Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.

Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.

Abstract: A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark portion. The monitoring device selectively emphasizes the outputs of the image sensor for any of luminance areas of the image taken by the image sensor using a sensor output characteristic table and can provide an image clearly showing both the very bright welding portion and the dark bead portion with a sufficient contrast allowing an observer to reliably recognize the objects in the image.

Abstract: A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.

Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.

Abstract: A method of measuring a thickness of a ball bonded to a pad is disclosed. The method includes: taking an image of the pad and the ball at each step position through an image taking means being shifted in a vertical direction at predetermined step intervals; obtaining luminance variations at an edge portion of the pad in each taken image to determine an in-focus height of the pad based on an image taking height position at which the taken image has the largest luminance variation at the edge portion of the pad; obtaining luminance variations on an upper surface of the ball in each taken image to determine an in-focus height of the upper surface of the ball based on an image taking height position at which the taken image has the largest luminance variation on the upper surface of the ball; and calculating the thickness of the ball by finding a difference between the obtained in-focus heights of the pad and the upper surface of the ball.

Abstract: The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the visually assessed soldered joints that do not meet the relevant quality requirements. The visual assessment takes place by means of a video camera and a computing device connected to the video camera. The assessment criteria for the soldered joints are stored in the computing device. The invention also relates to an apparatus for carrying out the method.

Abstract: A micro-optical train manufacturing process includes a step of characterizing the position of optical components on an optical bench, typically using a metrology system. These optical components are then aligned with respect to each other in a passive alignment step based on data from the metrology system and optical system design information. As a result, a subsequent active align process can be avoided in some situations, or if a subsequent active alignment process is performed, the time required for that active alignment process can be reduced because of this initial metrology-based passive alignment step.

Abstract: A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68. The light path 80 that passes through a parallel flat plate includes a half-mirror 82 disposed in the light path, a parallel flat plate 86, and a reflective mirror 88 which is disposed perpendicular to the optical axis of the light rays 96 that have passed through the parallel flat plate 86 and which performs a mirror reflection operation, in a plane perpendicular to the optical axis, on the light rays 96, so that the light rays again return to the parallel flat plate 86 as reflected light 98.

Abstract: The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A calibration jig for a component recognition device and a component recognition calibration method using the jig which can stabilize the mounting accuracy of a component to a to-be-mounted object and improve amount quality. An opening is formed at a to-be-picked up face of the calibration jig. A predetermined position of the calibration jig is recognized on the basis of the contrast between the picked-up face and the opening. The position of the calibration jig can be recognized with higher accuracy, so that a resolution of the component recognition device, etc. can be obtained with a higher degree of accuracy. Mount accuracy of the component to the object is thus stabilized and mount quality is improved.

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: An automated method for forge welding tubulars including heating the tubular ends to be joined in a welding chamber while the heated tubular ends are maintained aligned and parallel relative to each other and at a small spacing, whereupon the heated tubular ends are pressed together while a reducing shield gas is injected into the chamber.

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: On measurement of a component Ay of the amplitude of the oscillations of the tip of a capillary which is clamped to a horn to which ultrasonics can be applied from an ultrasonic transducer, whereby measurement is based on the shading of a light beam by the capillary and whereby the intensity of the light beam is measured by means of an opto-receiver, the capillary is placed at one side of the light beam without it shading the light beam and ultrasonics is applied to it. The capillary is then moved in steps through the light beam whereby, for each of the i=1 to n steps, the direct voltage portion UDC(yi) and the alternating voltage portion UAC(yi) of the output signal of the opto-receiver are determined as well as a co-ordinate yi whereby the co-ordinate yi designates the position of the capillary in relation to a co-ordinate axis y running perpendicularly to the light beam. The amplitude Ay is then calculated from the values measured.

Abstract: A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an optical assembly which conducts the image of the tool and reference member to the position detection camera. A lens used in the position detection camera and a lens installed in the optical assembly are arranged so that such lenses construct an afocal optical system.

Abstract: A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which emits illuminating light downward through the lens barrel, and a light path conversion device that directs an image of an area near the lower end of the tool to the position detection camera. The light path conversion device includes a wavelength-selective filter that is provided so as to be within a light path of the image of the area near the lower end of the tool. The wavelength-selective filter allows illuminating light of the light path conversion device to pass therethrough but prevents the illuminating light from the lens barrel side from passing therethrough.

Abstract: A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface temperature of the weld, and a computer to acquire and analyze data from the camera. In one embodiment, the sample is heated on one side and the time-temperature characteristic is monitored as the heat travels through the sample and the spot weld. The computer generates a histogram that represents the relationship between a particular time-temperature characteristic and the number of pixels exhibiting that characteristic, thereby representing the quality and size of the weld nugget. By generating a histogram corresponding to weld quality, the inventive apparatus and method provides an objective weld quality indicator and allows automation of the evaluation process.

Abstract: A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.

Abstract: The inventor relates to method for the posibility accurate adjustment and fixing of a microoptical element on a carrier. In this case, an optical position monitor with a camera monitors the accurate adjustment of the microchip and an imaging optical system directed onto the microoptical and element. According to the invention, thermal radiation is fed into the position monitor and directed by the same imaging optical system onto the microchip, and in this way the thermal energy is guided to exactly the correct point.

Abstract: An apparatus for making wire connections between a first connection area and a second connection area by means of a capillary. The apparatus contains an image recognition system which is designed so that the tip of the capillary enters the image area of the image recognition system immediately before impacting on the respective connection area. In this way, the position of the desired point of impact of the capillary on the connection area as well as the position of the tip of the capillary can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Abstract: The present invention describes the precise metering of soldering material realized in a preferred desktop preferably portable device designated for hand-soldering in small and medium volume operations. It combines the fully automated process of precise metering of the soldering wire for high accuracy and quality soldering with the freedom of a hand-operated soldering process.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longitudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface temperature of the weld, and a computer to acquire and analyze data from the camera. In one embodiment, the sample is heated on one side and the time-temperature characteristic is monitored as the heat travels through the sample and the spot weld. The computer generates a histogram that represents the relationship between a particular time-temperature characteristic and the number of pixels exhibiting that characteristic, thereby representing the quality and size of the weld nugget. By generating a histogram corresponding to weld quality, the inventive apparatus and method provides an objective weld quality indicator and allows automation of the evaluation process.

Abstract: In a bonding method and apparatus, a position-detecting camera is moved to a point above reference marks, and the positional relationship between the reference marks and the optical axis of the position-detecting camera is measured by the position-detecting camera, a bonding tool is moved to a point above the reference marks in accordance with an amount of offset stored in memory beforehand, the positional relationships between the reference marks and the tool are measured by an offset-correcting camera, and an accurate amount of offset is determined by correcting the mount of offset stored in memory beforehand based upon such a measurement result.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent plate (56), where an expansion amount of the film carrier (52) is changed according to a condition of the heat bonding. A distance between the measured marks (MA, MB) is then obtained. The condition for the heat bonding is determined based on this distance. The heat bonding is performed under this condition determined.

Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Abstract: A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode conductor and a armor on the polished unit element.

Abstract: Multi-modal soldering inspection system comprises means for automatic inspection involving imaging means for acquiring solder joint images, mode-selecting means for selecting auto mode, review mode, or eye mode, means for integrating inspection data obtained in the auto and the review modes, replay means for replaying images acquired with the imaging means to display them, input means for inputting the review data, and storage for storing the inspection data.

Abstract: A system (5) and method are used for predicting and controlling the temperature of a semiconductor wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14). The emissivity of the surface of the wafer (10) is measured using an infrared device (11) prior to the solder reflow process. Using the measured emissivity value of the wafer (10), the peak temperature of the wafer (10) is predicted, and the operating profile of the solder reflow furnace (14) is adjusted accordingly to achieve a desired temperature profile of the wafer (10). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer (10) and controls the actual temperature of the wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14).

Abstract: A computerized system and method for identifying and correcting bond placement errors in a bonder pre-programmed to attach connecting bonds onto bond pads of an integrated circuit by first providing a sacrificial bond pad for a sacrificial bond, then using a vision system associated with the bonder to determine the actual center of the pad as the intended bond location, and instructing the bonder to place a bond in the pre-programmed center of the pad. Second, the vision system is used to determine the actual location of the bond. Next, the error between the intended location and the actual location is determined by computing distances and directions between the pre-programmed and actual centers and the actual bond location. Finally, a new command of the bonder is computed such that a repetition of the initial error would cause the bond to be located in the actual center of another pad. This new command is input to the bonder.

Abstract: A method is provided for inspecting solder-bumped joints of a semiconductor package assembly comprising a packaged semiconductor device and a substrate, such as a circuit board. Embodiments include immersing the package assembly in a dye solution, such as red tracer dye, then placing the immersed package assembly under a vacuum such that, when cracks exist between the solder bumps and substrate bonding pads, or between the solder bumps and the semiconductor device bonding pads, the dye solution flows into the cracks. The package assembly is removed from the vacuum and the dye solution, dried, and the semiconductor device and the substrate manually separated. Thereafter, the substrate bonding pads and the semiconductor device bonding pads are inspected, as with an optical microscope, for residual dye, indicating cracked solder joints. Thus, cracked solder joints, and the full extent of the cracks, are clearly indicated by the presence of dye on the bonding pads after the inventive procedure is performed.

Abstract: An apparatus for making wire connections between a first connection area (2) and a second connection area (3) by means of a capillary (10) contains an image recognition system which is designed so that the tip (27) of the capillary (10) enters the image area of the image recognition system immediately before impacting on the respective connection area (2). In this way, the position of the desired point of impact of the capillary (10) on the connection area (2) as well as the position of the tip (27) of the capillary (10) can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary (10).

Abstract: A bonding apparatus has a bonding tool for holding a chip on a mount surface, an elevating mechanism for elevating the bonding tool, and a chip recognition camera for taking a picture of the chip from its lower side. A detecting device is provided for detecting contact between the chip and the bonding tool. A controlling device is provided for displacing the bonding tool from the position where the detection means has detected contact between the chip and the bonding tool by an amount, in the height direction, equal to a difference between the mount surface and a focal position of the chip recognition camera, so as to place the bonding tool above the chip recognition camera.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.