Abstract: Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the assembly and measuring the conductivity or resistance of the contacted solvent to determine the presence of flux residue in the solvent obtained from the assembly. Embodiments include contacting the assembly with isopropanol by immersing and withdrawing the assembly in a fixed amount of the solvent and measuring the conductivity of the contacted solvent with a volt meter.

Abstract: A process for correctly positioning layers of a multilayer printed circuit. A flat closed circuit is attached peripherally on each layer. Each layer is arranged parallel to multiple circuits that are fixed on a reference board. An alternating current flows in one of the fixed circuits. The alternating current electromagnetically induces a current in the flat closed circuit, which in turn electromagnetically induces electromotive forces in other fixed circuits. The characteristic values of the electromotive forces are a function of the relative positions of the fixed circuits with respect to the flat, closed circuit. These values are used to correct the position of each layer on which the circuit is attached until each layer or parts of each layer are stacked in a predetermined position relative to at least parts of the fixed circuits. The corrected position is the position which each layer must maintain in the multilayer circuit. The layers are secured by hot soldering of interposed sheets of synthetic resin.

Abstract: The invention is an apparatus and method for assessing the solderability of electronic component leads and adjacent mounting surfaces. The apparatus and method enables assessment of solderability of fine pitch surface mount components that may be “leadless” or have such small leads that other methods are unable to make measurements required for assessing solderability. The invention also provides a reliable automated test technology for electronic component solderability. It is based on the use of measurements of the distinctive changes in the IR radiation signal of a wetted soldered connection during the solder reflow process, resulting from rapid changes in emissivity of the materials. This is accomplished through the use of an IR camera connected to a computer, and a substrate heater controlled by the computer to achieve a predetermined temperature profile at the component leads.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A sheet metal component, obtained by press-forming a one-piece metal sheet comprised of two metal sheets into a desired shape, has an expanding portion having an external appearance varying in dependence on a weld state of a weld portion of the one-piece metal sheet at which the two metal sheets are welded at their confronting ends. In manufacturing the sheet metal component, the one-piece metal sheet is transferred between upper and lower dies of a pressing machine and is positioned such that its metal sheet section including part of the weld portion is disposed between a punch formed in the lower die and a recess formed in the upper die so as to face the punch. The metal sheet section is pressed by the punch to be subject to plastic deformation, whereby the expanding portion is formed.

Abstract: In diffusion bonding a metal pipe 112e and a metal pipe 114e via a bonded interface 116e formed at the end parts, a portion that is inclined with respect to the radial direction of metal pipes 112e and 114e is provided at least at part of bonded interface 116. In this case, the inclination angle &phgr; of bonded interface 116e and the tip angle 2&thgr; of a pipe expansion tool 130 are preferably in the relationship, 0<&phgr;≦&thgr;+60°. In performing pipe expansion of such a metal pipe bonded body 110e, the pipe expansion tool 130 is moved from the metal pipe 112e, at which the inclined portion of junction face 116e is formed to have a protruding shape, towards the metal pipe 114e, at which the inclined portion of junction face 116e is formed to have a recessed shape. Furthermore, the inner diameter at the vicinity of the junction face of the metal pipe junction may be made larger than the inner diameter at positions away from the junction face.

Abstract: A computerized system and method for identifying and correcting bond placement errors in a bonder pre-programmed to attach connecting bonds onto bond pads of an integrated circuit by first providing a sacrificial bond pad for a sacrificial bond, then using a vision system associated with the bonder to determine the actual center of the pad as the intended bond location, and instructing the bonder to place a bond in the pre-programmed center of the pad. Second, the vision system is used to determine the actual location of the bond. Next, the error between the intended location and the actual location is determined by computing distances and directions between the pre-programmed and actual centers and the actual bond location. Finally, a new command of the bonder is computed such that a repetition of the initial error would cause the bond to be located in the actual center of another pad. This new command is input to the bonder.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: A motor vehicle body assembly and welding station comprises a pair of facing tool (12) support conformators (11) designed to work on the body and taken between them by a conveyor system (14). The conformators are movable between a rest position in which the body is free to enter and exit the station and a work position in which the tools are near the body to work on it. At least some of the tools (12) comprise measurement means (20) for the relative position of facing body parts and the conformators have an intermediate position between said work and rest positions. On command control means (19) take the conformator into said intermediate position and activate the measurement means (20) to determine the agreement of body dimensions with predetermined measurement intervals and issue acceptance or rejection signals (22) for the body on the basis of the survey result.

Abstract: Assuming that the processes of joining, rolling, coiling, etc. of a material is evaluated by a preset speed pattern after the extraction from a heating furnace, the required time is predicted and calculated for both of a preceding material and a following material. At the time when the following material can catch up with the preceding material at an aiming position on the line, the following material is extracted from the heating furnace according to the result of the above prediction calculation. Control is carried out so that both of the preceding material and the following material finish the process at a preset speed. Also, the traveling speed of the following material is controlled according to the position and the speed of the tail edge of the preceding material in a section close to the catch-up position so that a distance between the tail edge of the preceding material and the leading edge of the following material be closed.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process.

Abstract: A method for reworking integrated circuit (IC) wafers having copper-metallized bond pads covered by deposited layers of a barrier metal and a bondable metal. After identifying the wafers with off-spec metal layers, the wafers are chemically etched using selective etchants consecutively until the metal layers over the bond pads are removed without damaging the copper metallization. Replacement metal layers are finally deposited over the bond pads. Specifically, the bondable metal, such as gold, is selectively removed by a cyclic dithio-oxamine compound, dissolved in tetra-hydro-furane or acetone. The barrier metals, such as nickel and palladium, are removed by a mixture of inorganic and organic oxidizing acids.

Abstract: A method and an arrangement for measuring the cooling rate and temperature differential between the top and bottom surfaces of a printed circuit board. The method is intended to facilitate control over the temperature differential which is encountered between the top and bottom of the printed circuit board so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longditudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes generating an ultrasonic output table. In the table, the current status of the bonding process is represented as a function of the gradient of deformation of the wire, the impedance of the transducer-bond wedge unit, as well as the currently reached deformation of the wire. The desired gradient of deformation of the wire, a function of the particular status of the process, is specified as the desired value. A correcting variable for the ultrasonic generator is calculated by the addition of correction values formed in the controller to the respective current table values.

Abstract: A method for examining bonded-metal by ultrasonic examination, the method comprising a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a sending probe and received by a receiving probe through a bonding interface, the sending probe and the receiving probe being disposed on the bonded-metal with putting the bonding interface therebetween, the bonded-metal being bonded under unknown condition, and a step of examining a bonding property of the bonded-metal based on the attenuation amount, with utilizing a relationship between a bonding property and an attenuation amount for standard metal bonded under known condition measured preliminarily.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: An apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions according to the present invention comprises a linear guide member for guiding said bonding head in the X and Y axial directions, a XY moving means for providing a moving force in the horizontal (X and Y axial) directions to said linear guide member by causing an induced electromotive force, a Z moving means for providing a moving force in the vertical (Z axial) direction to a block of said bonding head by causing an induced electromotive force, a hinge means for converting said moving force of said Z moving means into a rotating force, and functioning as a rotation center so that the block is rotated in the direction to a wire clamp motion. Thus, the present invention is not necessary additional device, the assembly is simple and the volumn of entire apparatus is reduced. In this case, since weight to be moved is reduced due to the reduce of volumn, the position control of the bonding head is perfored accurately.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: A method of monitoring the alignment of pipes to be welded end to end involves supporting a reference bar extending generally parallel to, and external of, the pipes so as to span a weld position of which the ends of two pipes are to be welded, performing measurements of perpendicular distance between the bar and each pipe at two predetermined distances from the end of each pipe, determining the thickness of the walls of the pipes, determining the slope of the exterior of each pipe with respect to the reference bar, calculating from the slopes the difference between the distances from the bar to the outer surface of each of the two pipes to the weld position, so as to provide a measure of the misalignment of the outer surface of the pipes at the weld position, differencing the wall thicknesses of the pipes to provide a wall thickness difference, and subtracting the wall thickness difference from the misalignment of the external walls of the pipe to determine the misalignment of the inner surfaces of the pipes

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.

Abstract: In a ball mount apparatus for mounting balls on a work by means of a mount head, the work is disposed under the mount head and the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction. A ball tray for storing the balls is disposed at a height between the mount head and the work and provided with a driving mechanism for reciprocating between a ball sucking position under the mount head and a stand by position.

Abstract: A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary descends so that the end of the tail contacts the tail length measuring member; a position of the capillary or a distance by which the capillary is lowered at the time that electrical continuity is established with the tail length measuring member is detected; and the tail length is calculated based upon a height level of the tail length measuring member, the position of the capillary before being lowered for measuring the tail, and the position of the capillary when the wire contacts the tail length measuring member, or upon the height of the capillary above the tail length measuring member before lowering the capillary for measuring the tail, and a distance the capillary is lowered.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

Abstract: A process for profiling solder joints of circuit boards including solder bumps is provided using an arrangement with a thin tape element with length and width dimensions generally corresponding to the length and width dimensions of the ball grid array (BGA) and with a registration portion. Thermal couple probes are positioned on the element at locations corresponding, based on the registration portion, to critical locations of the BGA requiring profiling. The element is disposed underneath the BGA and secured in position with the element in registration with the solder bumps on the BGA and with the plurality of thermal couples connected to the element such that the thermal couples are positioned corresponding to the critical locations requiring profiling. The tape element may be kapton tape. The registration may be provided with a portion of the element having holes, each hole being of a size to go over a solder bump on the BGA.

Abstract: The present invention relates generally to an improved laser welded work piece, such as an automotive body panel, and a system and method for the manufacture thereof. The invention is also directed to an improved system for manufacturing the welded work piece including an improved laser welder and a laser weld inspection device and system.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Abstract: Two polygon shaped articles having walls of different thicknesses are mated and welded together. Specimens cut from this composite part are used to evaluate the performance of welded joints with the influence of design, processing conditions such as welding, molding, and the like, and material composition. The evaluation advantageously provides an accurate predictor for linear vibration, orbital vibration, hot plate, hot gas, hot gas extrusion and infrared welding at a variety of bead thicknesses.

Abstract: The quality of bonding between a conductive ball and a conductive pad of a lead frame strip of an IC package are determined by etching the conductive ball from the conductive pad, and analyzing the bottom view of the conductive ball. The conductive ball is comprised of a first conductive material and a conductive pad is comprised of a second conductive material. The conductive ball is bonded to the conductive pad by formation of an intermediary material formed from the first conductive material of the conductive ball and the second conductive material of the conductive pad. The lead frame strip is immersed within an etching solution such that the intermediary material is etched between the conductive ball and the conductive pad until the conductive ball may be decoupled from the conductive pad.

Abstract: The present invention is to provide an apparatus and a method for detecting a double bonding error that a wire ball is in contact with a wire loop previously formed between a pad and a lead, by using the position of the wire ball and comparing a reference voltage with the voltage on a wire when the wire ball is in contact with either the pad or the wire loop.

Abstract: A method of soldering a bumped work without using flux is provided by the steps of vacuum-sucking the bumped work on a head, pressing a bump against a pad of another work, causing a projection of the bump to partially break an oxide film on the solder portion, to pierce it, and to be placed thereon, and cooling and solidifying the molten solder portion. The surface of the solder portion is coated by the oxide film as a hard shell, so that, even if the bump is firmly pressed against the solder portion, the solder of the solder portion does not flow sidewise, and a solder bridge is not produced.

Abstract: In method for forming a ball on a bonding wire, the tip end of the bonding wire that extends from a capillary is bent toward a discharge electrode, and the capillary is moved obliquely so that the tip end of the tail of the bonding wire faces the discharge electrode, and then an electric discharge is performed between the discharge electrode and the tip end of the wire, thus forming a ball on the tip end of the wire.

Abstract: A workpiece is held at a welding station by several clamps during welding. After welding, the workpiece is transferred to a checking station where a determination is made of the actual location of critical points on the workpiece. The actual critical point locations are compared with ideal critical point locations to determine if there is any error in the manner in which the workpiece was held by the clamps. If an error is determined, one or more of the clamps are adjusted to compensate for the error when holding a subsequent workpiece for welding. Apparatus is also provided for carrying out the method of this invention.

Abstract: A seam (16) between juxtaposed workpieces (14) is welded or heat-treated by friction-stir using a pin tool (12) driven by an apparatus (18) which controllably positions the pin tool (12) in the vertical direction (8). The workpiece (14) is supported by an anvil (22). The joint is heated by rotation of the pin tool (12) inserted into the joint from the obverse side. In order to provide a good weld through the thickness of the workpiece, a sensor (34, 310) senses electrical characteristics near the heated or welded region, and generates a control signal which tends to control the position of the pin tool near the reverse side of the weld. The sensor is located adjacent the weld (16s) on the obverse side, and is preferably protected by mounting in a depression (22c) in the anvil (22). In one embodiment, the sensor (34) senses magnetic characteristics near the weld. In another embodiment, the sensor (310) senses conduction, conductivity, or eddy currents in the vicinity of the weld.

Abstract: In a method for automatic multi-layer welding of a joint formed by two joint surfaces according to which method the contour of the joint in a number of cross-sections is established by means of a sensor emitting signals representative of the contour of the current cross-section of the joint. After evaluation, said signals control the deposition of the weld beads by means of a continuously fed electrode which is directed towards a welding zone in the joint.

Abstract: It is an object of the invention to provide a method and a device which can manufacture, by ultrasonic welding, a reel for use in a magnetic tape cartridge with an improved yield rate, while not only restricting the deformation of workpieces but also preventing the products from varying in quality. At least one of the amplitude of an oscillator power source 80 and pressure to be applied to workpieces in an ultrasonic welding operation are set high in the early stage of the ultrasonic welding operation and are then switched into lower levels in the middle of the ultrasonic welding operation when the workpieces, that is, upper and lower reels 4 and 5, begin to melt together.

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: A system and method that permits the accuracy of alignment of a transparent substrate relative to a second substrate to which it is bonded to be evaluated on-line, after the two substrates have been bonded together. The alignment of the two substrates is viewed through the transparent substrate as the bonded-together substrates are being transported between the station at which the bonding occurred and another processing station.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: So as to allow bonding precision to be confirmed on a bonding apparatus, both a confirmation substrate part and a confirmation chip part, which are flip-chip bonding confirmation parts used in the bonding of semiconductor devices that have daisy-chain type patterns, are formed as transparent plate-form members and daisy-chain type patterns are provided thereon.

Abstract: An improved method for teaching the location of a bond site on a selected lead finger of a semiconductor leadframe during a wire bonding process is provided. Initially, the location of the lateral edges and terminal edge of a tip portion of the lead finger is sensed by an automated vision system of a wire bonding apparatus. A width (W) and a longitudinal axis of the lead finger are then determined. The bond site is located along the longitudinal axis a predetermined distance of (W/2) from the terminal edge of the lead finger. The improved method allows greater accuracy in the placement of bond sites and precisely controls the length of the bond wire used during the wire bonding process.