With Condition Responsive, Program, Or Timing Control Patents (Class 228/102)
  • Patent number: 10499816
    Abstract: An apparatus and method that utilizes thermal dilution to detect a wide range of flow rates and/or flow status in cerebrospinal fluid (CSF) shunt systems. The use of a large cold source in combination with thermosensor pad of a particular construction provide a fluid flow analyzer with the ability to detect very low levels of CSF flow. In addition, a method for adjusting thermal dilution readings to compensate for varying shunt catheter depth is shown and for determining a steady state of the thermal dilution readings. The thermosensor pad is conformable to a patient's skin contour thereby making the apparatus and method less sensitive to ambient temperature errors and, as a result, more accurate in assessing CSF flow. Furthermore, a software error check is provided for identifying poor sensor-to-skin contact for alerting an operator to re-apply the thermosensor pad to correct, as well as a post-test check to determine if temperature data is reasonable before determining flow status or flow rate.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: December 10, 2019
    Assignee: ShuntCheck, Inc.
    Inventors: Frederick J. Fritz, Marek Swoboda, Mark E. Mattiucci, Matias G. Hochman
  • Patent number: 10426025
    Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: September 24, 2019
    Inventors: Bernd Mueller, Michael Niedermayer, Ulrich Wittreich
  • Patent number: 10347603
    Abstract: A semiconductor device manufacturing apparatus includes a stage, a head section facing the stage and configured to hold a semiconductor element, a driving section configured to drive one of the head section and the stage to move in a first direction intersecting the head section and the stage and apply a load to the other one of the stage and the head section, a load sensor configured to sense a load value of the applied load, and a controller configured to control the driving section to move one of the head section and the stage, and then separate the head section from the stage in accordance with a change in the load value.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: July 9, 2019
    Inventor: Masayuki Miura
  • Patent number: 10293430
    Abstract: The invention relates to a device and a method for detecting the mechanical forces at the welding pin tip during friction stir welding, having the following features: a) a strip-shaped sensor (3) at a long side of a tool cup (9) holding a welding pin pen (12) by way of a pin shaft (13) using a tool receiving cone (14), and also holding a welding shoe (11); b) a conical narrowed portion (20) in the further region of the tool-receiving cone (14), which serves to receive a sensor (18) for detecting the axial force, the torque and the bending moment at the welding pin pen (12); c) a further narrowed portion in the front region of the tool-receiving cone (14), having three sensors (24) distributed across the circumferences at a distance of 120 degrees; d) a sensor signal amplifier having a rotor antenna (19) for receiving, amplifying and forwarding all detected measurement values, said measurement values being forwarded by a static antenna (17) to a machine control; and e) an inductive power supply system.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: May 21, 2019
    Inventor: Markus Weigl
  • Patent number: 10292319
    Abstract: Before using a load cell to measure a load (nozzle load) arising during relative movement between a suction tube and a pipe of a suction nozzle, the suction nozzle and a metal contact tool are moved towards each other by a set load with the metal contact tool contacting the tip section of the suction tube. When the suction tube and the pipe has moved relatively by set amount due to the suction nozzle and metal contact tool being moved towards each other, the nozzle load of the suction nozzle is measured using the load cell. Nozzle load is measured only for a suction nozzle for which relative movement of the suction tube and the pipe has been confirmed, and nozzle load is measured appropriately without damaging the load sensor.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: May 14, 2019
    Inventors: Kazumi Hoshikawa, Kenji Shimosaka, Tadakatsu Ibe
  • Patent number: 10163845
    Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: December 25, 2018
    Inventors: Keng Yew Song, Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan
  • Patent number: 10161917
    Abstract: A method and device for ultrasound testing of welds is provided. For testing element welds on a body forming a single-piece assembly with these elements, the free end of a poly-articulated robot is fitted with an ultrasound probe which is fitted with an ultrasonic multi-element array transducer; the probe is inserted into the space between two adjacent elements of the assembly; the probe is moved along three-dimensional trajectories along the profile of the element; sectorial electronic scanning is performed in at least two non-parallel testing planes; and ultrasound signals output by the transducer in order to test the welds are processed. The method and device may be applied to welds of blades on the blisk of a bladed disk.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: December 25, 2018
    Inventors: Richard Michael Coulette, Laurent Le Ber, Pascal Jean-Christian Claude Ravault, Marc Jacky Vassault
  • Patent number: 10121759
    Abstract: A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: November 6, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Aashish Shah, Robert William Ellenberg, Stephen Babinetz, Ziauddin Ahmad, Wei Qin
  • Patent number: 10089662
    Abstract: Methods and systems for designing and producing a three-dimensional object selection of a base three-dimensional object from a customer device. A base three-dimensional model corresponding to the object is displayed on the customer device, and one or more custom modifications are received. A modified three-dimensional model corresponding to the modified object is prepared and displayed. Once confirmation to produce the modified object is received, data corresponding to the modified three-dimensional model is transmitted to a manufacturing device for production of the object, using the data to do so, such that the object corresponds directly to the modified three-dimensional model.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: October 2, 2018
    Assignee: KRAFTWÜRX, INC.
    Inventor: Bryan C. Norman
  • Patent number: 10064289
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 28, 2018
    Assignee: CCL Label, Inc.
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • Patent number: 10056296
    Abstract: A processing method of processing a workpiece on which a plurality of intersecting planned dividing lines are set is provided. The processing method includes a holding step of holding the workpiece by a holding table, a dividing step of forming a plurality of chips by dividing the workpiece held by the holding table along the planned dividing lines, and a carrying-out step of, after the dividing step is performed, sucking the plurality of chips on the holding table by a suction unit including a suction head sucking the plurality of chips and a suction passage connected to the suction head, and carrying out the plurality of chips from the holding table via the suction passage.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: August 21, 2018
    Inventor: Kazuma Sekiya
  • Patent number: 10032743
    Abstract: A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: July 24, 2018
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Winfried Luerbke
  • Patent number: 10010928
    Abstract: A device for direct screwing, in particular flow hole screwing, or friction welding includes a guide element extending in an axial direction and being formed in particular as a guide pipe. A driveshaft is movable in the axial direction, disposed within the guide element and driven by a rotary drive. A feed drive is disposed and constructed to generate a feed movement and feed force transmitted to the driveshaft, which is achieved by a feed unit. During the process, depending on a process parameter, a switchover is made from a high feed force to a reduced feed force (flow hole screwing) or to a higher feed force (friction welding). In order to enable the most compact and weight-saving embodiment possible, the feed unit is disposed coaxially to the driveshaft within the guide element and transmits the feed force to the driveshaft in the axial direction and centrally.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: July 3, 2018
    Assignee: DEPRAG Schulz GmbH u. Co.
    Inventors: Gerd Zinn, Rolf Pfeiffer
  • Patent number: 9986649
    Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: May 29, 2018
    Inventors: Stephen M. Hugo, Matthew S. Kelly
  • Patent number: 9881893
    Abstract: The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: January 30, 2018
    Inventor: Guangyuan Cai
  • Patent number: 9853371
    Abstract: A method of manufacturing a grounding connection is disclosed that comprises assembling a non-ferrous grounding connector to a non-ferrous part, and melting brazing material between the grounding connector and the part to secure the grounding connector to the part. The step of assembling the connector to the part may be performed by clinching the connector to the part. The ground connector may comprise a nut secured to the vehicle body by a clinch joint and a deposit of braze metal applied to the nut at the location of the clinch joint. Alternatively, the ground connector for a vehicle body may comprise a nut defining an opening for receiving a fastener and a deposit of brazing material attaching the nut to the vehicle body.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: December 26, 2017
    Assignee: Ford Global Technologies, LLC
    Inventor: Matthew Forsyth
  • Patent number: 9839973
    Abstract: A friction stir spot welding apparatus according to the present invention includes: a rotary tool; and a perpendicular-to-plane detector, which detects whether or not the rotary tool is positioned to be in a perpendicular-to-plane state relative to a joining target portion of workpieces. The perpendicular-to-plane detector measures distances to at least three measurement positions set around the joining target portion by means of, for example, position sensors. The measurement positions are set to be positioned at the vertices of a polygon on a reference plane to which forward and backward movement directions of the rotary tool are normal. The perpendicular-to-plane detector detects that the rotary tool is positioned to be in the perpendicular-to-plane state relative to the joining target portion of the workpieces if all the distances to the measurement positions are equal to each other.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: December 12, 2017
    Inventors: Hideki Okada, Ryoji Ohashi, Satoru Yamasumi
  • Patent number: 9832919
    Abstract: An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: November 28, 2017
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventor: Koji Kawaguchi
  • Patent number: 9716073
    Abstract: A machine for transferring at least one micro-device includes a carrier and a transfer device. The carrier includes a pedestal, a substrate, and at least one first cushion layer. The substrate allows the micro-device to be temporarily disposed thereon. The first cushion layer is disposed between the pedestal and the substrate. The transfer device includes a transfer head holder, transfer head, and at least one second cushion layer. The transfer head holder moves at least along a z-axis substantially perpendicular to the substrate. The transfer head has a grip force on the micro-device. The second cushion layer is disposed between the transfer head holder and the transfer head.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: July 25, 2017
    Inventor: Pei-Yu Chang
  • Patent number: 9620477
    Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: April 11, 2017
    Inventors: Keng Yew Song, Wai Wah Lee, Yi Bin Wang
  • Patent number: 9609795
    Abstract: Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: March 28, 2017
    Inventors: Yoshitaka Narita, Takeshi Fujimoto, Hidetoshi Sato
  • Patent number: 9536856
    Abstract: Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: January 3, 2017
    Assignee: SHINKAWA LTD.
    Inventor: Kohei Seyama
  • Patent number: 9375913
    Abstract: A screen printer in which a photoelectric sensor and squeegees are fixed to a slider, when outward movement printing in which solder on a screen is rolled by an outward movement of the right squeegee is completed, the right squeegee is separated from a state of contacting a right end of a solder roll and a squeegee position pl at that time is input, and, subsequently, the slider is returned until the photoelectric sensor detects a left end of the solder roll and a squeegee position p2 at this time is input. An amount (a solder roll width) of solder remaining on the screen is calculated by subtracting a movement amount from the squeegee position p1 to the squeegee position p2 from a distance from the right squeegee to an optical axis position of the photoelectric sensor on the screen.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: June 28, 2016
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Shoji Fukakusa, Yoshimune Yokoi
  • Patent number: 9266177
    Abstract: A flange bolt cutter for separating two connected flanges. The flange bolt cutter contains a circular saw blade connected to an flange mount which can be vertically adjusted relative to the flange mount and/or includes two arms which can be pivotally adjusted relative to each other.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: February 23, 2016
    Assignee: TORQ/LITE, LLC
    Inventors: James Dodd Smith, Michael T. Ramsey
  • Patent number: 9242439
    Abstract: In an apparatus and a method for welding of workpiece layers, a feed device is activated with a predefined adjustment force without ultrasound activation and the sonotrode is advanced in the direction of an anvil. The adjustment force is subsequently reduced and the sonotrode is activated. The sonotrode can subsequently be deactivated and the adjustment force can be increased on the basis of a deactivation signal.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: January 26, 2016
    Inventors: Joachim Wein, Hartmut Poll, Elmar Noder, Clemens Balle
  • Patent number: 9171830
    Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: October 27, 2015
    Inventors: Andy Quang Tran, Lance Wright
  • Patent number: 9165902
    Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: October 20, 2015
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Matthew B. Wasserman, Michael P. Schmidt-Lange, Thomas J. Colosimo, Jr.
  • Patent number: 9165842
    Abstract: A method of operating a wire bonding machine is provided. The method includes: detecting a short tail condition after formation of a wire bond formed using a wire bonding tool; providing a bond head assembly of a wire bonding machine at an xy location of the wire bonding machine, the bond head assembly carrying the wire bonding tool; lowering the bond head assembly toward a contact surface at the xy location with a wire clamp of the wire bonding machine closed; opening the wire clamp; decelerating the bond head assembly as it is lowered toward the contact surface such that a portion of a wire extends below a tip of the wire bonding tool; closing the wire clamp; and performing a test to determine if an end of the portion of the wire extending below the tip of the bonding tool is in contact with the contact surface.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: October 20, 2015
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: Gary S. Gillotti
  • Patent number: 9132504
    Abstract: An apparatus includes a connector and is configured to mount to a machine having multiple axes of control. A control signal on the connector determines a path of a rotating tool holder.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: September 15, 2015
    Assignee: Wichita State University
    Inventor: Dwight A. Burford
  • Patent number: 9067271
    Abstract: Devices and methods for indicating power on a torch. In one example, a welding or plasma cutting torch includes an indicator coupled to the torch. The torch also includes control circuitry coupled to the indicator and configured to provide a first signal and a second signal to the indicator. The indicator is configured to receive the first signal when at least one of welding power and arc starting power from a power supply is available at the torch and to receive the second signal when the at least one of active welding power and the arc starting power from the power supply is not available at the torch.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: June 30, 2015
    Inventors: Mark Steven Kadlec, Bradley William Hemmert
  • Patent number: 9038883
    Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.
    Type: Grant
    Filed: September 7, 2014
    Date of Patent: May 26, 2015
    Assignee: Princeton Optronics Inc.
    Inventors: Qing Wang, Jean-Francois Seurin, Chuni Lal Ghosh, Laurence Watkins
  • Publication number: 20150136837
    Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.
    Type: Application
    Filed: March 4, 2013
    Publication date: May 21, 2015
    Applicant: Panasonic Intellectual Property Management Co., Lt
    Inventors: Akira Maeda, Kennan Mou, Toshihiko Nagaya
  • Publication number: 20150136304
    Abstract: To provide a method of friction welding and an apparatus of friction welding in which a length of time for manufacturing one product is reduced as much as possible regardless of the dimension errors of works. The fast forwarding distance Lx1 is calculated for the fast forwarding by using the results of measuring the dimensions of works W1, W2 under the condition of the constant slowly forwarding distance Lx2, Thereby, for the work of a legitimate dimension and even for the work having a dimension smaller than the legitimate dimension, the elongation of the slowly forwarding distance is prevented compared with the work having the longer dimension than the legitimate dimension, and the relative proportion of the fast forwarding distance Lx1 is increased by making shorter the specified slowly forwarding distance.
    Type: Application
    Filed: July 13, 2012
    Publication date: May 21, 2015
    Applicant: NITTAN VALVE CO., LTD.
    Inventors: Ryo Onose, Takehiro Okuno
  • Patent number: 9016548
    Abstract: A method and machine for producing welded reinforcing steel rod mats for use in the production of DIN-conforming reinforced concrete components having primarily no static loads, and to such a reinforcing steel rod mat, uses a welding device, one or more reinforcing steel rods, and one or more stay braces in the case of uniaxial reinforcing steel mats, positioned relative to each other with position control and optionally with position correction of the reinforcing steel rods to be welded together, and a reinforcing steel rod is welded in the area of at least one of the ribs thereof to a stay brace, or to another reinforcing steel rod in the area of at least one of the ribs of the rod.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: April 28, 2015
    Assignee: Haussler Innovation GmbH
    Inventors: Franz Häussler, Hans Hundegger
  • Patent number: 9010614
    Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 21, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuya Ohdake, Tetsuro Aikawa, Yoshinori Satoh, Kazuo Aoyama
  • Publication number: 20150103500
    Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.
    Type: Application
    Filed: December 18, 2014
    Publication date: April 16, 2015
    Inventors: Han-Sung BAE, Wonkyu KWAK, Cheolgeun AN
  • Publication number: 20150102087
    Abstract: A method and a device for improving the quality of the weld seam in friction stir welding is provided. The process of friction stir welding is effected by means of a friction welding tip, in which a spiral conveyor screw is provided in the spindle bearing. The longitudinal axis of the spindle bearing is inclined at an angle to the vertical. The sliding surface of the rotating spindle consists of a flat sliding surface and, for the welding of curved seams, in each case of a sliding surface inclined at an acute angle to the sliding surface, the friction welding tip is designed in the shape of a truncated cone. The lateral surface of the truncated cone is formed by six trapezoidal planar parts, of which three planar parts each uniformly distributed at the circumference lie at an angle of 120 degrees with respect to one another and account for a proportion greater than ? at the circumference.
    Type: Application
    Filed: May 29, 2013
    Publication date: April 16, 2015
    Applicant: Grenzebach Maschinenbau GmbH
    Inventors: Johann Foerg, Martin Demharter, Andreas Reitenauer
  • Publication number: 20150090770
    Abstract: A screen printer includes: a substrate holder that holds a substrate; a mask to be contacted with the substrate; an imaging device that images the substrate; an elevation mechanism that moves up the substrate holder at a below-mask-position below the mask based on a result of the imaging to contact the substrate with the mask; a horizontal moving mechanism that moves the substrate holder between the below-mask-position and a retreat position retreated in a horizontal direction from the below-mask-position; a printing head that moves on the mask contacted with the substrate and prints a paste on the substrate via the mask; and a mask cleaner that cleans a lower surface of the mask with the substrate separated from the mask by the elevation mechanism. The imaging of the substrate and the cleaning of the mask are performed with the substrate holder positioned at the retreat position.
    Type: Application
    Filed: September 19, 2014
    Publication date: April 2, 2015
    Inventors: Masayuki MANTANI, Toshiyuki MURAKAMI
  • Publication number: 20150083786
    Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 26, 2015
    Inventors: Kazuya OKAMOTO, Isao SUGAYA, Naohiko KURATA, Masashi OKADA, Hajime MITSUISHI
  • Publication number: 20150069112
    Abstract: An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality.
    Type: Application
    Filed: September 12, 2013
    Publication date: March 12, 2015
    Applicant: Ford Global Technologies, LLC
    Inventors: Mahmoud A. ABOU-NASR, Dimitar Petrov FILEV, Elizabeth Therese HETRICK, William C. MOISION
  • Publication number: 20150069113
    Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.
    Type: Application
    Filed: September 7, 2014
    Publication date: March 12, 2015
    Inventors: Qing Wang, Jean-Francois Seurin, Chuni Lal Ghosh, Laurence Watkins
  • Publication number: 20150048146
    Abstract: In a method for producing welded pipes from steel, in which strips or metal sheets are formed into a pipe provided with a longitudinal or helical slot and the abutting edges of the slotted pipe are welded together, the process parameters for production of the pipes are specified on the basis of previously ascertained material properties and geometry of the strips or metal sheets.
    Type: Application
    Filed: February 27, 2013
    Publication date: February 19, 2015
    Inventors: Franz Martin Knoop, Michael Kaack, Ludwig Oesterlein
  • Patent number: 8950650
    Abstract: A tool driving section of a friction stir spot welding device is configured to cause each of a pin member and a shoulder member to advance and retract, and is controlled by a tool driving control section. A press-fit reference point setting section sets a position where the pin member or the shoulder member contacts an object to be welded as a press-fit reference point, and the tool driving control section controls the position of the pin member with respect to the shoulder member on the basis of the press-fit reference point, thereby controlling the press-fit depth of a rotating tool press-fitted from the surface of the object to be welded. This achieves the excellent welding quality at suitable precision according to welding conditions especially in a double-acting friction stir spot welding method.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: February 10, 2015
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Hideki Okada, Hajime Kashiki, Kazumi Fukuhara, Mitsuo Fujimoto
  • Publication number: 20150030874
    Abstract: A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly.
    Type: Application
    Filed: September 24, 2012
    Publication date: January 29, 2015
    Inventors: Lawrence A. Wolfgram, Alan Belohlav
  • Publication number: 20150021375
    Abstract: A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the male connector within the interior space, centering and stabilizing the fixture laterally on the male portion, inserting a clamping mechanism attached to the housing within an opening of the male connector to affix the housing to the male portion, securing the clamping mechanism to a surface of the male portion, and automatically machining at least a portion of the weld and/or parent casting material.
    Type: Application
    Filed: October 8, 2013
    Publication date: January 22, 2015
    Applicant: TTX Company
    Inventors: Richard A. Brueckert, William A. Guess, Donald F. Kroesch
  • Publication number: 20150014396
    Abstract: A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source port defining a passage having an inlet positioned to allow viscous material to flow into the elongate chamber, a pair of blades defining a slot that provides an outlet from which viscous material can flow out of the elongate chamber, an elongate plunger movable in the elongate chamber to reduce a volume of viscous material within the elongate chamber, and at least one sensor to detect pressure of the viscous material within the elongate chamber.
    Type: Application
    Filed: October 1, 2014
    Publication date: January 15, 2015
    Inventors: James Lynch, Dennis G. Doyle, Kenneth King, Joseph A. Perault, John George Klauser
  • Patent number: 8931684
    Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: January 13, 2015
    Inventors: Michael Nikkhoo, Amir Salehi
  • Patent number: 8925791
    Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: January 6, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Jeffrey A Abell, John Patrick Spicer, Michael Anthony Wincek, Hui Wang, Debejyo Chakraborty
  • Publication number: 20140374466
    Abstract: Multi-stranded wires are clamped between an ultrasonic welding tip and an opposing anvil. The multi-stranded wires are made of a material that is more malleable than copper, or of a material that has a malleability that is substantially the same or greater than the malleability of aluminum. The plurality of multi-stranded wires can be clamped between opposing side surfaces to further form the wire bundle. Ultrasonic energy is applied to a first side of the wire bundle adjacent the ultrasonic welding tip. After termination of ultrasonic energy to the first side, the wire bundle is rotated 180 degrees relative to the anvil and ultrasonic energy is applied to a second side of the wire bundle, wherein the second side is oppositely disposed relative to the first side.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 25, 2014
    Inventor: Guillermo COTO
  • Patent number: 8910850
    Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: December 16, 2014
    Assignee: Siemens VAI Metals Technologies SAS
    Inventor: Marc Michaut