Using Optical Viewing Means (e.g., Microscope) Patents (Class 228/105)
  • Patent number: 10489900
    Abstract: To facilitate setting of a parameter at the time of generating an inspection image from an image acquired by using a photometric stereo principle. A photometric processing part generates an inspection image based on a plurality of luminance images acquired by a camera. A display control part and a display part switch and display the luminance image and the inspection image, or simultaneously display these images. An inspection tool setting part adjusts a control parameter of the camera and a control parameter of an illumination apparatus. Further, when the control parameter is adjusted, the display control part updates the image being displayed on the display part to an image where the control parameter after the change has been reflected.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: November 26, 2019
    Assignee: Keyence Corporation
    Inventor: Daisuke Ando
  • Patent number: 10414104
    Abstract: A method for arranging a functional layer on a plastic component of a lighting device and a composite made of the plastic component and the functional layer, in particular a frame, an outer rim, a support frame, an inner lens, a retaining element, or the like is provided. The method includes that a film-like laminar composite is provided that has the functional layer and a substrate. The laminar composite is placed in a holding fixture. A vacuum is turned on in the holding fixture and suctioning of the laminar composite by means of a suction area of the holding fixture is performed. The plastic component is arranged on the laminar composite, and at least areas of the laminar composite are welded or bonded to the plastic component by means of a welding method or by means of an adhesive method.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: September 17, 2019
    Assignee: HELLA GmbH & Co. KGaA
    Inventors: Jennifer Dressel, Matthias Hahn, Sven Kinkel, Martin Mügge
  • Patent number: 10297276
    Abstract: Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: May 21, 2019
    Assignee: WESTERN DIGITAL (FREMONT), LLC
    Inventors: Wachira Puttichaem, Sarawut Waiyawong
  • Patent number: 10271436
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: April 23, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma
  • Patent number: 10262907
    Abstract: Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: April 16, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tim A. Bartsch, Jennifer Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo, Theron L. Lewis, Timothy P. Younger
  • Patent number: 10181451
    Abstract: A mounting apparatus includes: a mounting tool; a supporting mechanism; a first pressurizing mechanism having a Z axis motor as a drive source for moving the mounting tool in the vertical direction together with the supporting mechanism so as to apply a first load to the electronic component; a second pressurizing mechanism having a VCM as a drive source provided between the supporting mechanism and the mounting tool, and for moving the mounting tool in the vertical direction with respect to the supporting mechanism so as to apply a second load to the electronic component; a load cell; and a control unit configured to control driving of the first pressurizing mechanism and the second pressurizing mechanism, the control unit previously driving the second pressurizing mechanism to bring the load cell into contact with the supporting mechanism and generate precompression when the first load is applied by the first pressurizing mechanism.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: January 15, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Akira Sato, Kohei Seyama
  • Patent number: 10161865
    Abstract: An illumination system for recognizing material includes a measurement stage, a light-providing part, a light-receiving part, and a processing part. The measurement stage is upwardly open and the measurement target is located on the measurement stage. The light-providing part includes a plurality of illumination sections providing incident lights to the measurement target, and provides multi-directional incident lights to the measurement target from multiple upper directions at which the measurement stage is open. The light-receiving part receives single-directional reflection lights reflected by the measurement target according to the multi-directional incident lights provided by the light-providing part.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: December 25, 2018
    Assignee: DEEDIIM SENSORS INC.
    Inventor: Jang-Il Ser
  • Patent number: 9925624
    Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: March 27, 2018
    Assignee: Orthodyne Electronics Corporation
    Inventors: Jonathan Michael Byars, Garrett Leigh Wong
  • Patent number: 9784576
    Abstract: A calibration method for merging object coordinates and a calibration board device using the same are provided. The calibration board device has a plurality of characteristic points and a central reflection element. A center of the central reflection element has a central characteristic point. A distance sensor emits a distance sensing signal to the central reflection element, so as to obtain a central real coordinate. Intrinsic and extrinsic parameters of a camera is used to establish a transformation equation which transforms the central real coordinate into a central image coordinate. Finally, a calibration image of the calibration board device is retrieved, and the central characteristic point is searched, and the central image coordinate is projected on the calibration image whereby the central image coordinate is calibrated to aim at the central characteristic point on the calibration image, thereby generating extrinsic and intrinsic parameter parameters calibrated.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 10, 2017
    Assignee: Automotive Research & Test Center
    Inventors: Kuo-Ching Chang, Hsuan-Yu Huang
  • Patent number: 9769186
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to monitor network traffic to and from a device, compare the monitored network traffic to characteristics of the device to determine if the monitored traffic is outside the characteristics of the device, and take remedial action if the monitored traffic is outside the characteristics of the device.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: September 19, 2017
    Assignee: McAfee, Inc.
    Inventors: John D. Teddy, Ramnath Venugopalan, Cedric Cochin, Joel R. Spurlock
  • Patent number: 9621777
    Abstract: A component imaging device has: a head unit that has a first head row and a second head row; an imaging unit that images components held by heads; a moving device for moving the head unit; and an imaging control device. The imaging unit includes an image sensor and an optical system. The optical system includes a first light-guiding portion that guides light from a component of the first head row to the image sensor, and a second light-guiding portion that guides light from a component of the second head row to the image sensor. An optical path length of the first light-guiding portion is set so as to obtain a focused image, and an optical path length of the second light-guiding portion is set so as to obtain a focused image. The imaging control device controls the positions of the heads and the exposure timing.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: April 11, 2017
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Tadashi Onishi
  • Patent number: 9572293
    Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: February 14, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Yoshiyuki Hiroshima, Naoki Nakamura, Akiko Matsui, Tetsuro Yamada, Takahiro Ooi, Kohei Choraku
  • Patent number: 9470752
    Abstract: An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: October 18, 2016
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Joong-Ki Jeong, Yu-Jin Lee, Seung-Jun Lee, Bong-Ha Hwang
  • Patent number: 9466538
    Abstract: A method of improving chip-to-chip alignment accuracy for circuitry-including wafer-to-wafer bonding. The method comprises providing separate stages for holding first and second circuitry-including wafers, each stage including a plurality of adjacent thermal actuators arranged in an array integrated with the stage; determining planar distortions of a bonding surface of the first and second circuitry-including wafers; mapping the planar distortions for each wafer based on the relative planar distortions thereon; deducing necessary local thermal expansion measurements for each wafer to compensate for the relative distortions based on the mapping; translating the thermal expansion measurements into a non-uniform wafer temperature profile model and a local heat flux profile model for each wafer; aligning the first and second wafers; and bonding the first and second wafers together.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: October 11, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Spyridon Skordas, Subramanian S Iyer, Donald Francis Canaperi, Shidong Li, Wei Lin
  • Patent number: 9431365
    Abstract: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: August 30, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-dae Seok, Sang-yoon Kim, Hui-jae Kim, Jae-bong Shin
  • Patent number: 9162320
    Abstract: A chip attraction passage 23 is provided extending through a housing 5A, a tool base 13, and a bonding tool 14. When the chip attraction passage 23 is attracted by the vacuum source 32, a semiconductor chip 3 can be attracted to and held on the lower surface of the bonding tool 14. The tool base 13 is configured by laminating transmitting members 11 and 12. A connection passage 29, which is a main part of the chip attraction passage 23, is configured by a groove 12B formed on the upper surface of the transmitting member 12 and a through-hole 12A in the center of the transmitting member 12. When the semiconductor chip 3 is heated by laser beams L and bonded to a substrate 2, even if flux or the like adhering to bumps 35 transpires and adheres in the connection passage 29.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: October 20, 2015
    Assignee: SHIBUYA KOGYO CO., LTD.
    Inventors: Eiji Tanaka, Hiroyuki Yasuyoshi
  • Publication number: 20150102087
    Abstract: A method and a device for improving the quality of the weld seam in friction stir welding is provided. The process of friction stir welding is effected by means of a friction welding tip, in which a spiral conveyor screw is provided in the spindle bearing. The longitudinal axis of the spindle bearing is inclined at an angle to the vertical. The sliding surface of the rotating spindle consists of a flat sliding surface and, for the welding of curved seams, in each case of a sliding surface inclined at an acute angle to the sliding surface, the friction welding tip is designed in the shape of a truncated cone. The lateral surface of the truncated cone is formed by six trapezoidal planar parts, of which three planar parts each uniformly distributed at the circumference lie at an angle of 120 degrees with respect to one another and account for a proportion greater than ? at the circumference.
    Type: Application
    Filed: May 29, 2013
    Publication date: April 16, 2015
    Applicant: Grenzebach Maschinenbau GmbH
    Inventors: Johann Foerg, Martin Demharter, Andreas Reitenauer
  • Patent number: 8777086
    Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 15, 2014
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Jiang Wen Deng, Hei Lam Chang, Tim Wai Mak
  • Patent number: 8657605
    Abstract: Arc welding simulations that provide simulation of virtual destructive and non-destructive testing and inspection of virtual weldments for training purposes. The virtual testing simulations may be performed on virtual weldments created using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system). The virtual inspection simulations may be performed on “pre-canned” (i.e. pre-defined) virtual weldments or using virtual weldments created using a virtual reality welding simulator system. In general, virtual testing may be performed using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system), and virtual inspection may be performed using a standalone virtual weldment inspection (VWI) system or using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system).
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: February 25, 2014
    Assignee: Lincoln Global, Inc.
    Inventors: Matthew Wayne Wallace, Carl Peters
  • Patent number: 8657181
    Abstract: Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: February 25, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Chi Wah Cheng, Man Kit Mui
  • Publication number: 20130248583
    Abstract: Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.
    Type: Application
    Filed: June 25, 2012
    Publication date: September 26, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Bog Kim, Young Ju Lee, Seon Young Myoung, Suk Jin Ham, Seong Chan Park, Hyun Jung Lee
  • Patent number: 8496158
    Abstract: A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: July 30, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Fei Zong, Guoliang Gong, Meiquan Huang, Hejin Liu
  • Patent number: 8426769
    Abstract: The invention relates to a method of displaying and monitoring the profile of a weld bead (4), in which, placed inside the groove, there is an assembly (10) comprising, facing one another, an image acquisition means (11), a light source (12), the beam of which is directed towards said image acquisition means, and, between the image acquisition means and the light source, a mask (13); the optical axis of the image acquisition means (11) is oriented so as to be approximately parallel to the sidewalls (5, 6) of the groove (3); a light beam produced by the light source (12) is directed towards the mask (13) and the image acquisition means (11); a central shadow zone and a peripheral halo are formed by means of the light beam and the mask (13), said halo illuminating, approximately perpendicularly, the weld bead (4) and the sidewalls (5, 6); the profile of the weld bead (4) and the sidewalls (5, 6) are displayed on a display/monitoring means; and said assembly (10) is moved inside the groove (3) longitudinally and
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: April 23, 2013
    Assignee: Areva NP
    Inventors: Jean-Claude Ferlay, Jean-Mathieu Mestre-Bresson
  • Patent number: 8371027
    Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: February 12, 2013
    Assignee: Panasonic Corporation
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masahiro Kihara, Syoichi Nishi
  • Patent number: 8322591
    Abstract: A system for automated assembly and welding is disclosed. The system includes a pallet for receiving incoming workpieces; a workpiece holder having a plurality of electromagnets; a handling robot configured to transport incoming workpieces from the pallet to the workpiece holder; and a controller in communication with the workpiece holder and the handling robot. The controller is configured to determine an orientation of a workpiece positioned on the workpiece holder, and to selectively adjust an activation state of one or more electromagnets of the workpiece holder based upon the orientation of the workpiece. A method of assembling and welding workpieces is also disclosed.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: December 4, 2012
    Assignee: Caterpillar Inc.
    Inventors: Fernando Martinez Diez, Keith Alan Herman, Huijun Wang, Howard W. Ludewig, Mathew Mark Robinson
  • Publication number: 20120273554
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
    Type: Application
    Filed: July 2, 2012
    Publication date: November 1, 2012
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Christoph B. Luechinger, Orlando L. Valentin
  • Publication number: 20120228364
    Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).
    Type: Application
    Filed: October 12, 2010
    Publication date: September 13, 2012
    Inventor: Torsten Vegelahn
  • Patent number: 8240543
    Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 14, 2012
    Assignee: Panasonic Corporation
    Inventors: Syoichi Nishi, Mitsuhaya Tsukamoto, Masahiro Kihara, Masafumi Inoue
  • Patent number: 8113412
    Abstract: A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: February 14, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Nan-Hsin Tseng, Yun-Han Lee, Chin-Chou Liu, Ji-Jan Chen, Wei-Pin Changchien, Chien-Hui Chen
  • Patent number: 8091762
    Abstract: A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: January 10, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Chi Wah Cheng, Man Kit Mui, Hon Kam Ng, Hei Lam Chang
  • Patent number: 8091761
    Abstract: A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: January 10, 2012
    Assignee: Shinkawa Ltd.
    Inventors: Kenji Sugawara, Yong Ghen
  • Publication number: 20110226840
    Abstract: A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.
    Type: Application
    Filed: November 13, 2008
    Publication date: September 22, 2011
    Applicant: The Regents of the University of California
    Inventors: Caglar O. Girit, Alexander K. Zettl
  • Patent number: 8002165
    Abstract: The invention relates to a method for connecting material webs disposed with overlapping edges, wherein an automatic welding machine having a driven chassis and a drive unit disposed thereon and a welding unit is guided along the overlap zone of the material webs to be connected, such that the carried welding unit connects the edges to be connected to one another. The invention further relates to an automatic welding machine for performing the method.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: August 23, 2011
    Assignee: LEISTER Process Technologies
    Inventors: Reto Zurbuchen, Ulrich Gubler
  • Patent number: 7899239
    Abstract: An inspection method of determining the bonded status of a wire ball bonded to a pad of a semiconductor chip is provided. An image of the bonding position between the pad and the ball is taken by an image-taking unit for detection of an in focus height of the pad, in focus height of an upper surface of the bonded ball, an external diameter of the bonded ball, and a ball bonded point respectively while switching a color of a coaxial illuminating light depending on the specific position for the inspection. Blue light can be used in the detection of the pad and an external diameter of the bonded ball while red or yellow light is used for detecting an upper surface of the bonded ball and the ball bonded point.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: March 1, 2011
    Assignee: Kaijo Corporation
    Inventors: Kimiji Nishimaki, Noritaka Horiuchi
  • Patent number: 7886956
    Abstract: A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: February 15, 2011
    Assignee: Shinkawa Ltd.
    Inventors: Kohei Seyama, Yutaka Kondo, Osamu Kakutani, Shigeru Hayata
  • Patent number: 7857190
    Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: December 28, 2010
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kuniyuki Takahashi, Shinsuke Tei, Noriko Suzuki, Noriko Mori, Shinji Maki
  • Publication number: 20100301101
    Abstract: A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.
    Type: Application
    Filed: July 22, 2010
    Publication date: December 2, 2010
    Applicant: SHINKAWA LTD
    Inventors: Kohei Seyama, Yutaka Kondo, Osamu Kakutani, Shigeru Hayata
  • Patent number: 7810698
    Abstract: An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: October 12, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Kwok Kee Chung, Wing Hong Leung, Ka Fai Fung, Chi Leung Vincent Mok, Shun Ming Kenneth Fung
  • Publication number: 20100143658
    Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a colour-imparting component with an appropriate colour to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The colour-imparting component is utilised to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.
    Type: Application
    Filed: January 22, 2010
    Publication date: June 10, 2010
    Applicant: Henkel Limited
    Inventor: Frank Timothy Lawrence
  • Publication number: 20100132873
    Abstract: Disclosed are an apparatus for monitoring a process of joining components and for retracing quality, at least sections of an image which has been recorded by a camera and has been reproduced by a screen being able to be stored together with an identity number in a memory device, and a method for using such an apparatus.
    Type: Application
    Filed: September 14, 2006
    Publication date: June 3, 2010
    Applicant: ASSA ABLOY IDENTIFICATION TECHNOLOGIES GMBH
    Inventor: Ulrich Lang
  • Patent number: 7709294
    Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: May 4, 2010
    Assignee: Checkpoint Systems, Inc.
    Inventors: Thomas J. Clare, Andre Cote, Eric Eckstein
  • Patent number: 7699209
    Abstract: A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not applicable are acquired from a memory unit; and when it is determined that a first bonding point is the predetermined bonding point, a non-bonding verification on the first bonding point is executed in the optical non-bonding detection step, and when the first bonding point is not the predetermined bonding point, then non-bonding detection on the first bonding point is executed in the electrical non-bonding detection step.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: April 20, 2010
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Shinsuke Tei
  • Patent number: 7686204
    Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 30, 2010
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kuniyuki Takahashi, Shinsuke Tei, Noriko Suzuki, Noriko Mori, Shinji Maki
  • Patent number: 7654436
    Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 2, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Wing Cheung James Ho, Hon Shing Eddie Law, Kam Hong Kenneth Lam, Wai Lok Ben To
  • Patent number: 7624904
    Abstract: A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding operation. The wire bonding machine further includes a camera configured to receive images of a portion of the bondhead assembly, the images being used to determine a position where a length of the transducer is substantially parallel to the bonding surface.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: December 1, 2009
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventor: John J. Smith
  • Patent number: 7597234
    Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: October 6, 2009
    Assignee: Oerlikon Assembly Equipment AG, Steinhausen
    Inventors: Patrick Blessing, Ruedi Grueter, Dominik Werne
  • Patent number: 7591408
    Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: September 22, 2009
    Assignee: Hess & Knipps GmbH
    Inventor: Frank Walther
  • Publication number: 20090078743
    Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 26, 2009
    Inventors: Wing Cheung James HO, Hon Shing Eddie LAW, Kam Hong Kenneth LAM, Wai Lok Ben TO
  • Patent number: 7380697
    Abstract: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes the outputs of the image sensor for any of luminance areas of the image taken by the image sensor using a sensor output characteristic table and can provide an image clearly showing both the very bright welding portion and the dark bead portion with a sufficient contrast allowing an observer to reliably recognize the objects in the image.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: June 3, 2008
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hideo Seki, Sukeyuki Shinotsuka, Makoto Furukawa, Koji Oda, Keiji Otsuka, Jiro Kirita, Nobuhiro Fueki, Hironori Watanabe
  • Patent number: 7337939
    Abstract: A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: March 4, 2008
    Assignee: Shibuya Kogyo Co., Ltd
    Inventors: Touru Terada, Yasuhisa Matsumoto