Combined Patents (Class 228/176)
  • Patent number: 11160173
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 26, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (Chengdu) Ltd., TE Connectivity Services GmbH
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 11117804
    Abstract: Disclosed is a method of synthesizing graphene, wherein a Cu—Ni thin film laminate including a copper thin film and a nickel thin film formed thereon is placed in a chemical vapor depositor, brought into contact with a graphene precursor and subjected to chemical vapor deposition (CVD), thus synthesizing thickness-controlled graphene on the copper thin film, whereby the thickness of multilayer graphene can be easily and reproducibly controlled by adjusting only nickel thickness and CVD time, and a process window for obtaining reproducible results can be widened due to self-limiting properties whereby the maximum thickness of graphene is obtained after a certain synthesis time due to the thickness-controlled nickel thin film. Also, carbon atoms absorbed to the nickel thin film reach the copper thin film opposite thereto through internal diffusion of the metal laminate to thus grow graphene via surface-mediated reaction thereon, thereby improving the uniformity of synthesized graphene.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 14, 2021
    Assignees: CENTER FOR ADVANCED SOFT ELECTRONICS, POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Kilwon Cho, Min Seok Yoo, Hyo Chan Lee
  • Patent number: 11071411
    Abstract: Methods and systems for forming vacuum insulated containers, such as beverage and food containers, are described. The methods and systems include using a laser to close openings in walls of the container while the container is held at vacuum conditions. The closing of the opening forms the vacuum space within the walls of the container.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 27, 2021
    Assignees: THERMOS L.L.C.
    Inventors: Ronald K. Y. Mak, Tinghong Chen, Jun Zhou, Marvin Lane
  • Patent number: 10987550
    Abstract: A golf club head has an inner cavity and comprises a face member and a head main body which a front opening, which are connected to each other. The head main body comprises a sole portion, and a weight member which has a specific gravity greater than that of the head main body is fixed to an inner surface of the sole portion. A weld which fix the weight member to the sole portion is disposed at the peripheral edge of the weight member. The weight member has the width in the toe-heel direction of the head, which is smaller on its rear side than its front side.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: April 27, 2021
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventor: Masatoshi Kato
  • Patent number: 10923248
    Abstract: A method for producing a metal film from an over 50% nickel alloy melts more than one ton of the alloy in a furnace, followed by VOD or VLF system treatment, then pouring off to form a pre-product, followed by re-melting by VAR and/or ESU. The pre-product is annealed 1-300 hours between 800 and 1350° C. under air or protection gas, then hot-formed between 1300 and 600° C., such that the pre-product then has 1-100 mm thickness after the forming and is not recrystallized, recovered, and/or (dynamically) recrystallized having a grain size below 300 ?m. The pre-product is pickled, then cold-formed to produce a film having 10-600 ?m end thickness and a deformation ratio greater than 90%. The film is cut into 5-300 mm strips, annealed 1 second to 5 hours under protection gas between 600 and 1200° C. in a continuous furnace, then recrystallized to have a high cubic texture proportion.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: February 16, 2021
    Assignee: VDM Metals International GmbH
    Inventors: Nicole De Boer, Stefan Gilges, Heike Hattendorf, Andreas Heckmann
  • Patent number: 10886252
    Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: January 5, 2021
    Assignee: IMEC vzw
    Inventors: Lan Peng, Soon-Wook Kim, Eric Beyne, Gerald Peter Beyer, Erik Sleeckx, Robert Miller
  • Patent number: 10828731
    Abstract: A Pb-free solder alloy contains 4-12 wt% of Zn, 0.5-4 wt% of Bi, 0.5-5 wt% of In, 0.005-0.5 wt% of P, 0.001-0.5 wt% of Zr and at least one selected from: 0-0.1 wt% of Y, 0-0.2 wt% of Ge, 0-0.05 wt% of Mg, 0-0.02 wt% of B, 0-0.05 wt% of Al, 0-0.2 wt% of Ni and 0-0.3 wt% of Ag. A balance of the Pb-free solder alloy is Sn.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: November 10, 2020
    Inventor: Jusheng Ma
  • Patent number: 10773453
    Abstract: A pipe joint coating for welded ends of pipes forming a pipeline. A last and third layer of a 3LPP coating system covering at least a circumferential weld area of the pipe joint is a heated sheet applied around the pipe with a machine including a mounting frame and a transport carriage rotatably movable on the mounting frame to move circumferentially about the pipe joint, and a roller applying an adjusted pressure to the sheet against the pipe and adapting to eccentricity or ovality of the pipe. The sheet is pressed below the pipe away from its overlapping ends, a first part of the sheet is then applied when the roller is rolled in a first direction, and a second part of the sheet is applied by the roller rolled back in the reverse direction around the pipe. The sheet is dimensioned to obtain an overlapped area between its extremities.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: September 15, 2020
    Assignee: SERIMAX HOLDINGS
    Inventors: Terence Cottrell, Louis-Nicolas Hallez, Gareth Owen, Andrew Stribley
  • Patent number: 10766246
    Abstract: In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to partially or completely bury a part in layers of molten build material.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: September 8, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Krzysztof Nauka, Sivapackia Ganapathiappan, Lihua Zhao, Howard S. Tom, Yan Zhao, Hou T. Ng
  • Patent number: 10765475
    Abstract: Medical catheterization is carried out by introducing a catheter into a heart, sliding the catheter through a sheath that encloses a multi-electrode probe into a chamber of the heart. The sheath is retracted to expose the probe. As the sheath is retracted the exposed probe expands into a spiral configuration, and the electrodes contact the endocardial surface of the chamber at multiple contact points.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: September 8, 2020
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Assaf Govari, Christopher Thomas Beeckler, Joseph Thomas Keyes, Kevin Justin Herrera
  • Patent number: 10611027
    Abstract: An assembly apparatus according to an embodiment of the present technology includes a work base, a first robot, a second robot, and a controller. The work base has a placement surface on which a plurality of works is placed and causes the plurality of works to individually circulate to a plurality of work areas arranged along a circumference every certain time. The first robot is disposed inside the circumference and capable of accessing the plurality of work areas. The second robot is disposed outside the circumference and capable of accessing at least one work area out of the plurality of work areas. The controller causes the first robot to perform a predetermined process within the certain time with respect to works on a plurality of predetermined work areas out of the plurality of work areas, and causes the second robot to perform an operation of assisting the process by the first robot with respect to the work on the at least one work area out of the plurality of predetermined work areas.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: April 7, 2020
    Assignee: Sony Corporation
    Inventors: Yuji Kobori, Makoto Tonegawa, Hideki Takayanagi
  • Patent number: 10596425
    Abstract: Embodiments of golf club heads and methods to manufacture golf club heads are generally described herein. In one example, a golf club head may have a toe portion, a heel portion, a top portion, a sole portion, a back portion, and a front portion with a face opening. The golf club head may have a face portion joined to the body portion and covering the face opening. The golf club head may include an interior cavity partially, substantially, or entirely filled with a structural adhesive. Other examples and embodiments may be described and claimed.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: March 24, 2020
    Assignee: PARSONS XTREME GOLF, LLC
    Inventors: Robert R. Parsons, Michael R. Nicolette, Bradley D. Schweigert
  • Patent number: 10556306
    Abstract: A robot system including a plurality of robots that are arranged at intervals and that each perform machining on a work; and a tool storage unit that stores a tool used when each of the robots performs machining on the work and that is disposed at a position allowing at least one of the robot to take out the tool, wherein the respective robots are provided with hands with which the tool stored in the tool storage unit can be handled; and, when one of the robots needs to exchange the tool.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: February 11, 2020
    Assignee: FANUC CORPORATION
    Inventors: Kazuhiko Akiyama, Yoshitake Furuya
  • Patent number: 9824994
    Abstract: A semiconductor device includes: a semiconductor element; a joined member that is joined to the semiconductor element and includes a nickel film; and a joining layer that is joined to the joined member and contains 2.0 wt % or higher of copper, in which the joining layer includes a solder portion and a Cu6Sn5 portion, base metal of the solder portion contains at least tin as a constituent element and contains elemental copper, and the Cu6Sn5 portion is in contact with the nickel film.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: November 21, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takuya Kadoguchi
  • Patent number: 9767712
    Abstract: A simulator facilitates virtual welding activity of orbital weld joints. The simulator may include a logic processor based system operable to execute coded instructions for generating an interactive welding environment that emulates welding activity on a section of virtual pipe having at least one virtual weld joint. It also includes a display connected to the logic processor based system for visually depicting the interactive welding environment, wherein the display depicts the section of virtual pipe. A pendant is provided for performing welding equipment setup and virtual welding activity on the at least one weld joint in real time where one or more sensors are adapted to track movement of the input device in real time for communicating data about the movement of the input device to the logic processor based system.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: September 19, 2017
    Assignee: Lincoln Global, Inc.
    Inventors: Deanna Postlethwaite, Matthew Wayne Wallace, David Anthony Zboray, Zachary Steven Lenker
  • Patent number: 9737963
    Abstract: A system for positioning and welding a bracket 30 to a mounting surface, such as a vehicle side rail 40, including using a pivoting tool 20 on a moveable arm 10 that allows the bracket 30 to pivot to minimize the gap between the bracket 30 and its intended mounting surface. The pivoting tool 20 secures, positions near the surface, and allows the bracket 30 to pivot for a precise surface match. A welder 50 welds the bracket 30 to the surface with the gap minimized while the bracket 30 is held in the desired position. The pivoting tool 20 is preferably on an adjustable appendage 12 or combination end 60 mounted on a distal end of the arm 10. The flexible tooling does not require the bracket 30 to be forced with substantial pressure against the mounting surface.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: August 22, 2017
    Assignee: METALSA S.A. DE C.V.
    Inventors: Juan Villarreal Garcia, Jason Belcher, Marvin Lewis Adams
  • Patent number: 9316341
    Abstract: Equipment having a protective coating layer for use in abrasive environments, e.g., sulfur-containing environments, is disclosed. The coating is formed from a single-component feedstock, as a Fe-based alloy composition comprising at least two refractory elements selected from Cr, V, Nb, Mo and W in an amount of up to 30% each and a total concentration of up to 40%. In one embodiment, the coating is applied by thermal spraying, followed by heat treatment for at least a portion of the refractory elements in the coating to fuse into the substrate forming a metallurgically bonded coating. The coating has an adhesion strength of at least 7,000 psi measured according to ASTM D4541. The coating layer is further characterized as being impermeable to corrosive environments showing no pin holes in the ferroxyl test according to ASTM A967 Practice E.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: April 19, 2016
    Assignee: CHEVRON U.S.A. INC.
    Inventors: Grzegorz Jan Kusinski, Justin Lee Cheney
  • Patent number: 9230449
    Abstract: A system for training welders that includes a data generating component, a data capturing component and a data processing and visualization component. The data generating component operates in real time and derives data from an actual manually-executed weld and further includes a weld process-specific jig, a calibration block positioned on the jig, wherein the geometric configuration of the calibration block is specific to a particular type of weld joint, a weld coupon positioned on the welding process-specific jig adjacent to the calibration block, a welding gun for use by a trainee, wherein the welding gun is operative to form the weld; and at least one target mounted on the welding gun that is recognized by the data processing and visualization component for providing multidimensional position and orientation feedback to the trainee.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: January 5, 2016
    Assignee: Lincoln Global, Inc.
    Inventors: Christopher C. Conrardy, Victor M. Penrod, Paul C. Boulware, Constance T. Reichert Lamorte
  • Patent number: 9116291
    Abstract: An objective is to provide an integrated optical module which can avoid positional change and separation of a PLC chip when humidity changes. Provided is an integrated optical module characterized in that the integrated optical module includes: a PLC chip; a seat bonded and fixed to part of a lower surface of the PLC chip with an adhesive which is applied to an adhesion surface of the seat; and a support portion supporting the seat, in which a water-repellent treatment portion is provided by masking an upper portion of the support portion with a water-repellent material. The water-repellent treatment portion is provided only around the seat for a predetermined width. The water-repellent treatment portion is provided around the seat for a width of 100 ?m or more.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: August 25, 2015
    Assignees: NIPPON TELEGRAPH AND TELEPHONE CORPORATION, NTT ELECTRONICS CORPORATION
    Inventors: Ryoichi Kasahara, Atsushi Aratake, Ikuo Ogawa, Yusuke Nasu, Yuichi Suzuki, Shunichi Soma
  • Publication number: 20150131244
    Abstract: The electrical device (2, 202) according to the invention comprises a first electrical component (4) and a second electrical component (6) connected to each other via an electrical connection means (26) having an electrically insulating support plate (24), and a weld joint (22) deposited on the support plate (24). The weld joint (22) has a melting temperature (TO significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection means (26) are provided to be subjected. The electrical device (2) comprises a cement (28) that completely covers the exposed weld joint (22), the material of the cement (28) being chosen to maintain its adhesion and its tightness with respect to the weld joint (22) when the ambient operating temperature (Ta) is applied.
    Type: Application
    Filed: April 3, 2013
    Publication date: May 14, 2015
    Inventors: Sylvain Ballandras, Bruno Francois
  • Publication number: 20150110548
    Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventor: Aarne H. Reid
  • Publication number: 20150092357
    Abstract: A method for manufacturing a printed wiring board includes forming a resin insulation layer on an interlayer resin insulation layer and conductive circuits such that the resin insulation layer has first openings exposing pad portions in central portion of the interlayer layer and second openings exposing pad portions in peripheral portion of the interlayer layer, forming a seed layer on the resin insulation layer, in the first and second openings and on the pad portions, forming on the seed layer a plating resist such that the resist has resist openings exposing the second openings and having diameters greater than the second openings, filling the resist openings with electrolytic plating material via the seed layer such that metal posts are formed in the resist openings, removing the resist from the resin insulation layer, and removing the seed layer exposed on the resin insulation layer by the removing of the resist.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 2, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuhiro YOSHIKAWA, Takashi KARIYA
  • Publication number: 20150074978
    Abstract: Polyurethane systems that cure similarly to systems based on mercury catalysts contain 1,4-butanediol and a zinc carboxylate catalyst. These systems cure and develop green strength similarly to systems based on mercury catalysts. These systems are especially useful in making insulated pipe joints for subsea pipeline installations.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Inventors: Amber Stephenson, Eric Rexrode
  • Patent number: 8970026
    Abstract: A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consists of a second solder compound. The outer section can be farther away from a center of the one external side of the substrate than the inner section. During a reflow process, the first and second solder compounds are configured to become completely molten when heated and the first solder compound solidifies at a higher temperature during cool down than the second solder compound.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: March 3, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: George R. Leal, Leo M. Higgins, III, Tim V. Pham
  • Publication number: 20150053752
    Abstract: The present disclosure relates to a ball planting device for mounting a solder ball and a ball planting method thereof. The device includes a substrate, a dielectric layer, and a solder paste. The substrate includes a surface. The dielectric layer is disposed on the surface. The dielectric layer includes a plurality of apertures. The solder paste fills the apertures. A top surface of the solder paste is aligned with an exposed surface of the dielectric layer.
    Type: Application
    Filed: May 22, 2014
    Publication date: February 26, 2015
    Applicant: CHIPMOS TECHNOLOGIES INC
    Inventor: TSUNG JEN LIAO
  • Publication number: 20150048523
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 19, 2015
    Applicant: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20150041017
    Abstract: A method for forming a high temperature field joint between two insulated pipe sections, and an insulated conduit having a low temperature field joint. The conduit comprises a steel pipe with a corrosion protection coating and a pipe insulation layer comprising a polymer composition having thermal conductivity of less than about 0.40 W/mk, and/or heat resistance to continuous operating temperatures from about 150° C. to above about 205° C. After a circumferential weld joint is formed between the two pipes, a first field joint insulation layer is applied over the joint area, the first field joint insulation layer comprises a polymer composition having heat resistance to continuous operating temperatures from about 150° C. to above about 205° C.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 12, 2015
    Inventors: Jan Peder Hegdal, Torgeir Sletvold, Eileen Wan, Suresh Choudhary
  • Publication number: 20150043002
    Abstract: The present invention concerns the use of hybrid metal-dielectric optical coatings as the end reflectors of laser cavities and/or in the mirror structures used in other optical resonators, such as Fabry-Perot tunable filters, along with the use of such Fabry-Perot tunable filters in wavelength swept sources such as lasers. Hybrid metal-dielectric optical coatings have reflectivity spectra that can be broader than pure dielectric coatings, offer optical reflectivities higher than metal, as high as pure dielectric coatings, eliminate mirror transmission that can cause parasitic light reflections, and use fewer layers and thus have lower mass and higher mechanical resonant frequency for movable mirror applications An important characteristic of these coatings concerns the non-reflected light. Pure dielectric coatings offer high reflectivity, while the non-reflected portion of the light is transmitted by the coating to the substrate, for example.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 12, 2015
    Inventors: Mark E. Kuznetsov, Ranko Galeb
  • Publication number: 20150033878
    Abstract: The invention relates to a method for producing a pressure sensor, comprising the following steps: assembling a support substrate with a deformable membrane on which strain gauges have been deposited, wherein the deformable membrane comprises a thinned area at the centre thereof, the support substrate is disposed on top of the deformable membrane, the support substrate comprises an upper surface and a lower surface in contact with the deformable membrane, and the support substrate also comprises lateral recesses arranged on top of the strain gauges and a central recess arranged on top of the thinned area of the membrane, so as to obtain a micromechanical structure; and, once the assembly has been obtained, depositing, in a single step, at least one conductive material on the upper surface of the support and in the lateral recesses of the support, said conductive material extending into the recesses in order to be in contact with the strain gauges so as to form electrical contacts in contact with the strain ga
    Type: Application
    Filed: March 6, 2013
    Publication date: February 5, 2015
    Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE LABORATOIRE D'ANALYSE ET D'ARCHIT
    Inventors: Sebastiano Brida, Jean-Francois Le Neal
  • Publication number: 20150034702
    Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one process chamber or a plurality of process chambers having a treating space in which a reflow process with respect to the substrate is performed, a cleaning unit cleaning the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and the cleaning unit.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 5, 2015
    Applicant: Semigear Inc
    Inventor: Jian Zhang
  • Publication number: 20150037603
    Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 5, 2015
    Applicant: GLOBALFOUNDRIES, Inc.
    Inventors: Ernesto Gene de la Garza, Martin O'Toole
  • Patent number: 8939346
    Abstract: A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: January 27, 2015
    Assignee: International Business Machines Corporation
    Inventor: Julien Sylvestre
  • Publication number: 20150014398
    Abstract: A method of mounting electronic parts on a surface mounting substrate includes a step of forming a film resist layer by applying a resist with a film coating device to amounting surface of a surface mounting substrate formed with a wiring pattern including a pair of lands to mount an electronic part; precuring the formed film resist layer; exposing, by using a mask, inner side regions of the film resist layer, the inner side regions defining the exposure regions and another region defining non-exposure region; etching away the film resist layer in the non-exposure regions and forming film resist layers in the inner side regions; post curing the film resist layers; printing solder pastes in regions on the lands excluding the inner side regions; and placing the electronic part on the solder pastes and reflow-soldering thereon.
    Type: Application
    Filed: October 2, 2014
    Publication date: January 15, 2015
    Inventors: Kokichi OKAMOTO, Takahiro TAGUCHI
  • Publication number: 20140376195
    Abstract: Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 25, 2014
    Inventors: Qinglei Zhang, Amruthavalli P. Alur
  • Patent number: 8915740
    Abstract: A simulator facilitates virtual welding activity of pipe and open root weld joints. The simulator may include a logic processor based system operable to execute coded instructions for generating an interactive welding environment that emulates welding activity on a section of virtual pipe having at least one virtual weld joint. It also includes a display connected to the logic processor based system for visually depicting the interactive welding environment, wherein the display depicts the section of virtual pipe. A mock welding tool is provided for performing virtual welding activity on the at least one weld joint in real time where one or more sensors are adapted to track movement of the input device in real time for communicating data about the movement of the input device to the logic processor based system.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: December 23, 2014
    Assignee: Lincoln Global, Inc.
    Inventors: David Anthony Zboray, Matthew Alan Bennett, Matthew Wayne Wallace, Jeremiah Hennessey, Yvette Christine Dudac, Zachary Steven Lenker, Andrew Paul Lundell, Paul Dana, Eric A. Preisz, Lynn Briggs, Richard B. Droller, Eric C. Briggs
  • Publication number: 20140367072
    Abstract: Method for manufacturing a heat pipe is disclosed. A tube and a vessel mesh are provided. Solder paste in a pattern is coated on the vessel mesh. The vessel mesh is rolled into a vessel and the vessel is placed in the tube. The tube is heat to weld to the vessel to the tube. The present disclosure also provides an exemplary heat pipe having a vessel welded therein.
    Type: Application
    Filed: April 15, 2014
    Publication date: December 18, 2014
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHIH-YAO LI, JUI-WEN HUNG
  • Patent number: 8910852
    Abstract: A method of joining pipes to produce underwater pipelines, wherein the facing free ends of two adjacent pipes, aligned along an axis, are welded to define a cutback; a protective sheet of plastic material is extruded close to the cutback; and the protective sheet is wound about the cutback by simultaneously rotating the extruder extrusion outlet and the extruder about the pipeline as the protective sheet is extruded from the extrusion outlet.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: December 16, 2014
    Assignee: Saipem S.p.A.
    Inventor: Serafino Cittadini Bellini
  • Publication number: 20140339289
    Abstract: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 20, 2014
    Applicant: Sony Corporation
    Inventors: Hiizu OOTORII, Kiwamu ADACHI, Takeshi MIZUNO
  • Publication number: 20140339093
    Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic join between various parts.
    Type: Application
    Filed: May 14, 2014
    Publication date: November 20, 2014
    Applicant: Apple Inc.
    Inventors: Simon Regis Louis Lancaster-Larocque, Collin D. Chan, Kenneth A. Ross
  • Patent number: 8881386
    Abstract: There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat sink block 3, and a semiconductor chip 2, wherein a first insulating resin sheet 41, which forms a lower layer of the insulating resin sheet 4, is first bonded to the cooler 5 by thermal compression. Next, with a second insulating resin sheet 42, which forms an upper layer of the insulating resin sheet 4, interposed between the first insulating resin sheet 41 and the heat sink block 3, the second insulating resin sheet 42 is bonded to the first insulating resin sheet 41 by thermal compression, and the heat sink block 3 is bonded to the second insulating resin sheet 42 by thermal compression. The semiconductor chip 2 is then soldered onto the heat sink block 3.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: November 11, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Yuji Yoshida
  • Publication number: 20140327274
    Abstract: A profile piece includes: an extruded piece of a first material having a mouth portion along at least part of its length; and an insert of a second material different than the first material, the insert attached to the extruded piece by the mouth portion, wherein the insert is configured for welding the profile piece to a component of a third material different than the first material.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventor: Michael J. Baldwin
  • Patent number: 8875981
    Abstract: A cartridge microreactor includes a tubular heater, a metal capillary reaction tubing and a brazing alloy. The tubular heater includes an inner tube surrounded by an outer heater sheath. The metal capillary reaction tubing has a high aspect ratio, an inlet port and an outlet port and is wrapped around the tubular heater so that it is in intimate thermal contact with the heater sheath. The brazing alloy permanently bonds the tubular heater with the metal capillary reaction tubing. The metal capillary reaction tubing is configured to be heated by the tubular heater and is configured to receive one or more reactants through the inlet port and to allow the reactants to react under a selected temperature and pressure and to produce one or more products exiting through the outlet port.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Navolta LLC
    Inventors: Brian Neltner, David M. King, Rick Bryan Woodruff
  • Publication number: 20140318831
    Abstract: In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer.
    Type: Application
    Filed: December 11, 2012
    Publication date: October 30, 2014
    Inventors: Kimihito Nishikawa, Shuuji Nishimoto, Takeshi Kitahara, Toshiyuki Nagase
  • Publication number: 20140319348
    Abstract: A motion sensing device for sensing infrared rays, the motion sensing device includes a substrate; a sensing unit, configured on the substrate for sensing the infrared rays; a stabilizing layer, covering on the sensing unit for fixing and protecting the sensing unit, wherein the stabilizing layer has an opening; a protection layer, formed on the opening; and a coating layer, covering the stabilizing layer for absorbing infrared rays, wherein the coating layer does not cover the opening.
    Type: Application
    Filed: April 28, 2014
    Publication date: October 30, 2014
    Applicant: LITE-ON SEMICONDUCTOR CORPORATION
    Inventor: Ming-Hsun Hsieh
  • Publication number: 20140311669
    Abstract: In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.
    Type: Application
    Filed: June 2, 2014
    Publication date: October 23, 2014
    Inventors: Steven A. Miller, Leonid N. Shekhter, Stefan Zimmermann
  • Publication number: 20140306445
    Abstract: An assembly of two pipeline units (1), wherein each pipeline unit (1) comprises a pipe member (2) and a pipe coating (3) surrounding the pipe member (2), which pipe member (2) comprises a pipe end (4), and which pipe coating extends along a length of the pipe member and ends at a coating end face located at a distance from the pipe end, the pipe ends (4) of the pipeline units are joined together at a pipe joint (15), such that the coating end faces (6) of the pipeline units are located at opposite sides of the pipe joint, a joint coating (16) is provided at the pipe joint (15), the joint coating (16) surrounds the pipe joint, is attached to the two opposite coating end faces of the pipeline units and is made from a material comprising a silicone.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 16, 2014
    Inventor: Helen Rose Boyd
  • Publication number: 20140285736
    Abstract: Disclosed are an electrode structure and a method for producing an electrode. The method includes disposing first and second wires on a substrate, and bonding the first and second wires to each other. The electrode structure includes a substrate, a first wire disposed on the substrate, and a second wire disposed on the substrate. The first wire crosses the second wire, and the first and second wires are bonded to each other.
    Type: Application
    Filed: July 25, 2012
    Publication date: September 25, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Joon Rak Choi, Jong Woon Moon, Young Sun You, Kyoung Hoon Chai
  • Publication number: 20140260710
    Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gordon A. Shaw, Daniel Baseman, Chris Finn, Jim G. Hunter
  • Publication number: 20140263581
    Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: ALPHA DESIGN CO., LTD.
    Inventors: Toshiyuki SHIRATORI, Toru KAWASAKI, Tadatomo SUGA, Masataka MIZUKOSHI
  • Publication number: 20140277316
    Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a first portion and a second portion, wherein the first portion defines an exposed outer surface of the electrode and is electrically coupled to the second portion along a first interface, wherein the second portion is electrically coupled to the lead wire along a second interface different from the first interface via welding to couple the lead wire to the electrode, wherein an electrical signal may be transferred between the lead wire and exposed outer surface of the first portion via the second portion, and wherein the first portion is formed from a first material having a first composition, and the second portion is formed from a second material having a second composition different from the first composition.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Medtronic, Inc.
    Inventors: Xingfu Chen, Bernard Q. Li, Richard T. Stone, Dale F. Seeley, Alan Shi