Abstract: Tubulars are joined to each other without rotation of the tubulars. A coupling is placed between the aligned tubulars and is supported for rotation or oscillating about its longitudinal axis. The tubulars are clamped in a manner that allows a compressive force to be transmitted to the coupling as the coupling is rotated. An induction device can preheat each connection site before friction welding and/or provide heat as the connection is made and is allowed to cool down. The process can continuously create a string of casing or liner that can be run in or drilled into a wellbore.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: A system and method for repairing and/or joining together multiple lengths of tubulars using friction stir joining, and a system for manipulating the tubular so that friction stir joining may be performed while the tubular is on a reel and/or at a field site.

Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.

Abstract: Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.

Abstract: A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force.

Abstract: Disclosed therein are an apparatus for and a method of welding a flange to a guide thimble tube in a nuclear fuel assembly. The automatic welding apparatus includes a welding unit located on an axially conveying line of a tube for welding a surface of the tube inserted thereinto and a surface of a flange, a flange supplying unit for supplying the flange at a tube inlet of the welding unit onto the axially conveying line, and a conveying unit mounted on the axially conveying line in such a way as to move the tube and the flange on the axially conveying line, so that they are inserted into and drawn from the welding unit.

Abstract: A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a second bond point to form a second bonding part, thus connecting the pad 2 and the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillary 6 is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.

Abstract: System for friction stir welding of two parts which includes a welding unit which includes at least one welding head fitted with a rotating pin and a counter-bearing unit which has a support surface to support the parts against a pressure exerted by the welding head, and wherein each welding head can be moved relative to the support surface in a first direction parallel to an axis of rotation of the rotating pin and in a second direction orthogonal to the axis of rotation, and wherein the support surface can be moved in the second direction and is formed of two coaxial clamp rollers which are set apart from each other.

Abstract: Arc welding simulations that provide simulation of virtual destructive and non-destructive testing and inspection of virtual weldments for training purposes. The virtual testing simulations may be performed on virtual weldments created using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system). The virtual inspection simulations may be performed on “pre-canned” (i.e. pre-defined) virtual weldments or using virtual weldments created using a virtual reality welding simulator system. In general, virtual testing may be performed using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system), and virtual inspection may be performed using a standalone virtual weldment inspection (VWI) system or using a virtual reality welding simulator system (e.g., a virtual reality arc welding (VRAW) system).

Abstract: A monolithic compressed-gas dryer including in series: an inlet chamber, a precooler/reheater chamber, an evaporator chamber, and a sump chamber. The chambers are welded together to form columns where at least one column has a filtration chamber. Further provided is a gas outlet. The system creates a first and second set of heat transfer passages where refrigerant passes through the second set in a heat exchange relationship in a direction perpendicular to incoming gas passing in the first set. The filtration chamber conducts chilled gas from the first set to a third set of heat transfer passages. The third set extends through the precooler/reheater in heat exchange relationship with the first set. Chilled gas passes in heat exchange relationship in a direction perpendicular to the incoming gas so that the incoming gas chilled in the evaporator exchanges heat with the incoming gas in the precooler/reheater.

Abstract: A method for reconditioning a railcar connector is provided. The method comprises machining a portion of a casting to create a wear plate application surface, positioning a wear plate on the wear plate application surface, and welding the wear plate to the wear plate application surface.

Abstract: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24 and the ultrasonic wave reflected from the joined object 20 is taken in. In this case, the joining region 21 and the joining strength is estimated by observing a reflected wave of the ultrasonic wave in the vicinity of a position, along a reference direction Z, corresponding to an interface 27 of two joining members, without using the reflected wave of the ultrasonic wave reflected from the joining tool plunging face, thereby inspecting the joined object based on the estimation result.

Abstract: Methods, devices, and systems for providing certification of friction stir welds are disclosed. A sensor is used to collect information related to a friction stir weld. Data from the sensor is compared to threshold values provided by an extrinsic standard setting organizations using a certification engine. The certification engine subsequently produces a report on the certification status of the weld.

Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: Method and apparatus for bonding an electrical circuit component onto a substrate. A first electrically conductive bonding pad is formed on the component, and a second electrically conductive bonding pad is formed on the substrate. One of said first and second bonding pads is physically split into at least two parts, with electrical discontinuity between the two parts. An electrically conductive bond is formed between the first and second bonding pads such that electrical continuity is established from one part of the one bonding pad, through the other of the bonding pads, and through the second part of the one bonding pad. The integrity of the electrically conductive bond is evaluated by testing electrical continuity between the at least two parts.

Abstract: A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe.

Abstract: A method for monitoring free air ball (FAB) formation during a wire bonding process includes attaching a dummy bond wire to an unused location on a first surface of a semiconductor chip carrier, extending the dummy bond wire a predetermined distance from the first surface such that a tip of the dummy bond wire is spaced from the first surface, and forming a dummy FAB at the tip of the bond wire. A profile of the dummy FAB is inspected with an imaging unit to identify any defects in the dummy FAB. An alarm is triggered and the wire bonding process is halted if the dummy FAB is defective so that bonding parameters may be adjusted. The wire bonding process is restarted after the bonding parameters have been adjusted.

Abstract: A system includes a host machine and a status projector. The host machine is in electrical communication with a collection of sensors and with a welding controller that generates control signals for controlling the welding horn. The host machine is configured to execute a method to thereby process the sensory and control signals, as well as predict a quality status of a weld that is formed using the welding horn, including identifying any suspect welds. The host machine then activates the status projector to illuminate the suspect welds. This may occur directly on the welds using a laser projector, or on a surface of the work piece in proximity to the welds. The system and method may be used in the ultrasonic welding of battery tabs of a multi-cell battery pack in a particular embodiment. The welding horn and welding controller may also be part of the system.

Abstract: A friction stirring and joining apparatus includes a tool holder; and pressing means provided ahead in the direction of joining by a tool held by the tool holder for pressing a junction surface of a workpiece. The pressing means includes a load imparting section that imparts a load toward the workpiece; a first abutting portion that is provided between the load imparting section and the tool held by the tool holder and abuts on the junction surface in the workpiece; a second abutting portion that is provided opposite the first abutting portion with respect to the load imparting section and abuts on the surface of the workpiece; and a supporting portion that is attached to the load imparting section and supports the first abutting portion and the second abutting portion.

Abstract: The invention relates to a method of displaying and monitoring the profile of a weld bead (4), in which, placed inside the groove, there is an assembly (10) comprising, facing one another, an image acquisition means (11), a light source (12), the beam of which is directed towards said image acquisition means, and, between the image acquisition means and the light source, a mask (13); the optical axis of the image acquisition means (11) is oriented so as to be approximately parallel to the sidewalls (5, 6) of the groove (3); a light beam produced by the light source (12) is directed towards the mask (13) and the image acquisition means (11); a central shadow zone and a peripheral halo are formed by means of the light beam and the mask (13), said halo illuminating, approximately perpendicularly, the weld bead (4) and the sidewalls (5, 6); the profile of the weld bead (4) and the sidewalls (5, 6) are displayed on a display/monitoring means; and said assembly (10) is moved inside the groove (3) longitudinally and

Abstract: Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.

Abstract: A method for joining studs to workpieces, in particular for the purpose of stud welding, comprising the steps of acquiring a distinguishing dimension of a stud to be joined by the application of a sensing element to the stud and through measurement of a travel distance of the sensing element as it is applied to the stud; and then joining the stud to a workpiece, if the dimension of the stud is within an allowable tolerance range, and the allowable tolerance range is adapted in dependence on the travel distance of the sensing element measured during a preceding method step.

Abstract: A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a color-imparting component with an appropriate color to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The color-imparting component is utilized to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.

Abstract: To improve reliability of a semiconductor device, in a flip-chip bonding step, a solder material that is attached to a tip end surface of a projecting electrode in advance and a solder material that is applied in advance over a terminal (bonding lead) are heated and thereby integrated and electrically connected to each other. The terminal includes a wide part (a first portion) with a first width W1 and a narrow part (a second portion) with a second width W2. When the solder material is heated, the thickness of the solder material arranged over the narrow part becomes smaller than the thickness of the solder material arranged in the wide part. Then, in the flip-chip bonding step, a projecting electrode is arranged over the narrow part and bonded onto the narrow part. Thus, the amount of protrusion of the solder material can be reduced.

Abstract: An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (?m) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 ?m and 125 ?m.

Abstract: Cutting elements include an ultra-hard body, e.g., comprising diamond, that is attached to substrate, e.g., comprising a cermet. An interface exists between the body and the substrate, and an angle of departure as measured between the interface and a free edge of the cutting element within one or both of the body and substrate, is less than about 90 degrees to provide a desired stress reduction along the interface. The angle of departure can be from about 3 to 87 degrees. The desired reduced angle of departure is provided by a surface feature disposed along an outer side surface of the cutting element adjacent a free edge of the interface. The surface feature can in the form of a groove disposed circumferentially around the body and/or substrate outer side surface, that is configured to provide the desired reduced angle of departure within the body and/or substrate.

Abstract: A method of laying a pipeline is described in which both internal and external weld passes are performed in order to weld together the pipe sections. The method includes arranging a pipe section adjacent to the end of a pipeline thereby defining a circumferential joint to be welded, performing an external weld pass, with for example GMAW—MIG torches, on the root of the joint to be welded during which weld material is deposited in the root of the joint to be welded, thereby forming a root weld, and then performing an internal weld pass, with for example a GTAW—TIG torch, on the root weld during which the root weld is melted and re-shaped. The method has particular application in relation to pipes clad with corrosion resistant alloy.

Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.

Abstract: In a method for producing hot-rolled sections of steel with a rectangular or square cross-section, a substantially round pipe blank produced seamlessly by hot rolling or cold finished and welded and having a defined nominal outside diameter is initially produced and then formed at a forming temperature into a hollow section having the required cross-section, with visible edges C1 and C2 of the hollow section having a value ?1.5×t (t=wall thickness). The pipe blank has a nominal outer diameter determined from a reduction ratio of the pipe blank to be achieved and the hollow section dimensions to be achieved, wherein the reduction ration lies within a range of ?2% to ?13% and is determined according to the following formula: Reduction ratio R[%]=[(2×(H+B))??×D]×100%/[2×(H+B)].

Abstract: A method of determining bonding agent coverage in a joint between a first substrate (10) and a second substrate (12), including: dispersing a marker material (18) throughout a bonding agent (16); melting the bonding agent (16) but not the marker material; solidifying the melted bonding agent (16) to form an actual bond (24) in a joint between the first substrate (10) and the second substrate (12); detecting the marker material (18) in the joint through at least one of the substrates to ascertain an actual bond (24); and comparing the actual bond (24) to an expected bond (28) for the joint to determine the bonding agent coverage.

Abstract: A construction method of a pipeline that forms a pipeline by joining tubular members to each other by butt welding, includes: a tubular member preparation step for preparing a tubular member having a smooth length of an outer surface along an axial direction from a joined end, which is set based on conditions of ultrasonic inspection of a welded portion, which are determined by usage conditions of the pipeline; a tubular member welding step for welding together prepared tubular members; and a welded portion inspection step for inspecting a welded portion by ultrasonic inspection.

Abstract: A method for batch brazing in a diffusion furnace includes inserting a plurality of fusible parts into a plurality of slots of at least one quartz boat, transporting the at least one quartz boat, including the fusible parts, into an interior of a reaction chamber of the diffusion furnace, sealing the interior of the reaction chamber, adjusting an atmosphere of the interior of the reaction chamber according to a recipe, moving a preheated furnace heating element from a location spaced apart from the reaction chamber to a location in substantial proximity with the reaction chamber to increase a temperature of the atmosphere of the interior of the reaction chamber above a predefined brazing temperature for a predefined brazing time period according to the recipe.

Abstract: The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility.

Abstract: A method for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is positioned during second bonding on a lead 74 to a point “p”, and then moved horizontally by a first distance of L1 toward a pad 73, and lowered to a point “r”; a second folding step in which the tip end of the capillary is raised from the point “r” to a height of H2 and then moved horizontally toward the lead 74 by a second distance of L2; and a third bonding step in which the center of the capillary is aligned with and then lowered to a point 87a on the lead 74 adjacent to the point 86a.

Abstract: A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.

Abstract: A method of determining the quality of a friction weld between two components, the method comprising joining two components together using a friction welding process, measuring the loss of length of the components as a function of time during the friction welding process, determining the double differential with respect to time of the loss in length of the components as a function of time, determining the quality of the friction weld by calculating the R2 value of the linear fit to the loss in length of the components as a function of time over a defined time period, determining the end of the defined time period by identifying the start of the final positive peak of the double differential with respect to time of the loss of length of the components as a function of time, calculating R2 from the least square difference of the linear fit over the defined time period of the loss of length of the components as a function of time and comparing the calculated value of R2 with acceptable values of R2 to determine

Abstract: There are provided an apparatus for monitoring bonding surface bouncing, a wire bonding apparatus having the same, and a method for monitoring bonding surface bouncing. According to an aspect of the present invention, the apparatus for monitoring bonding surface bouncing includes a sensor measuring a capillary height in real time during bonding and a bouncing detector extracting a change rate of a capillary height from the capillary height measured in real time during a bonding performing period and detecting of whether bonding surface bouncing is present by comparing the extracted change rate with a set reference change rate.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A component is repaired by removing a damaged region to form a cavity, in which layered repair inserts are installed. The profile of the cavity, and of the exposed surface of each repair insert is measured to serve as the basis for the contact surface of each subsequent repair insert. The repair inserts are fused to the wall of the cavity and to each other in a process in which heated locations of each repair insert are successively heated to minimise heat transfer within the repair inserts and in the underlying substrate material. The repair inserts may be made in a powder bed process from an alloy powder having the same composition as the material of the substrate.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A method, apparatus, system, and device provide the ability to form one or more solder bumps on one or more materials. The solder bumps are reflowed. During the reflowing, the solder bumps are monitored in real time. The reflow is controlled in real time, thereby controlling a morphology of each of the solder bumps. Further, the wetting of the solder bumps to a surface of the materials is controlled in real time.

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract: A method for monitoring and controlling a vibration welding system includes collecting sensory data during formation of a welded joint using sensors positioned with respect to welding interfaces of a work piece. A host machine extracts a feature set from a welding signature collectively defined by the sensory data, compares and correlates the feature set with validated information in a library, and executes a control action(s) when the present feature set insufficiently matches the information. A welding system includes a sonotrode, sensors, and the host machine. The host machine is configured to execute the method noted above.

Abstract: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24 and the ultrasonic wave reflected from the joined object 20 is taken in. In this case, the joining region 21 and the joining strength is estimated by observing a reflected wave of the ultrasonic wave in the vicinity of a position, along a reference direction Z, corresponding to an interface 27 of two joining members, without using the reflected wave of the ultrasonic wave reflected from the joining tool plunging face, thereby inspecting the joined object based on the estimation result.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.

Abstract: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24 and the ultrasonic wave reflected from the joined object 20 is taken in. In this case, the joining region 21 and the joining strength is estimated by observing a reflected wave of the ultrasonic wave in the vicinity of a position, along a reference direction Z, corresponding to an interface 27 of two joining members, without using the reflected wave of the ultrasonic wave reflected from the joining tool plunging face, thereby inspecting the joined object based on the estimation result.