Plural Diverse Bonding Patents (Class 228/175)
  • Patent number: 10714846
    Abstract: The invention relates to the field of thermonuclear fusion and can be used in devices for electrically connecting internal elements of the reactor chamber to the vacuum vessel of the nuclear fusion reactor. The present device for electrically connecting elements inside the chamber of a reactor to the vacuum vessel of the nuclear fusion reactor comprises lamellar electrically conductive elements with surface portions oriented in different directions, said elements being stacked between flanges. The device is made as an integral unit, where profiled slots are formed with connecting walls therebetween. The connecting walls constitute the electrically conductive elements and have profiled sections of an increased thickness between the differently oriented surface portions at transition areas to the flanges provided at the end parts of the integral unit.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: July 14, 2020
    Assignee: STATE ATOMIC ENERGY CORPORATION “ROSATOM” ON BEHALF OF THE RUSSIAN FEDERATION
    Inventors: Vladimir Nikolaevich Elkin, Sergey Viktorovich Makarov, Konstantin Sergeevich Skladnov, Vladimir Ur'evich Kolganov
  • Patent number: 10654535
    Abstract: A system and process for gluing two components together includes measuring the temperature of one or both panels to be glued together prior to application of the glue to the panels. If the measured temperature of the panel(s) is outside a predetermined range, the system and process thermally conditions the panel(s) to bring them into the predetermined temperature range for proper adhesion and known and controlled glued panel properties for subsequent riveting of the glued panels. A control unit with predetermined reference values is in communication with the system temperature sensors and thermal conditioning devices to provide uniform gluing quality irrespective of the environmental conditions of the assembly line.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: May 19, 2020
    Assignee: Comau S.p.A.
    Inventors: Stefano Arduino, Giovanni Di Stefano, Valeria Serpi
  • Patent number: 10600719
    Abstract: The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be less than a eutectic temperature of a metal element that constitutes the metal member and aluminum. A Ti layer is formed at a bonding portion between the aluminum member and the metal member, and the aluminum member and the Ti layer, and the Ti layer and the metal member are respectively subjected to solid-phase diffusion bonding.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: March 24, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Patent number: 10524364
    Abstract: The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: December 31, 2019
    Assignee: HENKEL AG & CO. KGAA
    Inventor: Anja Henckens
  • Patent number: 10455708
    Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: October 22, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Hwan Ahn, Mi-Sun Hwang, Young-Gwan Ko, Jong-Seok Bae, Myung-Sam Kang
  • Patent number: 10400141
    Abstract: Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: September 3, 2019
    Assignee: TRUSS CO., LTD.
    Inventor: Ho Seup Moon
  • Patent number: 10403594
    Abstract: A hybrid bonding layer includes a metal inverse opal (MIO) layer with a plurality of hollow spheres and a predefined porosity, and a ball grid array (BGA) disposed within the MIO layer. The MIO layer and the BGA may be disposed between a pair of bonding layers. The MIO layer and the BGA each have a melting point above a TLP sintering temperature and the pair of bonding layers each have a melting point below the TLP sintering temperature such that the hybrid bonding layer can be transient liquid phase bonded between a substrate and a semiconductor device. The pair of bonding layers may include a first pair of bonding layers with a melting point above the TLP sintering temperature and a second pair of bonding layers with a melting point below the TLP sintering temperature.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: September 3, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan Mehmet Dede
  • Patent number: 10381793
    Abstract: A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: August 13, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Yukinari Naganishi, Akira Baba, Takashi Odajima, Hirohito Habara, Hideaki Saitoh, Takao Ota, Akihiro Koyama, Atsushi Nakata
  • Patent number: 10349519
    Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: July 9, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Su Kim, Nam Hee Kim, Hye Sun Yoon, Il Sang Maeng, Sang Seon Ha
  • Patent number: 10224294
    Abstract: Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor device 1 includes a device substrate 2, a semiconductor circuit 3, a sealing frame 7, a cap substrate 8, via portions 10, electrodes 11, 12 and 13, and a bump portion 14 or the like. A hollow portion 9 in which the semiconductor circuit 3 is housed in an airtight state is provided between the device substrate 2 and the cap substrate 8. The bump portion 14 connects all the via portions 10 and the cap substrate 8. Thus, the via portions 10 can be reinforced using the bump portion 14A.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: March 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koichiro Nishizawa, Takayuki Hisaka
  • Patent number: 10119762
    Abstract: A centrifugal dryer that has improved throughput capacity resulting from the combination of a high angle agglomerate catcher with optional overflow, increased dewatering capacity, a cylindrical dewatering feed chute, a modified rotor design with positionally and structurally modified lifters in the feed and dewatering section, the drying and propagating section, as well as the pellet discharge section, and an efficient circumferential foraminous membrane.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: November 6, 2018
    Assignee: Gala Industries, Inc.
    Inventors: Charles E. Aaron, Duane A. Boothe, John M. Linkenhoker, Kerry P. Morris, Samuel F. Hannah, Wayne L. Smith, Thomas C. Wenrich
  • Patent number: 10035251
    Abstract: A hydraulic hammer is provided. The hydraulic hammer includes a housing member. The hydraulic hammer also includes a power cell disposed within the housing member. The power cell includes an outer casing. The hydraulic hammer also includes a work tool operatively coupled with the power cell. The hydraulic hammer also includes one or more bushing parts arranged within the outer casing of the power cell. The one or more bushing parts are adapted to guide the work tool during an operation of the hydraulic hammer. The one or more bushing parts include a first surface and a second surface spaced apart from the first surface. The hydraulic hammer also includes a wear indicating system for indicating a wear of the one or more bushing parts with respect to the first surface. The wear indicating system includes a first passage and a second passage.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: July 31, 2018
    Assignee: Caterpillar Inc.
    Inventor: Cody T. Moore
  • Patent number: 10022968
    Abstract: A method (e.g., for creating a printing plate assembly of an ink jet print head assembly) includes coating one or more sides of plural planar subsection plates with a bonding material. The subsection plates include printing holes through which a fluid is to be ejected from the ink jet print head assembly. The method also includes placing the subsection plates of the printing plate assembly against each other with the printing holes axially aligned with each other and heating the bonding material between the subsection plates such that the subsection plates are affixed to each other. The subsection plates are coupled with each other to form a chamber printing assembly that is coupled to the ink jet print head assembly that prints fluid onto one or more objects by ejecting the fluid out of the printing holes of the subsection plates. The subsection plates may be hermetically bonded to each other by inductively heating the assembly.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: July 17, 2018
    Assignee: Illinois Tool Works Inc.
    Inventors: Yufeng Wu, Tzer-Yi Chen
  • Patent number: 10017957
    Abstract: Provided is a method for manufacturing a door lever made of a stainless steel material having excellent corrosion resistance, not made of a metal material used typically to manufacture the door lever, so that even if it is exposed, during long-term use, to a coast area where large amounts of moisture and salt are collected in the air, it can be used without any corrosion.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: July 10, 2018
    Assignee: YESKOREA CO., LTD.
    Inventor: Sung Jin Lee
  • Patent number: 9833856
    Abstract: A circumferential welded joint of a line pipe is formed by butting against each other end portions of steel pipes having a yield strength according to 5L Specification of API Standards not smaller than 555 N/mm2 and welding the butted portions in a circumferential direction. A joint strength ratio ?match=(TS-w/TS-b)·(YS-w/YS-b) represented by a product of a ratio between a tensile strength TS-w of a weld metal and a tensile strength TS-b of a base material and a ratio between a yield strength YS-w of the weld metal and a yield strength YS-b of the base material, and a critical equivalent plastic strain ?p-cri [%] for ductile crack generation in a base material heat affected zone satisfy Equation (1), and the yield strengths YS-w, YS-b of the weld metal and base material satisfy Equation (2). ?match>4.85?p-cri?0.31??(1) YS-w/YS-b?1.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: December 5, 2017
    Assignee: JFE STEEL CORPORATION
    Inventors: Takahiro Sakimoto, Satoshi Igi, Tomoyuki Yokota
  • Patent number: 9765576
    Abstract: A stop collar for a tubular and method for installing a stop collar on a tubular. The stop collar includes a flexible member extending circumferentially around the tubular more than once. A tension force on the flexible member causes the flexible member to apply a radially-inward gripping force on the tubular. The stop collar may also include a shield disposed around at least a portion of the flexible member, to protect the flexible member in a downhole environment. The stop collar may also or instead include an adhesive disposed radially between the flexible member and the tubular.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: September 19, 2017
    Assignee: ANTELOPE OIL TOOL & MFG. CO.
    Inventors: Jean Buytaert, Clayton Plucheck, Ira Eugene Hining
  • Patent number: 9716326
    Abstract: An electrical connector includes a plurality of connecting members arranged in an arrangement direction in parallel to a circuit board; and a joining member extending in the arrangement direction over an arrangement range of the connecting members for holding the connecting members. Each of the connecting members includes a terminal to be connected to a mating connector, and a terminal holding member for holding the terminal. The connecting members are arranged so that the connecting members arranged adjacently form a gap in between. The joining member is formed of a material having a coefficient of thermal expansion the same as that of the circuit board.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: July 25, 2017
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Nobuhiro Tamai
  • Patent number: 9618384
    Abstract: An acoustic measurement system for detecting locked blade assemblies in a gas turbine having a plurality of blade assemblies. The system includes at least one acoustic sensor for detecting acoustic energy generated as a result of movement of the blade assemblies during a turning gear operation. In addition, the system includes a housing for holding the acoustic sensor, wherein the housing is mounted to an outer diffuser of the gas turbine. The housing also includes a rotatable joint for enabling rotation of the acoustic sensor. Further, the system includes a data acquisition unit that detects an absence of acoustic energy wherein the absence of acoustic energy is indicative of locked blade assemblies. The blade assemblies are locked due to wedging of a sealing pin between the blade assemblies. The acoustic energy is detected in a frequency range of approximately 0.9 kHz to 10 kHz.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: April 11, 2017
    Assignee: SIEMENS ENERGY, INC.
    Inventors: Clifford Hatcher, Jr., Forrest R. Ruhge, John E. Junkin, Mark L. Kamphaus
  • Patent number: 9622357
    Abstract: Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Christopher D. Prest, Jonah A. Harley, Stephen B. Lynch, Stephen P. Zadesky
  • Patent number: 9515046
    Abstract: Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 6, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Mung Suan Heng, Kok Chua Tan, Vince Chan Seng Leong, Mark S. Johnson
  • Patent number: 9352412
    Abstract: A method of forming a bonded assembly (10). The method comprises: providing at least first and second parts (12, 14) of an assembly (10) to be bonded; assembling the first and second parts (12, 14) in a required relative position to define a bond interface region therebetween; sealing part way along an edge (18) of the bond interface region using laser beam welding to define a cavity between the first and second parts (12, 14); in a vacuum environment, sealing the remainder of the edge (20) of the bond interface region using electron beam welding to form a fluid tight seal around the cavity; and applying heat and pressure to an external surface of the cavity to diffusion bond the first and second parts (12, 14) together.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: May 31, 2016
    Assignee: ROLLS-ROYCE plc
    Inventors: John Harold Boswell, Daniel Clark, Charles Richard Carpenter, Andrew Richard Kennedy
  • Patent number: 9240331
    Abstract: A semiconductor device includes a substrate with contact pads. A mask is disposed over the substrate. Aluminum-wettable conductive paste is printed over the contact pads of the substrate. A semiconductor die is disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure over the contact pads of the substrate. The contact pads include aluminum. Contact pads of the semiconductor die are disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure between the contact pads of the semiconductor die and the contact pads of the substrate. The interconnect structure is formed directly on the contact pads of the substrate and semiconductor die. The contact pads of the semiconductor die are etched prior to reflowing the aluminum-wettable conductive paste. An epoxy pre-dot to maintain a separation between the semiconductor die and substrate.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: January 19, 2016
    Assignee: STATS ChipPAC, Ltd.
    Inventors: KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan Hoang, Pandi C. Marimuthu, Steve Anderson, See Chian Lim, HeeJo Chi
  • Patent number: 9229500
    Abstract: Embodiments of the present invention provide an apparatus that reduces an audible noise produced in a power supply. The apparatus includes: (1) a housing; (2) an inductor coil formed from a coil of wire enclosed in the housing; (3) a set of wires that are coupled from the inductor coil to the outside of the housing through corresponding apertures in the housing, comprising electrical leads for the inductor coil; and (4) a predetermined amount of adhesive in the apertures that bonds the wires to the housing to reduce an audible noise produced when the current through the inductor coil is cycled quickly.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: January 5, 2016
    Assignee: Apple Inc.
    Inventor: Dayu Qu
  • Patent number: 9153516
    Abstract: A system can include a semiconductor die having a first side and a second side opposite the first side. The system can also include a first slug coupled to a portion of the first side of the die. The system can further include a second slug coupled to a portion of the second side of the die. The system can additionally include an insulating material voidlessly encapsulating the die. The first slug can include a first portion having a first width in proximity to the die and a second portion having a second width. The first portion can be closer than the second portion to the die and the first width can be smaller than the second width.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: October 6, 2015
    Assignee: Microsemi Corporation
    Inventor: Cecil Kent Walters
  • Patent number: 9120985
    Abstract: The present invention relates to an improved gasifier reactor design. In particular, the present invention relates to improved design of gasifier reactor faceplates, gasifier reactor walls, gasifier reactor cooling tubes, and gasifier reactor walls with integrated cooling channels. The present invention utilizes aluminum nitride and/or aluminum nitride/metal composite materials which promote many benefits to the present design herein, including improved corrosion and erosion resistively as compared to high alloy metal materials.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: September 1, 2015
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Paul D. Oldenburg, Michael F. Raterman
  • Patent number: 9087827
    Abstract: One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, incoluding a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: July 21, 2015
    Assignee: Infineon Technologies AG
    Inventors: Jenny Ong Wai Lian, Chen Wei Adrian Chng
  • Patent number: 9084377
    Abstract: An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: July 14, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventor: Seng Guan Chow
  • Patent number: 9021696
    Abstract: The invention relates to a method for producing a plating (5) of a vane tip. Said method consists of the following steps: a) a vane having a vane tip which is arranged opposite the base of the vane (2) and which comprises a surface which points radially outwards is provided, and b) a porous layer (7) is applied to at least the surface (4) of the vane tip and/or c) a bulge (8) which increases the surface of the vane tip is applied to at least one part of the flanks of the vane tip, said flanks surrounding the surface of the vane tip, and d) the plating (5) is applied to the porous layer and/or the bulge. The invention also relates to corresponding vanes or gas turbines with corresponding vanes.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: May 5, 2015
    Assignee: MTU Aero Engines AG
    Inventors: Andreas Jakimov, Stefan Schneiderbanger, Manuel Hertter
  • Publication number: 20150103297
    Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 16, 2015
    Applicant: STMICROELECTRONICS PTE. LTD
    Inventors: WeeChinJudy LIM, David Gani, Hk Looi, Bs Aw, Cheng-hai Cheh
  • Publication number: 20150101416
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Application
    Filed: June 11, 2014
    Publication date: April 16, 2015
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Patent number: 8973809
    Abstract: A method for attaching a roof panel to a roof rail of a vehicle bodyside frame, wherein the roof rail prohibiting access to an underside of an area at which the roof panel attaches to the roof panel, can include applying a single-component adhesive to a roof rail or to a portion of a roof panel that rests on the roof rail, placing the roof panel onto the roof rail, attaching the roof panel to the roof rail using single-sided spot welds, and heating the roof panel and vehicle bodyside frame to a temperature that cures the single-component adhesive.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Ford Global Technologies, LLC
    Inventors: David John Hill, Stephen William Gallagher, Shawn Michael Morgans
  • Publication number: 20150062839
    Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 5, 2015
    Applicant: Apple Inc.
    Inventors: Nicholas G. Merz, Shayan Malek, Sawyer I. Cohen, Timothy Lui
  • Patent number: 8960525
    Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: February 24, 2015
    Assignee: General Electric Company
    Inventors: David Edward Schick, Srikanth Chandrudu Kottilingam, Johnie Franklin McConnaughhay, Brian Lee Tollison, Yan Cui
  • Publication number: 20150048147
    Abstract: The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to
    Type: Application
    Filed: March 14, 2013
    Publication date: February 19, 2015
    Applicant: CITIZEN HOLDINGS CO., LTD.
    Inventors: Masafumi Ide, Takeo Komiyama, Kaoru Yoda
  • Publication number: 20150050158
    Abstract: A blade for a gas turbine engine comprises a blade portion having a first end and a second end and an engagement portion including a first surface coupled to the second end of the blade portion and a second surface coupled to the second end of the blade portion, the first and second surfaces arranged to extend divergently away from one another. The engagement portion is adapted for coupling to a wheel included in a gas turbine engine wheel.
    Type: Application
    Filed: December 23, 2013
    Publication date: February 19, 2015
    Inventors: David J. Thomas, Richard C. Uskert, Adam L. Chamberlain, Matthew Peter Basiletti
  • Patent number: 8956473
    Abstract: The present invention relates to a method for manufacturing Ni/In/Sn/Cu multilayer structure, in which a Ni/In/Sn/Cu multilayer structure is formed between a first substrate (copper substrate) and a second substrate (such as silicon wafer), and further, a plurality of intermetallic layers are formed in the Ni/In/Sn/Cu multilayer structure through a reflow bonding process and an aging heat treatment, wherein the intermetallic layers comprises a first intermetallic layer of (Cu,Ni)6(Sn,In)5, a second intermetallic layer of (Cu,Ni)6(Sn,In)5 and a third intermetallic layer of (Cu,Ni)3(Sn,In)4. Therefore, the formed intermetallic layers makes the Ni/In/Sn/Cu multilayer structure performs good wettability, ductility, creep resistance, and fatigue resistance.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: February 17, 2015
    Assignee: National Taiwan University of Science and Technology
    Inventors: Pin-Ju Huang, Yee-Wen Yen
  • Publication number: 20150025176
    Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 22, 2015
    Inventors: Glenn G. Eagle, Andreas Lutz, Gary L. Jialanella
  • Publication number: 20150001281
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 1, 2015
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Publication number: 20140367996
    Abstract: An object is to restrain an adhesive from dropping or from being scraped off when a joining portion is adhered to a joined portion. A panel joining structure of the present invention includes: a first panel including a stepped portion extending in an intersecting direction with a vertical direction, and a joining portion extending toward a vertical direction upper side from one end of the stepped portion in the intersecting direction; and a second panel including a facing portion extending in the intersecting direction and superimposed on the stepped portion from the vertical direction upper side, a joined portion extending toward the vertical direction upper side from one end of the facing portion in the intersecting direction and joined to the joining portion by adhesion and welding, and a suspended portion extending toward a vertical direction lower side from the other end of the facing portion in the intersecting direction.
    Type: Application
    Filed: December 28, 2011
    Publication date: December 18, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Toshihiro Goto
  • Patent number: 8899472
    Abstract: A method for sealing vacuum glass and a vacuum glass product processed by said method are provided. The method specifically is: preparing metallized layers (6) consolidated with glass plates on the surface to be sealed at the edge of the glass plates by the known sintering process; enabling hermetically sealing the edges of the two glass plates (1, 2) by welding and connecting metal sealing sheet (7) between the metallized layers (6) of the tow glass plates to be hermetically sealed. A brand new technology for manufacturing vacuum glass is provided by sintering metallized layers on the surface of the glass plates, and hermetically sealing the edges of the glass plates by use of the metallized layers and metal sealing sheet.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: December 2, 2014
    Assignee: Luoyang Landglass Technology Co., Ltd
    Inventors: Yanbing Li, Zhangsheng Wang
  • Patent number: 8899470
    Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: December 2, 2014
    Assignee: Corning Incorporated
    Inventors: David M. Lineman, Wenchao Wang, Randy D. Ziegenhagen
  • Patent number: 8899471
    Abstract: A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A curved vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: December 2, 2014
    Assignee: Luoyang Landglass Technology Co., Ltd
    Inventors: Yanbing Li, Zhangsheng Wang
  • Publication number: 20140343648
    Abstract: One aspect relates to a contacting arrangement for use in a housing of a medically implantable apparatus. Said contacting arrangement includes an electrical feedthrough device that includes at least one electrically insulating main feedthrough member and at least one electrical conducting element. The conducting element is designed to establish at least one electrically conducting connection between an interior of the housing and an exterior through the main feedthrough member. The conducting element is hermetically sealed with respect to the main feedthrough member. The at least one conducting element comprises at least one cermet. The contacting arrangement further includes an electrical filter structure which is arranged on a face of the feedthrough device. Furthermore, said filter structure is connected to the conducting element by means of at least one electrical surface connection.
    Type: Application
    Filed: November 13, 2012
    Publication date: November 20, 2014
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic, Christina Modes, Frieder Gora, Frederik Roth
  • Patent number: 8890030
    Abstract: Hybrid welding apparatuses include a laser that produces a leading laser beam, and, an arc welder that produces a trailing backhand weld arc, wherein the leading laser beam and the trailing backhand weld arc are directed towards a common molten pool, and wherein the trailing backhand weld arc trails the leading laser beam as the leading laser beam progresses in a weld direction.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: November 18, 2014
    Assignee: General Electric Company
    Inventors: Dechao Lin, Srikanth Chandrudu Kottilingam, Yan Cui, David Edward Schick
  • Publication number: 20140311669
    Abstract: In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.
    Type: Application
    Filed: June 2, 2014
    Publication date: October 23, 2014
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmermann
  • Publication number: 20140301042
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 9, 2014
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Rosalba Cacciola, Giuseppe Luigi Malgioglio
  • Publication number: 20140263580
    Abstract: A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: RAYTHEON COMPANY
    Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Randall
  • Publication number: 20140268619
    Abstract: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.
    Type: Application
    Filed: August 31, 2012
    Publication date: September 18, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Tea Hyuk Kang, Hong Il Kim
  • Patent number: 8835772
    Abstract: In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: September 16, 2014
    Assignee: Dexerials Corporation
    Inventor: Satoshi Igarashi
  • Publication number: 20140254983
    Abstract: The sealing component 1 of the invention is provided with a metallic housing 19 that comprises a base part 19a, a side wall 19b connected to the base part 19a and an opening portion 19c facing to the base part 19a, and a metallic lid 20 to cover the opening portion 19c, wherein a melted portion 24 is formed around the boundary between the lid 20 and the upper edge 19b1, the melted portion 24 is formed to reach the corner 19b3 of the side wall 19b, and the melted portion 24 has a convexly-curved outward form 24a from the top face of the lid 20 to the corner 19b3 in the longitudinal cross-sectional view of the sealing component 1.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Tomomi MORIYA, Hiroshi KOHDA, Dai SASAKI