Abstract: The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.

Abstract: A method, and apparatus for performing the method, for the ultrasonic contacting wired connection of electrical circuits to metallic leadframe strips, which apparatus essentially includes a bonding head with the energy transducer located thereon for feeding to the process point of the leadframe strip and for producing a longitudinal vibration amplitude is supplied with a first voltage, the bonding head is associated a measuring head fixed to a machine base, and the measuring head has an optical/electrical sensor which measures the instantaneous amplitude of the longitudinal vibration of the infeed of the bonding head and determining a correction factor mathematically from the measured quantities obtained, and the first ultrasonic value for the vibration amplitude of the energy transducer is calibrated with the correction factor.

Abstract: A die bonding apparatus includes a device for making a coarse surface in a region where an identifier is to be applied to a lead frame; an application device for applying the identifier to the coarse surface region, a dividing device for dividing a wafer into chips, a test device for testing the wafer which has not been divided into chips yet in positions corresponding to the prospective chips, a storage device for storing information about positions of the chips on the wafer and the test results, a die bonding device picking out the chips from the wafer for die-bonding them to the lead frame having the identifier, a reading device for reading the identifier of the lead frame to which the chips are to be die-bonded, an information processing device for adding information which the identifier contains to the test results and position information about each of the chips to make test information, and an output device for outputting the test information.

Abstract: A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic assembly (including bare circuit board or boards in the manufacturing process), such as soldering/desoldering and various other production, rework and repair processes including cleaning, fluxing, preheating, thermocompression bonding and spot welding. In accordance with various embodiments, a layer of a first conductor material is applied on a first surface of an electrically insulative support, while a second layer of a second, dissimilar, conductor material is applied to at least one other surface of the support using conventional printed circuit board construction techniques.

Abstract: A wire bonding method includes a step of calculating the tracking parameters which determine the motion track of a capillary, from a function that has its variables a tracking wire loop length equivalent to the distance between the bonding point on the lead frame and the bonding point on a chip electrode, and amounts that the chips protrude from the positions of the bonding points on the chip electrode to the side of a lead frame electrode, and a step of performing drive control of the capillary in accordance with those calculated values.

Abstract: Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.

Abstract: A wire bonding method that uses plurality of bonders so that each samples treated by the respective bonders are collected via single sample correcting line, in which bonders perform bondings at different points on the samples and/or performs marking bonds at different points thereon, resulting in that the bonder that has performed the bonding can be easily recognized by examining bonding points.

Abstract: A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.

Abstract: In bonding a number of pads which may have different heights within a predetermined tolerance the bonding tool (28, 24, 14, 10) is moved in slow speed search mode (70) to contact the first pad (P.sub.1) and store the height (H.sub.1) of the first pad (P.sub.1). After a predetermined amount of continued overtravel (OT.sub.1) the bond is performed and the tool raised. Operations on other pads may occur at this point. The tool is then moved to a point above the location of the second pad. The tool is moved down to the second pad without a search mode but to a second pad target height (H.sub.1 +OT.sub.2) that is the sum of the sensed height of the preceding pad and an overtravel distance.

Abstract: Solder tape automated bonding of leads to an integrated circuit chip is performed using a constant temperature, flat faced thermode and a clamping plate to keep the leads in contact with the integrated circuit chip.

Abstract: A soldering system includes a visualization station disposed in relatively close proximity to the final resting position of a circuit element to be soldered, and a back lighted head arrangement for helping transport the circuit element to the visualization station, and for helping facilitate the clear visualization of the element so that its position may be adjusted for possible misalignment at the time of its placement at the final position.

Abstract: Determination of the quality of blind solder interconnections by X-ray inspection is made possible by forming indicator features on the pads of a component and the pads of the surface on which the component is to be mounted. The indicator features consist of an area which is different in size and/or shape than that of the other pad to be joined. For example, the indicator feature may be a circular region with an area approximately twice that of the pad to which it is to be joined. A relatively large amount of solder is deposited on the smaller pad and the two pads are placed in contact. During reflow, the molten solder on the smaller pad will flow to cover the full area of the indicator feature, indicating that a good interconnection was obtained. The indicator features may also be a different shape from that of the pad to which it is to be joined so that the solder deposited on the pad will take on the shape of the indicator feature when successful interconnection is achieved.

Abstract: An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate.

Abstract: A friction welding apparatus for preparing weldments by fictional contact of the weld members which includes sensors for measuring torque, axial forces, and other variables important to the control of the welding process, and for facilitating the obtainment of process information useful in correlating process conditions with weld quality. The apparatus includes means for the substantially frictionless coupling of the component providing the axial normal force on the aligned shafts upon which the weld pieces are mounted. The coupling, which contributes to accurate torque measurements, comprises a substantially frictionless, single-contact-point coupling provided by the point of contact between two adjacent spherical surfaces.

Abstract: A feedback signal of an ultrasonic generator (13) employed in a ball bonder (11) is sampled by an analog-to-digital converter (23) under control of a microprocessor (25) to provide a "bond signature" indicative of bond quality. The microprocessor (25) then compares the bond signature to limits representing a good quality bond to provide an indication of a good or failed bond. The indication may be visually provided by projecting the bond signature and limits on a display (27), as well as automatically provided by a programmed comparison.

Abstract: The inventive method for packaging electronic component parts on a substrate by eutectic bonding after the substrate has been heated to exceed the eutectic temperature is designed to observe the thermal expansion of the substrate with a camera and moves the substrate stage in accordance with the observation result so as to modify the mount coordinates of the component part, thereby compensating the displacement of component parts caused by the substrate thermal expansion.

Abstract: An apparatus for assembling semiconductor devices includes a transportation line for transporting partially fabricated articles such as lead frames with a semiconductor chip mounted thereon; a working unit disposed in the transportation line for processing the partially fabricated articles by wire bonding or die bonding; an inspection unit disposed separately from the transportation line; a delivery unit for extracting a processed article from the transportation line, moving the extracted worked article to an inspection section and returning the processed article to the transportation line after checking; and a stock unit for stocking the processed articles. In the inspection section, one of the processed articles selected for sampling inspection is placed on a support and is checked with a microscope. During checking, the support and the microscope can be moved relative to each other to enable observation of the whole of the selected article.

Abstract: A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connections by inspecting the bonding test patterns. The bonding test patterns can be implemented in a variety of configurations which verify several properties of the soldering process.

Abstract: A method for inspecting the placement and alignment of surface mounted components on printed circuit boards during assembly. After the component is placed on the board, an infrared camera provides an image of leads on the component and corresponding soldering pads, to which the leads are to be soldered, on the board in a single exposure. The image is then processed by a computer and the position and orientations of the leads of the component with respect to the soldering pads are determined. As a result, any unsatisfactory misalignment of the component can be detected and defective printed circuit boards identified.

Abstract: A method for heating a patterned substrate having electronic components, using a heat control mask having plural apertures is disclosed. Heat transfer rates associated with the apertures are determined by thermodynamic analysis based on the discrete two-dimensional heat conduction equation treating heat from the heater as an advection.

Abstract: A ball bonding method and apparatus is disclosed including gold wire bonding. The steps include positioning and lowering a bond capillary (10) with a bond wire (11) including a flame-scarfed bond wire ball (12) downwardly onto a first bonding pad (17). The bond wire ball (12) is welded by heating and applying a bonding pressure or ultrasonic, or both. The bond capillary (10) is raised and moved to form a loop (21), followed by the step of welding the bond wire (11) to a second bonding pad (16) using heating and applying pressure, ultrasonic or both. The bond capillary (10) is raised to a tail-length position (29) and the bond wire (11) is broken by a vertical pulling force created by closing a clamp (13) onto the wire and raising the clamp (13) engaging the bond wire (11). The end of the free bond wire is flame-scarfed to form a bond wire ball (12).

Abstract: A method for repairing interconnect interruptions with congruent preforms. Congruent preforms that bridge an interconnect interruption are utilized for repairing interconnects whose width lies in the range from 50 through 70 .mu.m and whose course is fashioned meander-like. Interconnects having a width of about 150 .mu.m can be repaired with previous repair methods. Due to miniaturization of the interconnects, a special method for monitoring the congruent alignment between the preform and the interconnect at the location of the interruption as well as for monitoring the symmetrical bridging of an interconnect interruption is needed. This monitoring method occurs by monitoring with video camera, whereby the location of the interconnect interruption and the environment thereof, a preform that is congruent therewith, and the positioning of this preform relative to the interconnect interruption are viewed at different positions.

Abstract: Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.

Abstract: A method and an apparatus for preparing a bonding wire, such as gold wire, drawn in contact-free manner from a bonding wire spool mounted in rotary manner about its longitudinal axis and supplied to a bonding device for forming circuits on electronic components. The apparatus constructed as a subassembly essentially comprises an electromotively-driven bonding wire spool carrier arranged on a support plate and a removal station provided with an optronic sensor. The bonding wire is deflected by means of air flows (P' or Q') for forming a bonding wire reserve in the removal station and the wire position is scanned by the optronic sensor. In the case of a decreasing bonding wire reserve, a signal is produced as a function of the bonding wire position, which is processed in a signal evaluation unit and is transmitted to a control unit, by means of which an electromotive drive operatively connected with the spool carrier is operated.

Abstract: A method for repairing interconnect interruptions. Faults at the interconnects occurring in manufacturing processes of printed circuit boards were previously repaired with suitable methods. The fashioning of the interconnects in a meander form and their miniaturization requires a completely new procedure. The dimensions of current interconnects amount, for example, to: width.times.height=70 .mu.m.times.20 .mu.m. For repairing such interconnects that are usually arranged in extremely tight proximity on an interconnect carrier, it is necessary to position preforms utilized for repair absolutely congruently on the interconnect interruption and to hold them until the joining zones are completely formed between the preform and the interconnect. This is achieved by use of an insulating foil having work windows and by use of a preform panel that contains a plurality of preforms.

Abstract: Fabrication of the test structure is functionally illustrated in FIG. 9. More specifically, the first step in the process is to machine the cavity 40 in the third body of austenitic material 42, as functionally illustrated at reference numeral 80. After the cavity 40 has been machined, the fault sample 34 is installed into the cavity by heating the third body of austenitic material 42 and cooling the fault sample 34. This process is functionally illustrated at reference numeral 82. After installation of the fault sample 34, the interface is welded to seal the junction and the combined structure HIP bonded, as functionally illustrated at Reference Numerals, 84 and 86. After bonding the test structure is machined into the desired configuration, as functionally illustrated at Reference Numeral 88.

Abstract: In the brazing of a component which comprises a carbide substrate carrying a layer of PCD (polycrystalline diamond) to a steel body, appropriately shaped brazing shims are placed between mating surfaces which are to be brazed. The component is forced towards the steel body and the steel body is heated uniformly across its surface where brazing is to take place. This is achieved by means of an induction heater placed adjacent the steel body at a position remote from that surface of the steel body where brazing is to take place. The local temperature at the PCD layer is monitored continuously and the heating process controlled so that this local temperature does not exceed 750.degree.. After brazing, the component and steel body are permitted to cool down slowly to ambient temperature.

Abstract: A method is provided for repairing fuel tanks. The method includes defuming the fuel tank, removing rust and tar from the surface of the tank, coating the exterior surface of the gas tank with a plastisol compound and heating the plastisol compound to cure the compound and bond the compound to the fuel tank. The method provides a fast and inexpensive procedure for repairing fuel tanks.

Abstract: A method of monitoring bonding parameters during a bonding process. The method is based on the object of continuous monitoring of bonding parameters in order to provide adjustment of bonding machines and thereby increase the reliability of the bonded connections. A bonding force is measured by a wire strain gauge attached to a bonding arm and an ultrasound amplitude is measured by a piezo-electric sensor secured to the bonding arm. The method can be used with all bonding machines which work with ultrasound.

Abstract: A workholder having top and bottom frame portions defining a cavity through which a leadframe passes is described. Dew point, moisture, ports are placed in one of the top or bottom frame portions to allow continuous, real time monitoring of the moisture level in the processing environment. A series of clamping an indexing means are integrally disposed within the frame portions of the workholder to clamp and index the leadframes.

Abstract: Disclosed is a method for bonding thermally-stable polycrystalline diamond or CBN compacts to carbide supports wherein the carbide support is placed in thermal contact with a heat sink and the thermally-stable compact is placed in thermal contact with a heat source during the brazing operation.

Abstract: A tool positioning system comprises a discontinuity detection means, such as an eddy current system, for detecting a discontinuity within a workpiece resulting from a joint between a first piece of material relative to a second piece of material, the discontinuity being detected from the back side of the second piece of material. The discontinuity is detected at a plurality of points by translating an eddy current probe over the back side of the second piece of material, the individual points thereafter being utilized to compute line elements that define the joint between the first and second pieces of material in a continuous fashion over the surface of the second piece of material. Thereafter a tool, such as a laser welding tool, is guided along the computed position along the backside of the second piece of material such that the first and second pieces of material are welded together along the joint.

Abstract: An apparatus and method for making high-speed wire bonds between a semiconductor chip and a chip carrier. A chuck supported on a pushrod passing through a rotating sleeve holds the chip and provides Z- and theta- motions, while the bonding head provides X- and Y- movements relative to the chip. Limiting the bonding head to X- and Y- motions significantly reduces the dynamic forces on the bonding head and supporting mechanism, thereby enabling a faster rate of reliable operation. A signal source directly contacts the pushrod to provide reference signals to control circuitry regarding the position of the anvil and chip supported thereon.

Abstract: A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).

Abstract: A bond quality monitor and method for monitoring and analyzing the relative quality of bonding operations performed by ultrasonic bonding machines is disclosed. The bond quality monitor (40) includes an analog bond monitoring circuit (42) and a digital microcomputer (44). The bond monitoring circuit, which is placed in series between an ultrasonic signal generator (26) and its corresponding ultrasonic transducer (18), monitors the transducer power signal generated by the ultrasonic signal generator and performs a series of analog computations based on the logarithm of the impedance of the transducer in order to create a measure of bond quality. The microcomputer controls the operation of the bond monitoring circuit and performs comparisons to determine bond quality relative to previously monitored good quality bonds.

Abstract: An optical video system for the inspection and repair of TAB lifted leads. Three distinct light sources are aligned at different angles to illuminate the side of a lead-solder-pad joint. Each of the surfaces of the joint are readily distinguished.

Abstract: A method for manufacturing thin-walled hollow bodies comprising concentric layers forming thin-walled structural parts of chemical installations subjected to stress at high temperatures, thereby replacing non-layered pipes of single-metal materials. Due to the methods of manufacture, structural parts of these single-metal materials have disadvantages because the single materials of which they are built cannot simultaneously satisfy the demands of corrosion resistance, high-temperature stability and resistance of scaling. According to the new method, for example, thin-walled pipes of concentric, non-corrosive, high-temperature stable, and non-scaling material layers are intended to be produced. For the non-corrosive inner layer, for example, a conventional thin-walled pipe is used.

Abstract: A rotary cylinder is tested by loading in two fixed and one movable locations until a location of the movable point is found at which no, or a predetermined amount of, distortion takes place in the vane slot. The cylinder is then welded into a shell at the three points without producing distortion of the vane slot or with a predetermined distortion.

Abstract: The absence of a wire (40) in proper position under the bonding tool (32) of an ultrasonic wire bonder is detected by energizing the bonder transducer (14) while the wire is pulled to break it after the second bond (B) has been made. The pulling of the wire to break it changes the transducer impedance, which is monitored to signal presence or absence of a wire in its proper location.

Abstract: A fixture is provided for testing thin sheet metal specimens to evaluate hot-cracking sensitivity for determining metal weldability on a heat-to-heat basis or through varying welding parameters. A test specimen is stressed in a first direction with a load selectively adjustable over a wide range and then a weldment is passed along over the specimen in a direction transverse to the direction of strain to evaluate the hot-cracking characteristics of the sheet metal which are indicative of the weldability of the metal. The fixture provides evaluations of hot-cracking sensitivity for determining metal weldability in a highly reproducible manner with minimum human error.

Abstract: The invention is directed to a method for performing remotely-manipulated rk on a conduit of a nuclear facility. The method of the invention is for maintaining pipe conduits in a radioactively contaminated cell such as a large-area cell of a reprocessing facility for irradiated nuclear fuel. The defective conduit portion to be removed is sawn out of a conduit and a replacement conduit segment is welded into the conduit. In order to provide for rapidly and accurately welding the replacement conduit segment into the conduit, the step of machining the two conduit end portions is combined with the step of determining the inside dimension between the conduit end portions formed by the step of sawing out the defective conduit portion. An apparatus for carrying out the method of the invention is also disclosed.

Abstract: In a method of building an automobile body separate upper and lower body modules (50, 78) are formed, incorporating the roof area and the floor area of the automobile respectively, precision mating locations (62) on the body modules are used first as reference for fitting interior parts and equipment to the respective modules and then for fitting the modules together. An assembly line for carrying out the method has respective sets of stations for forming operations on upper and lower body modules, a mating station (30) at which the two modules are brought together and a joining station (32) where they are, for example, welded. The leading station (20, 22) in each set determines a master body point (64, 82) on a module presented to it, and forms the mating locations (62) on the module with reference to the master body point.

Abstract: A wire bonding apparatus and method incorporating a pattern recognition system wherein there is stored, in a teach mode, signatures representing a pre-determined point on a chip to be bonded, the signatures being obtained at respective 90.degree. locations of the pedestal which carries the chip. Automatic re-calibration provides for rotating the pedestal to each of four 90.degree. apart spaced angles and finding the respective recorded signatures and the corresponding positions, and calculating the true center of rotation as a function of the four positions thus found. A specialized algorithm is used for correcting error which may be introduced if the chip is not rotated at precisely 90.degree. intervals during the process of finding the respective signatures. The system carries out re-calibration automatically every N packages bonded.

Abstract: A solder joint inspection feature (86) for evaluating the solder joint (88) securing a contact solder tail (58) of a surface mount connector to a printed circuit board (2). A solder joint inspection feature (86) is incorporated in the solder tail (58) of contacts (40) in a surface mount electrical connector a predetermined distance from the end. When the solder tails (58) are soldered, such as to traces (4) on a printed circuit board (2), an acceptable solder fillet (88a) will cover the inspection feature and thus the inspection feature (86) will not be visible. If the distal end (61) of the solder tail (58) is not close enough to the trace or if the fillet is formed with insufficient solder, the solder joint (88b) is unacceptable as indicated by the visible solder joint inspection feature (86).

Abstract: A welding monitor for use with a welding system is described. The monitor comprises a store (74) for storing at least two sets of predetermined acceptable ranges for one or more welding parameters such as voltage and current. A comparator bank (66,67) is provided for each parameter to compare the operating value of each parameter in use with the corresponding stored range or ranges. A display including sets of light emitting diodes (18-20) displays information relating to the stored ranges and operating values and is responsive to the comparator banks (66,67) to indicate the relationship between an operating value of at least one of the parameters and the corresponding predetermined range.

Abstract: The ultrasonic energy applied to a workpiece to be welded in an ultrasonic welding operation, over a predetermined welding time, is measured by processing the output of a load cell beneath the workpiece to produce a signal voltage for comparison with a predetermined reference voltage corresponding to the accumulated ultrasonic energy that should have been applied to the workpiece during said predetermined time to satisfactorily weld the workpiece. A one-shot timer is started at the commencement of the welding operation. If the comparison reveals that signal voltage has reached the reference voltage before the timer has run out, a success signal is generated to indicate the completion of the welding operation.

Abstract: A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow solderiung utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material.

Abstract: A printed circuit board having an electrically insulative substrate, an electroconductive layer formed on the electrically insulative substrate, and a resist layer formed on the electroconductive layer which has a row of openings whose distances between adjacent ones increase from one end to the other end of the row.

Abstract: A head (158) precisely registers an article (10) to a site for operations such as bonding. The article (10) may be an electronic chip (10) containing a plurality of sides (12-15) having top edges for engaging the head (158) and bottom edges for registering to a topside (95) of a pedestal (20). A body (161) has an upper portion adapted for support and a lower portion terminating in a downwardly presented, working face (159). Face 159 includes a cavity (166) formed by walls (167-170) having inwardly and upwardly directed surfaces (171-174) for engaging corresponding top edges of the chip (10). The chip (10) is at least partially disposed within the cavity (166) making it difficult for an operator to see, especially when a fixed microscope is required for viewing. A bore (175) communicates with the cavity (166) and may be connected to a vacuum source for drawing a chip (10) into the cavity and for removably engaging the same to the engaging surfaces (171-174).

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member containing a fusible solder insert, solder flux and a thermochromic composition which undergoes a visible change from a colored to a colorless state at the soldering temperature. Solderable substrates are positioned within the device and heat is applied until the soldering temperature has been reached, as indicated by a color change of the thermochromic composition. The soldering temperature is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Typically this temperature is at least about 20.degree. C. above the melting temperature of the solder.