Abstract: A screen printer in which a photoelectric sensor and squeegees are fixed to a slider, when outward movement printing in which solder on a screen is rolled by an outward movement of the right squeegee is completed, the right squeegee is separated from a state of contacting a right end of a solder roll and a squeegee position pl at that time is input, and, subsequently, the slider is returned until the photoelectric sensor detects a left end of the solder roll and a squeegee position p2 at this time is input. An amount (a solder roll width) of solder remaining on the screen is calculated by subtracting a movement amount from the squeegee position p1 to the squeegee position p2 from a distance from the right squeegee to an optical axis position of the photoelectric sensor on the screen.

Abstract: A flange bolt cutter for separating two connected flanges. The flange bolt cutter contains a circular saw blade connected to an flange mount which can be vertically adjusted relative to the flange mount and/or includes two arms which can be pivotally adjusted relative to each other.

Abstract: In an apparatus and a method for welding of workpiece layers, a feed device is activated with a predefined adjustment force without ultrasound activation and the sonotrode is advanced in the direction of an anvil. The adjustment force is subsequently reduced and the sonotrode is activated. The sonotrode can subsequently be deactivated and the adjustment force can be increased on the basis of a deactivation signal.

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED.

Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.

Abstract: A method of operating a wire bonding machine is provided. The method includes: detecting a short tail condition after formation of a wire bond formed using a wire bonding tool; providing a bond head assembly of a wire bonding machine at an xy location of the wire bonding machine, the bond head assembly carrying the wire bonding tool; lowering the bond head assembly toward a contact surface at the xy location with a wire clamp of the wire bonding machine closed; opening the wire clamp; decelerating the bond head assembly as it is lowered toward the contact surface such that a portion of a wire extends below a tip of the wire bonding tool; closing the wire clamp; and performing a test to determine if an end of the portion of the wire extending below the tip of the bonding tool is in contact with the contact surface.

Abstract: An apparatus includes a connector and is configured to mount to a machine having multiple axes of control. A control signal on the connector determines a path of a rotating tool holder.

Abstract: Devices and methods for indicating power on a torch. In one example, a welding or plasma cutting torch includes an indicator coupled to the torch. The torch also includes control circuitry coupled to the indicator and configured to provide a first signal and a second signal to the indicator. The indicator is configured to receive the first signal when at least one of welding power and arc starting power from a power supply is available at the torch and to receive the second signal when the at least one of active welding power and the arc starting power from the power supply is not available at the torch.

Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.

Abstract: To provide a method of friction welding and an apparatus of friction welding in which a length of time for manufacturing one product is reduced as much as possible regardless of the dimension errors of works. The fast forwarding distance Lx1 is calculated for the fast forwarding by using the results of measuring the dimensions of works W1, W2 under the condition of the constant slowly forwarding distance Lx2, Thereby, for the work of a legitimate dimension and even for the work having a dimension smaller than the legitimate dimension, the elongation of the slowly forwarding distance is prevented compared with the work having the longer dimension than the legitimate dimension, and the relative proportion of the fast forwarding distance Lx1 is increased by making shorter the specified slowly forwarding distance.

Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.

Abstract: A method and machine for producing welded reinforcing steel rod mats for use in the production of DIN-conforming reinforced concrete components having primarily no static loads, and to such a reinforcing steel rod mat, uses a welding device, one or more reinforcing steel rods, and one or more stay braces in the case of uniaxial reinforcing steel mats, positioned relative to each other with position control and optionally with position correction of the reinforcing steel rods to be welded together, and a reinforcing steel rod is welded in the area of at least one of the ribs thereof to a stay brace, or to another reinforcing steel rod in the area of at least one of the ribs of the rod.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: A method and a device for improving the quality of the weld seam in friction stir welding is provided. The process of friction stir welding is effected by means of a friction welding tip, in which a spiral conveyor screw is provided in the spindle bearing. The longitudinal axis of the spindle bearing is inclined at an angle to the vertical. The sliding surface of the rotating spindle consists of a flat sliding surface and, for the welding of curved seams, in each case of a sliding surface inclined at an acute angle to the sliding surface, the friction welding tip is designed in the shape of a truncated cone. The lateral surface of the truncated cone is formed by six trapezoidal planar parts, of which three planar parts each uniformly distributed at the circumference lie at an angle of 120 degrees with respect to one another and account for a proportion greater than ? at the circumference.

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Abstract: A screen printer includes: a substrate holder that holds a substrate; a mask to be contacted with the substrate; an imaging device that images the substrate; an elevation mechanism that moves up the substrate holder at a below-mask-position below the mask based on a result of the imaging to contact the substrate with the mask; a horizontal moving mechanism that moves the substrate holder between the below-mask-position and a retreat position retreated in a horizontal direction from the below-mask-position; a printing head that moves on the mask contacted with the substrate and prints a paste on the substrate via the mask; and a mask cleaner that cleans a lower surface of the mask with the substrate separated from the mask by the elevation mechanism. The imaging of the substrate and the cleaning of the mask are performed with the substrate holder positioned at the retreat position.

Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

Abstract: An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality.

Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.

Abstract: In a method for producing welded pipes from steel, in which strips or metal sheets are formed into a pipe provided with a longitudinal or helical slot and the abutting edges of the slotted pipe are welded together, the process parameters for production of the pipes are specified on the basis of previously ascertained material properties and geometry of the strips or metal sheets.

Abstract: A tool driving section of a friction stir spot welding device is configured to cause each of a pin member and a shoulder member to advance and retract, and is controlled by a tool driving control section. A press-fit reference point setting section sets a position where the pin member or the shoulder member contacts an object to be welded as a press-fit reference point, and the tool driving control section controls the position of the pin member with respect to the shoulder member on the basis of the press-fit reference point, thereby controlling the press-fit depth of a rotating tool press-fitted from the surface of the object to be welded. This achieves the excellent welding quality at suitable precision according to welding conditions especially in a double-acting friction stir spot welding method.

Abstract: A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly.

Abstract: A method for semi-automatically reconditioning a railcar articulated connector that comprises a male portion including a parent casting material is provided. The method comprises applying weld material to a male portion of an articulated connector, mounting a housing mounting a housing defining an interior space to the male portion, the male connector within the interior space, centering and stabilizing the fixture laterally on the male portion, inserting a clamping mechanism attached to the housing within an opening of the male connector to affix the housing to the male portion, securing the clamping mechanism to a surface of the male portion, and automatically machining at least a portion of the weld and/or parent casting material.

Abstract: A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source port defining a passage having an inlet positioned to allow viscous material to flow into the elongate chamber, a pair of blades defining a slot that provides an outlet from which viscous material can flow out of the elongate chamber, an elongate plunger movable in the elongate chamber to reduce a volume of viscous material within the elongate chamber, and at least one sensor to detect pressure of the viscous material within the elongate chamber.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.

Abstract: Multi-stranded wires are clamped between an ultrasonic welding tip and an opposing anvil. The multi-stranded wires are made of a material that is more malleable than copper, or of a material that has a malleability that is substantially the same or greater than the malleability of aluminum. The plurality of multi-stranded wires can be clamped between opposing side surfaces to further form the wire bundle. Ultrasonic energy is applied to a first side of the wire bundle adjacent the ultrasonic welding tip. After termination of ultrasonic energy to the first side, the wire bundle is rotated 180 degrees relative to the anvil and ultrasonic energy is applied to a second side of the wire bundle, wherein the second side is oppositely disposed relative to the first side.

Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract: A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a).

Abstract: A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: A display panel includes a display configured to display an image by receiving a drive signal, and a pad region including first and second pads groups configured to receive the drive signal from an external and to provide the received drive signal to the display, wherein the first pad group includes a plurality of first pads extending along a plurality of first imaginary lines, wherein the second pad group includes a plurality of second pads extending along a plurality of second imaginary lines, and wherein the plurality of first imaginary lines converges into a first point and the plurality of second imaginary lines converges into a second point, the first point and the second point are located at different positions.

Abstract: A tool welding system is disclosed that includes a table that heats a tool. A multi-axis robot includes a welding head that is moved relative to the table in response to a command. A controller is in communication with the robot and generates the command in response to welding parameters. The weld parameters are based upon a difference between an initial tool shape and a desired tool shape. The difference between the initial tool shape and the desired tool shape corresponds to a desired weld shape. The desired weld shape is adjusted based upon initial tool shape variations, which includes thermal growth of the tool. The tool is welded to provide the desired weld shape to achieve a desired tool shape.

Abstract: A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a).

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: Disclosed is a wire bonder comprising: a processor; a bond head coupled to the processor, the processor being configured to control motion of the bond head; a bonding tool mounted to the bond head, the bonding tool being drivable by the bond head to form an electrical interconnection between a semiconductor die and a substrate to which the semiconductor die is mounted using a bonding wire; and a measuring device coupled to the bond head, the measuring device being operable to measure a deformation of a bonding portion of the bonding wire as the bonding tool is driven by the bond head to connect the bonding wire to the semiconductor die via the bonding portion.

Abstract: A method for monitoring and controlling a vibration welding system includes collecting sensory data during formation of a welded joint using sensors positioned with respect to welding interfaces of a work piece. A host machine extracts a feature set from a welding signature collectively defined by the sensory data, compares and correlates the feature set with validated information in a library, and executes a control action(s) when the present feature set insufficiently matches the information. A welding system includes a sonotrode, sensors, and the host machine. The host machine is configured to execute the method noted above.

Abstract: A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.

Abstract: An apparatus according to the invention may include one or more fuses placed on a printed circuit board on which an printed circuit board assembly is formed. Each fuse changes in response to ambient thermal conditions beyond a threshold temperature. The change can be detected with a testing apparatus such as in in-circuit tester after a process such as a solder assembly process to determine whether the process was performed within the desire temperature range. Fuses may be positioned at different locations on the printed circuit board to provide localized and differentiated temperature measurements. An array of fuses may be designed to change at a progressing sequence of ambient temperatures to enable trends in the process temperature to be recorded. Temperature data may be recorded and linked to an identifier on the apparatus such as a product serial number.

Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.

Abstract: A method of identifying and selecting welding electrodes and welding output parameters on a welding power source is provided. The method includes identifying electrodes and/or electrode packaging with distinct colors and/or patterns which correspond to properties of the electrode. The method also may include employing distinguishable identifying markings on a power supply which correspond to the electrodes to be used to allow for easy setting of output parameters.

Abstract: A method for manufacturing an LED package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an LED chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the LED chip onto the substrate; and heating the substrate and the LED chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the LED chip, a total resistance of the LED chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit.

Abstract: A thermocompression bonding method for mounting semiconductor chips on a substrate comprises: picking up the semiconductor chip with a chip gripper displaceably mounted on a TC bonding head; positioning of the chip gripper above the assigned substrate location; lowering the TC bonding head up to a position in which the chip gripper is deflected by a predetermined distance relative to the TC bonding head; heating of the semiconductor chip to a temperature above the melting point of the solder, so that the deflection of the chip gripper becomes zero again; waiting until the temperature of the semiconductor chip has fallen to a value beneath the melting temperature of the solder, and lifting of the TC bonding head.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: Some exemplary implementations of this disclosure pertain to an integrated circuit package that includes a substrate, a first die and a second die. The substrate includes a first set of traces and a second set of traces. The first set of traces has a first pitch. The second set of traces has a second pitch. The first pitch is less than the second pitch. In some implementations, a pitch of a set of traces defines a center to center distance between two neighboring traces, or bonding pads on a substrate. The first die is coupled to the substrate by a thermal compression bonding process. In some implementations, the first die is coupled to the first set of traces of the substrate. The second die is coupled to the substrate by a reflow bonding process. In some implementations, the second die is coupled to the second set of traces of the substrate.

Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.

Abstract: The present invention relates to a weight balancer (100) and a pipe joining method that is capable of reducing a load of pipes when arranging and welding the pipes in ships, plants, piping work sites and the like.

Abstract: A method of making an aerofoil blink comprising a plurality of aerofoil blades joined to a disc to extend radially outwardly therefrom is provided. The method includes the step of: (a) modelling a linear friction welding process in which a blade member is joined to the disc, the blade member having a stub for joining to the disc, wherein the modelling provides results which are indicative of the welding power at positions along the stub during the welding process; (b) identifying adaptations to the stub using the modelling results to compensate for differences in welding power along the stub during the welding process; (c) providing a blade member having a stub with the identified adaptations; and (d) joining the provided blade member to the disc by the linear friction welding process.

Abstract: A welding tractor is described as well as a process for using the tractor in which a predefined angle of inclination or declination is maintained during a circumferential welding process.