Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.

Abstract: According to an aspect of the invention, there is provided an electrical package device comprising: a first substrate and a second substrate enclosing a first electric component; the second substrate supporting a second electric component, a plurality of connectors for mechanically connecting said first and second substrates in a stacked arrangement; and a seal provided between said first and second substrates at a distance from said first electric component; wherein said first electric component is electrically connected to said second electric component by connecting circuitry comprising said connectors; and wherein said connectors are provided in said seal. Preferably, said seal comprises a no flow resin material.

Abstract: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Abstract: A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element.

Abstract: In a particular embodiment, a process transmitter includes a corrosion resistive housing including a flange portion, where the corrosion resistive housing is formed from a first material. The process transmitter also includes an outer ring formed from a second material. The outer ring has an inner diameter and is brazed to the flange portion. The process transmitter further includes a deformable diaphragm formed from a third material, the deformable diaphragm is welded to the outer ring at a weld seam between the diaphragm and the outer ring adjacent to the inner diameter to form a fluid seal.

Abstract: A method for joining a cast metal material blade ring and a metal material hub structure into a turbine rotor. One of the blade ring and the hub structure is mounted in a holder and the other is mounted in a rotation holder for being rotated. At least one of these mountings is heated, and then they are pressed together with a selected force while rotating to weld the ring interior wall and the disk side to form the assembled structure.

Abstract: A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises a braze tape alloy containing the base metal of the superalloys and a melting point suppressant, and is applied so as to substantially cover the faying surface. The braze tape is then bonded to the faying surface by heating the first component to a temperature not exceeding the brazing temperature required to join the components. Thereafter, the components are assembled so that the bonded braze tape are between the respective faying surfaces of the components. The components are then brazed together by applying and heating a braze alloy to the braze temperature.

Abstract: A tube joint (16) for joining dissimilar metal sections (12, 14) of a superheater or reheater tube (10) is formed using a hot isostatic press process. A first end of the tube joint (16) is formed from a first metal which has substantially the same chemical composition as that of one section (12) of the superheater or reheater tube (10), and a second end of the tube joint is formed from a second metal which has substantially the same chemical composition as a metal used to form the other section (14) of the superheater or reheater tube (10). Because the ends of the tube joint (16) are made of substantially the same metal as the respective tube sections (12, 14) to which they attach, the welds (18) may be performed using a standard fusion welding process, such as arc welding, and the need for dissimilar metal welding is eliminated.

Abstract: Provided are strain hardened high strength nickel based alloy welds that yield improved properties and performance in joining high strength metals. The advantageous weldments include two or more segments of ferrous or non-ferrous components, and fusion welds, friction stir welds, electron beam welds, laser beam welds, or a combination thereof bonding adjacent segments of the components together, wherein the welds comprise a strain hardened nickel based alloy weld metal composition including greater than or equal to 10 wt % Mo based on the total weight of the nickel based alloy weld metal composition. Also provided are methods for forming the welds from the nickel based alloy weld compositions. The strain hardened high strength nickel based alloy welds are useful in the oil, gas and petrochemical industry in applications for natural gas transportation and storage, oil and gas well completion and production, and oil and gas refinery and chemical plants.

Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

Abstract: An autogenously welded structure is provided that includes a first face sheet, a plurality of individual stiffener elements, and a second face sheet. The stiffener elements each have a first edge disposed against the first face sheet and an opposed second edge. Each stiffener element has a central portion extending between the opposed edges. The central portion is disposed at an angle to the first face sheet. The stiffener elements include at least some stiffener elements that are disposed at an angle to at least some of the other stiffener elements. The second face sheet is disposed against the second edges of the stiffener elements and the first and second face sheets are autogenously welded to the edges of the stiffener elements.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with hot gas from the channeled tip melting the epoxy or solder and with the module forced against the fixed tool to remove it.

Abstract: A manufacturing method of an embedded inductor includes the steps of providing a magnetic plastic material, disposing at least one coil into a mold, and injecting or pressing the magnetic plastic material into the mold to form a magnetic body encapsulating the coil. An embedded inductor includes at least one magnetic body encapsulating the coil by injecting molding or pressing molding.

Abstract: A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to reduce the difference in shrinkage behavior during firing between the core and the green ceramic layers.

Abstract: A vacuum column for oil distillation incorporates a thickened plate that has a layer of erosion-resistant material that is thicker than the corrosion-resistant thickness of an adjacent column section. Use of thickened, explosive- or roll-bonded clad plates may provide better service than either conventional plug-welded liners or conventional shell plates with weld overlays.

Abstract: A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points. Also, a flip chip package is made by the method. In some embodiments the metallurgical connection includes an alloy of gold and tin at the interface between the bumps and the interconnect points.

Abstract: A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal with a permanent dielectric mold that results in sidewall plating defining an easy magnetic axis. The hard axis runs parallel to the longitudinal axis of the core and the inductor coils are orthogonal to the core's longitudinal axis. The magnetic field generated by the inductor coils is, therefore, parallel and self-aligned to the hard magnetic axis. The easy axis can be enhanced by electroplating in an applied magnetic field parallel to the easy axis.

Abstract: Embodiments of the invention are related to optical window assemblies for implantable medical devices, amongst other things. In an embodiment, the invention includes an optical window assembly for a medical device. The assembly can include a ferrule defining an aperture and a spacer ring disposed within the aperture. The assembly can also include an optical window coupled to the metal ferrule and the spacer ring. In an embodiment, the invention includes an implantable medical device including a housing and an optical window assembly coupled to the housing. In an embodiment, the invention can include a method of manufacturing a medical device. The method can include brazing a spacer ring to a metal ferrule, coupling an optical window to the spacer ring and the metal ferrule with a bonding glass material, depositing a chemical sensing element over the optical window, and coupling a porous cover layer to the spacer ring and the ferrule with an adhesive. Other embodiments are also included herein.

Abstract: A method for joining components using a brazing technique, namely relatively thin-walled components, in particular sheet-metal panels, which are not inherently stable and thus are susceptible to deformation, comprising at least the following steps: a) preparing at least two planar and relatively thin-walled components to be joined together, and a brazing foil; b) placing the brazing foil between the components to be joined together; c) fixing in position the components to be joined together by tack welding in such a way that a tack welding of the components, between which the brazing foil is placed, is carried out at at least one position that is spaced apart from an edge of the components; d) joining the fixed-in-position components by brazing.

Abstract: A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

Abstract: A method of heat sink manufacture in which the crests of a conductive fin are nested down into close fitting grooves in a flat, conductive base plate, with small interface gaps G. A compressive material is set inside the fin crests and the grooves, viscous enough to not intrude into the gaps G, to a level sufficient to substantially fill the grooves. The work piece thus created is subjected to a cold hydrostatic oil bath, crushing the outer surfaces of the fin crests into the internal surfaces of the grooves where the compressed seal covers, while the rest of the fin is supported against net deformation by the surrounding oil.

Abstract: A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.

Abstract: The invention relates to a method of producing and joining superalloy balls by means of brazing and to objects produced with such joints. According to the invention, an alloy powder covered with a brazing solder is bonded to a spherical core and subsequently transformed into a continuous alloy layer by means of brazing.

Abstract: An impeller for a fluid transmitting device includes a hub and a bowl-shaped shell connected to an outer peripheral portion of the hub via an annular weld seam. An inner peripheral surface of the shell is fitted to an outer peripheral surface of the hub, and the weld seam is formed therebetween by laser welding over an entire length of fitting depth. Thus, it is possible to form the annular weld seam between the hub and the shell with a relatively small amount of heat input, and to precisely perform a visual inspection as to whether the weld seam is good or not without any skill.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e.

Abstract: A method and a device produce a fleece of metallic fibers in a layer in which the metallic fibers are welded to one another to form the fleece. A welding process is repeatedly carried out with regard to a portion or section of the fleece. Such metallic fiber fleeces are used, in particular, for exhaust gas treatment units in the automobile industry.

Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG. 10.

Abstract: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.

Abstract: A method for welding and brazing a metallic component, such as, for example, a metallic component in a turbine, such as a bucket or blade. The method includes the steps of welding the metallic component to create a welded component; covering the welded component with a braze material to create a braze-covered welded component; and subjecting the braze-covered welded component to stress relief treatment.

Abstract: A method of fabricating a coil-embedded inductor provides steps for obtaining uniform density of coil-embedded inductor. The cavity of a first die is filled with dust before being flipped, and then filled with dust a second time. The dust in the cavity is pressed only once for improving the density.

Abstract: A liquid discharging head includes a channel unit formed of a plurality of stacked plates having openings and a liquid channel formed of the openings of the stacked plates. A curing material is filled in a step formed due to shift of the openings provided in the adjacent plates respectively, and the curing material forms part of an inner surface of the liquid channel. Consequently, the channel inner surface becomes smooth, and a liquid discharging head with little residual bubbles and with excellent bubble discharging capability is provided. Further, the attenuation of a pressure wave due to the step can be prevented.

Abstract: A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective opposite surfaces of the bonding surfaces of the flying leads, which will be connected to bonding terminals of a flexible printed circuit board. The method also includes a step of placing an ultrasonic tool in contact with the opposite surfaces of the flying leads via the coating layers, and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals to ultrasonically bond the flying leads and the bonding terminals together. Additionally, the method includes a step of heating and melting the coating layers to smooth surfaces of the coating layers that have been roughened by contact with the ultrasonic tool during ultrasonic bonding.

Abstract: A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and second work-piece are then friction stir or friction stir spot welded together, and the adhesive is cured. The use of bonding tools to maintain the two work-pieces together during curing of the adhesive is eliminated.

Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.

Abstract: A method for making a braze joint across a discontinuity in a work piece using alternating current. A filler metal is pre-placed at a location sufficiently close to the discontinuity such that, when an alternating current is applied across a work piece to heat the work piece and melt the filler metal, the filler metal is drawn into the discontinuity. The alternating current is maintained for a set residence time, generally less than 10 seconds and more particularly less than 3 seconds. The alternating current is then altered, generally by reducing the current and/or voltage such that the filler metal can solidify to form a braze joint of desired quality and thickness.

Abstract: The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.

Abstract: A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension.

Abstract: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.

Abstract: A coaxial cable structure includes an outer cable conductor, and an angle connector, for example a 90° elbow connector, disposed on one cable end. The elbow connector is implemented by encapsulating the one cable end with thermoplastic material and including a metal sleeve which is placed in contact with the outer cable conductor to define an outer conductor of the elbow connector.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: An accelerated vehicle development process includes establishing a common, standardized interface system whereby different types of vehicle bodies may be attached to a single chassis design. Chassis and bodies are designed, manufactured and validated independently of each other in accordance with the standardized interface system, thereby accelerating the development process. As new bodies are designed to mate with the previously manufactured and validated chassis, the newly designed bodies may be developed more quickly in response to market demand and attached to the previously validated chassis.

Abstract: An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

Abstract: A wristwatch case (11) and a method of manufacturing the case, the wristwatch case comprising a wristwatch case body (1) made of titanium or stainless steel and a crown pipe (3) fixed to each other, wherein a stem hole (2) corresponding to the crown pipe (3) is formed in the wristwatch case body (1), a small diameter part is formed in the crown pipe (3), and a small diameter part corresponding to the a small diameter part of the crown pipe is formed in the stem hole (2), the method comprising the step of fitting the crown pipe (3) into the stem hole (2) in the wristwatch case body (1) to form a solid phase diffusion joining part at a portion where the small diameter parts thereof are fitted closely to each other, and to form a brazed connection part at a portion other than that where the small diameter parts are fitted closely to each other, whereby a watch external part having excellent corrosion resistance and waterproof and a large number of design variations can be provided.

Abstract: In a brazed condenser for an air conditioner, a collecting tube connected with a collector is prefabricated as a one-piece tube. The collecting tube is connected by tack weld seams with the collector before brazing the collecting tube and the collector together.

Abstract: A coated lead wire can be solidly connected to a terminal of a coil bobbin by placing the terminal entwined with the coated lead wire into between electrodes having heating portions, and supplying electric current to the electrodes to heat the terminal entwined with the coated lead wire along with solder to melt the solder and burn off a coating layer of the coated lead wire while exerting pressure against to the terminal entwined with the coated lead wire, and directing a blow of inert gas toward the terminal entwined with the coated lead wire between the electrodes. The coating layer carbonized as the result of being burned out by heating up the electrodes can be blown out without being mixed into the molten solder, consequently to add strength to the connection between the lead wire and the terminal, to thereby form a reliable and firm connection between the lead wire and the terminal with ease.

Abstract: A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.

Abstract: A method, system, and apparatus are provided for improving ball grid array (BGA) joint reliability. According to one embodiment, an area of weakness in a BGA package having an array of solder balls is determined, and a bonder is applied to the area of weakness independently of the array of solder balls.

Abstract: A magnetic head slider with at least one thin-film magnetic head element on a suspension is mounted. This mounting includes electrically connecting the magnetic head slider with the suspension with ball bonding connections. Electrical property of the thin-film magnetic head element is inspected, and then the ball bonding connections are separated when it is judged that the thin-film magnetic head element has defective electrical property. Then, the magnetic head slider is detached from the suspension, and thereafter a new magnetic head slider with at least one thin-film magnetic head element is mounted on the suspension from which the magnetic head slider was detached.

Abstract: The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.