Abstract: A system for automated assembly and welding is disclosed. The system includes a pallet for receiving incoming workpieces; a workpiece holder having a plurality of electromagnets; a handling robot configured to transport incoming workpieces from the pallet to the workpiece holder; and a controller in communication with the workpiece holder and the handling robot. The controller is configured to determine an orientation of a workpiece positioned on the workpiece holder, and to selectively adjust an activation state of one or more electromagnets of the workpiece holder based upon the orientation of the workpiece. A method of assembling and welding workpieces is also disclosed.

Abstract: A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load.

Abstract: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

Abstract: A friction stir welding apparatus includes: a thermocouple and a temperature measurement device which are configured to detect a temperature of the temperature measurement point; a temperature monitor configured to calculate an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member; and a controller configured to perform a predetermined procedure based on the estimated temperature of the welding tool so as to prevent overheating of the welding tool.

Abstract: A method and machine for producing welded reinforcing steel rod mats for use in the production of DIN-conforming reinforced concrete components having primarily no static loads, and to such a reinforcing steel rod mat, uses a welding device, one or more reinforcing steel rods, and one or more stay braces in the case of uniaxial reinforcing steel mats, positioned relative to each other with position control and optionally with position correction of the reinforcing steel rods to be welded together, and a reinforcing steel rod is welded in the area of at least one of the ribs thereof to a stay brace, or to another reinforcing steel rod in the area of at least one of the ribs of the rod.

Abstract: A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: A process for operating a stringer (10) for connecting solar cells in series by solder ribbon cut-offs cut from continuous solder ribbon strip, includes monitoring depletion of the momentarily-employed continuous solder ribbon strip (13a) by a monitoring unit (16) detecting when the end (17) of this strip (13a) approaches, entering a new roll (2) with a new continuous solder ribbon strip (13b), connecting the end (17) of the momentarily-employed strip (13a) to this new strip (13b) thereby forming a composite continuous solder ribbon strip that includes a connection, moving this composite strip to a cutting station (14), cutting this composite strip into solder ribbon cut-offs in cutting station (14), and removing the ribbon cut-off that includes this connection. Also, stringer apparatus for performing such process.

Abstract: Friction stir welding equipment control force spindle for mounting in an orbital head housing uses a coaxial sensor to measure downforce. Simultaneously, an axial electrical actuator is controlled to dynamically correct the axial tool position during the welding, by a direct axial force system control, in order to maintain controlled downforce according to parameters previously set, based on numerical control. The equipment also sets up, monitors and controls spindle rotation speed, welding speed, acceleration speed and downforce using for example closed loop control functions. A laser system may scan the backing surface before welding and correct original tool path, in order to get an offset tool path. A precision alarm system may provide safe welding while preventing the tool from colliding with the backing surface.

Abstract: A linear friction welding system and method in one embodiment includes a first motor configured to rotate a first power shaft, a second motor configured to rotate a second power shaft, a memory including program instructions, and a controller operably connected to the first motor, the second motor, and the memory, and configured to execute the program instructions to identify a first current oscillation amplitude of a ram operably connected to the first power shaft and the second power shaft, determine a second desired oscillation amplitude for the ram, determine a minimum shift in relative angle between the first motor and the second motor to achieve the second desired oscillation amplitude, allocate the minimum shift in relative angle between the first motor and the second motor, and control the first motor and the second motor based upon the allocated minimum shift in relative angle.

Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.

Abstract: A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.

Abstract: An ultrasonic welding system and a method are provided. The system includes an ultrasonic welding device having an ultrasonic welding horn. The system further includes a controller generating control signals for inducing the welding device to form a first weld joint. The system further includes a power adjusting unit that induces the ultrasonic welding controller to increase a power level output by the ultrasonic welding controller to the ultrasonic welding device if a first displacement of the welding horn is less than the desired displacement during partial completion of forming the first weld joint, such that upon completion of the first weld joint an ending position of the ultrasonic welding horn is at a desired ending position.

Abstract: A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device.

Abstract: An ultrasonic welding system and a method are provided. The system includes an ultrasonic welding device and a controller that generates control signals for inducing the device to form a first weld joint. The system further includes a power adjusting unit having a desired output power level curve indicating desired power levels over time for obtaining a desired weld joint. The unit receives data from the controller indicating power levels when forming the first weld joint. The unit compares a power level output by the controller at a first time with an associated power level of the curve at the first time, and induces the controller to increase the power level at a second time if the power level output by the controller at the first time is less than the associated power level of the curve at the first time.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: A flux spraying system controls a flux sprayer to selectively spray soldering flux onto a printed circuit board (PCB) by a fixture. The fixture is disposed between the PCB and the flux sprayer, and comprises a plurality of openings corresponding to target areas of the PCB. The flux spraying system comprises a statistic module, a calculation module, and a control module. The statistic module records attributes of the fixture to determine spraying areas on the fixture. The calculation module calculates movement parameters of the flux sprayer, a movement length during a movement period and spraying segments of the flux sprayer, and spray duration of the flux sprayer based on the movement length during one movement period and the spraying segments of the flux sprayer. The control module directs the flux sprayer to coat the target areas of the PCB through the openings of the fixture.

Abstract: A welding device and a method for automatic multiple-bead welding, wherein a line illumination member is arranged to illuminate the joint by scanning a light beam across the joint line. A camera is arranged for the registration of line images of the joint when it is illuminated with the scanned light beam. The locations of the edges of the joint are determined by means of triangulation based on the registered line image. The welding device can include a stereo image member arranged to register photometric stereo images of the joint substantially simultaneously with the registration of the line images. The welding device is arranged to, during welding of a weld joint with a plurality of weld beads, control the welding head in dependence on both stereo images and line images.

Abstract: Friction welding systems and methods including a welding arrangement configured to impart kinetic friction between at least one surface of a first workpiece and at least one surface of a second workpiece to form a weld, a force providing mechanism arranged and disposed for applying a force to one or both of the first workpiece and the second workpiece, and a sensor arranged and disposed to measure a parameter of the welding arrangement, wherein an amount of vibration is determinable from the measured parameter.

Abstract: Disclosed is a print technology in which a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate onto which the lower surface of a mask is placed. A forward print process where solder is applied by driving a squeegee in a predetermined forward direction relative to a mask, and a backward print process where the solder is applied by driving the squeegee in a returning direction opposite to the forward direction are switched alternately. When the squeegee passes through the solder pool on the downstream side in a moving direction before switching in the course of switching from any one of the forward and backward print processes to the other one of these processes, the amount of solder in the solder pool is measured. Based on the amount of solder thus measured, the necessity of replenishing solder is determined The solder pool is supplemented with solder, based on the result of the decision on whether solder replenishment is required.

Abstract: The present invention relates to a technique for producing a jointed member by subjecting two to-be-jointed members which are contacted each other to friction stir welding. The method for producing a jointed member executes a dwelling step in which a probe is rotated only for a predetermined period at least one of a probe starting point position which is a position of the probe for forming a joint starting point in the to-be-jointed member and a probe end point position which is a position of the probe for forming a joint end point in the to-be-jointed member.

Abstract: A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation temperature. At the exothermic transformation temperature, the metal-aluminum powder melts and resolidifies as a metal aluminide solid having a non-magnetic configuration.

Abstract: Some embodiments include in-process welding devices to compensate for error associated with detected weld penetration depth. Exemplary devices can generally include an ultrasonic energy source, an ultrasonic receiving sensor, and a controller. The ultrasonic energy source can be disposed to generate ultrasonic energy through a first specimen being welded to a second specimen. A weld seam can be used to join the first specimen to the second specimen. The ultrasonic sensor can be disposed on an opposite side of the weld seam from the ultrasonic energy source, and configured to detect ultrasonic energy propagated from the first specimen side of the weld seam to the second specimen side of the weld seam.

Abstract: A method and apparatus for manufacturing an optical cable comprising at least one metal tube housing at least one optical fiber and having a predetermined excess fiber length (EFL) is described. In this method the metal tube is plastically deformed and shortened by a predetermined amount (St) greater than the predetermined EFL and is plastically deformed after shortening to provide a controlled elongation thereof so as to reach the predetermined excess fiber length. An optical cable so manufactured has a local excess fiber length (EFL) varying of or less than 0.2 % along the longitudinal extension of the cable with respect to an average EFL of the cable.

Abstract: A method of forming a wire bond using a wire bonding machine is provided.

Abstract: This invention relates to a method for axial positioning of a first pipe with respect to a second pipe for the welding of said pipes at their ends thereof of which the faces have been previously machined and define a joint plane, according to which a plurality of jacks are distributed around the first and second pipes, and said jacks are connected to a central processing and control unit. According to the invention, the movement of each of the jacks is controlled with respect to said external surface of the first and/or second pipe so as to align and center the internal end surfaces of the first and second pipes. The invention also relates to an associated device.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: Friction welding systems and methods including a welding arrangement configured to impart kinetic friction between at least one surface of a first workpiece and at least one surface of a second workpiece to form a weld, a force providing mechanism arranged and disposed for applying a force to one or both of the first workpiece and the second workpiece, and a sensor arranged and disposed to measure a parameter of the welding arrangement, wherein an amount of vibration is determinable from the measured parameter.

Abstract: A method is disclosed for controlling a process in which a component 4 is moved relative to another component 6 such that at least one of the components 4, 6 experiences a reduction in magnitude in at least one dimension. Such processes may include for example friction welding. The method comprises monitoring energy input to the process and adjusting an input parameter for the process based on the monitored energy input. The monitoring of energy input is performed before any reduction in component magnitude has begun to take place.

Abstract: A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.

Abstract: A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.

Abstract: A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit.

Abstract: In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.

Abstract: The invention relates to a method for producing a ceramic-metal connection that is repeatedly subjected to great changes in temperature during use, in which the metal and ceramic are brazed to one another two-dimensionally.

Abstract: A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.

Abstract: The present invention provides a wire bonding apparatus including: a lead frame loading unit for loading a lead frame, on which a semiconductor chip is mounted, on a transfer rail; a heater block for heating the loaded lead frame; a wire bonding tool for wire-bonding the semiconductor chip and leads of the lead frame; a lead frame unloading unit for unloading the wire-bonded lead frame from the transfer rail; and a control unit for detecting a wire bonding failure when the wire bonding failure occurs in the lead frame and separating the heater block from the lead frame after a predetermined time has elapsed from the occurrence of the wire bonding failure, and a method thereof.

Abstract: There are provided an apparatus for monitoring bonding surface bouncing, a wire bonding apparatus having the same, and a method for monitoring bonding surface bouncing. According to an aspect of the present invention, the apparatus for monitoring bonding surface bouncing includes a sensor measuring a capillary height in real time during bonding and a bouncing detector extracting a change rate of a capillary height from the capillary height measured in real time during a bonding performing period and detecting of whether bonding surface bouncing is present by comparing the extracted change rate with a set reference change rate.

Abstract: Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.

Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.

Abstract: The present invention provides an apparatus and improved method of friction stir spot welding that assures a predetermined bottom thickness and a reduction in variation in a series of resultant spot welds. The advantage of the present invention lies in that the plunge distance is controlled from the top plane of the anvil against which the bottom thickness is specified, and systematically adjusted to account for changing system parameters, such as, but not limited to, deflection and thermal expansion of the weld gun. The present invention also provides for improved and controlled weld quality through implementation of a dwell operation or dwell operations, whereby weld heat input is manipulated by causing the weld tool to dwell in a dwell region or at a desired depth or depths within the workpiece(s) for a predetermined time interval to achieve desired mechanical properties of the resultant weld joint.

Abstract: The invention relates to a method for connecting material webs disposed with overlapping edges, wherein an automatic welding machine having a driven chassis and a drive unit disposed thereon and a welding unit is guided along the overlap zone of the material webs to be connected, such that the carried welding unit connects the edges to be connected to one another. The invention further relates to an automatic welding machine for performing the method.

Abstract: An object is providing an electrostatic attraction apparatus and an attracting/releasing method capable of reliably attracting and quickly releasing a glass substrate. An attraction force for attracting a glass substrate is obtained according to the physical properties of the glass substrate. In addition to obtaining an attraction voltage (Vc(t)) required for obtaining the attraction force, a holding voltage (Vh(t)) for holding an attraction state and a release voltage (Vr(t)) for releasing the glass substrate are also obtained (S1 to S7). Attraction time period (tc) is actually measured and if this measured time is different from a preset attraction time (t1), the holding voltage (Vh(t)) and the release voltage (Vr(t)) are recalculated according to the actually measured attraction time period (tc) (S8 to S11).

Abstract: A process control system for a friction stir welding machine employs a master set of parameters and subroutines to control multiple machine processes, including welding, drilling, milling and probing. Sub-sets of the master set comprising command parameters, limits parameters and measurement parameters are used to control the operation of a weld tip, a clamping system and a motion head that cooperate under computer control to carry out the multiple processes.

Abstract: A welding system having a traveling base carriage, a carriage positioning mechanism engaging the base carriage; and a ring gear assembly mounted on the base carriage. The ring gear assembly will include: (i) two half ring sections, each having at least one gear track; (ii) a ring gear mount attaching each of the half ring sections to the base carriage, where the ring gear mounts allow the half ring sections to separate and guide the half ring sections into mating engagement. The system further includes at least one weld head assembly mounted on the ring gear assembly. The weld head assembly includes: i) a welding torch; ii) a torch positioner, and iii) a position sensor.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of determining a welding process parameter for an object comprises subjecting a specimen removed from the object to a controlled specimen welding process, measuring a property of the specimen, and determining a welding process parameter associated with the object from the measured specimen property and the controlled specimen welding process. In one disclosed embodiment the method permits the determination of a welding process parameter of a full scale pipe by use of a specimen removed from the pipe, or a similar pipe.