Abstract: A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures are coupled to structures and other substructures by fixture bridges in the pre-assembled state. The substructures of the device are dissociated by eliminating the fixture bridges. The plural laminae are registered and bonded to form the device either before or after the fixture bridges are eliminated. The fixture bridges can be eliminated in a variety of ways, including vaporization by electrical current, chemical dissolution, or thermochemical dissociation. One method to selectively bond the laminae together is by microprojection welding. Microprojection welding comprises forming laminae with projections that extend from at least one planar surface of the lamina.

Abstract: The invention relates to an interconnection between two overlapping end sections of metallic strips (10, 20) in which a quick and economical interconnetion should be produced. To this end, the invention provides that several annular welds (30) are provided in the overlapping area (15) which are situated at a distance from the face ends of both strips (10, 20).

Abstract: A window frame is formed of a plurality of plastic section pieces welded together at their ends. The ends of the plastic section pieces also have surfaces which abut one another. The plastic section pieces are not welded at the abutting surfaces. The unwelded abutting surfaces can therefore be used to define the length of the window frame.

Abstract: A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage caused by micro-cracking. This irregularity of the solder boundary constrains the propagation of cracks by creating obstacles along the crack path, redirecting the crack away from the intermetallic layer, or by increasing the path along which the crack propagates.

Abstract: In the present invention, by the method using a backing material such as copper, which is not melted by a welding heat source, in an end face of a member without using a backing metal or consumable backing material at a joint welding time, overlay welding is performed to increase a plate thickness and a plate width. Thereafter, edge preparation including a member of a designed joint weld location and an overlay weld is performed, and the groove processed portion is placed to an opponent member to provide joint welding in order to obtain an effective throat depth more than a plate thickness and a plate width of the member.

Abstract: In accordance with a preferred embodiment, a monolith extrusion die is formed by a plurality of individual tube elements bonded together as a tube stack defining a plurality of extrudable material feed holes and reference guides for a plurality of individual shaping teeth each having a root segment located in a reference guide and each having a shaping head spaced apart from adjacent shaping heads to form intersecting rows of extrusion slots having a shape corresponding to the monolith formed by extrudable material directed from the feed holes through the shaping teeth.

Abstract: A solder bridge between leads of a microelectronic circuit is removed by projecting a laser beam onto the solder bridge with sufficient power to cause the solder forming the bridge to melt and to flow onto a wicking tool placed into contact with the solder bridge. The wicking tool is removed during the heating to remove the solder and debridge the leads. Microelectronic leads having a width of the order of 4 mils and a pitch of the order of 8 mils may be debridged easily using the invention.

Abstract: The specification and drawings disclose a method and apparatus for rolling plural metal strips simultaneously to form thinner metal strip or foil. The method allows use of larger diameter rolls and simpler roll supporting structure and mill controls than heretofore possible in foil forming. The disclosed method contemplates the provision of a plurality of metal strips which are then bonded together in juxtaposed relationship with a thin layer of matrix material which substantially completely covers the opposed faces of the strips to form a composite comprising alternate layers of metal strip and matrix material. Thereafter the composite is rolled to reduce the strips to the desired thickness. Subsequently, the bond between the strips is destroyed and the strips are separated. According to certain embodiments, strong or low ductility metals can be formed into foils by bonding them in the central portion of the composite. Weaker or more ductile metals form the outer portions of the composite.