Abstract: A laser atherectomy device includes a light delivery catheter equipped with sensors for monitoring physical characteristics at a laser application site. An integrated control unit utilizing data from said sensors is provided to optimally adjust laser energy parameters and to provide for safe and efficacious ablation of the blood vessel occlusion.

Abstract: A system for separating the front and back outer glass layer from the casing/body of electronic mobile devices and for cutting mobile device screen protector sheets by way of laser burning and cutting comprises a housing, such housing containing a laser; a mirror galvanometer; a safety chamber enclosure; a metal plate with internal glass sheet; a chamber with opening and closing lid, lid button and lid sensor; a control printed circuit board with processor; a power inlet; a power supply; and an on/off switch.

Abstract: The method comprises the steps of: a) supplying building material; and b) fusing the building material using a light beam (2); wherein steps a) and b) are carried out so as to progressively produce the object out of the fused building material. In step b), the beam (2) is projected onto the building material so as to produce a primary spot on the building material, the beam being repetitively scanned in two dimensions in accordance with a first scanning pattern so as to establish an effective spot (21) on the building material, said effective spot having a two-dimensional energy distribution. The effective spot (21) is displaced in relation to the object being produced to progressively produce the object by fusing the building material.

Abstract: A method of additive manufacturing includes storing a plurality of predetermined cell processing recipes, dispensing a layer of a plurality of successive layers of feed material on a platform, receiving data describing an area of the layer of the feed material to fuse, determining a combination of a plurality of non-overlapping cells that substantially cover the area, and sequentially processing the plurality of cells. Each cell processing recipe includes scan path data indicating a path for an energy beam to follow, and different cell processing recipes having different paths for the energy beam. Each cell of the plurality of cells gets an associated cell processing recipe selected from the plurality of predetermined cell processing recipes. Each cell is processed by causing an energy beam to follow the first path for the cell processing recipe associated with the cell.

Abstract: Additive manufacturing can involve dispensing a powdered material to form a layer of a powder bed on a support surface of a build platform. A portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform.

Abstract: The present invention introduces a scanning arrangement and a method suitable for coating processes applying laser ablation. The arrangement is suited to prolonged, industrial processes. The arrangement comprises a target, which has an annular form. The laser beam direction is controlled by a rotating mirror locating along the center axis of the annular target. The scanning line will rotate circularly along the inner target surface when the mirror rotates. The focal point of the laser beams may be arranged to locate on the inner target surface to ensure a constant spot size. A ring-formed, a cylinder-shaped or a cut conical-shaped target may be used. The inner surface of the target may thus be tapered in order to control the release direction of the ablated material towards a substrate to be coated.

Abstract: Three-dimensional manufacturing method and apparatus which easily adjust individually a heating amount per unit area for each of solidified and unsolidified regions is provided. Light source and scanning unit heat with a laser beam a layer formed by a layer forming unit. In a layer forming step, a controlling unit causes the layer forming unit to form a layer of material powder. In a laser heating step, the controlling unit controls the light source and the scanning unit to alternately heat with the laser beam the solidified region obtained by fusing and solidifying the layer and the unsolidified region adjacent to the solidified region, thereby integrally fusing and solidifying the solidified region and the unsolidified region.

Abstract: The method comprises the steps of: a) supplying building material; and b) fusing the building material using a light beam (2); wherein steps a) and b) are carried out so as to progressively produce the object out of the fused building material. In step b), the beam (2) is projected onto the building material so as to produce a primary spot on the building material, the beam being repetitively scanned in two dimensions in accordance with a first scanning pattern so as to establish an effective spot (21) on the building material, said effective spot having a two-dimensional energy distribution. The effective spot (21) is displaced in relation to the object being produced to progressively produce the object by fusing the building material.

Abstract: Systems and methods for laser printing product codes on products include, in at least one aspect, a system including: a laser marking device that directs a laser beam to dwell at different locations to form marks on the products; and a controller that obtains a code to be printed, groups discrete symbols in the code with each other into separate symbol groups based on locations of the discrete symbols in the code, organizes symbol(s) in each respective symbol group into one or more stripes in a direction perpendicular to a direction of motion of the products, adds extra distance or time delay between stripes in at least one of the separate symbol groups to prevent clipping of a symbol by the laser marking device by the laser marking device's print aperture, and causes the laser marking device to direct the laser beam in accordance with the separate symbol groups.

Abstract: A laser processing method for a wafer includes: linearly forming a plurality of shield tunnels each having a fine hole and an amorphous region surrounding the fine hole at predetermined intervals in an inner part of a test substrate, the test substrate having a material and a thickness identical to those of a substrate of the wafer to be processed, while changing time intervals of a plurality of pulses constituting a burst pulse laser beam; and measuring a rupture strength when the test substrate is ruptured along the plurality of shield tunnels. Next, the time intervals of the pulses when the rupture strength is at a minimum are calculated, and a laser processing step is performed which linearly forms a plurality of shield tunnels at predetermined intervals in an inner part of the wafer, by irradiating the wafer with the laser beam having the time intervals of the pulses.

Abstract: A glue thickness inspection system automates a thickness measurement functionality for determining the thickness of both non-transparent and transparent materials including, but not limited to, glue, gel, solder and epoxy. The glue thickness inspection system includes a laser detector, a movable platform for positioning a unit under test, and a controller for controlling movement of the platform, angle of the laser detector, and calculation of the transparent material thickness. The laser detector includes a laser for emitting a laser light onto the unit under test and a sensor for receiving corresponding reflected light. The sensed data is used by the controller to determine the transparent material thickness.

Abstract: Expandable laser catheters for utilizing laser energy to remove obstructions from body passages are described. In one embodiment, the laser catheter includes a shaftway having a distal end including a flexible portion configured in a series of radial folds. Multiple optical fibers, configured to transmit laser energy, extend along the shaftway and are attached to the flexible portion. An inflatable, ring-shaped balloon is attached to the catheter within the flexible portion. In use, the catheter is inserted into a body passage such as an artery, and advanced until the distal end is adjacent to an obstruction. The balloon is inflated to expand the flexible portion and to bring the optical fibers nearer the inner wall of the body passage. Laser energy is directed by the optical fibers toward targeted regions of the obstruction, As the catheter is advanced and the process repeated, a core is formed from the obstruction and contained within the flexible portion.

Abstract: Methods of annealing a thin semiconductor wafer are disclosed. The methods allow for high-temperature annealing of one side of a thin semiconductor wafer without damaging or overheating heat-sensitive electronic device features that are either on the other side of the wafer or embedded within the wafer. The annealing is performed at a temperature below the melting point of the wafer so that no significant dopant redistribution occurs during the annealing process. The methods can be applied to activating dopants or to forming ohmic contacts.

Abstract: Methods and apparatuses are provided for improving the intensity profile of a beam image used to process a semiconductor substrate. At least one photonic beam may be generated and manipulated to form an image having an intensity profile with an extended uniform region useful for thermally processing the surface of the substrate. The image may be scanned across the surface to heat at least a portion of the substrate surface to achieve a desired temperature within a predetermined dwell time. Such processing may achieve a high efficiency due to the large proportion of energy contained in the uniform portion of the beam.

Abstract: A microscope assembly includes an illumination source coupled to an optical assembly by a coupler. The optical assembly includes an objective with optics that move along an optic axis. The illumination source generates a light blade that illuminates a portion of a sample at an illumination plane. The light blade induces a fluorescent emission from the sample that is projected through the objective optics to a detector. The focal plane of the objective optics is fixed with respect to the illumination source by the coupler so that the illumination plane is coincident with the focal plane as the objective optics move along the optic axis. The objective and illumination may be rapidly scanned along the optic axis to provide rapid three-dimensional imaging while the objective and illumination may also be rapidly scanned along the optic axis to provide rapid three-dimensional imaging.

Abstract: This disclosure discusses various methods and devices for capturing plaque that is to be removed from a blood vessel after the plaque has been separated from the blood vessel or remaining plaque.

Abstract: A laser welding device may include: a frame including a lower die supporting at least two sheets of welding objects and an upper die mounted over the lower die to be spaced apart from the lower die; a pressing plate movably mounted on the upper die in a vertical direction and pressing the welding objects; a rotating member mounted on the pressing plate and rotating based on a pressing central shaft of the pressing plate; a tilting member disposed in a direction intersecting the pressing central shaft and connected to the rotating member to be tilted in a vertical direction; and a scanner head reciprocally mounted on the tilting member along a length direction, scanning the laser beam in an X axis and a Y axis, and irradiating the laser beam to the welding object.

Abstract: In order to provide a laser irradiation system, a method for removing a coating, and a laser irradiation apparatus capable of efficiently removing a coating on a surface of a structure and recovering the removed substance using suction, a laser head (3) is configured from an optical system (4) for irradiating laser beam (30), a suctioning means (33) for suctioning removed matter (60) produced at the point where the laser beam (30) is directed, and an attachment (5) configured to be capable of abutting a surface (20) of a structure, the optical system (4) being operated to scan the irradiation point of the laser beam so as to draw a trajectory of a circle having a radius r1 around the optical axis of the laser beam (30) on a surface substantially perpendicular to the optical axis.

Abstract: A method is disclosed for crystallizing semiconductor material so that it has large grains of uniform size comprising delivering a first energy exposure of high intensity and short duration, and then delivering at least one second energy exposures of low intensity and long duration. The first energy exposure heats the substrate to a high temperature for a duration less than about 0.1 sec. The second energy exposure heats the substrate to a lower temperature for a duration greater than about 0.1 sec.

Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.

Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: A system for and method of processing an article such as a semiconductor wafer is disclosed. The wafer includes first and second surfaces which are segmented into a plurality of first and second zones. The first surface of the wafer, for example, on which devices or ICs are formed is processed by, for example, laser annealing while the second surface is heated with a backside heating source. Corresponding, or at least substantially corresponding, zones on the first and second surfaces are processed synchronously to reduce variations of post laser anneal thermal budget across the wafer.

Abstract: A system is provided for thermal processing of a semiconductor substrate including a laser configured for emitting a laser beam towards the semiconductor substrate and a scanning means configured for scanning the laser beam along a first plurality of paths on the semiconductor substrate such that the paths are spaced apart from each other by predetermined distances. Further, a method for thermal processing of a semiconductor substrate is provided including scanning a laser beam along a first plurality of paths on the semiconductor substrate such that the paths are spaced apart from each other by predetermined distances.

Abstract: A method for producing a metal or metal alloy surface or metal oxide layer or metal alloy oxide layer on the surface of a workpiece having surface structures with dimensions in the sub-micrometer range, involves scanning the entire surface of the metal or of the metal alloy or of the metal or metal alloy oxide layer on the metal or the metal alloy on which the structures are to be produced and which are accessible to laser radiation one or more times by a pulsed laser beam in such a way that adjacent flecks of light of the laser beam adjoin one another without gaps or overlap one another and a specific region of a predetermined relation between method parameters is satisfied.

Abstract: Coating removal systems for optical fibers are disclosed. Related methods and optical fibers processed with these methods and coating removal systems are also disclosed. An optical fiber includes a glass fiber, having a cladding and core, surrounded by a protective coating which does not contribute to the optical performance of the optical fiber. By removing the coating at an end portion of the optical fiber, the end portion may be precisely positioned and secured to enable reliable optical communications. A laser beam may be directed at the protective coating to remove the protective coating by one or more ablating, melting, vaporizing, and/or thermal decomposing processes. The optical fiber may also be optionally cleaved. In this manner, the coating may be efficiently removed while retaining at least fifty percent of the tensile strength of the optical fiber.

Abstract: A laser machining system (20) employs a fast positioner (68), such as a pair of galvanometer mirrors (70), that directs a beam axis (24) at a specified velocity to a start position of a cutting path (92) in coincidence with one of multiple laser pulses emitted from a laser (28) a constant laser pulse repetition rate, which runs independently of the relative position of the beam axis (24) with respect to the workpiece (26).

Abstract: This device scans a high-energy beam in a direction traversing a feed path of a grain-oriented electrical steel sheet having subjected to final annealing so as to irradiate a surface of the steel sheet being passed through with the high-energy beam to thereby perform magnetic domain refinement, the device including an irradiation mechanism for scanning the high-energy beam in a direction orthogonal to the feed direction of the steel sheet, in which the irradiation mechanism has a function of having the scanning direction of the high-energy beam oriented diagonally, relative to the orthogonal direction, toward the feed direction at an angle determined based on a sheet passing speed of the steel sheet on the feed path.

Abstract: The present disclosure relates to methods of preparing a material for welding. The material is prepared by utilizing a laser to obliterate contaminants from the material surface.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A device for irradiating a laser beam onto an amorphous silicon thin film formed on a substrate. The device includes: a stage mounting the substrate; a laser oscillator for generating a laser beam; a projection lens for focusing and guiding the laser beam onto the thin film; a reflector for reflecting the laser beam guided onto the thin film; a controller for controlling a position of the reflector; and an absorber for absorbing the laser beam reflected by the reflector.

Abstract: A system and method for precision welding using a fiber laser is disclosed in which varying intensity laser pulses are spread across the material junction in a number of high aspect ratio areas. The power density applied along each area is varied to accommodate differences in the material characteristics of each material while allowing for the creation of a more uniform weld pool alloy.

Abstract: Laser systems and methods improve the processing velocity of the routs or other features to avoid exceeding the laser system's dynamic limits. A laser processing system divides laser processing commands corresponding to a plurality of features to be processed on or in the workpiece into process segments. Laser processing parameters and beam trajectories are simulated to determine a maximum processing velocity for each of the process segments. The laser processing system selects one or more of the maximum processing velocities for processing the plurality of features on or within the workpiece. A slowest processing velocity of the maximum processing velocities may be used to process each of the plurality of features. Alternatively, each continuous rout sequence may be processed using a different processing velocity. In other embodiments, each process segment is processed using its corresponding maximum processing velocity.

Abstract: A display device is manufactured by forming a semiconductor film over a substrate and irradiating the film with laser light. The laser light is generated from an oscillator, passes through an attenuator that includes a filter, and passes through an optical system after passing through the attenuator. A first region of the semiconductor film is irradiated with the laser light passed through the optical system such that one point of the first region of the semiconductor film is irradiated with at least two shots. A second region of the semiconductor film is also irradiated with the laser light passed through the optical system such that one point of the second region of the semiconductor film is irradiated with at least two shots. The first region and the second region have a portion at which they overlap, and the semiconductor film is etched into semiconductor layers for transistors in areas outside the portion.

Abstract: The present invention provides a laser irradiation apparatus which can accurately control positions of beam spots of laser beams emitted from laser oscillators and the distance between the adjacent beam spots. A laser irradiation apparatus of the present invention includes a first movable stage with an irradiation body provided, two or more laser oscillators emitting laser beams, a plurality of second movable stages with the laser oscillators and optical systems provided, and a means for detecting at least one alignment maker. The first stage and the second stages may move not only in one direction but also in a plurality of directions. Further, the optical systems are to shape the laser beams emitted from the laser oscillators into linear beams on the irradiation surface.

Abstract: The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.

Abstract: A process for localized hardening of steel sheet components includes scanning a laser beam in a scan direction across a predetermined portion of the steel sheet component. The laser beam selectively heats material within the predetermined portion of the steel sheet component to a temperature of austenitizing transformation. During scanning of the laser beam across the predetermined portion, a source of external cooling is applied to the material within the predetermined portion and immediately behind the laser beam along the scan direction of the laser beam. The source of external cooling is selected to cool the material at a sufficiently rapid rate to form a locally hardened region that is defined substantially within the predetermined portion. Subsequent to applying the source of external cooling, the material within the predetermined portion of the steel sheet component is allowed to cool to ambient temperature.

Abstract: To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.

Abstract: A method of forming stiffened plate by welding a plurality of stiffener materials and a steel plate, so that closed cross-sectional structures are secured onto a surface of the steel plate. The stiffener materials are joined to the steel plate as a result of edge portions of the stiffener materials which are in contact with the steel plate by being laser welded at a predetermined welding speed as a result of a laser having a predetermined output being irradiated from a predetermined direction thereon from the external side of the closed cross-sectional structures. Accordingly, it is possible to achieve an improvement in the weld quality when welding stiffener materials onto a steel plate, and to achieve an improvement in fatigue strength.

Abstract: A method of processing an optical element includes providing the optical element. A surface region of the optical element includes one or more pre-cursors. The method also includes raster scanning a laser beam across the optical element. The laser beam comprises a plurality of laser pulses, each of the laser pulses being characterized by a pulse length less than 1 ns. The method further includes exposing the one or more pre-cursors to the laser beam and observing a light emission event from one of the one or more pre-cursors.

Abstract: A roll former for forming a sheet into a continuous multi-tubular reinforcement beam. The roll former includes a first set of rollers that are configured to bend the sheet to form a common center wall in generally perpendicular orientation relative to first and second lateral portions of the sheet that extend in opposing directions from respective first and second radiused ends of the common center wall. The first set of rollers also form radiused edges on the first and second lateral portions. A second set of rollers is configured to form a channel rib longitudinally along each of the first and second lateral portions. A third set of rollers is configured to bend the first and second lateral portions simultaneously and equally to abut the first and second radiused edges with the respective first and second radiused ends of the common center wall to define adjacent tubes of the beam.

Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

Abstract: An optical scanning device includes: a light projector configured to radiate light while causing the light to make angular movement at a constant speed; and a light reflector configured to reflect the light radiated from the light projector to guide the light to an intended irradiated point on a predetermined scanning line. The light reflector includes a plurality of reflecting portions and reflects, at least twice, the light radiated from the light projector to guide the light to the intended irradiated point. The reflecting portions each include a plurality of reflecting surfaces. A length of an optical path from the light projector to the irradiated point is substantially constant for all of irradiated points on the scanning line, and a scanning speed, on the scanning line, of the light radiated from the light projector is substantially constant.

Abstract: There is provided manufacturing method of a spark plug that includes a center electrode and a ground electrode with a discharge gap left therebetween. At least one of the center electrode and the ground electrode has an electrode body containing a base metal and a noble metal tip welded to the electrode body. The spark plug manufacturing method includes a laser welding step for welding the noble metal tip and the electrode body by placing the noble metal tip at a given position on the electrode body, irradiating a pulsed laser onto the noble metal tip and the electrode body and thereby sequentially forming welding spots corresponding to pulses of the laser in a circumferential direction of the noble metal tip, wherein at least one of the laser pulses is an initially increasing type laser pulse having a laser intensity waveform in which a laser intensity increases with time during a predetermined initial period from a pulse start time.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: An optical scanning device is adapted to output a light beam, and includes a base, a transmission mechanism, a rotary power source and a holder. The transmission mechanism is disposed on the base. The rotary power source is adapted to generate a rotation and mechanically connected to the transmission mechanism so as to drive the transmission mechanism to generate the rotation. The holder is disposed to the transmission mechanism and includes a first lateral section, wherein when the transmission mechanism and the holder are synchronously rotated, the first lateral section also rotates the output light beam and thus the output light beam forms a light spot having a scanning area projected on a destination.

Abstract: An apparatus for forming a pattern using a laser is provided. The apparatus includes a pattern storing unit, a controller, a laser oscillating unit, an X-Y driver, a header unit, and a stage. The pattern storing unit stores data on light guide patterns of a discontinuous straight line shape. The controller transmits position signal of the light guide patterns to the X-Y driver and simultaneously, transmits a switching signal to the laser oscillating unit. The laser oscillating unit outputs a laser beam synchronized with a movement of the header unit. The X-Y driver moves the header unit and the stage. The header unit moves along a first guide rail. The stage moves along a fixed second guide rail in the front and rear direction of the light guide panel.

Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.