Condition Responsive Patents (Class 219/121.81)
  • Patent number: 11152246
    Abstract: A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 19, 2021
    Inventor: Hideaki Tanaka
  • Patent number: 10300555
    Abstract: A laser cutting machine for cutting a workpiece having a first thickness (using a first processing laser beam having a first laser beam characteristic and a workpiece having a different second thickness using at least a second processing laser beam having a different second laser beam characteristic includes a laser source for producing a unprocessed laser beam having a laser wavelength of less than 4 ?m, a device which forms from the unprocessed laser beam the processing laser beams, and a control unit which controls the device in dependence on the thickness of the workpiece to be cut.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: May 28, 2019
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Tim Hesse, Tobias Kaiser
  • Patent number: 9387555
    Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, in particular a part of a motor vehicle, wherein a laser beam is applied to the workpiece by means of a scanner, material of the workpiece is ablated, the radiation produced by the plasma during the process in the work area and/or reflected laser radiation is detected, and a signal is generated depending on the detected plasma and/or laser radiation. In addition the invention also relates to an apparatus for the laser beam machining of a workpiece, in particular for carrying out a method according to the invention. A greater process reliability can be ensured in laser beam machining in that the position of the laser beam in relation to the workpiece and/or the ablation depth is regulated and/or controlled depending on the signal.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: July 12, 2016
    Assignee: ThyssenKrupp Steel Europe AG
    Inventors: Martin Koch, Stefan Wischmann, Erwin Blumensaat
  • Publication number: 20150144604
    Abstract: A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.
    Type: Application
    Filed: December 30, 2013
    Publication date: May 28, 2015
    Applicant: Industrial Technology Research Institute
    Inventors: Kuang-Yao HUANG, Yung-Hsing WANG, Ying-Hui YANG, Pin-Hao HU, Sung-Ho LIU
  • Publication number: 20150107033
    Abstract: The present invention relates to the automated cutting of pliable items. More particularly, the present invention relates to the automatic cutting and/or trimming of pliable items, such as a shoe upper that lacks uniformity. An image of the pliable item is captured having image features and a pattern is retrieved having pattern features, such as a proposed cut path. An image feature is compared to distance tolerances associated with pattern features to adjust the proposed cut path such that it satisfies the distance tolerances while providing a consistently sized and shaped trimmed item.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 23, 2015
    Applicant: Nike, Inc.
    Inventors: Chih-Chi Chang, Cheng-Yen Ho, Mike F. Quigley, Shu-Hui Wang
  • Patent number: 9012806
    Abstract: Provide a pulse laser processing device which facilitates stable microfabrication of the surface of a large target processing material, and an increase in the speed of microfabrication. The pulse laser processing device includes a reference clock oscillating circuit which generates a clock signal, a laser oscillator which emits a pulse laser beam synchronized with the clock signal, a laser scanner which scans a pulse laser beam only in a one-dimensional direction in synchronization with the clock signal, a stage on which the target processing material can be placed and which moves in a direction orthogonal to the one-dimensional direction, and a pulse picker which is provided on an optical path between the laser oscillator and laser scanner and which switches pass and block of the pulse laser beam in synchronization with the clock signal.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: April 21, 2015
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Makoto Hayashi
  • Publication number: 20150090702
    Abstract: Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 2, 2015
    Applicant: LG CHEM, LTD.
    Inventors: Jin Ho BAN, Chang Bum AHN, Ki Hong MIN, Ji Won PARK, Myung Hoon KO, Seung Ho NA
  • Publication number: 20150087082
    Abstract: In some embodiments, a system includes (1) a controller configured to receive information regarding substrate uniformity; (2) a processing tool configured to perform a semiconductor device manufacturing process on a substrate; and (3) a laser delivery mechanism coupled to the controller, the laser delivery mechanism configured to selectively deliver laser energy to the substrate during processing within the processing tool so as to selectively heat the substrate during processing. The controller is configured to employ the substrate uniformity information to determine a temperature profile to apply to the substrate during processing within the processing tool and to employ the laser delivery mechanism to selectively heat the substrate during processing within the processing tool based on the temperature profile. Numerous other embodiments are provided.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 26, 2015
    Inventor: Subramani Iyer
  • Publication number: 20150076126
    Abstract: A movement control system is provided for cutting and welding applications which uses a laser movement detection system to detect deflection or displacement in a guide rail movement system. A movement controller controls the movement of the cutting or welding operation based on the detected laser beam displacement.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: LINCOLN GLOBAL, INC.
    Inventors: Jonathan V. FIKES, Ryan Owens, Dionysus Damato, Dane Weiler
  • Patent number: 8952290
    Abstract: In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in working direction, it encloses a tilt angle (?) differing from 0 degrees with the longitudinal axis of the laser head. Starting therefrom, to produce the inclination of the collimated laser beam to the vertical with a very small number of optical components if possible, the invention suggests that the laser beam is supplied to the laser head by means of an optical fiber and the laser beam is collimated, passes through the deflection element laterally offset to the longitudinal axis of the laser head and is deflected by means of said element onto the workpiece surface and focused at the same time.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 10, 2015
    Assignee: Messer Cutting Systems GmbH
    Inventor: Karl Eck
  • Patent number: 8933374
    Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: January 13, 2015
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Makoto Hayashi
  • Patent number: 8907245
    Abstract: An apparatus for reducing resources for selecting seed to be produced in commercial quantities or for research is disclosed. Samples of seed which are candidates for selection are collected and given an identifier. Specific tissue or structure from candidate seed is removed. A test or analysis is performed on the candidate seed or the removed tissue or structure. Results of the test or analysis are recorded and correlated to the seed's identifier. The results are evaluated and a decision is made whether to select a candidate seed for commercial production or for research. Time, space, and labor associated with growing plants in an experimental plot or greenhouse and taking tissue samples from growing plants is saved.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: December 9, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventor: Jason Cope
  • Publication number: 20140346156
    Abstract: An adaptive mirror for a laser processing apparatus has a housing and a pressure chamber which is arranged in the housing and can be connected to a pressure source. A mirror substrate, which delimits the pressure chamber, is fixedly clamped in the housing. Depending on the internal pressure in the pressure chamber, which can be changed by means of the pressure source, the mirror substrate is deformed. The mirror substrate has a stiffness which increases towards the geometric centre at least in a region surrounding the geometric centre of the mirror substrate. By means of such a stiffness distribution, an almost spherical deformation can be achieved over a large surface of the mirror substrate despite the mirror substrate's being fixedly clamped into the housing.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 27, 2014
    Applicant: LT-Ultra Precision Technology GmbH
    Inventor: Dietmar Bischof
  • Publication number: 20140346155
    Abstract: A laser machining apparatus comprises a laser radiation source that generates laser radiation. A first and a second adaptive mirror are provided each having a pressure chamber connected to a pressure source and a mirror substrate that bounds the pressure chamber. An internal pressure in the pressure chamber can be changed with the aid of the pressure source in such a way that the mirror substrate deforms if the internal pressure in the pressure chamber changes. The mirror substrate of the first adaptive mirror has a thickness which varies at least within a region of the mirror substrate that bounds the pressure chamber. The mirror substrate of the second adaptive mirror has a thickness which is constant over the entire region over which the mirror substrate is deformable.
    Type: Application
    Filed: May 20, 2014
    Publication date: November 27, 2014
    Applicant: LT-Ultra Precision Technology GmbH
    Inventor: Marius Jurca
  • Publication number: 20140339208
    Abstract: A laser machining device includes a laser emitting device, a supporting device including a supporting surface, a controller, and optical detecting units mounted on the supporting surface. The laser machining device sets an X-Y coordinates having an original point and moves to being substantially above one of the optical detecting units. A laser beam is emitted at a plurality of microscopically-close positions and the values of the luminous flux of the received laser beams are detected, the values being sent to the controller. The controller compares the detected values to determine the greatest value, and corrects the position of the original point to accord with the position of the greatest detected value.
    Type: Application
    Filed: July 19, 2013
    Publication date: November 20, 2014
    Inventor: YUNG-LUN HUANG
  • Patent number: 8878096
    Abstract: The invention relates to a method for detecting and adjusting the focus (F) of a laser beam when laser machining workpieces, having the following steps: a.) guiding and focusing a laser beam of a machining laser (1) emitted from a machining head (48) into a machining point (26) on or with respect to the surface (49) of a workpiece to be machined, wherein the focusing takes place by means of an optical focusing element (2); b.) guiding and focusing the radiation (28, 31) emitted by at least one first adjusting light source (22) and one second adjusting light source (23) onto the surface (49) of the workpiece to be machined, wherein the wavelengths of the radiation emitted by the adjusting light sources (22, 23) are different; c.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: November 4, 2014
    Assignee: LT Ultra-Precision-Technology GmbH
    Inventor: Marius Jurca
  • Publication number: 20140312018
    Abstract: The present invention relates to a dynamic height adjusting system and method that uses capacitance for a head assembly of a laser processing system throughout a process cycle. The proposed system and method involves use of a single frequency in which a change in phase is measured and processed to determine changes in height and distance between a work piece with an increased reliability. The system further enables operative computerized processor control and substantial improvements in process control signal and feedback distribution throughout an integrated system and optional remote interfaces.
    Type: Application
    Filed: November 13, 2012
    Publication date: October 23, 2014
    Applicant: IPG Photonics Corporation
    Inventors: Walter Leslie, Peter Castagna
  • Patent number: 8866041
    Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: October 21, 2014
    Assignees: TDK Corporation, Rohm Co., Ltd, SAE Magnetics (H.K.) Ltd.
    Inventors: Koji Shimazawa, Osamu Shindo, Yoshihiro Tsuchiya, Yasuhiro Ito, Kenji Sakai
  • Patent number: 8859934
    Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: October 14, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Patent number: 8847113
    Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: September 30, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
  • Publication number: 20140259659
    Abstract: A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Electro Scientific Industries, Inc.
    Inventor: Jan Kleinert
  • Publication number: 20140263223
    Abstract: Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventor: Mark A. Unrath
  • Publication number: 20140263211
    Abstract: A display such as a liquid crystal display has a display substrate that includes a layer of liquid crystal material sandwiched between a color filter layer and a thin-film-transistor layer. An oversized polarizer is laminated to the surface of the display substrate. Laser-based polarizer trimming equipment is used to trim away excess portions of the polarizer from the display substrate. A thickness gauge gathers thickness information from the laminated polarizer and display substrate. The thickness information is used to adjust the position of a laser relative to the polarizer during polarizer trimming operations. The laser beam moves along a cutting path that is unique to the display substrate. A vision system performs an inspection to determine whether the display substrate is damaged following polarizer trimming operations. Based on the inspection, laser parameters may be adjusted prior to performing polarizer trimming operations on additional polarizers and display substrates.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 18, 2014
    Applicant: Apple Inc.
    Inventors: Mohd Fadzli A. Hassan, Nathan K. Gupta, Yu-Cheng Chen, Kuan-Ying Lin
  • Patent number: 8835797
    Abstract: The invention relates to a method and a device for the plasma treatment of metal substrates or insulating substrates (3) running substantially continuously through a vacuum chamber having a treatment zone (2), the plasma being sustained by radiofrequency inductive coupling in the treatment zone (2) by means of an inductor (4) connected to a radiofrequency generator, in which the inductor (4) is protected from any contamination by the material emitted by the surface of the substrates (3) by means of a Faraday cage (7), which is positioned between the plasma and the inductor (4), and in which the Faraday cage (7) is on average electrically biassed positively with respect to the substrates (3) or with respect to a counter-electrode present in the plasma.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: September 16, 2014
    Assignee: Advanced Galvanisation AG
    Inventor: Pierre Vandenbrande
  • Publication number: 20140251964
    Abstract: A laser assembly (12) for providing an output beam (18) includes a gain medium (16) and a laser housing (20) that retains the gain medium (16). The gain medium (16) generates the output beam (18) when electrical power is directed to the gain medium (16). The laser housing (20) includes a reference redirector (20A) that is used to a reference datum to check the alignment of the output beam (18) relative to the laser housing (20). The reference redirector (20A) can be a mirror that is integrated into the laser housing.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Inventor: Jeremy A. Rowlette
  • Publication number: 20140209584
    Abstract: A laser machining device includes a stationary platform configured for carrying a workpiece, a movable platform opposite to the stationary platform, a laser machining unit and a distance measuring unit both fixed on the movable platform. The laser machining unit machines micro-structures on the workpiece. The distance measuring unit measures a distance between the movable platform and the workpiece, and adjusts the movable platform to make sure a laser beam emitted by the laser machining unit is focused on the workpiece.
    Type: Application
    Filed: March 22, 2013
    Publication date: July 31, 2014
    Inventor: Hon Hai Precision Industry Co., Ltd.
  • Publication number: 20140175071
    Abstract: Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.
    Type: Application
    Filed: December 26, 2013
    Publication date: June 26, 2014
    Applicant: TRUMPF Laser - und Systemtechnik GmbH
    Inventors: Dieter Pfitzner, Holger Braun, Friedhelm Dorsch
  • Publication number: 20140144895
    Abstract: The present invention relates to a laser material processing system for processing a workpiece by means of a laser beam, comprising an optical system having at least one optical component for focusing the laser beam to form a focal point on the workpiece or in a defined position relative to the workpiece, at least one inertial sensor for detecting a transitional and/or rotational acceleration of the at least one optical component of the optical system and/or the workpiece, and a processing unit connected to the at least one inertial sensor for determining a relative transitional and/or rotational acceleration between the focal point and the workpiece.
    Type: Application
    Filed: May 14, 2012
    Publication date: May 29, 2014
    Inventors: Ingo Stork Genannt Wersborg, Frederik Born
  • Patent number: 8674260
    Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: March 18, 2014
    Assignee: Donadon Safety Discs and Devices S.R.L.
    Inventors: Mario Modena, Antonio Ruggero Sante Donadon
  • Publication number: 20140069897
    Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 13, 2014
    Applicant: General Lasertronics Corporation
    Inventors: James W. Thomas, Mitchell R. Wool
  • Publication number: 20140042133
    Abstract: An apparatus for focusing a laser beam on a workpiece includes at least one transmissive optical element which is arranged at a tilting angle with respect to a plane perpendicular to a beam axis of the laser beam, the transmissive optical element comprising a first side and a second side through which the laser beam passes, a spatially-resolving detector configured to detect laser radiation reflected from the transmissive optical element, and an image evaluation device coupled to the detector, the image evaluation device configured to distinguish laser radiation reflected from the first side of the optical element from laser radiation reflected from the second side of the optical element.
    Type: Application
    Filed: October 11, 2013
    Publication date: February 13, 2014
    Applicant: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventor: Juergen-Michael Weick
  • Publication number: 20140027421
    Abstract: In a method for determining the focal point or the beam profile of a laser beam, which can be deflected in the x and y directions by a scanner optic or an x-y-movement unit and can be displaced in the z direction by a focusing optic or a z-movement unit, at a plurality of measurement points in the two-dimensional working field or three-dimensional working space of the laser beam. An aperture diaphragm, followed by a detector, is arranged at each measurement point. At each measurement point, for x-y-focal point or beam profile measurements, the laser beam is moved by the scanner optic or the x-y-movement unit in an x-y-grid over the measurement aperture in the aperture diaphragm, and, at each grid point, the laser power is measured by the detector, the scanner axis of the scanner optic or the x-y-movement unit being stationary. For z-focal point measurements, the laser beam is displaced by the focusing optic or the z-movement unit in the z direction within the measurement aperture in the aperture diaphragm.
    Type: Application
    Filed: September 30, 2013
    Publication date: January 30, 2014
    Applicant: TRUMPF Laser GmbH + KG
    Inventor: Thomas Notheis
  • Patent number: 8637784
    Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When a cylindrical tubular body (2) is improved in its residual stress by locally irradiating an outer-circumferential surface of a welded portion (C) of the tubular body (2) with laser beams (5a) and by moving an irradiation area (s) in an circumferential direction, a plurality thermocouples (9) are installed on the tubular body (2) to be improved, a temperature history of the outer surface of the tubular body (2) by the irradiation of the laser beam (5a) is managed by measuring the temperature history itself.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: January 28, 2014
    Assignees: Mitsubishi Heavy Industries, Ltd., The Japan Atomic Power Company, Hokkaido Electric Power Company, Inc., Tohoku Electric Power Co., Inc, The Tokyo Electric Power Co., Inc, Chubu Electric Power Co., Inc, Hokuriku Electric Power Company, The Kansai Electric Power Co., Inc, The Chugoku Electric Power Co., Inc, Shikoku Electric Power Co., Inc, Kyushu Electric Power Co., Inc, Electric Power Development Co., Ltd
    Inventors: Takahiro Ota, Kazuhiko Kamo, Itaru Muroya, Seiji Asada, Kazuhiro Wakabayashi, Koji Okimura, Hironori Onitsuka
  • Publication number: 20140014632
    Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).
    Type: Application
    Filed: July 26, 2013
    Publication date: January 16, 2014
    Inventors: Daniel Cathry, Beat Beutler, Sven Rauschenbach
  • Publication number: 20140008340
    Abstract: There is provided a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece, the precision-machining means being equipped with a replaceable cutting tool selected from the group consisting of a planar tool, a shaper tool, a fly-cutting tool, a diamond-turning tool and a micro-milling tool; a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means; and a control means for controlling the electromagnetic-wave-machining means or the precision-machining means, based on information on the shape of the workpiece, the shape being measured by the shape-measuring means.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 9, 2014
    Inventors: Noboru URATA, Kimitake OKUGAWA, Yoshiyuki UCHINONO, Takashi SHINDO
  • Publication number: 20130334184
    Abstract: The present invention provides a rotor balance device and a method thereof. The device includes a balance measurement unit and at least one laser unit. The balance measurement unit has a correcting platen for supporting the rotor and at least one sensor. The laser unit receives a sensing signal outputted by the sensor to identify at least one position to be removed on the rotor and controls a laser beam to illuminate the position to be removed. By the inventive device and method, an improved degree of balance and reduced working hours can be obtained.
    Type: Application
    Filed: June 15, 2012
    Publication date: December 19, 2013
    Inventors: Wen-Hao Liu, Hsu-Jung Lin
  • Publication number: 20130334181
    Abstract: Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor.
    Type: Application
    Filed: July 20, 2013
    Publication date: December 19, 2013
    Inventors: Andreas Luedi, Daniel Cathry
  • Publication number: 20130299474
    Abstract: A fiber laser apparatus that generates invisible laser light using an amplification optical fiber having a single-mode core and outputs the invisible laser light via an output optical fiber is provided. The fiber laser apparatus includes a visible laser light source that generates visible laser light, an introducing section that introduces the visible laser light generated by the visible laser light source into a core of one of the amplification optical fiber and the output optical fiber, and a drive unit that drives, in a case of performing alignment of an irradiation position of the invisible laser light with respect to a workpiece, the visible laser light source and emits the visible laser light via the core of the output optical fiber.
    Type: Application
    Filed: July 17, 2013
    Publication date: November 14, 2013
    Inventors: Kosuke KASHIWAGI, Akira FUJISAKI, Yoshihiro EMORI
  • Patent number: 8525073
    Abstract: A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: September 3, 2013
    Assignee: United Technologies Corporation
    Inventors: John Patrick Quitter, Chester E. Yaworsky, Jr., Hai-Lung Tsai
  • Publication number: 20130220983
    Abstract: The invention relates to a method and a device for joining workpieces by means of a laser beam, wherein the device comprises: a scanner optics for guiding the laser beam; a press element, which, during the joining process, is pressed along a pressing direction onto at least one of the workpieces; and a housing, which houses the scanner optics and the laser beam running from the scanner optics towards the workpieces, wherein the press element forms a part of the housing and is movable relative to the rest of the housing by at least one degree of movement freedom.
    Type: Application
    Filed: October 20, 2011
    Publication date: August 29, 2013
    Inventors: Igor Haschke, Arwed Kilian
  • Patent number: 8519297
    Abstract: An apparatus for reducing resources for selecting seed to be produced in commercial quantities or for research is disclosed. Samples of seed which are candidates for selection are collected and given an identifier. Specific tissue or structure from candidate seed is removed. A test or analysis is performed on the candidate seed or the removed tissue or structure. Results of the test or analysis are recorded and correlated to the seed's identifier. The results are evaluated and a decision is made whether to select a candidate seed for commercial production or for research. Time, space, and labor associated with growing plants in an experimental plot or greenhouse and taking tissue samples from growing plants is saved.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: August 27, 2013
    Assignee: Pioneer Hi-Bred International, Inc.
    Inventor: Jason Cope
  • Publication number: 20130186871
    Abstract: A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.
    Type: Application
    Filed: July 26, 2012
    Publication date: July 25, 2013
    Inventors: Masami Suzuki, Norio Nishi, Junichi Matsumoto, Nobutaka Yoneyama, Satoshi Tokuoka, Etsushi Kato
  • Patent number: 8476553
    Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: July 2, 2013
    Assignee: Disco Corporation
    Inventors: Satoshi Usuda, Kiyoshi Ohsuga, Masaru Nakamura
  • Patent number: 8455791
    Abstract: The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: June 4, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shinobu Tamaoki, Motoki Kakui, Kazuo Nakamae
  • Patent number: 8430707
    Abstract: An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: April 30, 2013
    Assignee: Sage Electrochromics, Inc.
    Inventors: Neil L. Sbar, Harvey Kalweit
  • Patent number: 8426768
    Abstract: A method of directing a laser beam along a desired path on a workpiece and at spaced intervals delivering a pulse of laser energy comprising the steps of: using a position command stream and position feedback to control the positioning of galvanometer scanned mirror or mirrors to define the path a laser beam will travel to intersect the desired path on the workpiece; and using position feedback alone to determine when a pulse of laser energy is delivered to strike the workpiece at locations such that are uniformly overlapped along the path notwithstanding variations in galvanometer mirror velocity.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: April 23, 2013
    Assignee: Aerotech, Inc.
    Inventor: Ronald Rekowski
  • Publication number: 20130082037
    Abstract: The invention relates to a method characterized in that it comprises—a step (E1) of calibrating a device, whereby—a galvanometric head illuminates along two axes a calibration plate, situated at a depth, in order to illuminate a plurality of determined points of the calibration plate, while a camera observes said calibration plate, a control unit establishing a relationship between, on the one hand, the position of illumination of each of the illuminated points of the calibration plate at the depth, and, on the other hand, the position observed by the camera of the illuminated points; the calibration plate being successively positioned at a plurality of depths during the calibration step so as to allow a plurality of illuminations by the head, of observations by the camera and of relationships to he established by the control unit; the control unit establishes a correspondence relationship,—a step (E2) of determining the three-dimensional shape of the surface that is to be ablated, from the calibration step (
    Type: Application
    Filed: December 22, 2010
    Publication date: April 4, 2013
    Inventors: François Champonnois, Bertrand Laval
  • Publication number: 20130082038
    Abstract: A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 4, 2013
    Inventors: Toshiyuki YOSHIKAWA, Hironari OHKUBO, Noboru TAKEDA
  • Patent number: 8389893
    Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: March 5, 2013
    Assignee: Nanoscribe GmbH
    Inventors: Michael Kempe, Peter Westphal, Wolfgang Grau, Georg von Freymann
  • Patent number: 8367970
    Abstract: A method and device (1) for laser machining vehicle bodies or body parts (2) uses a laser beam (14) that is guided from a laser source (13) to a remote laser tool (15) on a robot hand by a guiding device (16). The robot (4) maintains the laser tool (15) in a suspended manner over the tool (2), at a focal length (F) and at a contact free distance and guides it along a machining path (30). The laser beam (14) is deviated, by movement of the hand axis (IV, V, VI), about a variable deviation angle (?), and the laser source (13), whose power is variable, is controlled according to the movement of the laser beam. The beam deviation of the hand axis (IV, V, VI) can be superimposed on an offset movement of the robot (4).
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: February 5, 2013
    Assignee: Kuka Systems GmbH
    Inventors: Peter Rippl, Johann Hesse, Anton Englhard