the beam splitter together with the first light beam. An asymmetry of the second light beam reversed by the reversion assembly is different from an asymmetry of the first light beam.

Abstract: Provided are an optical system capable of improving the spatial resolution of hyperspectral imaging and an optical alignment method using the same. The optical system includes a digital micromirror device (DMD) having a rectangular shape, a first cylindrical lens curved to focus and form an image on an axis corresponding to a shorter side of the DMD, and a second cylindrical lens curved in the same axial direction as the axis to collimate light reflected from the DMD.

Abstract: Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

Abstract: Systems and methods for wireless control of welding power supplies are disclosed. An example welding power supply includes: a housing comprising a control panel configured to receive inputs from an operator; power conversion circuitry configured to convert input power into output power for a welding operation; and local control circuitry configured to wirelessly receive a control signal from remote control circuitry of a portable electronic device, and to control the welding power supply based on the received control signal; wherein the local control circuitry is configured to set prioritization of control of the welding power supply between the portable electronic device and the control panel of the welding power supply, prevent the control panel from controlling a parameter of the welding power supply when the portable electronic device is prioritized, and prevent the portable electronic device from controlling the parameter when the control panel is prioritized.

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Abstract: A method for calibrating a measurement device by a target object is disclosed. Prior to calibrating the measurement device the suitability of the target object is inspected by multiple evaluation criteria. The calibration of the measurement device by the target object is only performed if the target object meets all evaluation criteria. To evaluate the target object, a camera device takes an image of the target object without using a laser beam and an image of the target object with using a laser beam, with the images then evaluated by image processing and object identification procedures.

Abstract: In one embodiment of the invention, a method to image a probe array is described that includes focusing on a plurality of fiducials on a surface of an array. The method utilizes obtaining the best z position of the fiducials and using a surface fitting algorithm to produce a surface fit profile. One or more surface non-flatness parameters can be adjusted to improve the flatness image of the array surface to be imaged.

Abstract: In one embodiment of the invention, a method to image a probe array is described that includes focusing on a plurality of fiducials on a surface of an array. The method utilizes obtaining the best z position of the fiducials and using a surface fitting algorithm to produce a surface fit profile. One or more surface non-flatness parameters can be adjusted to improve the flatness image of the array surface to be imaged.

Abstract: In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a plurality of radiation beams before the beams are coupled into an optical fiber.

Abstract: The present disclosure relates to an optical irradiation unit for a plant for producing workpieces by irradiating powder layers of a raw material powder with laser radiation, comprising optical components for guiding and focussing a beam path of a first laser beam, and an optical splitting and coupling unit for splitting the first laser beam into at least two laser sub-beams and/or for coupling a second laser beam with a wavelength differing from the wavelength of the first laser beam into the beam path of the first laser beam. The disclosure also relates to a plant for producing workpieces by irradiating powder layers of a raw material powder with laser radiation, and to an associated method.

Abstract: Cladding and remanufacturing a machine component includes directing cleaning and welding beams split from an incident laser beam toward the machine component, and moving the machine component relative the cleaning and welding beams such that the welding beam trails behind the cleaning beam along a common travel path. A surface of the machine component is decontaminated by the cleaning beam, whilst a cladding material is melted via the welding beam such that upon solidifying the cladding material forms a coating metallurgically bonded to base material and previously deposited cladding material of the machine component.

Abstract: Metal is locally heated to a predetermined temperature within a predetermined time. A laser annealing apparatus forms a line beam at a focusing position in a heatable area on a workpiece by an optical system, which has a long and narrow shape having a width of 0.5 ?m all to 20 ?m in the short direction and a long width of 6 ?m to 200 ?m in the length direction and has a depth of focus in the range of 2 ?m to 4 ?m, by using a semiconductor laser element that generates laser light, while moving a movable stage on which the workpiece has been mounted in an X direction and a Y direction; and selectively performs a heating step of performing laser annealing while controlling focusing and second laser power that has an output lower than the output of first laser power in the unheatable area on the workpiece.

Abstract: An inexpensive pulse laser device that outputs a laser pulse capable of welding a transparent member is provided. There is provided a pulse laser device including: a laser light source 1 that outputs a repeated pulse laser; a demultiplexer 2 that demultiplexes the pulse laser output from the laser light source 1 into two pulse lasers; first pulse train generation means 3 that generates a first pulse train by changing at least a peak power and/or a pulse width of one of the two pulse lasers demultiplexed by the demultiplexer 2; and a multiplexer 4 that multiplexes the other of the two pulse lasers demultiplexed by the demultiplexer 2 and the first pulse train generated by the first pulse train generation means 3, in which a pulse laser in which a low-peak power pulse laser is superimposed on a high-peak power ultra-short pulse laser is output.

Abstract: A substrate having a pattern of magnetic properties may be formed by forming a magnetically inactive layer on the substrate, forming a magnetic precursor on the magnetically inactive layer, and forming magnetically active domains separated by magnetically inactive domains in the magnetic precursor by applying thermal energy to the magnetic precursor. The thermal energy may be applied using a laser, which may be pulsed. Forming the magnetically active domains may include crystallizing portions of the magnetic precursor.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: Subject matter of the invention is a CO2 laser that permits a rapid power modulation, particularly a highly efficient Q-switching. The key concept is the sub-division of the resonator into a high-power branch, containing inter alia the active medium (1), and a low-power feedback branch (14), in which the power-sensitive beam-shaping elements, particularly the modulators, are arranged. This is made possible by a suitable arrangement of a polarisation beam splitter (5) and a ?/4-phase shifter (2). The free adjustability of an angle ? between said two components permits the extremely flexible realisation of various operating modes, particularly the optimisation of the feedback degree during pulse generation.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.

Abstract: In the case where the workpiece (1) is processed, the laser beam is S-polarized by an optical modulator (7). Thus, the laser beam is mainly diverted toward a workpiece (1) by a polarizer (6). An optical path through which the laser beam passes is caused to have a high light converging ability with respect to a target spot by an optical device (9). In the case where the workpiece (1) is not processed, the laser beam is P-polarized by the optical modulator (7). Thus, the laser beam is mainly diverted to a beam damper (10) side by the polarizer (6). However, the workpiece 1 is irradiated with the laser beam having leaked from the polarizer (6). An optical path through which the laser beam passes is caused to have a low light converging ability with respect to the target spot by the optical device (9).

Abstract: The present invention provides a laser irradiation apparatus which can accurately control positions of beam spots of laser beams emitted from laser oscillators and the distance between the adjacent beam spots. A laser irradiation apparatus of the present invention includes a first movable stage with an irradiation body provided, two or more laser oscillators emitting laser beams, a plurality of second movable stages with the laser oscillators and optical systems provided, and a means for detecting at least one alignment maker. The first stage and the second stages may move not only in one direction but also in a plurality of directions. Further, the optical systems are to shape the laser beams emitted from the laser oscillators into linear beams on the irradiation surface.

Abstract: A mask manufacturing apparatus includes a chamber, a laser beam irradiator, a stage, a cooling system, and a fan. The chamber provides an interior space therein. At least an upper wall of the chamber comprises a glass. The laser beam irradiator is disposed outside the chamber and configured to divide a laser beam into a plurality of sub-laser beams to irradiate the sub-laser beams onto a shadow mask material. The stage is disposed in the chamber and the shadow mask material is placed on the stage. The cooling system is configured cool the interior space. The fan configured to discharge heat generated in the interior space of the chamber to the outside of the chamber. Therefore, the shadow mask may be protected from overheating.

Abstract: A laser beam irradiation apparatus irradiates a laser beam onto a sealing unit disposed between a first substrate and a second substrate so as to seal the first substrate and the second substrate. A center portion of the laser beam comprises a first beam profile having a beam intensity which increases toward a beam center portion, and a center of each of a plurality of peripheral portions of the laser beam is included in an area onto which the first beam profile is irradiated. The plurality of peripheral portions are symmetrically distributed around the first beam profile, and comprise a plurality of second beam profiles having the same beam intensities. The first beam profile and the plurality of second beam profiles are symmetrically distributed around a center point of the first beam profile and move in synchronization with one another.

Abstract: A laser welding head capable of producing a plurality of beams that are proficient in providing a unique keyhole. The welding head is movable through a plurality of positions relative to substrates that enables the plurality of beams to engage the substrates in a manner that welds the substrates in a variety of stack-up positions. A welding method using the welding head is also provided.

Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.

Abstract: In order to separate a material layer from a substrate at the boundary face between the substrate and the material layer, a laser light is applied to a workpiece from the substrate side through a mask, the work having the material layer formed on the substrate. The laser beam is split into a plurality of small area laser light by the mask 44, and two or more irradiation regions are formed on the workpiece. Adjacent irradiation regions are separated from each other, and an edge part of each irradiation region and an edge part of an adjacent irradiation region, which extend in a direction parallel to the relative moving direction of the workpiece, are arranged such that the edge of the irradiation region and the edge of the adjacent irradiation region are sequentially overlapped each other as the work is moved.

Abstract: Systems for processing thin films having variable thickness are provided. A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component.

Abstract: Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device (10) includes a groove forming step of irradiating an intermediate-contact-layer separating groove (15) constituting a photoelectric conversion device (10) with a picosecond laser and of moving the picosecond laser relative to the intermediate-contact-layer separating groove (93), thereby forming a processed groove (15) in a predetermined scanning direction. In the groove forming step, interference fringes arranged in parallel in one direction are formed in an irradiated area corresponding to a beam diameter of the picosecond laser, and the picosecond laser is relatively moved such that the interference fringes are joined in the scanning direction.

Abstract: A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target.

Abstract: A laser annealing apparatus used in a crystallization process of an amorphous silicon thin film. The laser annealing apparatus includes a laser beam generation unit generating a laser beam, an optical system dividing the laser beam into a plurality of linear laser beams and including a focusing lens focusing the linear laser beams and projecting the focused linear laser beam on a substrate to be processed, and a focusing lens adjustment device adjusting a perpendicular distance and a rotation angle of the focusing lens relative to the substrate.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.

Abstract: Methods and systems for forming a scribe line in a thin film stack on an inner surface of a thin film photovoltaic superstrate are provided via the use of a cleaning laser beam and a scribing laser beam. The cleaning laser beam is focused directly onto the exposed surface of the superstrate such that the cleaning laser beam removes debris from the exposed surface of the superstrate, and the scribing laser beam is focused through the exposed surface of the superstrate and onto the thin film stack such that the scribing laser beam passes through the superstrate to form a scribe within the thin film stack on the inner surface of the superstrate. The method and system can further utilize a conveyor to transport the superstrate in a machine direction to move the superstrate past the cleaning laser source and the scribing laser source.

Abstract: There is proposed a laser machining device (10) for a laser workpiece machining operation, having a laser (14) for producing laser radiation (50), and having at least two laser tools (18, 18?), to which the laser radiation (50) can be supplied by means of an optical-fibre cable (16). According to the invention, the optical-fibre cable (16) has an input-side end (20) having at least two optical fibre cores (22, 22?) and a plurality of output-side ends (26, 26?) each having one of the optical fibre cores (22, 22?), the optical fibre cores (22, 22?) each being connected to one of the laser tools (18, 18?). A switching device (28) is preferably provided for selectively coupling the laser radiation (50) in one or more of the optical fibre cores (22, 22?) of the optical-fibre cable (16).

Abstract: Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

Abstract: Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

Abstract: An optical device includes: a beam splitter by which a laser beam emitted from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Abstract: Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.

Abstract: An processing apparatus comprises a laser oscillator, an overall control device which controls an operation of the laser oscillator, and a plurality of processing units. The processing unit comprises a holding part which movably holds a processed object, an optical system which guides the laser beam, oscillated from the laser oscillator, toward the processed object, a shutter which selectively prevents the laser beam from reaching the processed object, and an individual control device which controls an operation of the holding part, and transmits a laser request signal to the overall control device. When at least one of the plurality of individual control devices transmits the request signal, the overall control device controls the shutter of the processing unit, which has transmitted the laser request signal, to enable the laser beam to reach the processed object, and drives the laser oscillator to allow the laser oscillator to oscillate the laser beam.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.

Abstract: The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity.

Abstract: A multi-beam laser device is used to make a microretarder plate, which comprises a plurality of first retardation state areas and second retardation state areas alternating with each other. The device comprises an infrared laser, a beam splitter, and a driving means. The beam splitter is used to split the laser beam into a plurality of equal intensity parallel beams and bring the parallel beams into focus. The driving mechanism is used to drive the beam splitter in one direction, and the beam splitter will scan a plurality of parallel scan lines by the direction on a surface.

Abstract: The present invention, among other things, relates to an apparatus (10) for working a surface (11) of a workpiece, in particular a metal workpiece, by means of laser radiation. The apparatus (10) is characterized by a scanner device (20), which is mounted in a rotationally immovable manner in the working apparatus (10) and is intended for shaping a laser beam that is to be deflected and positioned onto the surface to be worked, a control device for changing the orientation of the scanning direction of the laser beam shaped in the scanner device (20), and an optics element (40), which is movable about an axis of rotation (12), is arranged downstream of the scanner device (20) in the beaming direction of the laser beam and advantageously has a beam splitter device for splitting the laser beam into two or more beam parts (41, 42) and for deflecting and positioning the beam parts (41, 42) onto the surface (11) that is to be worked.

Abstract: A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.

Abstract: A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.

Abstract: Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source.

Abstract: A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.

Abstract: A device for applying laser radiation to an at least partially reflective or transparent region or a workpiece disposed in a working area, with a laser light source for generating the laser radiation and optics for influencing the laser radiation, such that the radiation is transferred into the working area, wherein the optics comprise at least one mirror that can reflect a part of the laser radiation reflected in the working area or a part of the laser radiation having passed through the working area, such that said part of the laser radiation is at least partially fed hack into the working area.

Abstract: A laser processing apparatus for processing a multitude of portions to be processed in an area to be processed in a subject W to be processed, including a laser device, a focusing or imaging device for laser beams provided by the laser device, and an arranging device for arranging the subject W to be processed, in which the subject W to be processed and the focusing or imaging device are fixed, and the subject to be processed is processed while relatively shifting the laser beams and the focusing or imaging device so that the focusing or imaging device is irradiated from different areas in the laser beam, inside and outside the area to be processed, and that cumulative laser beam irradiation time during the processing of each of the multitude of portions to be processed is equalized.

Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.

Abstract: A laser machining system and method uses a shaped laser beam, such as a long, narrow beam, and effectively scans the beam in the narrow direction across a mask having an aperture pattern. The pattern on the mask is imaged onto a moving workpiece and the patterned laser beam selectively removes material from the workpiece. The workpiece may be moved using a coordinated synchronized rotational motion. The laser may use a longer wavelength (e.g., 248 nm) and the beam may be scanned at a high rate of speed to reduce the dissipation of the residual thermal energy in the material being machined. In one embodiment, this system and method may be used to machine a complex pattern into a curved surface with relatively high resolution and high speeds.

Abstract: A method of sealing a surface crack in a member is provided includes steps of irradiating a region of the member at which the crack is produced with a heating laser beam so as to heat the region to a temperature lower than a melting point of the member, and then irradiating a region of the member at which the crack is produced with a welding laser beam subsequent to irradiation of the heating laser beam so as to heat the region to a temperature higher than or equal to the melting point of the member, thereby sealing an opening of the surface crack of the member.