Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Abstract: A welding system is provided. The welding system includes a low power transceiver configured to be coupled to a weld cable. The low power transceiver includes a low power transmitter, a low power receiver, and a first processor. The low power receiver is configured to transmit one or more unmodulated tones through the weld cable to a welding power supply. The low power receiver is configured to receive the one or more unmodulated tones through the weld cable from the welding power supply. The first processor is configured to determine one or more channel equalization filter coefficients related to the weld cable corresponding to a distortive characteristic of the weld cable.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

Abstract: Magnetic sensor assembly (1) having a magnetic sensor (2) with a main sensor surface (2a) and four side surfaces (2b), and a lead frame (3) having a main lead frame surface (3a). The magnetic sensor (2) is positioned onto the lead frame (3) with one of the four side surfaces (2b), and the main sensor surface (2a) is oriented perpendicular to the main lead frame surface (3a). The magnetic sensor (2) has a first plurality of contact pads (4), the lead frame (3) a second plurality of external bond pads (5). The first plurality of contact pads (4) are connected to a subgroup of the second plurality of external bond pads (5) by a conductive glue (6).

Abstract: A magnetic flaw detection method includes a magnetization step (S2) of moving a magnet (21) in a predetermined direction (D) along a surface of an object (7) that is a magnetic body and subsequently removing the magnet (21) from the surface of the object (7) to magnetize a region (R) corresponding to a movement range of the magnet (21) on the object (7), a sensor arrangement step (S3) of arranging a magnetic sensor (35a) to be capable of measuring magnetic flux leakage (8) generated from an abnormal portion (72) of the region (R) that was magnetized in the object (7), and a detection step (S4) of detecting an abnormality in the region (R) with the magnetic sensor (35a) arranged by the sensor arrangement step (S3).

Abstract: An underactuated joining system for a moving assembly line includes a robot with actuated joints, an articulated compliance mechanism, and a controller. An end-effector of the mechanism is connected to linkages and to a joining tool, unactuated joints interconnect the linkages, and position sensors measure joint positions of the unactuated joints. In response to the joint positions, a controller regulates a position of the actuated joints to cause the compliance mechanism to compliantly follow the assembly line. This occurs while the tool remains engaged with a workpiece being transported along the assembly line. A method includes engaging the tool with the workpiece as the workpiece is transported by the assembly line, measuring joint positions of the unactuated joints using position sensors, and controlling a position of the active joints to cause the compliance mechanism to compliantly follow the workpiece along the assembly line.

Abstract: A method for joining metallic well tubulars to be lowered into a wellbore (4) comprises the steps of: a) providing a first well tubular (6) having an upper end surface (6a), and a second well tubular (7) having a lower end surface (7a); b) lowering the first well tubular (6) into the wellbore (4), leaving the upper end thereof outside the wellbore (4); c) setting the second well tubular (7) in an axially aligned position on the first well tubular (6), with the lower end surface (7a) of the second well tubular (7) set against the upper end surface (6a) of the first well tubular (6); d) keeping the first and second well tubulars (6, 7) in said axially aligned position; e) welding the upper end of the first well tubular (6) to the lower end of the second well tubular (7), forming a circumferential weld bead (WL) in a position corresponding to said upper and lower end surfaces (6a, 7a); and f) lowering into the wellbore (4) the first well tubular (6) and the second well tubular (7) welded together.

Abstract: The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength ?.

Abstract: A method for estimating degradation of a wire-bonded power semi-conductor module is provided. The method includes obtaining an indicator of degradation (Degrest_t-1); estimating an estimated indicator of degradation (Degrest_t) by a temporal degradation model; obtaining a set of on-line measure (Xon_meas_t); then, (1) converting the on-line measure (Xon_meas_t) into a deducted indicator of degradation (Degrmeas_t) by an electrical equivalence model, and (2) computing a deviation between estimated and deducted indicator of degradation (Degrest_t; Degrmeas_t); and/or (1) converting the estimated indicator of degradation (Degrest_t) into a set of on-line estimation (Xon_est_t), and (2) computing a deviation between set of on-line measure and estimation (Xon_meas_t; Xon_est_t); and correcting the estimated indicator of degradation (Degrest_t) into a corrected estimated indicator of degradation (Degrcorr_t) as a function of the computed deviation.

Abstract: A component mounting line control system controls a component mounting line. The component mounting line control system includes an acquirer, a first detector, a second detector, and a controller. The acquirer acquires set-up changing data. The first detector is provided on the upstream side of the reflow device and detects the board. The second detector is provided on the downstream side of the reflow device and detects the board. The controller changes a reflow condition based on the set-up changing data and the result of detection performed by the first detector and the second detector after the acquirer acquires the set-up changing data.

Abstract: In a double-acting friction stir spot welding device or a double-acting friction stir spot welding method, a pin member and a cylindrical shoulder member that rotates around the axis of the pin member are used as rotary tools, and a clamp member that has a cylindrical shape positioned so as to surround the outside of the shoulder member and is configured to press a workpiece from an obverse surface with an annular pressing surface of the distal end is used as a holding jig. The clamp member has an inclined surface that is adjacent to the inner edge portion of the pressing surface and inclined so as to reduce the inner diameter of the clamp member toward the back side as viewed from the pressing surface.

Abstract: A method for butt-welding of sheet metal, especially bodywork in the motor vehicle industry, where at least two flat workpieces with any desired contours are fed to a machining process. In a first sub-process, the workpieces are positioned in relation to one another forming a minimal gap and secured in place with holding means. In another sub-process, the position and width of the gap are measured continuously immediately before welding together and the measurements are used to control a laser welding head. The laser welding head is fit with a rotatable twin-spot lens, where the relative alignment of a main spot to an auxiliary spot is controlled depending on the absolute position of the gap and the gap width during the welding process while the processing lens of the laser welding head is rotated around the laser beam axis with the angle of rotation alpha.

Abstract: Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

Abstract: A workpiece rotating apparatus including a first rotary positioner and a second rotary positioner which are arranged to face each other in a direction along a substantially horizontal rotation axis, which hold, respectively, one end portion and the other end portion of a long workpiece, and which can rotate the workpiece around the rotation axis, a linear motor which linearly moves the second rotary positioner in a direction along the rotation axis, and a motor controller which controls the linear motor to adjust a position of the second rotary positioner in a direction along the rotation axis, and the motor controller controls the linear motor so that magnitude of force acting on the linear motor from the other end portion of the workpiece via the second rotary positioner becomes equal to or smaller than a predetermined threshold.

Abstract: A friction welding method comprises causing an end surface of a first workpiece and an end surface of a second workpiece to engage in relative rotation while the end surfaces are in mutual contact as a compressive load is applied thereto so as to generate heat due to friction at a joint interface between the workpieces, thereafter stopping the relative rotation of the workpieces, and then applying an upset process pressure to the workpieces. When the workpiece end surfaces are brought into mutual contact, a compressive load employed is less than a lower threshold of a bend-producing compressive load domain within which bending of the first workpiece and/or the second workpiece would occur but the compressive load and the relative rotational speed between the workpieces are such as will cause the heat due to friction to be capable of causing plastic deformation at workpiece end surface(s).

Abstract: A friction stir spot welding method performs friction stir spot welding of a pair of workpieces having a coating film formed on at least one welding surface by using a refill friction stir spot welding device including rotary tools. The method includes removing the coating film by plunging a distal end of the shoulder member into one workpiece up to a position closer to the surface than the welding surface, while rotating the shoulder member as a rotary tool around the axis, and rotating the shoulder member in a state in which the surface of one of the pair of workpieces, with the welding surfaces being overlaid on each other, is pressed by the end face of the clamp member and performing friction stir spot welding of the pair of workpieces after the coating film removal by using the pin member and the shoulder member as rotary tools.

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

Abstract: A vehicle assembly method includes assembling a chassis platform, mounting a floor pan to the platform, mounting a modular interior to the floor pan, assembling a body top-hat separate from the platform and the floor pan, and mounting the body top-hat to the platform and the floor pan after mounting the modular interior to the floor pan.

Abstract: The disclosure discloses a simplified space vector modulation method for multi-lever converters, and relates to the field of space vector modulation methods for multilevel converters, which solves problems that a redundant on-off state is greatly increased along with increase of a number of levels in a traditional SVM technology, and SVM is difficult to realize due to calculation of the redundant on-off state and selection of a proper on-off state. The method includes the following steps of: step 1: establishing a vector expression; step 2: establishing a reference vector trajectory model; step 3: respectively representing reference signals and level signals by coordinate components of a reference vector and a basic vector and corresponding component sums; step 4: constructing a star-connected multilevel converter; step 5: sampling a phase voltage reference vector trajectory model of the star-connected multilevel converter, and synthesizing the reference vector.

Abstract: Provided are a semiconductor element bonding apparatus and a semiconductor element bonding method that do not cause a bonding material to protrude and also ensure adhesion, even when there are variations in a thickness of a semiconductor element or a workpiece and even when there are projections and depressions on surfaces. A semiconductor element bonding apparatus includes disposing means for disposing a workpiece and a semiconductor element at positions facing each other, moving means for moving the workpiece or the semiconductor element in a vertical direction, displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction, load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween, and elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means.

Abstract: When the strip head (7) of a metal strip (1) runs out of a roll stand (2a), a lateral position (y) of the strip head (7) is detected by a detection device (8) at at least one location (P) lying between the roll stand (2a) and a device (8) arranged downstream of the roll stand. A strip position controller (10) is designed as a model predictive controller which ascertains a sequence of adjusting commands (uk) to be output one after the other in a work cycle (T) on the basis of the detected lateral position (y) of the strip head (7), and the sequence is used to adjust a respective roll gap wedge. The number of control commands (uk) define a prediction horizon (PH) of the strip position controller (10) in connection with the work cycle (T). The strip position controller (10) at least supplies the roll stand (2a) with the control command (u0) ascertained to be output next.

Abstract: Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 ?m and not greater than 600 ?m. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.

Abstract: In a trajectory determination device (40); a CAD data acquisition unit (41) acquires shape data representing the shape of a three-dimensional structure; a trajectory data generating unit (43) and layering conditions adjusting unit (44) generate, on the basis of the shape data acquired by the CAD data acquisition unit (41), control information which is information for controlling a layering device for layering molten metal for forming the structure and which indicates the trajectory for the layering device and/or layering conditions when the layering device layers molten metal such that the upper surface of one layer of a plurality of layers of molten metal layered is flat; and a control program output unit (45) outputs the control information generated by the trajectory data generating unit (43) and the layering conditions adjusting unit (44).

Abstract: A method for manufacturing a semiconductor device includes (i) a step of preparing a first semiconductor chip having a first electrode pad thereon and a second semiconductor chip having a second electrode pad thereon and larger in thickness than the first semiconductor chip, the second electrode pad being larger in size than the first electrode pad, (ii) a step of mounting the first semiconductor chip and the second semiconductor chip on the same planarized surface of a substrate having a uniform thickness, (iii) a step of bonding a ball formed by heating and melting a bonding wire to the second electrode pad, (iv) a step of first-bonding the bonding wire to the first electrode pad, and (v) a step of second-bonding the bonding wire to the ball.

Abstract: A method of joining a first pipe section to a second pipe section includes positioning the two pipe sections in an end-to-end configuration to define therebetween a joint to be welded, measuring the degree of alignment of the pipe sections when they are in the end-to-end configuration in a position ready for welding, ascertaining the relative movement required of the pipe sections in order to improve their alignment, effecting the relative movement so ascertained, and welding together the two pipe sections. The method may include the use of geometric data of the end of the pipes in order to ascertain the relative movement required of the pipe sections. A control unit may be used to calculate, using such data, a target orientation that lines up the pipe sections. The measuring step may be performed using, for example, a laser or a camera and backlight.

Abstract: A welding method heats and pressurizes a contacting portion, where a first member and a second member made of resin are in contact with each other, by a pressing tool. The welding method has forming a step, forming a recessed portion, crushing a protrusion, and filling the recessed portion. The step is defined between the first member and the second member by providing the protrusion to the first member. The recessed portion is provided in a tip of the pressing tool. The protrusion of the first member is crushed in the recessed portion by being pressed toward the second member using the pressing tool. The recessed portion is filled with the molten portion of the first member and the molten portion of the second member such that a rim of an outer periphery of the recessed portion is dug into the first member and the second member.

Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.

Abstract: An apparatus for positively locking a ball screw in a lift position is described. The apparatus includes defined tooth disc and pawl housings, which interconnect to facilitate interoperation of locking components. A tooth disc is secured to the ball screw and actuators associated with each pawl can exert a downward force on each pawl, in order to force the pawls into engagement with the tooth disc via movement in a vertical plane. Owing to the shape, size and positioning of the pawl and tooth disc components relative to one another, and the vertical movement of the pawl members into engagement with the tooth disc, the apparatus of the present invention is capable of locking the hall screw in position at any point along the length of the ball screw, even if the pawls are out of alignment with the teeth, or recesses between adjacent teeth.

Abstract: An apparatus and method that utilizes thermal dilution to detect a wide range of flow rates and/or flow status in cerebrospinal fluid (CSF) shunt systems. The use of a large cold source in combination with thermosensor pad of a particular construction provide a fluid flow analyzer with the ability to detect very low levels of CSF flow. In addition, a method for adjusting thermal dilution readings to compensate for varying shunt catheter depth is shown and for determining a steady state of the thermal dilution readings. The thermosensor pad is conformable to a patient's skin contour thereby making the apparatus and method less sensitive to ambient temperature errors and, as a result, more accurate in assessing CSF flow. Furthermore, a software error check is provided for identifying poor sensor-to-skin contact for alerting an operator to re-apply the thermosensor pad to correct, as well as a post-test check to determine if temperature data is reasonable before determining flow status or flow rate.

Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.

Abstract: A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving section configured to drive one of the head section and the stage to move in a first direction intersecting the head section and the stage and apply a load to the other one of the stage and the head section, a load sensor configured to sense a load value of the applied load, and a controller configured to control the driving section to move one of the head section and the stage, and then separate the head section from the stage in accordance with a change in the load value.

Abstract: The invention relates to a device and a method for detecting the mechanical forces at the welding pin tip during friction stir welding, having the following features: a) a strip-shaped sensor (3) at a long side of a tool cup (9) holding a welding pin pen (12) by way of a pin shaft (13) using a tool receiving cone (14), and also holding a welding shoe (11); b) a conical narrowed portion (20) in the further region of the tool-receiving cone (14), which serves to receive a sensor (18) for detecting the axial force, the torque and the bending moment at the welding pin pen (12); c) a further narrowed portion in the front region of the tool-receiving cone (14), having three sensors (24) distributed across the circumferences at a distance of 120 degrees; d) a sensor signal amplifier having a rotor antenna (19) for receiving, amplifying and forwarding all detected measurement values, said measurement values being forwarded by a static antenna (17) to a machine control; and e) an inductive power supply system.

Abstract: Before using a load cell to measure a load (nozzle load) arising during relative movement between a suction tube and a pipe of a suction nozzle, the suction nozzle and a metal contact tool are moved towards each other by a set load with the metal contact tool contacting the tip section of the suction tube. When the suction tube and the pipe has moved relatively by set amount due to the suction nozzle and metal contact tool being moved towards each other, the nozzle load of the suction nozzle is measured using the load cell. Nozzle load is measured only for a suction nozzle for which relative movement of the suction tube and the pipe has been confirmed, and nozzle load is measured appropriately without damaging the load sensor.

Abstract: A method and device for ultrasound testing of welds is provided. For testing element welds on a body forming a single-piece assembly with these elements, the free end of a poly-articulated robot is fitted with an ultrasound probe which is fitted with an ultrasonic multi-element array transducer; the probe is inserted into the space between two adjacent elements of the assembly; the probe is moved along three-dimensional trajectories along the profile of the element; sectorial electronic scanning is performed in at least two non-parallel testing planes; and ultrasound signals output by the transducer in order to test the welds are processed. The method and device may be applied to welds of blades on the blisk of a bladed disk.

Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.

Abstract: Methods and systems for designing and producing a three-dimensional object selection of a base three-dimensional object from a customer device. A base three-dimensional model corresponding to the object is displayed on the customer device, and one or more custom modifications are received. A modified three-dimensional model corresponding to the modified object is prepared and displayed. Once confirmation to produce the modified object is received, data corresponding to the modified three-dimensional model is transmitted to a manufacturing device for production of the object, using the data to do so, such that the object corresponds directly to the modified three-dimensional model.

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

Abstract: A processing method of processing a workpiece on which a plurality of intersecting planned dividing lines are set is provided. The processing method includes a holding step of holding the workpiece by a holding table, a dividing step of forming a plurality of chips by dividing the workpiece held by the holding table along the planned dividing lines, and a carrying-out step of, after the dividing step is performed, sucking the plurality of chips on the holding table by a suction unit including a suction head sucking the plurality of chips and a suction passage connected to the suction head, and carrying out the plurality of chips from the holding table via the suction passage.

Abstract: A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.

Abstract: A device for direct screwing, in particular flow hole screwing, or friction welding includes a guide element extending in an axial direction and being formed in particular as a guide pipe. A driveshaft is movable in the axial direction, disposed within the guide element and driven by a rotary drive. A feed drive is disposed and constructed to generate a feed movement and feed force transmitted to the driveshaft, which is achieved by a feed unit. During the process, depending on a process parameter, a switchover is made from a high feed force to a reduced feed force (flow hole screwing) or to a higher feed force (friction welding). In order to enable the most compact and weight-saving embodiment possible, the feed unit is disposed coaxially to the driveshaft within the guide element and transmits the feed force to the driveshaft in the axial direction and centrally.

Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

Abstract: The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.

Abstract: A method of manufacturing a grounding connection is disclosed that comprises assembling a non-ferrous grounding connector to a non-ferrous part, and melting brazing material between the grounding connector and the part to secure the grounding connector to the part. The step of assembling the connector to the part may be performed by clinching the connector to the part. The ground connector may comprise a nut secured to the vehicle body by a clinch joint and a deposit of braze metal applied to the nut at the location of the clinch joint. Alternatively, the ground connector for a vehicle body may comprise a nut defining an opening for receiving a fastener and a deposit of brazing material attaching the nut to the vehicle body.

Abstract: A friction stir spot welding apparatus according to the present invention includes: a rotary tool; and a perpendicular-to-plane detector, which detects whether or not the rotary tool is positioned to be in a perpendicular-to-plane state relative to a joining target portion of workpieces. The perpendicular-to-plane detector measures distances to at least three measurement positions set around the joining target portion by means of, for example, position sensors. The measurement positions are set to be positioned at the vertices of a polygon on a reference plane to which forward and backward movement directions of the rotary tool are normal. The perpendicular-to-plane detector detects that the rotary tool is positioned to be in the perpendicular-to-plane state relative to the joining target portion of the workpieces if all the distances to the measurement positions are equal to each other.

Abstract: An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

Abstract: A machine for transferring at least one micro-device includes a carrier and a transfer device. The carrier includes a pedestal, a substrate, and at least one first cushion layer. The substrate allows the micro-device to be temporarily disposed thereon. The first cushion layer is disposed between the pedestal and the substrate. The transfer device includes a transfer head holder, transfer head, and at least one second cushion layer. The transfer head holder moves at least along a z-axis substantially perpendicular to the substrate. The transfer head has a grip force on the micro-device. The second cushion layer is disposed between the transfer head holder and the transfer head.

Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion.

Abstract: Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.

Abstract: Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.