Abstract: The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface.

Abstract: A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed.

Abstract: The invention provides a method of assembling together two thin plane parts (1, 2) by friction welding. A main sheet (19) made of a material having high thermal conductivity is held against the parts (1, 2) for assembly. The main sheet (19) picks up the heat induced by the friction of a welding pin (5) against the parts (1, 2) for the purpose of forming the weld bead (17), and it dissipates this heat by radiation. Temperature regulation of the welding operation is obtained by the main sheet (19), ensuring that no localized excess heating occurs in the welding zone. The main sheet (19) is based on copper and presents a thickness that is less than the thickness of the parts (1, 2).

Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.

Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.

Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.

Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.

Abstract: Method and device (2) for monitoring a welding area of an object (14) in connection with welding, which device includes arrangements (3) for reproduction of the welding area, at least one filter (4) arranged in front of or in the reproduction arrangement (3), and an illumination arrangement (5) of the welding area with ultraviolet radiation. The filter (4) consists of a band-pass filter which is adapted for filtering around a wavelength within the ultraviolet wavelength range.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis.

Abstract: An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.

Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.

Abstract: A system for performing an ultrasonic staking operation in order to join a first part having a post protruding therefrom and a second part having a hole through which the post is passed includes a horn having an end vibrating at a frequency in the ultrasonic range and a motion system operatively connected to the horn, the motion system being capable of selectively moving the horn toward and away from the parts. The motion system moves the horn, with the end of the horn in contact with the post, toward the parts at a first speed such that the ultrasonic vibrations of horn cause melting of the post, and once a determination is made that the end of the horn has contacted a surface of the second part, the motion system moves the horn toward the parts at a second speed, the second speed being slower than the first speed.

Abstract: The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility.

Abstract: A gas turbine engine airfoil is made from separate cast sections having different cast alloy structures. The cast alloy structures are selected on the basis of the local operating conditions of each section. Friction welding can be used to join the sections together.

Abstract: A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.

Abstract: The invention relates to the confinement of an alloy formed of actinide transuranic radioactive wastes and beryllium metal within a neutron moderating and reflecting apparatus to cause accelerated destruction (burning) of the actinide wastes. Waste actinides, including plutonium, neptunium, americium, and curium, emit alpha particles by radioactive decay. The alpha particles are converted into neutrons by the beryllium through an alpha-neutron (alpha, n) reaction. The neutrons developed by the alpha, n reaction are moderated by a surrounding layer of graphite, which allows the slowed neutrons to cause additional fission or decay events within the waste actinide alloy. This process is passive because the alpha particles that initiate the actinide burning are an intrinsic physical property of the actinides.

Abstract: A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at least one of the lid and the container body, providing the material in the inside space, welding the lid and the container body to each other, and exhausting the organic compound vaporized by welding heat to the outside space through the groove and the communication member.

Abstract: This invention provides a method for inspecting a joined region and joining strength of a joined object formed by a spot friction stir joining process. In this method, an ultrasonic wave is introduced into the joined object from a backing face 25 opposed to a joining tool plunging face 24 and the ultrasonic wave reflected from the joined object 20 is taken in. In this case, the joining region 21 and the joining strength is estimated by observing a reflected wave of the ultrasonic wave in the vicinity of a position, along a reference direction Z, corresponding to an interface 27 of two joining members, without using the reflected wave of the ultrasonic wave reflected from the joining tool plunging face, thereby inspecting the joined object based on the estimation result.

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract: A method, with an associated system, for providing a cast component comprises annealing heat treatment to reduce casting stresses; initial machining the cast component; initial nondestructive testing (NDT) the machined cast component to identify NDT indications in the cast component; treating and removing NDT indications from the machined cast component; weld upgrading the treated and removed NDT indications from the machined cast component, the weld upgrading providing stress relief; intermediate nondestructive testing the cast component to identify NDT indications in the weld upgraded cast component; normalizing and temper heat treatment of the cast component; second intermediate nondestructive testing the cast component to identify NDT indications in the cast component; further treating and removing NDT indications from the cast component; post-normalization and temper weld upgrading the treated and removed NDT indications providing stress relief; and final nondestructive testing the cast component to iden

Abstract: Cutting elements include an ultra-hard body, e.g., comprising diamond, that is attached to substrate, e.g., comprising a cermet. An interface exists between the body and the substrate, and an angle of departure as measured between the interface and a free edge of the cutting element within one or both of the body and substrate, is less than about 90 degrees to provide a desired stress reduction along the interface. The angle of departure can be from about 3 to 87 degrees. The desired reduced angle of departure is provided by a surface feature disposed along an outer side surface of the cutting element adjacent a free edge of the interface. The surface feature can in the form of a groove disposed circumferentially around the body and/or substrate outer side surface, that is configured to provide the desired reduced angle of departure within the body and/or substrate.

Abstract: An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to detect, on a continuous basis, solder interconnect fractures as they occur during actual end-use, throughout the lifecycle of monitored components, rather than relying on a one-time electrical check prior to shipment.

Abstract: An invention providing improvement in integrity testing of wire bonds between an IC die and a BGA substrate. The invention includes a BGA integrated circuit package comprising: 1) a BGA substrate having conducting bond fingers and a grounded feature on a first side thereof; 2) an IC die electrically connected to the conducting bond fingers with wire bonds; the BGA substrate configured to be formed into a singulated unit with the IC die; wherein the BGA substrate does not have direct electrical connection on the first side thereof between the bond fingers and the grounded feature; 4) the BGA substrate including an indirect electrical connection pathway from each wire bond to the grounded feature that enables electrical integrity testing for the wire bonds; the indirect electrical connection pathway configured so that at least a portion of each indirect electrical connection pathway is not present on the singulated unit.

Abstract: To precisely measure bead cutting shapes of electric resistance welded pipes without being affected by difference in luminance level between cut and uncut portions in optical cutting images, an image is obtained by overlaying an optical cutting image with the optical cutting image subjected to thinning processing. A profile of the welded pipe is approximated with a quadratic function and a region containing the bead apex coordinates is identified as the bead. Shape data of the pipe surface at the portion corresponding to the bead portion is obtained from the preset left and right boundaries of the bead portion and the apex position of the separately-calculated bead portion, and bead width, height, slope angle, and unevenness at the left and right boundaries between the bead portion and base pipe portion, are each calculated, based on the left and right bead shape approximation functions and base pipe shape approximation function.

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract: A select solder machine configured to solder a circuit board using a solder material. The select solder machine includes a solder head movable with respect to the circuit board. The solder head is configured to position the solder material with respect to the circuit board to solder the circuit board. The select solder machine further includes a support member configured to support the circuit board in a position adjacent the solder head, and a heating member configured to heat the circuit board. The heating member is located above the circuit board.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: A method for inspecting welds comprising sorting a plurality of welds to be inspected according to a weld device that made the welds. After sorting the welds according to the weld device that made the welds, the welds are sorted according to a plurality of weld schedules at which the weld devices made the welds. Then, the welds are sorted according to a weld number. Subsequently, at least one weld made by each weld device is inspected, and the process is repeated until every weld made by each weld device at each weld setting is inspected.

Abstract: A system and method of forming a continuous strip from a plurality of strips, each strip having a leading end and a trailing end. Embodiments can include a forming apparatus that chamfers at least one of the leading and trailing ends of each strip. The chamfered trailing ends may then be positioned against chamfered leading ends of successive ones of the plurality of strips. Once a leading end and a trailing end are positioned against one another, a first welding apparatus may weld on a first side, from above, the trailing and leading ends positioned against each other to form weld joints. Once at least two strips have been welded together, the strips can constitute the continuous strip. An inverting apparatus can then invert the continuous strip and weld joints. The inversion of the weld joints can be done so as not to create a reverse bend in the continuous strip. A second welding apparatus can then weld on a second side opposite the first side, from above, the inverted weld joints to form weld junctions.

Abstract: A thermal management process for enabling the restoration of a surface of a metallic detail in the presence of at least one bonding material, comprising preparing at least one damaged area on a metallic detail; disposing at least one thermal management component upon a bonding material or a surface area proximate to the bonding material to which the metallic detail is joined; masking at least the surface area and the bonding material with a masking agent; and dimensionally restoring a surface of the metallic detail disposed on the article at a processing temperature lower than a temperature which would degrade the bonding material, the substrate, or the bondment interface therebetween.

Abstract: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes the outputs of the image sensor for any of luminance areas of the image taken by the image sensor using a sensor output characteristic table and can provide an image clearly showing both the very bright welding portion and the dark bead portion with a sufficient contrast allowing an observer to reliably recognize the objects in the image.

Abstract: A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply voltage used to power the package. Resistors R1 and R2 are connected in series at a first junction between the high and low supply voltages and a resistor R3 is coupled to the high supply voltage and connected in series with the resistance of the solder-network at a second junction. The network is held at a low voltage on the die. The detector compares the sensitivity and detection voltages and outputs a Pass/Fail signal for the solder-joint network.

Abstract: A computing environment is provided with the ability to at least contribute to generate a representation for a weld bead to be used to weld a number of components of an article of manufacture together at one or more edges of the components in the manufacturing of the article outside the computing environment, including the ability to generate an initial set of one or more data representations of an initial set of one or more wire bodies based on one or more data representations of the one or more edges respectively to synthesize one or more corresponding wire bodies for the one or more edges, and the ability to generate a final data representation of a final wire body based on the initial set of one or more data representations of the initial set of one or more wire bodies of the one or more edges.

Abstract: A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.

Abstract: The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasound source (14). During a first welding process (n1), a signal processing (30) determines a first ultrasonic permeability (Dn1) from a received ultrasonic signal (UE). During at least one subsequent welding process (n2), a second ultrasonic permeability (Dn2) is determined from an ultrasonic signal (UE) that is received during a renewed exposure of the welding area (18, 21, 22) to ultrasonic waves. A display (32) and/or a diagnostic function and/or a correction of control quantities of the welding system is/are carried out as a function of the at least two ultrasonic permeabilities (Dn1, Dn2).

Abstract: A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.

Abstract: In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.

Abstract: An external focused ultrasonic beam, non-destructive, open-air, inspection method of sheet metal spot and seam weldments using a probe in combination with motion measurement of the probe over the weldments during inspection without immersion of the material. Reflected ultrasonic waves are received and signals produced and processed or displayed as A-scan, B-scan and C-scan images that are easily recognized. An A-Scan is based on the time-of-flight difference between the outer surface, the weldment and inner and opposite surfaces of the component. B-scan and C-scan indicate the degree of weld fusion and provide data relative to fused thickness and defects sheet metal or welds. A special purpose scanner that enables ultrasonic examination welds. Scanner is pencil like ultrasonic probe with bearing face and position sensing device disposed adjacent a weld position. Scanner collects data for method to determine various characteristics of welded items.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep damage progress of crystal grains having a crystal orientation difference of about 2 degrees or more, preferably 3 degrees or more at an evaluated part on the basis of a working curve or a working map prepared in advance by looking for the relation of grain sizes to creep damage extent. A high-precision apparatus evaluates the creep damage of high tension heat resistant steel used in high temperature exposed apparatuses.

Abstract: A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or outer surface of at least one of the welded tubular ends and inducing the EMAT assemblies to transmit sequentially or simultaneously acoustic shear wave signals towards the weld and to detect the shear waves reflected by and/or passing through the weld while the EMAT assemblies are maintained in a substantially fixed position relative to the weld such that at least a substantial part of the weld is scanned by the EMAT assemblies instantly after the weld is made.

Abstract: Methods for producing toughness-optimized weld joints are provided. A welding procedure that will provide adequate toughness for the center-weld of the weld-joint is developed and used, and a welding procedure that will provide adequate toughness for the surface-weld of the weld-joint is developed and used.

Abstract: This invention relates to a method of spatially integrating multiple pipeline datasets. The method involves weld matching multiple inline inspection datasets by selecting one dataset as master and designated the other datasets as slaves, then spatially slaving the weld positions in the slaves to the weld positions in the master. After the weld matching process is completed, the method repositions the other data in the slave datasets relative to the master datasets, and which itself was previously spatially fit against a centreline model.

Abstract: The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with a laser to ablate material to a predetermined thickness; polishing the upper layer substrate ablated to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.

Abstract: A method for determining the quality of an examined weld joint comprising the steps of providing acoustical data from the examined weld joint, and performing a neural network operation on the acoustical data determine the quality of the examined weld joint produced by a friction weld process. The neural network may be trained by the steps of providing acoustical data and observable data from at least one test weld joint, and training the neural network based on the acoustical data and observable data to form a trained neural network so that the trained neural network is capable of determining the quality of a examined weld joint based on acoustical data from the examined weld joint. In addition, an apparatus having a housing, acoustical sensors mounted therein, and means for mounting the housing on a friction weld device so that the acoustical sensors do not contact the weld joint. The apparatus may sample the acoustical data necessary for the neural network to determine the quality of a weld joint.

Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.

Abstract: A solderless test interface (10) includes a thin, flexible, electrically insulative sheet (20) having metal plated through-holes (24) formed in the pattern of the external ball contacts (54) of a semiconductor device (14). The termini (26, 30) of the holes (24) on the surface of the sheet (20) are also plated. The metal (40) is coated with a soft metal (42) which will cold-flow under force. The sheet is inserted between the ball contacts (54) and a test board (18). Force is applied to the test board and/or the device to engage and deform the soft metal (42) at the hole termini (26, 30) by its engagement with the balls (54) and pads (16) on the test board. The deformation ensures a low resistance electrical path between the balls and the pads during testing of the device.

Abstract: In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.