Subsequent To Bonding Patents (Class 228/155)
  • Patent number: 11498361
    Abstract: An axle housing assembly and a method of manufacture. A friction weld may join a spindle to an arm portion of the axle housing assembly. An extension weld may encircle the arm portion. The extension weld may extend from the friction weld in a direction that may extend away from the spindle.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 15, 2022
    Assignee: ArvinMeritor Technology, LLC
    Inventors: Kenneth Yu, Joseph Melekian, Srinivasa Perumal Rengasamy
  • Patent number: 11404177
    Abstract: Fuel pellets and fuel pellet arrangements include thermally-conductive inserts within a fuel. The inserts have at least one portion of a thermally-conductive material, such as radially-extending fins. The inserts are configured to dissipate heat during use of the fuel pellets, while minimizing the amount of the total volume of the fuel pellet that is occupied by non-fissile material. The inclusion of heat-dissipating inserts enables the fuel pellets to exhibit improved thermal performance over the lifetime of the fuel, including a relatively low peak temperature and relatively low integrated average temperatures, while the minimal volume of the inserts avoids significantly decreasing the percent of enrichment achievable.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: August 2, 2022
    Assignee: Battelle Energy Alliance, LLC
    Inventors: Robert D. Mariani, Pavel G. Medvedev
  • Patent number: 11069481
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
  • Patent number: 10808216
    Abstract: Improved biopharmaceutical processing equipment such as reactor vessels and stainless steel surfaces, and methods of determining the same are disclosed herein. In some embodiments, a biopharmaceutical processing equipment can include a vessel having a surface that is configured to contact proteinaceous processing material, wherein the surface has a pre-commissioning surface roughness of greater than about 20 Ra Max (?in).
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 20, 2020
    Assignee: Lonza Ltd
    Inventors: Michael Mietzner, Jim Heimbach, Andrew Harris
  • Patent number: 10802175
    Abstract: A reflectometer sensor element comprises (i) a recess formed in an electrically conducting material, the electrically conducting material defining a connection portion; the recess including an open end at or adjacent a surface of the electrically conducting material; and a transverse cross-sectional area defined by at least one wall of the recess increasing in at least a first region between the connection portion and the open end; (ii) an electrically conducting electrode that is spaced from the said at least one wall of the recess and extends between the open end and a location proximate the connection portion; and (iii) one or more dielectric materials occupying at least part of the recess between the at least one wall of the recess and the electrically conducting electrode. Such an element allows the detection of signals reflected from deeper within subterranean rock than has previously been possible.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 13, 2020
    Assignee: REEVES WIRELINE TECHNOLOGIES LIMITED
    Inventor: Darren Chaney
  • Patent number: 10407826
    Abstract: A detachable flyer bow system, apparatus and methods of using the same are provided. The systems each comprise a base having a longitudinal recess with an inner lateral dimension that is greater than the outer lateral dimension and a front lateral dimension that is smaller than the rear lateral dimension, an end block attachable to the end of the flyer bow with a recess engagement portion to slidably engage the longitudinal recess of the base. The base may have an opening to allow at least a portion of the end block to clear the opening for the inward insertion of the end block into the base, or the outward removal of the end block from the base.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: September 10, 2019
    Inventor: Roy R. R. Rymer
  • Patent number: 10239371
    Abstract: A non-driven axle for a vehicle or a trailer is provided. The non-driven axle includes a first arm portion, a second arm portion, and a central portion. The first arm portion is for rotatably mounting a first wheel hub. The second arm portion is for rotatably mounting a second wheel hub. The second arm portion is on an axial end of the central portion opposite the first arm portion. The central portion is between the first arm portion and the second arm portion and may be substantially arch-shaped or substantially ring-shaped. The substantially arch-shaped central portion includes a main portion and a radially inner portion. The substantially ring-shaped central portion includes a main portion and an inner portion. The non-driven axle reduces a weight of a vehicle or trailer while capable of being lifted without interfering with an operation of a drive axle.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: March 26, 2019
    Assignee: Dana Heavy Vehicle Systems Group, LLC
    Inventors: Steven G. Slesinski, Steven J. Wesolowski, James F. Ziech
  • Patent number: 10232422
    Abstract: A composite tube manufacturing method includes the following steps: providing a billet, wherein the billet includes an inner material and an outer material, and the inner material is enveloped in the outer material; heating the billet; pushing the billet to a to-be-extruded position; and performing an extrusion process, and extruding the billet to a composite tube, wherein the inner material and the outer material of the billet are respectively extruded to an inner tube and an outer tube of the composite tube, and the outer tube is bonded to the inner tube through the extrusion process.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 19, 2019
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventor: Shun-Yu Shao
  • Patent number: 10018302
    Abstract: A high pressure tank has a liner and a reinforcing layer. The reinforcing layer is formed on an outer surface of the liner. An adhesion inhibiting process that inhibits the liner from adhering to the reinforcing layer is applied to at least a portion of the liner in a region contacting the reinforcing layer.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: July 10, 2018
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shiro Nishibu
  • Patent number: 9991233
    Abstract: Package-on-package (“PoP”) devices with same level wafer-level packaged (“WLP”) components and methods therefor are disclosed. In a PoP device, a first integrated circuit die is surface mount coupled to an upper surface of a package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region. The first conductive lines extend away from the upper surface of the package substrate. A molding layer is formed over the upper surface of the package substrate, around sidewall surfaces of the first integrated circuit die, and around bases and shafts of the conductive lines. WLP microelectronic components are located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: June 5, 2018
    Assignee: Invensas Corporation
    Inventors: Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba
  • Patent number: 9991235
    Abstract: Package-on-package (“PoP”) devices with upper RDLs of WLP (“WLP”) components and methods therefor are disclosed. In a PoP device, a first IC die is surface mount coupled to an upper surface of the package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region with reference to the first IC. A molding layer is formed over the upper surface of the package substrate. A first and a second WLP microelectronic component is located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. Each of the first and the second WLP microelectronic components have a second IC die located below a first RDL respectively thereof. A third and a fourth IC die are respectively surface mount coupled over the first and the second WLP microelectronic components.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: June 5, 2018
    Assignee: Invensas Corporation
    Inventors: Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba
  • Patent number: 9972609
    Abstract: Package-on-package (“PoP”) devices with WLP (“WLP”) components with dual RDLs (“RDLs”) for surface mount dies and methods therefor. In a PoP, a first IC die surface mount coupled to an upper surface of a package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region. A molding layer is formed over the upper surface of the package substrate. A first and a second WLP microelectronic component are located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. Each of the first and the second WLP microelectronic components have a second IC die located between a first RDL and a second RDL. A third and a fourth IC die are respectively surface mount coupled over the first and the second WLP microelectronic components.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 15, 2018
    Assignee: Invensas Corporation
    Inventors: Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba
  • Patent number: 9912035
    Abstract: A retaining and anchoring device forming a retaining and anchoring section on a metal plate on a reflector includes a recess provided in the metal plate. The recess has on an upper face of the metal plate a peripheral edge or edge sections spaced apart from one another. An undercut or several undercut sections are formed below the peripheral edge or the edge sections. The recess is free of bores or passages. A locking device prevents unintentional removal of a snap-on mechanism from the recess beyond an edge section or plural edge sections which cover the undercut section(s).
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: March 6, 2018
    Assignee: Kathrein-Werke KG
    Inventors: Christian Fröhler, Mario Günther, Johann Baptist Obermaier
  • Patent number: 9493994
    Abstract: A centralizer comprises a first collar, a second collar, a plurality of bow springs coupling the first collar to the second collar, and a plurality of particulates disposed on an outer surface of at least one bow spring. One or more of the first collar, the second collar, and the bow springs comprises a composite material. In some embodiments, the centralizer comprises a third collar, wherein the plurality of bow springs comprise a first portion of bow springs and a second portion of bow springs, and wherein the first portion of the bow springs couple the first collar to the third collar and the second portion of the bow springs couple the second collar to the third collar.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: November 15, 2016
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Glenn Lively, David Levie, Dietmar Mueller, Thorsten Weber
  • Patent number: 9461305
    Abstract: The invention provides magnesium fuel cells which can prevent the self-discharge of negative electrode materials and can produce electricity stably for a long term. A magnesium fuel cell includes a negative electrode material including a magnesium alloy, and an electrolytic solution for eluting magnesium ions from the negative electrode material. The magnesium alloy contains aluminum and calcium. The electrolytic solution is preferably an aqueous sodium chloride solution, an aqueous sodium hydroxide solution, an aqueous sodium hydrogencarbonate solution, an aqueous sodium percarbonate solution, or a mixture including two or more of these solutions.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: October 4, 2016
    Assignee: Tohoku University
    Inventors: Yasuaki Kohama, Michiru Sakamoto, Toshihiko Abe
  • Patent number: 9242286
    Abstract: A multilayer cookware article has an inner metal sheet and an outer metal sheet defining a flat bottom and a side wall connected to the bottom by a rounding. The flat bottom has at least one intermediate layer positioned between the inner sheet and the outer sheet. The intermediate layer has a diameter limited to a diameter of the flat bottom including the rounding. The side wall has an intermediate layer located between the inner sheet and the outer sheet. The intermediate layer of the side wall is mechanically separated from the intermediate layer of the bottom.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: January 26, 2016
    Inventors: Dusko Maravic, Sebastian Rastberger
  • Publication number: 20150111665
    Abstract: An iron type golf club head comprising a blade portion located near a terminal end of said iron type golf club head, wherein over 50% of said blade portion is made out of a first material; a hosel portion located near a proximal end of said iron type golf club head, wherein over 50% of said hosel portion is made out of a second material; and a bifurcation plane defined as a plane that is perpendicular to said striking face positioned at a distance of 30 mm heel-ward along an X-axis from a face center of said iron type golf club head, said bifurcation plane separating said blade portion from said hosel portion; wherein said first material has a yield strength greater than about 570 MPa; wherein said second material has a yield strength less than about 570 MPa.
    Type: Application
    Filed: December 30, 2014
    Publication date: April 23, 2015
    Applicant: ACUSHNET COMPANY
    Inventors: Marni Ines, Uday V. Deshmukh
  • Publication number: 20150102128
    Abstract: Aspects of the disclosure are directed to a bonding of a first skin and a second skin to a core material, coupling a sheet to the first skin to form with the first skin an enclosure containing the second skin and the core material, exposing the first skin, the second skin, and the core material to heat, and based on the exposition of heat, applying pressure via the enclosure to the first skin to cause the first skin to deform and expand to a shape of a die.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 16, 2015
    Inventor: Alan R. Douglas
  • Patent number: 9004341
    Abstract: Provided is a method for producing a welded steel pipe having excellent buckling resistance. The method for producing a welded steel pipe according to the present embodiment includes steps of: preparing a welded pipe, and expanding the welded pipe over the entire length thereof by using a pipe expanding head such that an undulation wavelength ratio D defined by Formula (1) is not more than 0.8, or not less than 1.8: D=p/???(1), where p is an undulation wavelength in the axial direction of the welded steel pipe, and ? is a Timoshenko's buckling wavelength as defined by Formula (2): ?=3.44×(r×t)1/2 ??(2), where r is an inner radius of the welded steel pipe and t is a wall thickness of the welded steel pipe.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: April 14, 2015
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventor: Hidenori Shitamoto
  • Publication number: 20150097022
    Abstract: Method of assembly of a first element (I) and a second element (II) each having an assembly surface, at least one of the assembly surfaces comprising recessed metal portions (6, 106) surrounded by dielectric materials (4, 104) comprising: A) a step to bring the two assembly surfaces into contact without application of pressure such that direct bonding is obtained between the assembly surfaces, said first and second assemblies (I, II) forming a stack with a given thickness (e), B) a heat treatment step of said stack during which the back faces (10, 110) of the first (I) and the second (II) elements are held in position so that they are held at a fixed distance (E) between the given stack thickness+/?2 nm.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Lea DI CIOCCIO, Yann BEILLIARD
  • Publication number: 20150090771
    Abstract: A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding.
    Type: Application
    Filed: September 23, 2014
    Publication date: April 2, 2015
    Inventors: Domenico Furfari, Marco Pacchione, Valentin Richter-Trummer
  • Publication number: 20150050516
    Abstract: In one aspect of the disclosure, an apparatus for manipulating a plurality of curved sheets is provided. Each of the plurality of curved sheets includes an upper surface and a lower surface. The apparatus includes tooling to be coupled to the upper surface of each of the plurality of curved sheets. The tooling is capable of moving the plurality of curved sheets relative to each other and abutting the plurality of curved sheets so that the upper surface of each of the plurality of curved sheets is coextensive with a virtual arcuate surface. The apparatus also includes a welding apparatus capable of welding the plurality of curved sheets together after abutting the plurality of curved sheets.
    Type: Application
    Filed: August 13, 2013
    Publication date: February 19, 2015
    Applicant: The Boeing Company
    Inventor: Peter Z. Anast
  • Patent number: 8943691
    Abstract: A method of manufacturing a furcated composite post (1) comprising at least two strips (7, 8) that are joined together along their length in a furcated manner. The method comprises the steps of feeding one or more of the strips (7, 8) at a set rate to working rolls of a roll mill for profile rolling to a desired cross section/profile, feeding the strips (7, 8) at the same set rate to positioning rolls for holding the strips (7, 8) in a correct orientation for joining, and joining the strips together, preferably by welding the strips (7, 8) along their length.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: February 3, 2015
    Inventors: Ashley Dean Olsson, Ashley Norman Olsson, Nathanael Dean Olsson, Stafford James Olsson
  • Publication number: 20150030381
    Abstract: Methods of manufacture include welding two or more elongate members together to define an elongate weldment, wherein the welding results in a weld region that is in tension and regions adjacent to the weld region that are in compression, and longitudinally stretching the elongate weldment. Tools and systems for manufacturing elongate weldments, as well as apparatuses, such as aircraft, that include elongate weldments, also are disclosed.
    Type: Application
    Filed: July 29, 2013
    Publication date: January 29, 2015
    Applicant: The Boeing Company
    Inventors: Paul Stevenson Gregg, Kirk B. Kajita
  • Publication number: 20150021376
    Abstract: A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball. A capillary for wire bonding includes a working face, an annular chamfer section, and a cylindrical bore offsetting the annular chamfer section from the working face. A capillary for wire bonding includes a capillary body comprising a working tip having a working face. The capillary body defines an axial passage extending from the working face along a longitudinal axis of the capillary. The axial passage includes a cylindrical bore extending internally from the working face, and a first annular chamfer having a major diameter defined by the cylindrical bore.
    Type: Application
    Filed: July 17, 2013
    Publication date: January 22, 2015
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Trent Uehling, Ilko Schmadlak
  • Publication number: 20140377485
    Abstract: A method for achieving a higher stress corrosion cracking resistance for steel components of corrosion resistant, austenitic steel having an outer oxide layer, especially a chromium oxide layer, especially steel components in the form of steel sheets, steel pipes or steel rods, as well as for weld seams connecting austenitic steel components, wherein the increased stress corrosion cracking resistance is achieved by introducing compressive stresses into an outer layer of the steel component covered outwardly by the oxide layer, respectively into an outer layer of the weld seam, wherein the compressive stresses are introduced by areal pressure exertion on the respective outer layer.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Inventors: Markus Berger, Christoph Bollig, Volker Frey
  • Publication number: 20140327272
    Abstract: A method of creating a hardened steel assembly from at least two parts may include the consecutive steps of first joining the at least two parts in a cold formed state to form an assembly, and then hardening the joined assembly.
    Type: Application
    Filed: April 25, 2014
    Publication date: November 6, 2014
    Applicant: Volvo Car Corporation
    Inventor: Richard Johansson
  • Patent number: 8827140
    Abstract: Coiled tubing with a secured conduit and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected by the welding and heat treatment process or processes. To install the conduit into the coiled tubing, the coiled tubing is unrolled from the reel, the conduit is attached to an end of the slickline and the other end of the slickline pulled to fish the conduit through the coiled tubing, resulting in conduit held within the retainer inside the coiled tubing. In embodiments where a slickline is not used, the conduit can be pumped into the retainer or dropped therein by gravity when the coiled tubing is hung in a wellbore. Alternatively, a heat resistant conduit may be secured within the coiled tubing by attachment directly to the coiled tubing or held therein by a retainer.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: September 9, 2014
    Inventor: Mark Andreychuk
  • Patent number: 8820614
    Abstract: The method of producing a magnesium alloy joined part has the following steps: a joining step of joining a reinforcing material made of metal to a plate material made of magnesium alloy without allowing an organic material to remain at the joined portion and a plastic-working step of performing plastic working on the plate material to which the reinforcing material is joined. A desirable means of joining the reinforcing material to the plate material can be to use an inorganic adhesive. Because the magnesium alloy joined part is formed by a structure in which the reinforcing material is joined to the plate material, in comparison with the case where the reinforcing material is formed by machining or the like, the magnesium alloy structural member can be obtained with high production efficiency.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: September 2, 2014
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masatada Numano, Ryuichi Inoue, Nobuyuki Okuda, Nozomu Kawabe, Koji Mori, Nobuyuki Mori, Yukihiro Oishi, Takahiko Kitamura
  • Publication number: 20140144973
    Abstract: The present disclosure relates to a reinforcing structure for reinforcing a side wall structure for a motor vehicle in the region of a door cutout, wherein the reinforcing structure is designed ring-shaped in order to surround a door cutout of a side wall structure. It is provided that the reinforcing structure is produced material-uniformly. The present disclosure furthermore relates to a semi-finished product for producing such a reinforcing structure and to a method for producing the reinforcing structure. The present disclosure also relates to a side wall structure and to a side wall for a motor vehicle.
    Type: Application
    Filed: January 29, 2014
    Publication date: May 29, 2014
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Bernd POHL, Stefan STANIK
  • Publication number: 20140125090
    Abstract: Method for producing a vehicle component, in particular a motor vehicle component, in particular a B-pillar, including providing a first aluminum alloy and a second aluminum alloy. The second alloy composition substantially matches the first aluminum alloy composition. Performing a heat-treatment of the first alloy to increase the ductility of the first alloy. Performing a heat-treatment of the second alloy. The heat-treatment of the first alloy differing from the heat-treatment of the second alloy. Welding together the heat-treated first alloy and the heat-treated second alloy to obtain a composite part. Shaping the composite parts into a motor vehicle component. The motor vehicle component sub-region of the first alloy can be designed as a predetermined deformation region when a force is applied due to an accident to achieve a good combination of rigid regions for example forming a safety cell, and deformable regions forming a crumple zone for absorbing energy.
    Type: Application
    Filed: June 8, 2012
    Publication date: May 8, 2014
    Applicant: ALERIS ROLLED PRODUCTS GERMANY GmbH
    Inventor: Wolfgang Braunschweig
  • Publication number: 20140054358
    Abstract: Coiled tubing with a secured conduit and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected by the welding and heat treatment process or processes. To install the conduit into the coiled tubing, the coiled tubing is unrolled from the reel, the conduit is attached to an end of the slickline and the other end of the slickline pulled to fish the conduit through the coiled tubing, resulting in conduit held within the retainer inside the coiled tubing. In embodiments where a slickline is not used, the conduit can be pumped into the retainer or dropped therein by gravity when the coiled tubing is hung in a wellbore. Alternatively, a heat resistant conduit may be secured within the coiled tubing by attachment directly to the coiled tubing or held therein by a retainer.
    Type: Application
    Filed: September 10, 2013
    Publication date: February 27, 2014
    Inventor: Mark ANDREYCHUK
  • Patent number: 8640320
    Abstract: A method of joining a first and a second work piece, such as automotive closure panels, includes supporting the work pieces on a fixture, and then joining the work pieces to one another by a first solid state weld with a vibrating roller head of a tool assembly, such as a robotically-controlled ultrasonic seam welder. Next, a flange of the second work piece is hemmed about an outer periphery of the first work piece using the same or a different roller head with the work pieces supported by the fixture. The hemmed flange is then joined to the first work piece by a second solid state weld with the vibrating roller head of the robotically-controlled ultrasonic seam welder. A system for joining a first and a second work piece is also provided.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: February 4, 2014
    Assignee: GM Global Technology Operations LLC
    Inventors: John E. Carsley, Blair E. Carlson, James G. Schroth, David R. Sigler
  • Patent number: 8616433
    Abstract: A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: December 31, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20130337128
    Abstract: The present invention relates to a food forming drum comprising a multitude of rows of cavities. The present invention further relates to the process of manufacturing the inventive drum.
    Type: Application
    Filed: February 10, 2012
    Publication date: December 19, 2013
    Applicant: GEA CFS BAKEL B.V.
    Inventors: Hendrikus Petrus Gerardus Van Gerwen, George Boogers, Hendrik Jan Righolt
  • Patent number: 8568901
    Abstract: An alloy for use as a welding overlay for boiler tubes in a low NOx coal-fired boiler comprising in % by weight: 36 to 43% Cr, 0.2 to 5.0% Fe, 0-2.0% Nb, 0-1% Mo, 0.3 to 1% Ti, 0.5 to 2% Al, 0.005 to 0.05% C, 0.005 to 0.020% (Mg+Ca), 0-1% Mn, 0-0.5% Si, less than 0.01% S, balance substantially Ni and trace additions and impurities. The alloy provides exceptional coal ash corrosion resistance in low partial pressures of oxygen. The alloy also increases in hardness and in thermal conductivity at service temperature over time. The increased hardness improves erosion resistance of the tubes while the increased thermal conductivity improves the thermal efficiency of the boiler and its power generation capabilities.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: October 29, 2013
    Assignee: Huntington Alloys Corporation
    Inventors: Samuel D. Kiser, Brian A. Baker
  • Patent number: 8567657
    Abstract: Coiled tubing with secured wireline and a method for manufacturing same. A slickline held by a retainer is introduced to the coiled tubing manufacturing process by attaching the retainer and slickline to a metal plate, prior to the metal plate being welded into a tubular. The slickline is unaffected by the welding and heat treatment process or processes. To install wireline into the coiled tubing, the coiled tubing is unrolled from the reel, the wireline is attached to and end of the slickline and the other end of the slickline pulled to fish the wireline through the coiled tubing, resulting in wireline held within the retainer inside the coiled tubing. Alternatively, heat resistant wireline may be secured within the coiled tubing by attachment to the coiled tubing or held by a retainer.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: October 29, 2013
    Inventor: Mark Andreychuk
  • Patent number: 8557411
    Abstract: A secondary battery in which electric connection between an electrode tab of a bare cell and a connection tab of a protective circuit module is performed by welding the electrode tab of the bare cell to the connection tab of the protective circuit module that form a battery pack. A process is provided so that electrode tabs of two or more laminated bare cells are easily and precisely welded to a single, or more, connection tabs by a worker. The welding process is effectively performed and welding strength between the tabs increases.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: October 15, 2013
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Deayon Moon
  • Publication number: 20130240609
    Abstract: A component is formed by welding a plurality of sheets of metal to form a blank with a number of weld nuggets, placing the blank between a die section and a lid section, heating the die section to heat the blank, and introducing a pressurized gas between the lid section and the die section to press the blank into a mold in the die section to form a component. The number of weld nuggets has a desired thickness ratio between about 1.1 to about 1.25 such that the plurality of sheets of metal and the component formed have a number of characteristics that are substantially the same.
    Type: Application
    Filed: November 12, 2009
    Publication date: September 19, 2013
    Applicant: THE BOEING COMPANY
    Inventors: Daniel G. Sanders, Luis R. Leon, Paul D. Edwards, Gregory L. Ramsey, Gary W. Coleman
  • Publication number: 20130200134
    Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
    Type: Application
    Filed: January 22, 2013
    Publication date: August 8, 2013
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventor: ORTHODYNE ELECTRONICS CORPORATION
  • Publication number: 20130119012
    Abstract: An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 16, 2013
    Applicant: TESSERA INTERCONNECT MATERIALS, INC.
    Inventor: TESSERA INTERCONNECT MATERIALS, INC.
  • Publication number: 20130092279
    Abstract: New methods of manufacturing coiled tubing result in increased useful life of the coiled tubing string by creating an enhanced strip-to-strip weld zone having load bearing and/or fatigue resistance properties substantially equal to or greater than the load bearing and/or fatigue resistance properties of the strip base material. The enhanced weld zone is transition into the nominal tubing to reduce stress concentration.
    Type: Application
    Filed: October 12, 2011
    Publication date: April 18, 2013
    Applicant: QUALITY TUBING, INC.
    Inventors: David L. Daniel, William D. Van Arnam, III, Danny J. Dennis, Kevin J. Elliot, Clayton D. Hargis
  • Patent number: 8404520
    Abstract: A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 26, 2013
    Assignee: Invensas Corporation
    Inventors: Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang
  • Publication number: 20130068154
    Abstract: A watercraft body includes a hull made of an aluminum-based material and a separately fabricated superstructure that is mounted on the hull via adjoining flange plates. To fabricate the hull, frame elements are spot-welded onto the inner surface of initially-flat hull plates or plank elements, which are then curved according to the required hull contour and assembled onto the flange plate. The frame elements are screwed together via gusset plates and transverse beams to form transverse frames, and then longitudinal seams between plank elements are continuously welded from the outside. Additionally, the longitudinal seams may be welded from the inside, for example by temporarily removing gusset plates to allow continuous access to the longitudinal seams. Additionally, stand-offs may form a spacing gap between the frame elements and the plank elements, and an adhesive may fill this spacing gap to adhesively bond the framework to the hull plating.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 21, 2013
    Applicant: OPHARDT R+D GmbH & CO. KG
    Inventor: Hermann OPHARDT
  • Publication number: 20130071511
    Abstract: A method of producing at least one conformal cooling passage in a part-producing mold, and a mold provided with such a conformal cooling passage(s). A conformal cooling passage is produced by creating an open channel in a molding surface of a mold of interest, the channel substantially conforming to the contour of the molding surface. A bridging weld formed from a plurality of connected weld beads is generated in the channel so as to span and seal the channel while enclosing an open passage in the bottom thereof. The remainder of the channel above its bridging weld is filled, such as by welding, and an exposed portion of the fill material in the channel may be subsequently shaped to conform with the contours of the molding surface surrounding the channel. A sub-surface conformal cooling passage is thus formed in the mold.
    Type: Application
    Filed: November 16, 2012
    Publication date: March 21, 2013
    Applicant: HONDA MOTOR CO., LTD.
    Inventor: HONDA MOTOR CO., LTD.
  • Patent number: 8356409
    Abstract: A method for repairing a gas turbine engine component includes applying a braze slurry to a first portion of the component, applying a pre-sintered preform to a second portion of the component that is different than the first portion, and brazing the component.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: January 22, 2013
    Assignee: United Technologies Corporation
    Inventor: Edmundo J. Perret
  • Publication number: 20130001276
    Abstract: A method of forming a pack in a die by superplastic formation and diffusion bonding comprises applying a forming pressure within the pack to expand the pack within the die; and supplying gas between the die and the pack to apply a back pressure around an outside of the pack while the pack is being expanded to counteract the forming pressure to reduce surface mark off.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 3, 2013
    Applicant: THE BOEING COMPANY
    Inventors: Daniel G. Sanders, Larry D. Hefti, Gregory L. Ramsey
  • Publication number: 20120256314
    Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.
    Type: Application
    Filed: September 8, 2011
    Publication date: October 11, 2012
    Applicant: CARSEM (M) SDN.BHD.
    Inventors: Liew Siew Har, Law Wai Ling
  • Publication number: 20120190153
    Abstract: A method for connecting substrates is provided. The method includes the steps of: preparing a first wiring substrate having a first substrate including a first region and a second region which are provided with a first metal wire, wherein an area ratio between the first region and the first metal wires in the first region is different from an area ratio between the second region and the first metal wire in the second region; heating the first wiring substrate to bend the first wiring substrate; and electrically connecting a third wiring on a third substrate to the first metal wire provided on the first wiring substrate, thereby mounting the first wiring substrate on the third substrate in a manner that the first surface of the first substrate is nonparallel to the first surface of the third substrate.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 26, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Manabu KONDO
  • Publication number: 20120188727
    Abstract: The present invention discloses a package module with EMI shielding and the method thereof. The package module has a substrate or a PCB with at least one ground pad. A variety of electronic components are mounted on the substrate. The dielectric layer overlays a selected area which covers some electronic components and ground pads. Openings are formed within the dielectric layer and above ground pads. The shielding layer with at least two metal layers covers the dielectric layer and is electrically coupled, via the openings, to the ground pad. In general, there is a protection layer to encapsulate the entire substrate. The package module of the present invention not only achieves the requirement of miniature packaging but also reduces EMI caused by high speed electronic devices.
    Type: Application
    Filed: January 24, 2011
    Publication date: July 26, 2012
    Applicant: ADL Engineering Inc.
    Inventors: Nan-Chun LIN, Ya-Yun Cheng, Jing-Hua Cheng, Kuang-San Liu