Abstract: A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Abstract: A welding control device includes an actual position determination part configured to determine an actual position of the position control target on the basis of a weld characteristic amount detected from a captured image captured so as to include at least the position control target, the welding characteristic amount including at least one of a wire position of the weld wire or an electrode position of the electrode; a target position determination part configured to determine a target position being a target of the actual position corresponding to a weld condition for welding the weld target; and a position control part configured to execute a position control of the position control target to bring the actual position to the target position.

Abstract: According to one embodiment, a processing device performs at least determination processing of determining a state of a weld by using a first image of at least a portion of a weld pool. The state includes a first state, and a second state that is more unstable than the first state. The determination processing determines the weld to be in the second state when ripples exist in the weld pool. The processing device corrects a condition of the weld when the weld is determined to be in the second state. The processing device does not correct the condition of the weld when the weld is determined to be in the first state.

Abstract: The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

Abstract: A frame is described for positioning a battery using a vision system to determine at least one weld point on the battery. The frame includes at least one visual reference feature detectable by the vision system. The reference feature is used by the vision system to determine the weld point(s). For example, the at least one visual reference feature includes a pair of stubs that define a line, and the at least one weld point is determined based on the line. In a further example, the pair of stubs correspond to respective batteries, which are arranged adjacent to one another within the frame. In a further example, respective centers of the stubs are lined up along a center line extending from respective centers of respective end faces of the respective batteries. The vision system includes vision circuitry, processing circuitry coupled to the vision circuitry, and a weld system.

Abstract: Methods and systems for detecting weld defects, and methods for manufacturing vehicles using such methods or systems, are provided. An exemplary method includes receiving an input indicating a weld material and material thickness by a portable computing device and determining, with the portable computing device, a detection protocol for the weld material and material thickness. Further, the method includes communicating the detection protocol from the portable computing device to a portable heating source and to a portable thermographic sensor, heating a weld with the portable heating source according to the detection protocol, and recording thermographic data from the weld with the portable thermographic sensor according to the detection protocol.

Abstract: A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.

Abstract: A stationary electromagnetic inspection (EMI) apparatus and method are disclosed which includes a base; a plurality of hydraulic clamping rollers, connected to that base, operable to move a test pipe forward and backward in a translational direction only; a transverse flaw detection module comprising a plurality of sensor arms each equipped with rows of magnetic sensor arrays arranged in a stagger manner along an axis of a test pipe; and a longitudinal flaw detection module comprising magnetizers and magnetic sensor arrays each respectively arranged orthogonal to one another.

Abstract: A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

Abstract: Examples are described for predicting a thermal profile of a product in an oven using temperature measurements for each zone of the oven. An example method of producing a predicted thermal profile of a product in an oven includes measuring the temperature of each oven zone using a zone temperature sensor as the product transitions through the zone, and calculating the predicted thermal profile of the product using a baseline temperature profile and the measured temperatures of each zone at the time the product is in each zone. Parameters of the predicted thermal profile may be compared to thermal targets corresponding to a process specification for the product in order to determine whether the product was processed according to the process specification.

Abstract: Systems and methods for distributed weld monitoring using jobs and job sessions are described. In some examples, a distributed monitoring system comprises a central monitoring station in communication with a user device and a local monitoring station. A user may use the user device to enter weld monitoring data that is subsequently received by the central monitoring station and stored in a central data repository. The central data repository may associate the weld monitoring data with welding data received from a welding device, as well as with a job session that is, in turn, associated with a job.

Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Abstract: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.

Abstract: A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Abstract: An information processing apparatus includes: a processor configured to: if a part of a designated wiring or a designated component is arranged in an invisible wiring layer of a printed wiring board other than a currently visible wiring layer of the printed wiring board when superimposing and displaying, on a captured image of the printed wiring board, information related to the component or wiring which has been designated from among plural components and plural wirings arranged on the printed wiring board, display information related to the part of the designated wiring or the designated component on the currently visible wiring layer.

Abstract: A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

Abstract: A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Abstract: A target image of a target circuit board and a gold image of a gold circuit board are taken by an image acquisition system. Fiducial points are located on the target image and on the gold image. Perspective transformation is performed on the target image using the fiducial points on the target image for reference and on the gold image using the fiducial points on the gold image for reference. After perspective transformation, an anomalous section of the target image is identified by identifying pixels that have different intensities between the target image and the gold image, the anomalous section being indicative of an unauthorized modification to the target circuit board.

Abstract: A transmission shaft of a countershaft-type manual transmission is constructed from a plurality of hollow shaft portions which are butt press welded to one another, at least two of which hollow shaft portions are provided in each instance with at least one helical toothing of a fixed wheel of a spur gear stage. The hollow shaft portions provided with a helical toothing are connected to the respective adjacent hollow shaft portion in each instance so as to be rotated by a correction angle (??) around their center axis in proportion to a deviation (?x) from their axial target position, wherein the ratio between the correction angle (??) and the axial deviation (?x) corresponds to the pitch (s) of the helical toothing (??/?x=s).

Abstract: According to one embodiment, a display control system acquires a tilt of a detector with respect to a weld portion. The detector includes a plurality of detection elements arranged along a first arrangement direction and a second arrangement direction. The first arrangement direction and the second arrangement direction cross each other. The tilt is calculated based on a detection result of a reflected wave obtained by transmitting an ultrasonic wave from the plurality of detection elements. The system displays a user interface, displays a symbol and a tolerance range in a region included in the user interface, and updates the display of the symbol in the region according to the acquiring of the tilt. The region spreads two-dimensionally. The symbol indicates the tilt. The tolerance range is of a target value of the tilt.

Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven.

Abstract: A machine tool includes a first main shaft, a first drive source for moving the first main shaft, a second main shaft, a second drive source for moving the second main shaft, and a control means for carrying out a control so as to bring the workpiece held by the first main shaft and the workpiece held by the second main shaft into contact with each other while rotating them relative to each other, thereby to carry out the friction-heating, and to stop the relative rotation of the pair of workpieces and move only the second main shaft in the axial direction while holding the first main shaft stationary, thereby to carry out friction-welding of the pair of workpieces. The control means controls the operation of the first drive source upon the friction-welding of the pair of workpieces, so as to maintain the axial position of the first main shaft.

Abstract: According to an embodiment, an object tracking device in a welding process tracks and outputs a predetermined object in a welding image. The object tracking device comprises a camera device capturing the welding image including a base material and a welding torch for welding the base material, a controller receiving a plurality of camera control parameter-varied images from the camera device, identifying the predetermined object in the received images, and generating an object tracking image, the plurality of camera control parameter-varied images having varied camera control parameters of the camera device, and an output device outputting the welding image captured by the camera device, the plurality of images received by the controller, or the object tracking image generated by the controller.

Abstract: A counter support for friction stir welding, which makes it possible to also produce very long weld seams by friction stir welding despite a very compact design, is shown. Curved components and nn-straight weld seams may also be produced.

Abstract: A representation of the electronic component to be mounted according to a production program is displayed so as to be superimposed on the image of the mounting area on the display device, and the production program is edited so that a mounting orientation of the electronic component matches an orientation of the pad pattern, in a case where the mounting orientation of the electronic component designated in the production program does not match the orientation of the pad pattern in the mounting area when an operator looks at the representation of the electronic component displayed so as to be superimposed on the image of the mounting area on the display device.

Abstract: A sonotrode includes multiple layers of a material melted to one another to form a structure. The structure provides a base that has an attachment feature that is configured to operatively secure to an ultrasonic converter. The structure includes a shaft that extends from the base to a terminal end that provides a working surface that is configured to selectively engage a workpiece.

Abstract: An embodiment of a method includes fabricating a first single crystal boule having a uniform composition and grain orientation. The first uniform single crystal boule is divided into a first plurality of layered shapes. The shapes of the first plurality are stacked with at least a second plurality of layered shapes along a first axis. The second plurality of layered shapes have at least one physical aspect differing from at least one corresponding physical aspect of the first plurality of layered shapes. The first plurality of layered shapes and at least the second plurality of layered shapes are joined via a field assisted sintering technique (FAST) to form a bulk component.

Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of

Abstract: The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.

Abstract: A friction stir welding device includes a friction stir welding tool equipped with a fixed shoulder on an outer periphery of a probe on a proximal end side, a main shaft positioning mechanism which relatively moves the friction stir welding tool with respect to a corner portion between workpieces a control device thereof, and a filler supply unit which supplies a filler to a stirring region in which the workpieces are stirred by the probe at the time of friction stir welding. When the probe is immersed into the corner portion to perform the friction stir welding, the fixed shoulder is maintained at a position separated by a gap from the surfaces of the workpieces with the control device.

Abstract: Cyclical testing of electrically conductive bonding (ECB) is provided. Cyclical testing comprises high current flows using multiples of max operating currents and monitoring sensors with periods of no current to accelerate testing of electrical connections employing ECBs.

Abstract: A circuit test structure including an interposer for electrically connection to a chip, wherein the interposer includes a conductive line, and the conductive line traces a perimeter of the interposer. The circuit test structure further includes at least three electrical connections to the conductive line. The circuit test structure further includes a testing site. The circuit test structure further includes a through substrate via (TSV) connecting the testing site to the conductive line.

Abstract: The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

Abstract: A semiconductor device includes an interconnect substrate having a plurality of pads formed on a first surface thereof, a semiconductor chip having a plurality of electrodes formed on a circuit surface thereof, the semiconductor chip being mounted on the interconnect substrate such that the circuit surface faces the first surface, a plurality of bonding members that are made of a same material and that electrically couple the pads and the electrodes, and a resin disposed on the first surface to encapsulate the semiconductor chip and to fill a gap between the circuit surface and the first surface, wherein the semiconductor chip is mounted on the interconnect substrate such that the gap between the circuit surface and the first surface progressively increases from a first side to a second side.

Abstract: A circuit board assembly inspection method includes the following steps: measuring a geometrical characteristic value of a solder layer before soldering an electronic component to a circuit board and comparing the geometric characteristic value with a predetermined value and defining the grad of the solder layer according to a comparing result of the comparing step and performing a defective product process to the circuit board having an extremely bad solder layer, measuring a quality characteristic value of a solder joint layer after soldering the electronic component to the circuit board and comparing the quality characteristic value with a predetermined quality parameter value and then defining the grade of the solder joint layer according to a comparing result of the comparing step, manually inspecting the circuit board assembly having both an medium-grade solder layer a the poor solder joint layer.

Abstract: According to one aspect of the present invention, an adhesive sheet material application device is disclosed, which includes a roller support bar, a roller support member, a first and second handle, and a roller. According to another aspect of the present invention, an adhesive sheet material application device is disclosed which includes a roller support member, a roller, and a second handle.

Abstract: An ultrasonic flaw detecting apparatus comprises an array prove, an element-group defining circuit, a calculator, a signal receiver and a generator. The array probe comprises a plurality of piezoelectric elements, each of the plurality of piezoelectric elements being configured to transmit and receive an ultrasonic wave to and from an inspection object. The element-group defining circuit is configured to select, as an element group, plural consecutive piezoelectric elements from the plurality of piezoelectric elements, set a reference position of the element group based on array arrangement information of the plurality of piezoelectric elements in the element group and based on a weighting value of each of the plurality of piezoelectric elements in the element group, and calculate a propagation path of an ultrasonic beam from the element group based on the reference position and a predetermined refraction angle.

Abstract: A system places a pin into at least one hole on an article. The system generally includes a moveable base on which the article is located, a press head for holding and inserting the pin into the hole, a first vision system to capture a first image of a designated hole on the article, and a second vision system to capture second and third images of the held pin relative to the press head respectively from two vantage points. A computing unit is configured to assign a relative coordinate consisting of a X-value and a Y-value being correspondingly indicative to an actual location of the hole, compute relative deviations presented between the held pin and the designated hole, and move the base to adjust the article in a manner correcting or compensating for the computed deviation prior to inserting the held pin into the hole.

Abstract: A manufacturing device (1), and a method for manufacturing saw blades (2) and for welding or soldering individually fed cutting elements (4) on a fed, toothed base blade (3) uses an electrical pressure welding device (6) having an advance able welding head (14). The relative position of the base blade (3) and the welding head (14) in the process area is detected by an automatic adjusting device (9) and, if necessary, adjusted or readjusted.

Abstract: Examples of an image sensor are disclosed. In one example, the image sensor comprises a dual-mode pixel cell operable in a first mode and in a second mode at different times, the pixel cell including a photodiode to receive incident light. The image sensor further comprises one or more configurable voltage sources coupled with the photodiode. In the first mode, the one or more voltage sources are configured to bias the photodiode to generate a quantity of charges that reflects a quantity of photons of the incident light received by the photodiode within a first exposure period. In the second mode, the one or more voltage sources are configured to bias the photodiode to generate a signal corresponding to a time when the photodiode receives a first photon of the incident light within a second exposure period for a time-of-flight measurement.

Abstract: According to the present invention, a power module includes an insulating substrate, a semiconductor device provided on the insulating substrate, an internal terminal provided on the insulating substrate and electrically connected to the semiconductor device, a sealing material that seals the internal terminal, the semiconductor device and the insulating substrate so that an end portion of the internal terminal is exposed, a case that is separate from the sealing material and covers the sealing material and an elastic member that connects the case and the end portion of the internal terminal.

Abstract: A structure design support device includes: an evaluation point information acquisition unit which acquires evaluation point information representing a position in a first state and a position in a second state, of an evaluation point provided in a structure which is configured of a plurality of parts, and a part to which the evaluation point belongs, among the plurality of parts; and an evaluation value calculation unit which calculates an evaluation value representing the magnitude of a change between the first state and the second state, of a positional relationship between a first evaluation point belonging to a first part and a second evaluation point belonging to a second part different from the first part to which the first evaluation point belongs, by using the evaluation point information acquired in the evaluation point information acquisition unit.

Abstract: A device (20) for installing a tubular junction sleeve inside a pipe (1), having a mandrel (20a) of longitudinal axis (XX) supporting on its surface at least a first peripheral chamber (21) having a wall (21a) that is radially expandable by inflation. The first wall including at least one electrical connector (21b) suitable for being connected to one end of said heater wire. The connector being connected to an umbilical (24) including at least a compressed air feed duct for inflating the first chamber and an electrical power supply duct connected to the electrical connector. The device being characterized in that the mandrel supports on its outer surface a second peripheral chamber (22) having a wall (22a) that is radially expandable by inflation, and also a weld inspection device (23) arranged in the longitudinal direction of the mandrel.

Abstract: The method of friction stir spot welding uses a database of stored optimization parameters to maximize welding strength for an input type of material and an input geometrical parameter of the material, such as its thickness. Experiments are performed for a variety of different materials having different thicknesses. Each experiment performed for each material and each thickness associated with the material measures the welding strength of a friction stir spot welding process for varying values of an initial dynamic welding parameter, a final dynamic welding parameter and a type of varying function. The values of the initial dynamic welding parameter, final dynamic welding parameter and type of varying function that maximize the measured welding strength for the selected material and its selected thickness are stored in a lookup table. A rotating tool may then be controlled using these optimized values in order to maximize welding strength.

Abstract: An electric resistance welded steel pipe having an identifiable seam portion and a method for manufacturing the same. The electric resistance welded steel pipe includes a steel pipe portion with a seam portion, which is formed by electric resistance welding, and a coating portion of zinc phosphate. The coating portion covers at least an outer surface side of the steel pipe portion. A part of the coating portion that is immediately above the seam portion forms a color difference portion that has a width W along a pipe circumferential direction of greater than or equal to 0.1 times a wall thickness of the pipe and less than or equal to the wall thickness of the pipe. The color difference portion has a visually identifiable color difference from the other parts of the coating portion.

Abstract: A system for forming a pipeline including fused pipe having straight pipe elements and one or more non-linear pipe subassemblies positionable at respective preselected locations on a predetermined path. The system includes a straight pipe processing subassembly and a finishing subassembly. The system also includes a second fusing module for fusing the non-linear pipe subassembly with a selected one of the straight pipe elements to include the non-linear pipe subassembly in the fused pipe, the second fusing module being attachable to the finishing subassembly.

Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.

Abstract: A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

Abstract: A method for manufacturing an electronic component includes positioning a first surface of a first component facing a second surface of a second component in a first state. The first surface has a first pad having a first center. The second surface has a second pad having a second center. At least one of the first or second pads includes a metal member. The method includes melting the metal member and moving the first and second components until the melted metal member contacts both pads, moving at least one of the first or second components in a direction along the first surface, and solidifying the metal member in a second state. A first distance in a direction along the first surface between the first and second centers in the first state is longer than a second distance in the direction between the first and second centers in the second state.