Abstract: A method of method of resistance soldering may include providing a controllable electrical power supply having a negative pole and a positive pole. The method may include providing an electrical terminal having a first surface and a second surface opposite the first surface on which a solder layer is disposed. The method may include providing a resistance soldering device with an electrode having a first electrical conductor connected to the positive pole of the electrical power supply, a second electrical conductor connected to the negative pole of the electrical power supply, an electrically resistive bridge interconnecting the first and second electrical conductors. The method may include turning the electrical power supply on to provide an electrical current between the positive and negative poles. The method may include contacting the electrode to the first surface of the electrical terminal.

Abstract: A machine tool comprising: a first spindle; a second spindle provided on a rear headstock to face the first spindle; a barstock supply unit for supplying an elongate rod to the first spindle; and a processing means including a tool for processing the barstock, characterized in that the machine tool further comprises: a workpiece clamp device provided on the rear headstock and adapted to grip a second material comprised of the barstock that has been removed from the first spindle as an old material; and a joining means for joining opposite end portions of the second material gripped by the workpiece clamp device and of a first material gripped by the first gripping means and comprised of a barstock newly supplied by the barstock supply unit, thereby to integrate the second material and the first material into a single barstock.

Abstract: Systems and methods for distributed weld monitoring using jobs and job sessions are described. In some examples, a distributed monitoring system comprises a central monitoring station in communication with a user device and a local monitoring station. A user may use the user device to enter weld monitoring data that is subsequently received by the central monitoring station and stored in a central data repository. The central data repository may associate the weld monitoring data with welding data received from a welding device, as well as with a job session that is, in turn, associated with a job.

Abstract: The present disclosure discloses a pressure detection assembly and an ultrasonic welding device, the pressure detection assembly includes a first connecting piece, a second connecting piece, a detection unit and an elastic member, wherein the first connecting piece is provided with a first guide portion; the second connecting piece is connected to the first connecting piece, and the second connecting piece is provided with a second guide portion matched with the first guide portion; the detection unit is provided between the first connecting piece and the second connecting piece, and the detection unit is configured to collect the pressure value between the first connecting piece and the second connecting piece; and the elastic member is connected between the first connecting piece and the second connecting piece, wherein the elastic member can make the first connecting piece and the second connecting piece clamp the detection unit.

Abstract: Disclosed is a user guidance system (2) for cable, pipe or wire transits (1; 1a . . . 1n; 400) of a type which has one or more transit elements (10, 20, 30, 40; 42; 400) to form a sealed installation of one or more cables (7), pipes or wires. The user guidance system (2) comprises a communication network (60; 60a-c; 61, 61a-n, 62), and a computer resource (70) which is connectable to the communication network. The user guidance system (2) also comprises a plurality of transit indicator devices (50; 50a-50n; 250; 350; 450), each being connectable to the communication network (60; 60a-c; 61, 61a-n, 62) and each being located at or within a respective transit (1a-1n). The computer resource (70) is configured to receive a command (74) from an authorized user (4), and in response send a remote instruction (76) to one or more of the plurality of transit indicator devices (50; 50a-50n; 250; 350; 450) over the communication network (60; 60a-c; 61, 61a-n, 62).

Abstract: Images stored in an information repository are prepared for browsing. For each image in the repository, text in the repository is mined to extract snippets of text about the image which are semantically relevant to the image, and for each of these snippets of text, keyterms are detected in the snippet of text which represent either concepts that are related to the image or entities that are related to the image, and the snippet of text and keyterms are associated with the image. Each keyterm that is associated with each image in the repository is hyperlinked to each other image in the repository that has this keyterm associated therewith. A graphical user interface allows a user to browse the images in the repository by using their associated snippets of text and hyperlinked keyterms.

Abstract: A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

Abstract: A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.

Abstract: The present invention provides a mounting apparatus and a parallelism detection method in the mounting apparatus. The parallelism detection method in the mounting apparatus includes: a first height detection process of detecting first heights of a mounting tool when a holding surface comes into contact with the a tip of a triangular pin by placing the triangular pin on a placement surface of a stage and lowering the mounting tool; a second height detection process of detecting second heights of the mounting tool when the tip of the triangular pin comes into contact with the placement surface by holding the triangular pin on the holding surface of the mounting tool and lowering the mounting tool; and a parallelism calculation process of calculating the parallelism between the placement surface of the stage and the holding surface of the mounting tool based on the first heights and the second heights.

Abstract: A double curvature blade for a portion of system. The system may include a pump, such as a submersible pump. The pump may include a multiple or single stage pump. The pump may be powered by a selected motor.

Abstract: A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Abstract: A welding control device includes an actual position determination part configured to determine an actual position of the position control target on the basis of a weld characteristic amount detected from a captured image captured so as to include at least the position control target, the welding characteristic amount including at least one of a wire position of the weld wire or an electrode position of the electrode; a target position determination part configured to determine a target position being a target of the actual position corresponding to a weld condition for welding the weld target; and a position control part configured to execute a position control of the position control target to bring the actual position to the target position.

Abstract: According to one embodiment, a processing device performs at least determination processing of determining a state of a weld by using a first image of at least a portion of a weld pool. The state includes a first state, and a second state that is more unstable than the first state. The determination processing determines the weld to be in the second state when ripples exist in the weld pool. The processing device corrects a condition of the weld when the weld is determined to be in the second state. The processing device does not correct the condition of the weld when the weld is determined to be in the first state.

Abstract: The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

Abstract: A frame is described for positioning a battery using a vision system to determine at least one weld point on the battery. The frame includes at least one visual reference feature detectable by the vision system. The reference feature is used by the vision system to determine the weld point(s). For example, the at least one visual reference feature includes a pair of stubs that define a line, and the at least one weld point is determined based on the line. In a further example, the pair of stubs correspond to respective batteries, which are arranged adjacent to one another within the frame. In a further example, respective centers of the stubs are lined up along a center line extending from respective centers of respective end faces of the respective batteries. The vision system includes vision circuitry, processing circuitry coupled to the vision circuitry, and a weld system.

Abstract: A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.

Abstract: Methods and systems for detecting weld defects, and methods for manufacturing vehicles using such methods or systems, are provided. An exemplary method includes receiving an input indicating a weld material and material thickness by a portable computing device and determining, with the portable computing device, a detection protocol for the weld material and material thickness. Further, the method includes communicating the detection protocol from the portable computing device to a portable heating source and to a portable thermographic sensor, heating a weld with the portable heating source according to the detection protocol, and recording thermographic data from the weld with the portable thermographic sensor according to the detection protocol.

Abstract: A stationary electromagnetic inspection (EMI) apparatus and method are disclosed which includes a base; a plurality of hydraulic clamping rollers, connected to that base, operable to move a test pipe forward and backward in a translational direction only; a transverse flaw detection module comprising a plurality of sensor arms each equipped with rows of magnetic sensor arrays arranged in a stagger manner along an axis of a test pipe; and a longitudinal flaw detection module comprising magnetizers and magnetic sensor arrays each respectively arranged orthogonal to one another.

Abstract: A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

Abstract: Examples are described for predicting a thermal profile of a product in an oven using temperature measurements for each zone of the oven. An example method of producing a predicted thermal profile of a product in an oven includes measuring the temperature of each oven zone using a zone temperature sensor as the product transitions through the zone, and calculating the predicted thermal profile of the product using a baseline temperature profile and the measured temperatures of each zone at the time the product is in each zone. Parameters of the predicted thermal profile may be compared to thermal targets corresponding to a process specification for the product in order to determine whether the product was processed according to the process specification.

Abstract: Systems and methods for distributed weld monitoring using jobs and job sessions are described. In some examples, a distributed monitoring system comprises a central monitoring station in communication with a user device and a local monitoring station. A user may use the user device to enter weld monitoring data that is subsequently received by the central monitoring station and stored in a central data repository. The central data repository may associate the weld monitoring data with welding data received from a welding device, as well as with a job session that is, in turn, associated with a job.

Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Abstract: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.

Abstract: A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Abstract: An information processing apparatus includes: a processor configured to: if a part of a designated wiring or a designated component is arranged in an invisible wiring layer of a printed wiring board other than a currently visible wiring layer of the printed wiring board when superimposing and displaying, on a captured image of the printed wiring board, information related to the component or wiring which has been designated from among plural components and plural wirings arranged on the printed wiring board, display information related to the part of the designated wiring or the designated component on the currently visible wiring layer.

Abstract: A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

Abstract: A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Abstract: A target image of a target circuit board and a gold image of a gold circuit board are taken by an image acquisition system. Fiducial points are located on the target image and on the gold image. Perspective transformation is performed on the target image using the fiducial points on the target image for reference and on the gold image using the fiducial points on the gold image for reference. After perspective transformation, an anomalous section of the target image is identified by identifying pixels that have different intensities between the target image and the gold image, the anomalous section being indicative of an unauthorized modification to the target circuit board.

Abstract: A transmission shaft of a countershaft-type manual transmission is constructed from a plurality of hollow shaft portions which are butt press welded to one another, at least two of which hollow shaft portions are provided in each instance with at least one helical toothing of a fixed wheel of a spur gear stage. The hollow shaft portions provided with a helical toothing are connected to the respective adjacent hollow shaft portion in each instance so as to be rotated by a correction angle (??) around their center axis in proportion to a deviation (?x) from their axial target position, wherein the ratio between the correction angle (??) and the axial deviation (?x) corresponds to the pitch (s) of the helical toothing (??/?x=s).

Abstract: According to one embodiment, a display control system acquires a tilt of a detector with respect to a weld portion. The detector includes a plurality of detection elements arranged along a first arrangement direction and a second arrangement direction. The first arrangement direction and the second arrangement direction cross each other. The tilt is calculated based on a detection result of a reflected wave obtained by transmitting an ultrasonic wave from the plurality of detection elements. The system displays a user interface, displays a symbol and a tolerance range in a region included in the user interface, and updates the display of the symbol in the region according to the acquiring of the tilt. The region spreads two-dimensionally. The symbol indicates the tilt. The tolerance range is of a target value of the tilt.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven.

Abstract: A machine tool includes a first main shaft, a first drive source for moving the first main shaft, a second main shaft, a second drive source for moving the second main shaft, and a control means for carrying out a control so as to bring the workpiece held by the first main shaft and the workpiece held by the second main shaft into contact with each other while rotating them relative to each other, thereby to carry out the friction-heating, and to stop the relative rotation of the pair of workpieces and move only the second main shaft in the axial direction while holding the first main shaft stationary, thereby to carry out friction-welding of the pair of workpieces. The control means controls the operation of the first drive source upon the friction-welding of the pair of workpieces, so as to maintain the axial position of the first main shaft.

Abstract: According to an embodiment, an object tracking device in a welding process tracks and outputs a predetermined object in a welding image. The object tracking device comprises a camera device capturing the welding image including a base material and a welding torch for welding the base material, a controller receiving a plurality of camera control parameter-varied images from the camera device, identifying the predetermined object in the received images, and generating an object tracking image, the plurality of camera control parameter-varied images having varied camera control parameters of the camera device, and an output device outputting the welding image captured by the camera device, the plurality of images received by the controller, or the object tracking image generated by the controller.

Abstract: A counter support for friction stir welding, which makes it possible to also produce very long weld seams by friction stir welding despite a very compact design, is shown. Curved components and nn-straight weld seams may also be produced.

Abstract: A sonotrode includes multiple layers of a material melted to one another to form a structure. The structure provides a base that has an attachment feature that is configured to operatively secure to an ultrasonic converter. The structure includes a shaft that extends from the base to a terminal end that provides a working surface that is configured to selectively engage a workpiece.

Abstract: A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

Abstract: An embodiment of a method includes fabricating a first single crystal boule having a uniform composition and grain orientation. The first uniform single crystal boule is divided into a first plurality of layered shapes. The shapes of the first plurality are stacked with at least a second plurality of layered shapes along a first axis. The second plurality of layered shapes have at least one physical aspect differing from at least one corresponding physical aspect of the first plurality of layered shapes. The first plurality of layered shapes and at least the second plurality of layered shapes are joined via a field assisted sintering technique (FAST) to form a bulk component.

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.

Abstract: A friction stir welding device includes a friction stir welding tool equipped with a fixed shoulder on an outer periphery of a probe on a proximal end side, a main shaft positioning mechanism which relatively moves the friction stir welding tool with respect to a corner portion between workpieces a control device thereof, and a filler supply unit which supplies a filler to a stirring region in which the workpieces are stirred by the probe at the time of friction stir welding. When the probe is immersed into the corner portion to perform the friction stir welding, the fixed shoulder is maintained at a position separated by a gap from the surfaces of the workpieces with the control device.

Abstract: Cyclical testing of electrically conductive bonding (ECB) is provided. Cyclical testing comprises high current flows using multiples of max operating currents and monitoring sensors with periods of no current to accelerate testing of electrical connections employing ECBs.

Abstract: A circuit test structure including an interposer for electrically connection to a chip, wherein the interposer includes a conductive line, and the conductive line traces a perimeter of the interposer. The circuit test structure further includes at least three electrical connections to the conductive line. The circuit test structure further includes a testing site. The circuit test structure further includes a through substrate via (TSV) connecting the testing site to the conductive line.

Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

Abstract: A semiconductor device includes an interconnect substrate having a plurality of pads formed on a first surface thereof, a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface, a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes, and a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface, wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.

Abstract: A circuit board assembly inspection method includes the following steps: measuring a geometrical characteristic value of a solder layer before soldering an electronic component to a circuit board and comparing the geometric characteristic value with a predetermined value and defining the grad of the solder layer according to a comparing result of the comparing step and performing a defective product process to the circuit board having an extremely bad solder layer, measuring a quality characteristic value of a solder joint layer after soldering the electronic component to the circuit board and comparing the quality characteristic value with a predetermined quality parameter value and then defining the grade of the solder joint layer according to a comparing result of the comparing step, manually inspecting the circuit board assembly having both an medium-grade solder layer a the poor solder joint layer.

Abstract: According to one aspect of the present invention, an adhesive sheet material application device is disclosed, which includes a roller support bar, a roller support member, a first and second handle, and a roller. According to another aspect of the present invention, an adhesive sheet material application device is disclosed which includes a roller support member, a roller, and a second handle.

Abstract: An ultrasonic flaw detecting apparatus comprises an array prove, an element-group defining circuit, a calculator, a signal receiver and a generator. The array probe comprises a plurality of piezoelectric elements, each of the plurality of piezoelectric elements being configured to transmit and receive an ultrasonic wave to and from an inspection object. The element-group defining circuit is configured to select, as an element group, plural consecutive piezoelectric elements from the plurality of piezoelectric elements, set a reference position of the element group based on array arrangement information of the plurality of piezoelectric elements in the element group and based on a weighting value of each of the plurality of piezoelectric elements in the element group, and calculate a propagation path of an ultrasonic beam from the element group based on the reference position and a predetermined refraction angle.

Abstract: A system places a pin into at least one hole on an article. The system generally includes a moveable base on which the article is located, a press head for holding and inserting the pin into the hole, a first vision system to capture a first image of a designated hole on the article, and a second vision system to capture second and third images of the held pin relative to the press head respectively from two vantage points. A computing unit is configured to assign a relative coordinate consisting of a X-value and a Y-value being correspondingly indicative to an actual location of the hole, compute relative deviations presented between the held pin and the designated hole, and move the base to adjust the article in a manner correcting or compensating for the computed deviation prior to inserting the held pin into the hole.

Abstract: A manufacturing device (1), and a method for manufacturing saw blades (2) and for welding or soldering individually fed cutting elements (4) on a fed, toothed base blade (3) uses an electrical pressure welding device (6) having an advance able welding head (14). The relative position of the base blade (3) and the welding head (14) in the process area is detected by an automatic adjusting device (9) and, if necessary, adjusted or readjusted.