Abstract: A vertical pipe column assembly procedure involves the simultaneous welding and ultrasonic testing activity by using a plurality of welders progressing peripherally around a joint with the ultrasonic testing work similarly progressing peripherally around the joint between the welders. The temperature rise from welding activity is reduced by only partially completing the weld at a selected joint, then lowering the joint by the usual process of lowering or driving it downward one section length and completing the weld deposit at a lower work station. At the lower work station, ultrasonic testing again proceeds simultaneously between the peripherally progressing welders. An optional step used to improve joint strength, usable at selected joints needing the most strength, involves the application of an axial pull on the section above the finish welding activity. This axial pull places an axial stress in the partially completed weld.

Abstract: A reworkable cold welded microelectronic multi-chip module contains cold welded microelectronic chips in which the chip's cold weld metal bonding pads (3) are constructed of a metal having one hardness and the corresponding cold weld metal bonding pads of the multi-chip module's substrate (5) are of a different greater hardness, which, despite the difference in hardness, cold weld to one another. Two forms of Indium preferably serve as the metals. If for any reason the chip must be removed from the module, it is found that the cold weld breaks at a predictable location. A new microelectronic chip may thereby be cold welded to the module substrate as a replacement. New rework and testing procedures are thereby made possible.

Abstract: A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.

Abstract: Aluminum-lithium alloy sheets which are welded together are examined to identify regions requiring repair. A grid is applied to the sheet about the region requiring repair, and the region to be repaired is ground out and rewelded. Residual stresses are relieved by planishing yes to cause localized plastic deformation in the repaired region. The grid is used as a guide to restoring the original dimensions of the sheet in a manner which tends to reduce in-plane shrinkage. The reduced in-plane shrinkage in turn tends to reduce undesired tensile residual stresses. The planishing also tends to work-harden the weld filler.

Abstract: A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Abstract: The invention relates to a spin beam for spinning a plurality of synthetic filament yarns, and which has the shape of an elongate, hollow parallelepiped block formed by two side walls, a lower wall, an upper wall and end walls. The spin beam comprises a number of pressure-tight spin heads with downwardly extending spinnerets arranged in at least one row on a lower support. An upper support mounts at least one multiple pump which is connected, via distribution lines, to the spin heads. A pump connection plate is joined to the upper support for each multiple pump. Each of the distribution lines is connected on the one hand to the pump connection plate and on the other hand to one of the spin heads, the distributing lines forming together with the pump connection plate, the spin heads, and the lower support, form a self-supporting distributor unit. The lower support forms a portion of the lower wall of the spin beam, and the side walls are mounted on the lower support of the self-supporting unit.

Abstract: A test method and apparatus for use with a plurality of magnetically sensitive elements having a fixed relative physical sequence, and with a plurality of electrical lead sets through each of which the magnetic field being experienced by a respective one of said magnetically sensitive elements can be sensed. The method includes the steps of placing the magnetically sensitive elements in a variable magnetic field and determining a respective magnetic field setting at which each given one of the lead sets indicates the presence of a magnetic null. The results of such a test can be used to determine which lead sets are connected to which magnetic elements, and/or to determine whether at least one lead set is mis-connected.

Abstract: An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.

Abstract: An automated sensor transport system for non-destructive inspection of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The system includes: a computer control unit; a transport apparatus having a first EMAT for producing an ultrasonic SH shear wave and a second EMAT for receiving an ultrasonic SH shear wave reflected from a weld and a calibration means. The computer control unit, which is in electrical communication with a welding apparatus, the transport apparatus and a data acquisition unit, coordinates the weld test with completion of the weld. An edge detection sensor, which is affixed to the transport apparatus is used to automatically position the transport apparatus for a weld scan and to signal completion of the scan. The system includes an electrostatic shield to protect the second EMAT from electromagnetic and radio frequency interference.

Abstract: A mechanical testing process for insuring composite patch bond integrity. A composite patch is applied to an aircraft aluminum skin. A thermal imaging system views the composite patch using both low and high heat techniques with prior calibration to a calibration standard. The inspection using these techniques produces images which are stored and these images so produced will display defects such as delaminations and disbonds, for example. These images are compared to calibration standard images to determine if the defect in the installed composite patch is sufficiently serious to require removal of the defective composite patch and another composite patch to be applied. Mechanical testing results are used in conjunction with thermography testing to determine composite patch bond integrity.

Abstract: Method and apparatus for selecting a threshold for use by a boundary tracker to locate a crescent on a bonded lead involves creating a two-dimensional inspection window along the angle of the wire in a post-bond image of a bonded wire in order to generate a one-dimensional projection; generating a one-dimensional projection by summing each column of pixels in the inspection window in the direction of the wire angle and computing an average grey value for each column; and applying an edge-detection to the one-dimensional projection to locate the edges of the wire. If an edge point falls directly in the center of a pixel of the one-dimensional projection, the grey value for that edge point is considered to be the grey value of that pixel. If the edge falls between pixels, the edge's grey value is determined by the fractional pixel position of the edge point in the projection. The grey values of the left and right edge points are averaged and used as the threshold value.

Abstract: A die bond touch down detector (20) includes a strain gauge circuit (22) having a plurality of strain gauges (12) formed into a wheatstone bridge configuration. The strain gauges (12) are mounted on a die bond head (10) and measure and detect deformations of the die bond head (10). The strain gauge circuit (22) generates a differential output signal in response to deformations detected by the strain gauges (12). The differential output signal is amplified, filtered, and converted to digital format for processing by a microcontroller (36). The microcontroller (36) performs calibration, display formatting, and touch down signal generation. The die bond touch down detector (20) provides real time monitorization, automatic calibration, and real force applied information for the die bond head (10).

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

Abstract: Apparatus and method for nondestructive evaluation of butt welds. The present invention in its broadest form includes an apparatus and method for detecting flaws in butt welds in steel sheets using horizontal shear ultrasonic waves generated on the surface thereof. Observation of reflected waves having amplitude greater than a chosen value signals the presence of significant flaw. To achieve this objective, the present apparatus detects only reflected horizontal shear waves; other modes are electronically removed using bandpass filters, since they occur at different frequencies. The invention may therefore be used in the presence of surface structures such as clamps and the like, and in the presence of surface nonuniformities in the vicinity of the weld, thereby permitting on-line flaw detection steel mill environment without interfering with the line output.

Abstract: A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test.

Abstract: A process and system exists for temperature control and testing of modules, such as printed circuit boards, with fitted electronic, electromechanical and mechanical components or individual components, wherein the modules are subjected, following assembly in a soldering process and when the solder joints are still in a semi-molten state, to one or more test phases at high and low temperature, in order to detect defects at an early stage and to take immediate corrective measures when errors occur. To this end, in a first test phase the modules are cooled, as they emerge from the soldering process, to a temperature ranging from 40.degree. to 125.degree. C. and tested in a first test phase. Thereafter, in a second test phase the modules are cooled to a temperature ranging from -40.degree. to 10.degree. C. and tested. In the respective test phase the modules are subjected to a component and/or function test in order to determine defective modules.

Abstract: An automated method for non-destructive inspection and evaluation of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The method includes automatic positioning of a transport apparatus containing EMAT transmitter and receiver coils in proximity of a just-completed weld; scanning the weld; receiving an electrical signal produced in the EMAT receiver coil by a reflected ultrasonic SH shear wave; recording and monitoring the electrical signal; analyzing tie electrical signal relative to predetermined control limits; signaling the presence of a defect in the weld; and communicating electronically with a welding apparatus to reperform and/or alter the way in which subsequent welds are made so as to avoid repetition of the defect. The method also includes automatic receiving, recording, and monitoring of welding apparatus and welding process data, as well as automatic adjustment of corresponding welding apparatus and welding process parameters.

Abstract: In a method of testing weld seams using an eddy-current technique, large-volume and coarse-grained weld seams are subjected to the testing, said weld seams being tested for the presence of faults in layers on-line during their buildup. The method is particularly suitable for testing components with austenitic weld metal. It is notable for a high fault location probability.

Abstract: A fast, nondestructive, and easy to perform method of Potentiometric Evaluation of Substrate Oxidation ("PESO") is provided. A coated part to be analyzed is placed in contact with an electrolytic solution having a pH adjusted to provide an optimum oxide dissolution rate. The open circuit potential of the part is monitored as the substrate oxide dissolves in the electrolytic solution. The voltage typically changes as a function of time during oxide dissolution. When oxide dissolution is complete, the voltage reaches a steady value associated with active dissolution of the substrate metal and reduction processes on the coating. The electrolytic solution can be flowed or agitated to reduce concentration polarization, provide more meaningful voltage measurements, and minimize the time required for analysis. The time required to reach a steady-state voltage provides a measure of the amount of substrate oxide within pores in the coating.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: A method for testing semiconductor chips using a test package having electrical contacts which have in them metallized particles which pierce the surface of the pads of a semiconductor chip, the chips being mounted on a flexible substrate which can deflect to increase the uniformity of the level to which the metallized particles pierce the surface of the pads of the semiconductor chip. If the chip tests as "good", pressure can be applied to increase the piercing depth, thereby allowing the test package to be used as a permanent package.

Abstract: Method to implant defects in a metallic component, for the retraining and qualification of operators and in non-destructive test techniques. This method is characterized by the implantation of non-homogenious material directly in the model item and to do so excavations are made that, following implantation of the defects, are filled by a welding process.

Abstract: A method for testing a lead connection to an integrated circuit chip is disclosed. The method comprises the steps of: (a) applying heat to an exposed surface of the integrated circuit chip; and (b) determining the heat transferred from the integrated circuit chip to a lead. Rapid transfer of heat to the lead indicates a valid connection between the integrated circuit chip and the electrical lead. Slow, non-uniform, or inadequate transfer of heat to the lead indicates an insufficiency or failure in the electrical connection between the integrated circuit and the lead. Determination of the heat transferred from the integrated circuit chip to the lead can be by any appropriate method. For example, the temperature of the lead can be determined using temperature probe, a liquid crystal display, or an electronically or visually scanned infrared display.

Abstract: Apparatus for assessing solderability of electronic component leads and printed wiring boards by sequential electrochemical reduction. The apparatus detects and quantifies the oxides present on copper, solder, andintermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability.

Abstract: Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding tool on second bond and at the time the fine wire breaks from second bond. The monitoring circuit determines if the wire clamps are initiated and when and if the electronic flame-off control is fired. Logic circuit in the WBMS determine if wire tail after second bond is of a proper length to make a ball on the wire tail and if not, what remedial measures must be made to avoid damage to the semiconductor device being bonded.

Abstract: In the assembly and testing of hard disk drive systems, a station having the capability of performing soldering and testing operations on a disk drive subassembly unit, such as a head gimbal assembly. The subassembly unit is placed onto a fixture. The fixture firmly holds the subassembly unit during both the soldering and testing operations. Wires are reflow soldered onto solder pads of a flex circuit. Afterwards, the subassembly unit is subjected to a variety electrical tests. The results of these tests are displayed to the operator. If these results indicate that there might be a problem with the wiring and/or soldering, the operator can readily "retouch" or resolder the wiring and repeat the testing procedure to verify that the remedial measures have corrected the problem.

Abstract: A sequential electrochemical reduction method and apparatus for assessing solderability of electronic component leads and printed wiring boards. The method detects and quantifies the oxides present on copper, solder, and intermetallics that are detrimental to solderability. A solderable portion of the component to be tested is immersed in an electrolyte to form an electrode. An inert counter electrode and a reference electrode are also placed in the electrolyte. A current is passed from the inert counter electrode to the tested component, and the potential between the component and the reference electrode is recorded as a function of time. In a plot of the electrode potential versus the total charge passed, a series of inflection points identify and quantify particular metallic oxides present on the solder. The plot is compared with previous analyses of aged specimens having known oxide compositions that correlate with degradation of solderability.

Abstract: A method for inspecting a repair insert welded into a hole where the weld is not permitted to penetrate the full depth of the hole. An inspection feature, either grooves at the minimum and maximum weld depths or grooves parallel to the insert axis, is formed on the surface of the repair insert. The insert is welded into the hole using electron beam or laser welding. The structure is then non-destructively inspected to determine whether the inspection feature has been consumed at the minimum required weld depth and has not been consumed at the maximum permitted weld depth.

Abstract: A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).

Abstract: The present invention provides a wire bonder and its method able to reliably and efficiently perform non-contact detection of the misattachment of wires spread between the pads of various types of bonded components and a lead without damage to said bonded component. The present invention is equipped with a clamp provided above a capillary through which is passed a wire, a toroidal coil provided above the capillary without making contact with the wire, a high frequency oscillator that generates a high frequency to the toroidal coil, and a differentiation circuit that detects whether the wire connected to the bonded component is misattached, so that the present invention is able to detect whether the wire to be connected to the bonded component is misattached by this differentiation circuit. Alternatively, the toroidal coil is provided within a path that forms a loop between a clamping device, that performs cutting of the wire, and a bonding stage, without making contact with the line that composes said path.

Abstract: The method and the corresponding installation detect sealing faults in metal protective tubes for protecting cables having electrical and/or optical conductors, referred to as "protected components", embedded in a sealing material filling the tube. The method consists in priming said sealing material with a detectable "test" gas either prior to or during injection of said material into said tube in a first station for enclosing the protected components inside the tube, and in causing said tube, filled in this way and optionally heated, to advance continuously past a detector, or inside a detection chamber of a second station containing the detector, either directly after the tube has been filled or at a subsequent stage. Application: land or under-sea cables, in particular for monitoring fluid-tight protective microtubes for protecting optical fibers.

Abstract: The method and structure permit the testing of welds forming the structure. The structure comprises a base plate, a longitudinal member on the base plate, a web having an opening positioned over the longitudinal member, and a lap collar having an air hole and covering the web opening. An air channel is formed by welds formed between welded abutting surfaces of the base plate and the web, and between the web and the longitudinal member, and between the lap collar and the base plate, and between the lap collar and the longitudinal member. The air channel is continuous along the entire length of the web and base plate thereby permitting the detection of defects in the entire length of welds when the air channel is pressurized through the air hole.

Abstract: A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.

Abstract: An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

Abstract: Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device are broken by a breaking unit, and a defect mark is applied on the defective semiconductor device by a defective mark putting unit in response to the defect signal, the defect mark applying unit applying the defect mark on an area other than an area to be covered with sealing material.

Abstract: An apparatus is provided for use with a solderability testing machine to releasably engage a sample for immersion into a solder bath. The apparatus contains a pair of spring-loaded plates which serve to hold the sample so that only the desired portion of the sample may be dipped in the solder. The apparatus also carries a threaded, depth-controlling member which may be threadedly adjusted to precisely control the depth of immersion of the sample held by the holder into the sample bath.

Abstract: A solder joint inspection system comprises a substrate (60) having at least one solder pad (56), a predetermined amount of solder (54) on the solder pad, and an image fluxing material (52) that fluoresces when an ultraviolet light source (42) is applied to the solder (54) and the fluxing material (52). When an ultraviolet light source is applied to the substrate having a predetermined amount of solder and fluxing material, a visual inspecting device (40) can verify if, in fact, the predetermined amount of solder and fluxing material is present.

Abstract: Method for detecting failures in wire bonding is performed by applying a minimal voltage to bonding wire between the first and second bonding steps, between the second bonding step and bonding wire cutting step, and before the next first bonding step. Thus, whether or not the first bonding and the second bonding have been performed properly and whether or not the wire condition before the next first bonding is proper are all detected before advancing next bonding.

Abstract: A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested while connected to the support member and provides it with a conductor lead for connection to a carrier for use.

Abstract: A method of producing a warp beam, and the warp beam produced by this method are described.

Abstract: A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.

Abstract: A face-down connecting an electrode formed on a semiconductor device surface and an electrode on a circuit substrate using an insulating resin, is arranged such that after positioning the electrode of the circuit substrate and the electrode of the semiconductor device, they are pressed from the side of semiconductor device or circuit substrate, and, in this state, a light-stiffening insulating resin is applied to the side surface of the semiconductor device, and then the light-stiffening insulating resin is stiffened. Since the light-stiffening insulating resin is applied and injected between the semiconductor device and circuit substrate with the electrodes of the semiconductor device and circuit substrate pressed together, the light-stiffening insulating resin intervenes between the two electrodes, and the problems of failure of the electrical contact between the two electrodes or a high electrical connection resistance will be avoided.

Abstract: Determination of the quality of blind solder interconnections by X-ray inspection is made possible by forming indicator features on the pads of a component and the pads of the surface on which the component is to be mounted. The indicator features consist of an area which is different in size and/or shape than that of the other pad to be joined. For example, the indicator feature may be a circular region with an area approximately twice that of the pad to which it is to be joined. A relatively large amount of solder is deposited on the smaller pad and the two pads are placed in contact. During reflow, the molten solder on the smaller pad will flow to cover the full area of the indicator feature, indicating that a good interconnection was obtained. The indicator features may also be a different shape from that of the pad to which it is to be joined so that the solder deposited on the pad will take on the shape of the indicator feature when successful interconnection is achieved.

Abstract: An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate.

Abstract: A sample holder (22) is provided for use with a solderability testing machine (10) to releasably engage a sample 12) for immersion into a solder bath (26). The sample holder comprises a beam (28) provided at its upper end (30) with means (29) for engaging the solderability tester. A clamping mechanism (34) is carried by the beam (28) below its upper end for releasably holding the sample. The beam also carries a threaded, depth-controlling member (50) which may be threadedly adjusted to precisely control the depth of immersion of the sample held by the holder into the sample bath.

Abstract: A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connections by inspecting the bonding test patterns. The bonding test patterns can be implemented in a variety of configurations which verify several properties of the soldering process.

Abstract: A method and structure for providing radio-opaque polymer compounds for use in metal bonding and sealing. A powder filler comprising a high atomic number metal or compound thereof is incorporated into a polymer compound to render it more radio-opaque than the surrounding metal structures. Voids or other discontinuities in the radio-opaque polymer compound can then be detected by x-ray inspection or other non-destructive radiographic procedure.

Abstract: In order to guarantee a constant quality of assembled modules, bonders in accordance with the object underlying the present invention must be monitored and potentially adjusted in suitable time intervals with respect to bonding force, ultrasound amplitude and bonding time. Further, it is an advantage that the present invention has a flexible format. In accordance with the invention, the registration of the measured values ensues with a mobile, piezo-electric sensor on a table of the bonder which is no higher than integrated circuits normally processed thereon. Fields of utilization cover all ultrasound bonders for integrated circuits.

Abstract: A detector is adapted to detect the kinds and concentrations of impurity metals in molten solder or changes in the tin-lead composition of the solder by measuring the dissolution rate of a metallic film. The detector comprises a light-transmissive rod, the bottom cross-sectional area of which is covered by a metallic film. The top cross-sectional area of the rod is connected to an optical measurement means through an optical fiber cable and the time required to dissolve the metallic film in the sample molten solder is measured.

Abstract: A method and apparatus for constructing an electrical contact including welding means for welding a base element to a blank comprised of contact facing material, separating means for separating finished electrodes from the balance of the contact facing material, examining means for examining an aperture formed within the contact material blank when the finished electrode is separated from the blank, and classifying means for classifying the finished electrode as acceptable or unacceptable depending upon the examination.