Abstract: This invention relates to an SBB machine and method used in a magnetic head assembly process of HGA production for hard disk drives. The SBB comprises a laser head with a focus system, a monitor with a camera positioning system and a flex cable sheet station with a conveyer system. The laser head can be controlled from the monitor to move vertically and horizontally by the camera positioning system, and the conveyer belt of the transport system can be controlled to move step by step.

Abstract: A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

Abstract: An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

Abstract: A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and the converted epitaxial layer of the temporary bonded substrate replaces the epitaxial wafer growth substrate, and the second bonded layer of the etch stop layer of the epitaxial layer is bonded with the second bonded layer of the high-thermal-conductive substrate to form an alloy layer with permanent connection, and then the temporary bonded substrate is removed, such that the process completes the integration of the epitaxial layer and the high-thermal-conductive substrate and makes the ohmic contact layer to face upward to provide a better reliability and efficiency of optical output of the LED.

Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.

Abstract: A coaxial cable structure includes an outer cable conductor, and an angle connector, for example a 90° elbow connector, disposed on one cable end. The elbow connector is implemented by encapsulating the one cable end with thermoplastic material and including a metal sleeve which is placed in contact with the outer cable conductor to define an outer conductor of the elbow connector.

Abstract: A weld shield device for facilitating end-to-end welding of two pipe segments having fiberglass liners. The weld shield device includes an insulation material applied about the outer surface of a sleeve body. The sleeve body helps establish a welding gap between the two pipe segments. The insulation material reduces the heat transfer from the welding operations to the fiberglass liners. Additionally, a method of joining two pipe segments with fiberglass liners is provided, which includes connecting a first end of a weld shield device to a first pipe segment and connecting a second pipe segment to the second end of the weld shield device with the weld shield device being partially in a cutout portion of the fiberglass liner. Then, the two pipe segments are welded together. Insulation material on the weld shield device reduces the heat transfer from the welding operations to the fiberglass liners.

Abstract: Braze filler in the form of coiled melt spun foil is adhesively bonded to coiled parent sheet metal forming a coiled laminate which can be cut to desired shapes, and brazed as an assembly comprised of laminate and non-laminate parts. Because the parent metal and melt spun foil are cut at the same time, only one piece of material must be handled. The laminate may comprise melt spun foil on one or both sides of the parent metal, may be bonded to the parent metal by means of spraying, rolling, dripping, or brushing, and may be applied to either parent metal or melt spun foil, or both. Application of the adhesive may also be in a pattern rather than covering the entire surface of parent metal.

Abstract: A circuit board having improved soldering characteristics having raised structure consisting of spacer pads arranged to provide for vertical distancing of electrical or electronic components from the component side planar surface of the circuit board. Such spacing is complementary to top vented soldering stations where the spacing allows solder process gases to flow unimpeded from the soldering stations through the spacing to atmosphere.

Abstract: A value housing having overlapped inner and outer members is fabricated by a process including placing the members in position where one side of the joint is accessible for welding and the opposite side is inaccessible, single welding from the accessible side and brazing the opposite side. The brazing step provides for filling of minute gaps in the joint at the inaccessible side. A bronze welding type brazing alloy and heating at a temperature of 1800 to 1900 degrees Fahrenheit are employed.

Abstract: A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

Abstract: Methods of welding two pieces of metal to produce a weld joint having excellent fracture toughness are provided. Two pieces of metal are positioned for welding so as to form a narrow weld groove having two sidewalls with bevel angles of less than about 10°. Two or more layers are applied to the weld groove to produce the weld joint such that the heat-affected-zone of the weld joint is substantially free of rogue grains.

Abstract: The present invention concerns a method for welding the far ends of two elongated elements together, whereby the above-mentioned far ends are heated up to forging temperature by rotating a ring clamped between them. A flat ring is provided between the far ends, whereby these far ends are axially drawn towards one another and, as soon as the forging temperature is reached, the elements are pushed towards one another with great force by exerting a dynamic force. The device contains driving means to rotate the ring, drawing means to draw the elongated elements towards one another and means to exert a dynamic force.

Abstract: A method for applying a brazing medium to a configuration, which is formed of a honeycomb body and a jacket pipe is described. First, the honeycomb body is configured by stacking and/or winding of sheet metal layers, at least some of which are structured sheet metals layers such that the honeycomb body has channels for conducting a fluid flow. The honeycomb body is partially placed in the jacket pipe. A section of the honeycomb body that projects out from the jacket pipe is brought by its end face into contact with an adhesive medium. The honeycomb body is further introduced into the jacket pipe. Subsequently, a brazing medium is introduced into the honeycomb body.

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body.

Abstract: In a brazed condenser for an air conditioner, a collecting tube connected with a collector is prefabricated as a one-piece tube. The collecting tube is connected by tack weld seams with the collector before brazing the collecting tube and the collector together.

Abstract: A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

Abstract: An arc lamp comprises nine component parts that are brought together in three brazes and one TIG-weld to result in a finished product. An anode assembly is brazed with the rest of a body sub-assembly in one step instead of two. A single-bar cathode-support strut is brazed together as one step. A window flange and a sapphire output window are brazed together with the product of the strut braze step in a mounted-cathode-braze step. A copper-tube fill tubulation, a kovar sleeve, a ceramic reflector body, an anode flange, and a tungsten anode are all brazed together in a “body-braze” step. The products of the mounted-cathode-braze step and body-braze step are tungsten-inert-gas (TIG) welded together in a final welding step. A lamp is finished by filling it with xenon gas and pinching off the tubulation.

Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire and a ground wire between a first resin tip and a second resin tip. The first resin tip has, around the connecting part, first recessed parts for accommodating the molten cover of the shield wire and second recessed parts for accommodating the molten cover of the ground wire. The second resin tip has second recessed parts formed for accommodating the molten cover of the ground wire.

Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: A self-adhesive flexible circuit for printed circuit assembly repair is provided. The flexible circuit comprises a carrier film, a circuit trace and an adhesive. The flexible circuit is placeable on a printed circuit board having a circuit assembly and allows simple repair of boards not designed or manufactured correctly and which contain undesirable short or open circuits or misrouted traces. The flexible circuit allows for placement in a desired location, adherence to the circuit board using its own adhesive. The flexible circuit can then be electrically attached, i.e. solder or conductively adhered, to the board.

Abstract: A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Abstract: A hermetically sealed electrical package having wires entering at the base and being embedded vertically in its walls for connecting to the leads of a component assembly within the package. The wires protrude vertically from the walls, serving as pins for electrical connection of the leads inside the package. The component assembly is secured to an inner side of the package by an adhesive. A cover is affixed to the upper edges of the walls by an ultrasonic weld so as to create a hermetic seal.

Abstract: Fastening an attaching eye to the base of a dashpot by welding. The object is to simplify tooling and position the parts more accurately. The eye (3) is fabricated from strip, preferably by rolling or bending, prior to welding and is provided with an outward-tapering V-shaped abutment (4). The base (1) is provided with a transverse W-shaped groove comprising two rounded depressions (5 & 6), their depths and middle elevations (7) dimensioned to ensure that the eye will come into contact with the lateral edges (8 & 9) of the groove. The abutment is more or less in alignment with the groove's elevation.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: Disclosed is a friction stir welding method of welding a butted portion of work pieces relatively easily and firmly with an improved finish after the butted portion is tack-welded. In the method, a plurality of work pieces are placed to be butted, a plurality of V-shaped grooves are intermittently formed along the butted portion, each of the grooves is tack-welded by using a welding material by TIG welding or MIG welding, deposits in the tack-welded sections are cut and removed so as to be substantially coplanar with a surface of the work pieces, and then friction stir welding is continuously performed over the entire length of the butted portion, and thus, the work pieces are joined.

Abstract: A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of terminals respectively are mounted on opposite sides of the board so that the second set of terminals are directly opposite the third set of terminals. Each package contains an IC die coupled to the respective set of terminals. The IC die in the first package is substantially identical to the one contained in the second package, and different than the one contained in the third package. For improved fanout of the metal lines that interconnect the first package to the second and third packages, each of the first, second, and third sets of terminals in the packages is arranged in substantially a U-shape. Each set of terminals has the same set of signal assignments of a parallel bus implemented by metal lines in the board.

Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.

Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.

Abstract: A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.

Abstract: A rotary tool 140 is relatively moved against members 30, 30 to be welded so as to perform friction stir welding of said members, while blades 145 mounted on the rotary tool 140 and a rotary brush 220 are used to cut the welded portion, and swarfs on the cut surface are removed through a suction opening 225, before medium liquid is supplied on said cut surface through a supply opening 240. Next, an inspection roller 250 is rotated on the surface of the welded portion for inspection. A probe 251 is provided within the roller 250. Upon detecting defect, paint is applied to the position of defect by a marking device 270. Thereafter, based on said marking, the joint portion is cut and repaired by welding.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: The object is to provide a method of connecting covered wires mutually which can solve increasing cost. Each of the covered wires 2, 3 is comprised of a conductor 4, 10 and a cover 5, 11. The covered wires 2, 3 are connected to each other by ultrasonic welding. An ultrasonic welding machine includes a chip and an anvil. The covered wires 2, 3 are placed between the chip and the anvil. The chip is located with the length of its cross section disposed along the length of the other covered wire 3. The chip and the anvil are pushed toward each other and the chip is vibrated. Friction heat is generated between the covered wires 2, 3. The covers 5, 11 are adhered together and the conductors 4, 10 are bonded to each other by ultrasonic welding.

Abstract: A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.

Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Abstract: A method of facing a substrate comprises the steps of first welding a body of a hard facing material to the substrate and then filling a space around the body with a molten metal. The method can be used in the hard facing of metal components with, for example, hard facing materials such as tungsten carbide. The substrate can comprise a metal surface, which can, for example, be the surface of any suitable component, tool, or implement subject to wear in use. The method is particularly suitable for hard facing the wear surfaces of components for use in drill strings in down-hole drilling technology, for example, drill stabilizers.

Abstract: A front floor panel (31) and a first small component such as a second cross member (35) to be assembled to a surface thereof, with the first small component at the bottom side are positioned and set into a locator jig (29) at a part setting station (S), a moving stage (27) is moved to a welding station (T), and the front floor panel (31) and first small component are welded. A handling robot (55) reverses the front floor panel 31 front-to-rear, the moving stage (27) is caused to retreat to the part setting station (S), and a second small component such as a front floor reinforcement (41) to be assembled to the rear surface of the front floor panel (31) is positioned in locator jig (29), the moving stage (27) being moved to the welding stage and the reversed front floor panel (31) being positioned in a locator jig (29), after which the front floor panel (31) and second small component are welded together.

Abstract: A bi-material assembly comprising two adherends, adhesively bonded. The assembly is adhesively bonded in an area consisting of a length of 2l at each end of the bonded assembly. The interface of the adherends is not completed bonded so that 2l is less than half of the assembly length. Each bonded area has an inner edge. The inner edge local interfacial shearing stress is substantially equal in magnitude to the inner edge global interfacial shearing stress causing the strength of the bi-material bonded assembly to be substantially the same as a like structure wherein 2l substantially equals half the assembly length. Further are a method of fabricating a bi-material assembly, and a semiconductor device and fabrication method.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: A steam turbine rotor is constructed from a first forging of a first alloy, and a second forging of a second alloy different than the first alloy. For example, one of the alloys is suitable for use in a high temperature environment and the other in a low temperature environment. The forging ends are contoured so as to provide central portions, which may be disc-shaped, and the contoured portions may be in the shape of truncated cones. A first weld, such as a root weld formed by inertia, friction, or electroslag welding, joins the central portions, and the contoured portions are joined by a second weld different than the first weld, such as a submerged arc weld. This allows the rotor forgings to be joined in relatively inexpensive horizontal facilities, and reduces the demands on the welding technology required to obtain a sound root weld.

Abstract: A method of welding a hollow member and an insert member to form a composite member including a hollow member and insertion member requiring a high dimensional accuracy in the end-to-end distance in the axial direction and requiring a reliable concentricity in the center axes of the hollow member and insertion member, including preparing a hollow member and insertion member, inserting the insertion member in the hollow member, providing spot welds at an overlap portion where the hollow member and insertion member overlap to correct the axial end-to-end distance of the hollow member and the insertion member, and providing a partial weld at an overlap portion where the hollow member and insertion member overlap to correct the concentricity of the hollow member and the insertion member.

Abstract: In a brazed condenser for an air conditioner, such as a motor vehicle air conditioner, a collecting tube connected with a collector is a prefabricated as a one-piece tube which is connected by tack weld seams with the collector before brazing the collecting tube and the collector together.

Abstract: Selectively reinforced blanks are used in a hydroforming process to produce completed components having a predetermined shape and sufficient structural integrity to perform their desired function. To reinforce those components, reinforcing patches are added to the blank prior to hydroforming. Planar patches can be bonded to planar blanks or arcuate patches can be bonded to tubular blanks. In so doing, the hydroforming process produces a complete component, which does not require additional manufacturing steps to reinforce it. Additionally, by selectively using the reinforcing patches, the overall weight of the component is not unduly increased.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: A multi-element composite object composed from first, second, and third metal components is provided, wherein the first metal and the third metal are weld incompatible. The multi-element composite object includes a first component fabricated from a first metal. A second component, fabricated from a second metal, is brazed to the first component. A third component, fabricated from a third metal, is inertia welded to the second component. The first metal may be provided as a titanium alloy, e.g. a TiNi alloy. The second metal may be provided as low-carbon mild or alloy steel. The third metal may be provided as alloy steel, e.g., 9310 nickel alloy steel. In an embodiment, the multi-element composite object is a gear assembly, with the first element of the gear assembly object being a shaft and the third element of the gear assembly being a gear member with hardened teeth surfaces. The first and second components can be mechanically keyed together via an anti-rotational element.

Abstract: A stainless steel pipe which prevents a gas supplied through the pipe from being contaminated so as to maintain high degree of purity, the stainless steel pipe having a superior corrosion resistance so appropriate as to supply the gas for manufacturing semiconductors. According to the present invention, there are provided a stainless steel pipe and a joining method thereof regarding joining by butt welding, the stainless steel pipe comprising a joining portion 1 having a butt joining portion 2, the butt joining portion having an outer butt joining portion 2a in an outer wall surface portion 3 joined by a butt welding with penetration welding portion W and, an inner butt joining portion 2b in an inner wall surface portion joined in solid-state without being melted, such that the joining portion comprises the butt joining portion joined by the butt welding with partial penetration.

Abstract: A method for applying brazing material to metal structures is used, in particular, for honeycomb bodies of exhaust gas catalytic converters. The brazing material is applied in the form of a powder and is firmly held to the metal structures through the use of an adhesive material acting as a bonding agent, binder or adhesion promoter. The adhesive material that is used to firmly hold the brazing powder assumes two different states with respect to its adhesive action during the production process of the metal structure. A first state is less adhesive and a second state is more strongly adhesive. The adhesive strength can be selected or adjusted as a function of external conditions, especially temperature. Therefore, at a given time the adhesive material can be put into a state which is suitable for each production step, as a result of which the brazing material quality is increased and the production process is simplified.