Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longditudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate composed of a transparent sheet member and a precision confirmation chip composed of a transparent sheet member are used; and a precision confirmation substrate positioning component for positioning and fixing the precision confirmation substrate is provided on a bonding station, the precision confirmation chip is held by suction to a tool and disposed above the precision confirmation substrate, images of the precision confirmation substrate and precision confirmation chip are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip is then placed on the precision confirmation substrate, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.

Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: The quality of bonding between a conductive ball and a conductive pad of a lead frame strip of an IC package are determined by etching the conductive ball from the conductive pad, and analyzing the bottom view of the conductive ball. The conductive ball is comprised of a first conductive material and a conductive pad is comprised of a second conductive material. The conductive ball is bonded to the conductive pad by formation of an intermediary material formed from the first conductive material of the conductive ball and the second conductive material of the conductive pad. The lead frame strip is immersed within an etching solution such that the intermediary material is etched between the conductive ball and the conductive pad until the conductive ball may be decoupled from the conductive pad.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Abstract: An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a “shield” or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.

Abstract: In a method for automatic multi-layer welding of a joint formed by two joint surfaces according to which method the contour of the joint in a number of cross-sections is established by means of a sensor emitting signals representative of the contour of the current cross-section of the joint. After evaluation, said signals control the deposition of the weld beads by means of a continuously fed electrode which is directed towards a welding zone in the joint.

Abstract: A system and method that permits the accuracy of alignment of a transparent substrate relative to a second substrate to which it is bonded to be evaluated on-line, after the two substrates have been bonded together. The alignment of the two substrates is viewed through the transparent substrate as the bonded-together substrates are being transported between the station at which the bonding occurred and another processing station.

Abstract: So as to allow bonding precision to be confirmed on a bonding apparatus, both a confirmation substrate part and a confirmation chip part, which are flip-chip bonding confirmation parts used in the bonding of semiconductor devices that have daisy-chain type patterns, are formed as transparent plate-form members and daisy-chain type patterns are provided thereon.

Abstract: An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

Abstract: A method for preparing and assembling a planar reinforcement for a concrete element according to a pre-determined design plan, wherein a full-sized plan including the position and type of each element in the reinforcent to be achieved is mapped onto a working surface (30) having two reference directions, a suitable reinforcement element is positioned in each of a plurality of crossing points. The method is characterised in that one or both of the mapping and assembling operations are performed by a tool attached to the carriage of a robot (10), said carriage (10) having at least two degrees of freedom parallel to the reference directions. The method further comprises storing all the design plan data in a storage area of the robot, and using the robot to move the carriage (10) automatically in accordance with said data.

Abstract: A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.

Abstract: An electronic component monitoring device and method for correctly recognizing electronic components with bumps. A reflection-recognizing light emitter for emitting light toward an array of bumps on an electronic component, a transmission-recognizing light emitter for emitting light toward a background board, and a bump-recognizing light emitter for emitting light at an acute angle toward the array face of the electronic component are provided, and switchable light emitter(s) is/are switched on and off in accordance with a bump recognition method, transmission recognition method, and reflection recognition method.

Abstract: There is provided a method of bonding inner leads of lead frames to electrodes of semiconductor chips, including the steps of (a) pictorially recognizing bonding sites of inner leads a semiconductor chip through wires for the certain number of lead frames among a plurality of lead frames and analyzing the bonding sites to obtain coordinate data numerically expressing the bonding sites, (b) calculating statistic about dispersion in the thus obtained coordinate data, (c) judging whether the thus calculated statistic is smaller or greater than a predetermined threshold value, and (d) bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames in accordance with predetermined bonding site data without pictorially recognizing bonding sites thereof, if the statistic is equal to or smaller than the predetermined threshold value, or bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames by pictorially recognizing bonding sites in adv

Abstract: In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

Abstract: Automatically monitoring pads of material deposited on a surface of a workpiece using an inspection system that senses a deposited pad of material and determines pad height values at a plurality of locations across the pad, and a shape classifier that receives the pad height values as inputs and outputs a plurality of three-dimensional shape attributes related to pad deposit conditions.

Abstract: A method and apparatus for determining the position, size and/or shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead of a lead frame. The ball is detected in at least three directions from the center of the ball towards the edge of the ball.

Abstract: A conductive ball mounting apparatus and a mounting method for mounting a conductive ball for forming a bump without erroneously mounting an additional conductive ball in a workpiece, comprising a workpiece positioning section, a conductive ball feeding section, a mounting head provided with a plurality of suction holes each of which has a recess capable of storing one conductive ball on the bottom surface of the head, a moving device for moving the mounting head between the workpiece positioning section and the conductive ball feeding section, and a detecting device for detecting conductive balls erroneously additionally attached to the bottom surface of the mounting head without being stored in recesses arranged on the moving route of the mounting head.

Abstract: A method is available for inspecting a printed circuit board and solder paste deposited upon the printed circuit board, whereby both systematic defects occurring during a solder paste deposition process and random defects are located. The printed circuit board is continuously scanned by an inspection head immediately following the solder paste deposition process. Images of the printed circuit board are then analyzed for random defects such as missing solder paste, improper solder paste coverage, and solder bridging. Next, heights of solder paste deposits are sampled. A pattern of light is projected upon selected solder paste deposits, and images of the selected solder paste deposits are captured. Light triangulation techniques are then used for determining the height of each selected solder paste deposit. Variations in the height of solder paste are systematic defects occurring in the solder paste deposition process.

Abstract: This method and apparatus for wire bonding allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Abstract: An LCD 1 is evacuated from the focus range of the camera 4 in a horizontal direction, while a positioning object 18 on a TCP 17 is placed in the focus range of the visual field of the camera 4 to obtain a dislocation of the TCP 17 by monitoring the positioning object 18. The TCP 17 is then lifted in a vertical direction keeping its horizontal position until it goes out of the focus range of the camera 4. The LCD 1 is returned in the horizontal direction so that a positioning object 2 on the LCD 1 comes into the focus range of the camera 4. Then, a dislocation of the LCD 1 is detected by monitoring the positioning object 2. A mutual positional relation is corrected by shifting at least either the LCD 1 or the TCP 17 in the horizontal direction based on the detected dislocations of the positioning objects 2 and 18. Finally, the TCP 17 is lowered keeping its horizontal position, and mounted on the LCD 1.

Abstract: In a wire bonding apparatus used in manufacturing, for instance, semiconductor devices, a cover is attached to a detection image intake section of the camera mirror tube of a camera which detects the bonding points of a semiconductor workpiece, and the cover covers an area where a variation in air density occurs between the detection image intake section of the camera mirror tube and the semiconductor workpiece.

Abstract: An alignment method for ultrasonic wire bonders of the type using capillary ball type and wedge type bonding tools utilizes a bonding tool construction having an elongated shank angle obliguely At any desired azimuthal angle from the lower working face of a tool tip. This angular offset allows a workpiece to be positioned laterally to place a desired wire bond site on an integrated circuit or other such workpiece in precise alignment with a target image in the field of view of a television camera or other optical imaging device viewing the location of a desired bond site along the line of action of the tool tip. Because of the angular offset construction of the bonding tool, the line of site of the imaging device is coincident with the line of action of the tool tip eliminating parallax errors and permitting viewing of the bond site continuously during motion of the tool tip along its line of action.

Abstract: An IC socket for mounting an IC package on a printed wiring board includes a socket body and pin terminals. The socket body has a mount portion for the IC package. The mount portion has a flat bottom wall. The pin terminals are arranged in the bottom wall at predetermined intervals lengthwise and widthwise. Each pin terminal has a contact portion, on the upper surface of the mount portion, which is brought into contact with a corresponding terminal of the IC package mounted on the mount portion, and a connecting portion, on the lower surface of the mount portion, which is connected to a corresponding pattern on the printed wiring board. A press member having elasticity which makes the press member press an upper surface of the IC package mounted on the socket body to press each terminal of the IC package against the contact portion of a corresponding pin terminal of the socket body is arranged on the socket body.

Abstract: In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.

Abstract: A method for superimposing an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Abstract: Method and apparatus for selecting a threshold for use by a boundary tracker to locate a crescent on a bonded lead involves creating a two-dimensional inspection window along the angle of the wire in a post-bond image of a bonded wire in order to generate a one-dimensional projection; generating a one-dimensional projection by summing each column of pixels in the inspection window in the direction of the wire angle and computing an average grey value for each column; and applying an edge-detection to the one-dimensional projection to locate the edges of the wire. If an edge point falls directly in the center of a pixel of the one-dimensional projection, the grey value for that edge point is considered to be the grey value of that pixel. If the edge falls between pixels, the edge's grey value is determined by the fractional pixel position of the edge point in the projection. The grey values of the left and right edge points are averaged and used as the threshold value.

Abstract: An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.

Abstract: A method for analyzing solder joint assemblies in devices such as solder bumped silicon chips, ball grid arrays or land grid arrays is disclosed. The method includes applying a dye solution to a device under test and then causing that dye solution to penetrate any interstices between any solder interconnect and the device under test, which also includes penetrating any fractures in any joints or joint failures. Next, the dye is dried or cured so as to provide ready analysis upon the analysis portion of the method. The device under test is then caused to be separated or fractured in such a way that a seam or border of a solder joint or an attachment border may be analyzed to identify any structural failure by visually analyzing where any dye has penetrated such structural failures.

Abstract: An LCD 1 is evacuated from the focus range of the camera 4 in a horizontal direction, while a positioning object 18 on a TCP 17 is placed in the focus range of the visual field of the camera 4 to obtain a dislocation of the TCP 17 by monitoring the positioning object 18. The TCP 17 is then lifted in a vertical direction keeping its horizontal position until it goes out of the focus range of the camera 4. The LCD 1 is returned in the horizontal direction so that a positioning object 2 on the LCD 1 comes into the focus range of the camera 4. Then, a dislocation of the LCD 1 is detected by monitoring the positioning object 2. A mutual positional relation is corrected by shifting at least either the LCD 1 or the TCP 17 in the horizontal direction based on the detected dislocations of the positioning objects 2 and 18. Finally, the TCP 17 is lowered keeping its horizontal position, and mounted on the LCD 1.

Abstract: A method for aligning and bonding spaced components, such as a baseplate and a faceplate of a field emission display, is provided. The method includes: providing an optical alignment tool suitable for flip chip bonding; calibrating the tool to simulate a desired spacing in the assembled components; aligning the components using the calibrated tool; bringing the aligned components towards one another using the calibrated tool; and then bonding the components together with the desired spacing therebetween. The method of the invention can be practiced with an aligner bonder tool calibrated to eliminate a parallax error. A spacer element placed between the bondheads of the tool can be used to simulate the desired spacing during calibration. Alternately the spacing during calibration can be simulated by measuring with a caliper or other instrument.

Abstract: To present means for bonding two types of devices on a display panel at high speed and at high precision.A first feed section comprising first devices and a second feed section comprising second devices are provided. Among the display panel, first feed section, and second feed section, a turntable comprising a first nozzle for picking up first devices and a second nozzle for picking up second devices is provided.Between the turntable and display panel, a first head for bonding the first device sucked in vacuum to the first nozzle to a longer side of the display panel, and a second head for bonding the second device sucked in vacuum to the second nozzle to a shorter side of the display panel are provided.

Abstract: In this invention, a designed value of a lead width is previously input and a bonding load suitable for the designed lead width is previously input before the step of continuously bonding a TAB tape on a semiconductor chip is effected. Next, the TAB tape and chip are carried to preset positions, and after recognition of the positions of the tape and chip and the alignment of the tape and chip by use of a CCD camera are completed, the inner lead width is actually measured by use of the CCD camera. The measured lead width is compared with the designed lead width, and when a difference therebetween exceeds a preset reference value, the bonding load is changed to a bonding load suitable for the measured lead width of the lead to be actually bonded based on the ratio of the measured lead width to the designed lead width and then the bonding operation is effected by the suitable bonding load.

Abstract: An apparatus for aiding in welding a pipe structure is provided. The apparatus includes first and second expandable spaced apart seals adapted to be positioned in the pipe structure and on opposed sides of a region subjected to a welding process. Each of the spaced apart seals has a circular exterior surface selectively expandable to contact and form a seal with an interior surface of the piping structure, and a circular inner surface. A light-transmitting tubular shield support extends between the first and second seals and mates with the circular inner surfaces to position the first and second seals in spaced relationship with each other. An optical device has a selectable field of view supported within the interior of the tubular support, and is rotatable about the major axis of the tubular support for producing an image of the portion of the inner surface of the piping structure that is within the field of view of the optical device.

Abstract: An I.D. pipe clamp used for holding the ends of two pipes during welding, and having a means for inspecting the inside diameter of the root pass of the weld without removal of the pipe clamp or breaking of the purge gas seal. The pipe clamp has a frame with two clamping mechanisms for locking the clamp in position within the pipe ends. A means for inspecting, such as a video camera or other nondestructive testing device, is mounted on the pipe clamp between the two clamping mechanisms. Gas purge dams are located proximate each clamping mechanism to facilitate the creation of an inert gas purge in the region of the weld joint. The means for inspecting is operated to inspect the root pass of the weld prior to breaking the gas purge and prior to removal of the pipe clamp. The pipe clamp may also support a means for dressing of the weld I.D., such as a brush or a grinding tool, along with a vacuum line for removal of debris created during operation of the means for dressing.

Abstract: In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

Abstract: A method for aligning and soldering a first device (11) to a substrate (16) comprises the steps of providing a plurality of solder elements (17) between the first device and the substrate, aligning the first device, and then reflowing and cooling the solder elements to bond the first device to the substrate. The improvement comprises, first, reflowing only a first group of solder elements and then cooling the elements of the first group, thereby to tack the first device to the substrate. Thereafter, we reflow only a second group of the plurality of solder elements and cool the second group, thereby to provide a more secure bond between the device and the substrate without interfering with the alignment of the first device. This method reduces the amount of energy needed for each reflow step, thereby reducing stresses and maintaining better alignment.

Abstract: An apparatus and method are provided to energize an optoelectric component, such as a semiconductor laser chip, exciting a lasing gap to emit light from the front facet of the chip. The laser is positioned on a transparent tool element having a conductive portion thereon. The conductive portion is preferably a metallized ITO surface transparent to visible light. This allows the laser to be energized while simultaneously looking through the tool element to image a feature on the laser. The lasing gap is then located with a high degree of precision with respect to this feature. This precise location information is used to position and bond the laser chip with respect to an optical transmission line with precise alignment.

Abstract: A method for inspecting a semiconductor device includes an inspection station (10), a handling system (12), a microscope (14), a camera (18), and a computer (20) having a monitor (22). A magnified image (40) of the device being inspected is transmitted to monitor (22) via camera (18). A template image (60) is then recalled from computer readable memory and is superimposed upon the magnified image of the device appearing on monitor (22). The template image (60) includes transparent regions (62) and opaque regions (64). The opaque regions block out all areas of the device not associated with the characteristic being inspected, while the transparent regions highlight the area of interest. Using the superimposed image (70), the operator can quickly focus on the area of the device requiring attention. In specific embodiments of the invention, a template is used to assist inspection of a wire bond configuration, a die attach material bondline, lead skew, and mark placement.

Abstract: A wire bonding apparatus for semiconductor devices have a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position, an optical means disposed above the supporting block and used for recognizing the pattern of the workpiece held on the supporting block, a storage means for prestoring each level of the workpiece so that the positions of not less than two places intended for recognition on the workpiece having difference in level conforms to the focal point of the optical means, and a control unit for controlling the drive for driving the supporting block, moving the workpiece to the position stored in the storage means and stopping the workpiece at that position.

Abstract: Apparatus and method for soldering a first material to a second material uses a laser and involves applying solder paste over the first material, placing the second material on the solder paste in alignment with the first material to form a sample, and focusing a laser beam onto a predetermined location on the sample to segment the solder paste and form a solder joint between the first material and the second material. During the soldering, optical images of at least one region-of-interest in the solder paste adjacent the solder joint are captured. Formation of the solder joint is monitored by repeatedly calculating pixel value sums in the region-of-interest from the optical images to determine whether the solder paste in the region-of-interest has segmented. Control signals may be generated based on the pixel value sums and used to adjust at least one of the intensity and duration of the laser beam.

Abstract: A bonding apparatus used in manufacturing, for example semiconductor devices, including an adiabatic plate provided beneath a bonding horn for blocking the radiant heat from a heating block that heats up a workpiece. The apparatus further includes horn cooling pipes and a mirror tube cooling pipe for blowing cooling air onto a bonding horn and onto a mirror tube of a detection camera or a detection camera supporting arm.

Abstract: A printed wiring pattern for preventing poorly soldered connection that tends to occur when soldering surface mounting chip components and lead terminals of mounting components on the printed wiring pattern is capable of making the detection of a poorly soldered site a simple task.

Abstract: A method for testing a lead connection to an integrated circuit chip is disclosed. The method comprises the steps of: (a) applying heat to an exposed surface of the integrated circuit chip; and (b) determining the heat transferred from the integrated circuit chip to a lead. Rapid transfer of heat to the lead indicates a valid connection between the integrated circuit chip and the electrical lead. Slow, non-uniform, or inadequate transfer of heat to the lead indicates an insufficiency or failure in the electrical connection between the integrated circuit and the lead. Determination of the heat transferred from the integrated circuit chip to the lead can be by any appropriate method. For example, the temperature of the lead can be determined using temperature probe, a liquid crystal display, or an electronically or visually scanned infrared display.

Abstract: An improved method for teaching the location of a bond site on a selected lead finger of a semiconductor leadframe during a wire bonding process is provided. Initially, the location of the lateral edges and terminal edge of a tip portion of the lead finger is sensed by an automated vision system of a wire bonding apparatus. A width (W) and a longitudinal axis of the lead finger are then determined. The bond site is located along the longitudinal axis a predetermined distance of (W/2) from the terminal edge of the lead finger. The improved method allows greater accuracy in the placement of bond sites and precisely controls the length of the bond wire used during the wire bonding process.