Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.

Abstract: 3D semiconductor packages and methods of forming 3D semiconductor package are described herein. The 3D semiconductor packages are formed by mounting a die stack on an interposer, dispensing a thermal interface material (TIM) layer over the die stack and placing a heat spreading element over and attached to the die stack by the TIM layer. The TIM layer provides a reliable adhesion layer and an efficient thermally conductive path between the die stack and interposer to the heat spreading element. As such, delamination of the TIM layer from the heat spreading element is prevented, efficient heat transfer from the die stack to the heat spreading element is provided, and a thermal resistance along thermal paths through the TIM layer between the interposer and heat spreading element are reduced. Thus, the TIM layer reduces overall operating temperatures and increases overall reliability of the 3D semiconductor packages.

Abstract: A method of eliminating dissimilar metal welds has been disclosed. The method includes the steps of providing a first part having a first alloy composition; providing a second part having a second alloy composition different from the first part; connecting a containment structure to the first part; pouring a powder into the containment structure such that the powder is in contact with the first part; positioning a portion of the second part in the containment structure such that the second part compresses the powder between the first and second parts; and performing hot isostatic pressing (HIP) to consolidate the powder and join the first and second parts together.

Abstract: A quick release bow clamp comprising a hinged circular body having a vehicle mating flange and a nose cone mating flange configured to selectively attach to an access plate on the bow of an underwater vehicle and a nose cone for the same, respectively. The flanges of the bow clamp and the corresponding flanges of the access plate and nose cone may include an intermittent pattern of open and solid portions for weight reduction. The bow clamp may also include a quick release clamp having an adjustable draw latch configured to attach to a clip on the body of the bow clamp and a safety latch configured to prevent the draw latch from inadvertently disengaging with the clip.

Abstract: A screw element of a ball screw mechanism includes a lead screw which, at an axial end, is joined to a rod element using a friction welding process. In order to improve the friction-welded joint, prior to the friction welding process, the lead screw has a circumferential groove on the end face facing the rod element.

Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Abstract: A macro-molecular leakage-free self-adhering aluminum foil has two layers of aluminum foil compounded using a PET film, and the other surfaces of each layer coated with a modified PE adhesive layer respectively; or air gaps in one surface or two surfaces are filled with nano-aluminum to form a permeable air gap-free surface. The foil has advantages: 1, high folding resistance, fatigue resistance and strength 2, wrapping self-adhering performance is good, and stripping strength formed after adhesion is several times as high as that of the prior art; 3, air gaps in the surface of the aluminum foil filled with nano-aluminum powder result in improved compactness; manufacture from low-grade aluminum foil, and so that rolling precision requirements are lowered, and manufacturing cost reduced; 4, insulating strength is high, shielding effect is good, the return loss phenomenon is avoided, and tensile strength is good.

Abstract: An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.

Abstract: A welding method of a diffusion bonded structure in which the diffusion bonded structure formed by diffusion bonding metal parts to each other is bonded to another part by fusion welding includes a buffer layer forming step of forming a buffer layer in a welding region including a diffusion bonded joint of the diffusion bonded structure, the buffer layer having greater ductility than the diffusion bonded joint, and a welding step of bonding the welding region in which the buffer layer is formed to the another part by performing the fusion welding from above the buffer layer.

Abstract: A method of forming a vibration-damped aluminum article is provided. The method includes forming a groove in a surface of an aluminum substrate, the groove having a groove depth which is less than 50% of a thickness of the aluminum substrate. The method further includes placing metal oxide nanoparticles in the groove to form an unmixed composite. The method further includes friction stir processing the unmixed composite to form the vibration-damped aluminum article. The friction stir processing includes at least two passes over the unmixed composite. The vibration-damped aluminum article includes a surface nanocomposite portion and an aluminum alloy portion. The metal oxide nanoparticles are substantially free of metal carbides, metal borides, and carbon nanomaterials.

Abstract: A method of monitoring a heating operation on an component by a flame torch, including the steps of producing a flame with the flame torch, rotating the component with respect to the flame so that a circular weld is created on the component, and providing a first sensor that is operatively engaged with the component so that the first sensor monitors rotation or non-rotation of the components.

Abstract: This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 ?m or less.

Abstract: Double side mounted package structures and memory modules incorporating such double side mounted package structures are described in which memory packages are mounted on both sides of a module substrate. A routing substrate is mounted to a bottom side of the module substrate to provide general purpose in/out routing and power routing, while signal routing from the logic die to double side mounted memory packages is provided in the module routing. In an embodiment, module substrate is a coreless module substrate and may be thinner than the routing substrate.

Abstract: A system and method to correct for height error during a robotic additive manufacturing process. One or both of an output current, output voltage, output power, output circuit impedance and a wire feed speed are sampled during an additive manufacturing process when creating a current layer. A plurality of instantaneous contact tip-to-work distances (CTWD's) are determined based on at least one or both of the output current, output voltage, output power, output circuit impedance and the wire feed speed. An average CTWD is determined based on the plurality of instantaneous CTWD's. A correction factor is generated, based on at least the average CTWD, which is used to compensate for any error in height of the current layer.

Abstract: A semiconductor device includes a bonding pad that includes a base portion having a base layer. A bond wire or clip is bonded to a bonding region of a main surface of the bonding pad. A supplemental structure is in direct contact with the base portion next to the bonding region. A specific heat capacity of the supplemental structure is higher than a specific heat capacity of the base layer.

Abstract: Disclosed is a joint structure that includes a basal phase that contains Sn and an Sn—Cu alloy, and an intermetallic compound that is composed of Sn, Cu and Ni, and is contained in the basal phase; the Sn—Cu alloy and the intermetallic compound form an endotaxial joint; area ratio of the endotaxial joint, when assuming the total area of joint face between the Sn—Cu alloy and the intermetallic compound as 100%, is 30% or larger; and the joint structure contains 0.7 to 40% by mass of Cu, 0.1 to 5% by mass of Ni, and the balance of Sn.

Abstract: A plow blade edge system includes a plurality of wear bars mounted to a rear side of a plow blade section body. A first channel extends below each of the wear bars and is partially defined by the plow blade section body. Each where bar includes a weldment of carbide matrix along a bottom edge of the wear bar forming a first wear surface. The weldment of carbide matrix is retained in the first channel. The plow blade section body further includes a second channel formed in and extending along a bottom edge of the plow blade section body. The second channel is operative to receive at least one carbide insert and forms a second wear surface. A total surface area of the first wear surface exposed to the road surface is greater than a total surface area of the second wear surface exposed to the road.

Abstract: A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

Abstract: A method protects a field joint of a pipeline, where chamfered edges of thermally-insulating parent coatings on conjoined pipe lengths are in mutual opposition about a longitudinally-extending gap. The method includes manufacturing an hourglass-shaped inner layer around the pipe lengths, which layer may be moulded. The inner layer extends longitudinally along the gap between the chamfered edges and at least partially overlies the chamfered edges. A thermally-insulating solid insert is assembled from two or more parts to lie in the gap surrounding the inner layer, and pressure is applied radially inwardly from the insert to the inner layer. An outer layer of molten material is manufactured around the insert to form a watertight barrier and to form one or more melted interfaces with the inner layer. Corresponding field joint arrangements are also disclosed.

Abstract: A bladed rotor comprising a rotor disk (12) presenting two front faces (14, 15) and an outer peripheral face (16), sockets (18) being provided in the outer peripheral face (16) and opening out into at least one of the front faces (14, 15). The rotor (10) comprising blades (30), each having a root (32) whereby the blade is fastened in a socket (18), an end face (31) of the root being substantially level with the front face (14) of the disk when the blade is fastened in the socket. A coating layer (40) is deposited on the disk (12) so as to cover both at least a portion of the front face (14) of the disk and at least a portion of the end face (31) of the root (32).

Abstract: The disclosure describes a tempered vacuum glass, which comprises: at least two glass sheets arranged parallel to each other; surrounding edges of adjacent glass sheets being sealed using an edge sealing structure; and support members placed in an array between the adjacent glass sheets to form a vacuum space. The edge sealing structure is a metallic edge-sealing structure. The structure comprises a first transition layer, a first metallized layer, a first intermetallic compound layer, a solder layer, a second intermetallic compound layer, a second metallized layer, and a second transition layer stacked in that order. The first and second metallized layers are in a spongy skeleton structure formed by sintering a metal paste. The first and second transition layers are formed by sintering the metal paste on the adjacent glass sheets, and contain a glass phase layer including metallic particles and a metal oxide layer with a net structure.

Abstract: A flip-chip manufacture is described. Methods of blocking adhesive underfill in flip-chip high speed component manufacture include creating topology discontinuities to prevent adhesive underfill material from interacting with RF sensitive regions on substrates.

Abstract: The invention relates to the field of thermonuclear fusion and can be used in devices for electrically connecting internal elements of the reactor chamber to the vacuum vessel of the nuclear fusion reactor. The present device for electrically connecting elements inside the chamber of a reactor to the vacuum vessel of the nuclear fusion reactor comprises lamellar electrically conductive elements with surface portions oriented in different directions, said elements being stacked between flanges. The device is made as an integral unit, where profiled slots are formed with connecting walls therebetween. The connecting walls constitute the electrically conductive elements and have profiled sections of an increased thickness between the differently oriented surface portions at transition areas to the flanges provided at the end parts of the integral unit.

Abstract: A system and process for gluing two components together includes measuring the temperature of one or both panels to be glued together prior to application of the glue to the panels. If the measured temperature of the panel(s) is outside a predetermined range, the system and process thermally conditions the panel(s) to bring them into the predetermined temperature range for proper adhesion and known and controlled glued panel properties for subsequent riveting of the glued panels. A control unit with predetermined reference values is in communication with the system temperature sensors and thermal conditioning devices to provide uniform gluing quality irrespective of the environmental conditions of the assembly line.

Abstract: The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be less than a eutectic temperature of a metal element that constitutes the metal member and aluminum. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.

Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.

Abstract: Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.

Abstract: A hybrid bonding layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity, and a ball grid array (BGA) disposed within the MIO layer. The MIO layer and the BGA may be disposed between a pair of bonding layers. The MIO layer and the BGA each have a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the hybrid bonding layer can be transient liquid phase bonded between a substrate and a semiconductor device. The pair of bonding layers may include a first pair of bonding layers with a melting point above the TLP sintering temperature and a second pair of bonding layers with a melting point below the TLP sintering temperature.

Abstract: A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.

Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.

Abstract: Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor device 1 includes a device substrate 2, a semiconductor circuit 3, a sealing frame 7, a cap substrate 8, via portions 10, electrodes 11, 12 and 13, and a bump portion 14 or the like. A hollow portion 9 in which the semiconductor circuit 3 is housed in an airtight state is provided between the device substrate 2 and the cap substrate 8. The bump portion 14 connects all the via portions 10 and the cap substrate 8. Thus, the via portions 10 can be reinforced using the bump portion 14A.

Abstract: A centrifugal dryer that has improved throughput capacity resulting from the combination of a high angle agglomerate catcher with optional overflow, increased dewatering capacity, a cylindrical dewatering feed chute, a modified rotor design with positionally and structurally modified lifters in the feed and dewatering section, the drying and propagating section, as well as the pellet discharge section, and an efficient circumferential foraminous membrane.

Abstract: A hydraulic hammer is provided. The hydraulic hammer includes a housing member. The hydraulic hammer also includes a power cell disposed within the housing member. The power cell includes an outer casing. The hydraulic hammer also includes a work tool operatively coupled with the power cell. The hydraulic hammer also includes one or more bushing parts arranged within the outer casing of the power cell. The one or more bushing parts are adapted to guide the work tool during an operation of the hydraulic hammer. The one or more bushing parts include a first surface and a second surface spaced apart from the first surface. The hydraulic hammer also includes a wear indicating system for indicating a wear of the one or more bushing parts with respect to the first surface. The wear indicating system includes a first passage and a second passage.

Abstract: A method (e.g., for creating a printing plate assembly of an ink jet print head assembly) includes coating one or more sides of plural planar subsection plates with a bonding material. The subsection plates include printing holes through which a fluid is to be ejected from the ink jet print head assembly. The method also includes placing the subsection plates of the printing plate assembly against each other with the printing holes axially aligned with each other and heating the bonding material between the subsection plates such that the subsection plates are affixed to each other. The subsection plates are coupled with each other to form a chamber printing assembly that is coupled to the ink jet print head assembly that prints fluid onto one or more objects by ejecting the fluid out of the printing holes of the subsection plates. The subsection plates may be hermetically bonded to each other by inductively heating the assembly.

Abstract: Provided is a method for manufacturing a door lever made of a stainless steel material having excellent corrosion resistance, not made of a metal material used typically to manufacture the door lever, so that even if it is exposed, during long-term use, to a coast area where large amounts of moisture and salt are collected in the air, it can be used without any corrosion.

Abstract: A circumferential welded joint of a line pipe is formed by butting against each other end portions of steel pipes having a yield strength according to 5L Specification of API Standards not smaller than 555 N/mm2 and welding the butted portions in a circumferential direction. A joint strength ratio ?match=(TS-w/TS-b)·(YS-w/YS-b) represented by a product of a ratio between a tensile strength TS-w of a weld metal and a tensile strength TS-b of a base material and a ratio between a yield strength YS-w of the weld metal and a yield strength YS-b of the base material, and a critical equivalent plastic strain ?p-cri [%] for ductile crack generation in a base material heat affected zone satisfy Equation (1), and the yield strengths YS-w, YS-b of the weld metal and base material satisfy Equation (2). ?match>4.85?p-cri?0.31??(1) YS-w/YS-b?1.

Abstract: A stop collar for a tubular and method for installing a stop collar on a tubular. The stop collar includes a flexible member extending circumferentially around the tubular more than once. A tension force on the flexible member causes the flexible member to apply a radially-inward gripping force on the tubular. The stop collar may also include a shield disposed around at least a portion of the flexible member, to protect the flexible member in a downhole environment. The stop collar may also or instead include an adhesive disposed radially between the flexible member and the tubular.

Abstract: An electrical connector includes a plurality of connecting members arranged in an arrangement direction in parallel to a circuit board; and a joining member extending in the arrangement direction over an arrangement range of the connecting members for holding the connecting members. Each of the connecting members includes a terminal to be connected to a mating connector, and a terminal holding member for holding the terminal. The connecting members are arranged so that the connecting members arranged adjacently form a gap in between. The joining member is formed of a material having a coefficient of thermal expansion the same as that of the circuit board.

Abstract: Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.

Abstract: An acoustic measurement system for detecting locked blade assemblies in a gas turbine having a plurality of blade assemblies. The system includes at least one acoustic sensor for detecting acoustic energy generated as a result of movement of the blade assemblies during a turning gear operation. In addition, the system includes a housing for holding the acoustic sensor, wherein the housing is mounted to an outer diffuser of the gas turbine. The housing also includes a rotatable joint for enabling rotation of the acoustic sensor. Further, the system includes a data acquisition unit that detects an absence of acoustic energy wherein the absence of acoustic energy is indicative of locked blade assemblies. The blade assemblies are locked due to wedging of a sealing pin between the blade assemblies. The acoustic energy is detected in a frequency range of approximately 0.9 kHz to 10 kHz.

Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

Abstract: A method of forming a bonded assembly (10). The method comprises: providing at least first and second parts (12, 14) of an assembly (10) to be bonded; assembling the first and second parts (12, 14) in a required relative position to define a bond interface region therebetween; sealing part way along an edge (18) of the bond interface region using laser beam welding to define a cavity between the first and second parts (12, 14); in a vacuum environment, sealing the remainder of the edge (20) of the bond interface region using electron beam welding to form a fluid tight seal around the cavity; and applying heat and pressure to an external surface of the cavity to diffusion bond the first and second parts (12, 14) together.

Abstract: A semiconductor device includes a substrate with contact pads. A mask is disposed over the substrate. Aluminum-wettable conductive paste is printed over the contact pads of the substrate. A semiconductor die is disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure over the contact pads of the substrate. The contact pads include aluminum. Contact pads of the semiconductor die are disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure between the contact pads of the semiconductor die and the contact pads of the substrate. The interconnect structure is formed directly on the contact pads of the substrate and semiconductor die. The contact pads of the semiconductor die are etched prior to reflowing the aluminum-wettable conductive paste. An epoxy pre-dot to maintain a separation between the semiconductor die and substrate.

Abstract: Embodiments of the present invention provide an apparatus that reduces an audible noise produced in a power supply. The apparatus includes: (1) a housing; (2) an inductor coil formed from a coil of wire enclosed in the housing; (3) a set of wires that are coupled from the inductor coil to the outside of the housing through corresponding apertures in the housing, comprising electrical leads for the inductor coil; and (4) a predetermined amount of adhesive in the apertures that bonds the wires to the housing to reduce an audible noise produced when the current through the inductor coil is cycled quickly.

Abstract: A system can include a semiconductor die having a first side and a second side opposite the first side. The system can also include a first slug coupled to a portion of the first side of the die. The system can further include a second slug coupled to a portion of the second side of the die. The system can additionally include an insulating material voidlessly encapsulating the die. The first slug can include a first portion having a first width in proximity to the die and a second portion having a second width. The first portion can be closer than the second portion to the die and the first width can be smaller than the second width.

Abstract: The present invention relates to an improved gasifier reactor design. In particular, the present invention relates to improved design of gasifier reactor faceplates, gasifier reactor walls, gasifier reactor cooling tubes, and gasifier reactor walls with integrated cooling channels. The present invention utilizes aluminum nitride and/or aluminum nitride/metal composite materials which promote many benefits to the present design herein, including improved corrosion and erosion resistively as compared to high alloy metal materials.

Abstract: One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, incoluding a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers.

Abstract: An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.

Abstract: The invention relates to a method for producing a plating (5) of a vane tip. Said method consists of the following steps: a) a vane having a vane tip which is arranged opposite the base of the vane (2) and which comprises a surface which points radially outwards is provided, and b) a porous layer (7) is applied to at least the surface (4) of the vane tip and/or c) a bulge (8) which increases the surface of the vane tip is applied to at least one part of the flanks of the vane tip, said flanks surrounding the surface of the vane tip, and d) the plating (5) is applied to the porous layer and/or the bulge. The invention also relates to corresponding vanes or gas turbines with corresponding vanes.