Abstract: The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer.

Abstract: The invention relates to a method for producing coated spring-loaded steel rails especially for windshield wipers comprising a rubber or elastomer wiper blade, wherein a cold-rolled steel rail blank is provided with a zinc layer, whereafter a zinc-containing anchor layer is produced, and a coating made of a polymerizable coating powder is deposited on the anchor layer and partially cured.

Abstract: The invention relates to a method of assembling gold alloy parts that enables identical or different gold alloys, particularly gold alloys of different colors, to be assembled. This method comprises the following steps: a) a film of tin is applied over at least one portion of a face of a first gold alloy part; b) the tinned face of the first gold alloy part is brought directly into contact with a face of a second gold alloy part; c) the first and second parts are pressed against each other; and d) the assembly is heated. This method may be used to manufacture checkerboards.

Abstract: An ultra low permeability fluid member for conveying a fluid (e.g., a hose, tube, etc.) having a metal vapor barrier layer (22) formed around an inner tube (14). The metal vapor layer (22) is formed from one or more metal strips (40a, 40b) having edge portions (44) that are bonded so as to seal the vapor barrier layer (22) preventing permeation of vapor.

Abstract: A solid phos-copper base or silver-phos-copper base brazing alloy component for forming a brazed joint with a raised shoulder, little to no black oxide, and improved corrosion resistance. The brazing alloys of the present invention are visually distinguishable from copper and copper alloy parts. The solid brazing components of the present invention may be used in forming brazed joints at low brazing temperatures and result in a joint that is strong, ductile, smooth and corrosion resistant. The solid brazing components are provided in the form of wire, strip, foil or preform, and thus are advantageously used in a wide variety of brazing applications including copper tubing. The brazing components of the present invention are made of an alloy having a liquidus temperature above 840° F. and consist essentially of about 4-9% phosphorus, about 0.1-10% tin, up to about 4% antimony, about 0.1-15% nickel, up to about 3% silicon, up to about 18% silver, up to about 3% manganese, with the balance being copper.

Abstract: Method for manufacturing an solar cell device, characterized in that the method comprises among others the following steps: arranging solar cell units (1) and electrically insulating units (2) alternatingly next to each other; applying rear soldering ribbons (3) to the rear side of the solar cell units (1) and the electrically insulating units (2); applying front soldering ribbons (4) to the front side of the solar cell units (1) and the electrically insulating units (2); soldering the rear soldering ribbons (3) and the front soldering ribbons (4) to the solar cell units (1), thereby providing an assembled solar cell. The invention also comprises a solar cell manufactured by means of the method.

Abstract: In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member.

Abstract: Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure.

Abstract: In one aspect of the present invention, a method for forming a bonded assembly comprises providing a first and second portion of the assembly; preparing a mating surface on each portion that conforms substantially to the mating surface of the other portion; rapidly heating a bonding material while substantially heating no more than a thin surface zone adjacent each mating surface, and rapidly assembling the two portions in such a manner as to confine a fraction of the bonding material between the mating surfaces. The first portion may comprise polycrystalline diamond or thermally stable polycrystalline diamond; the second portion may comprise cobalt-cemented tungsten carbide. The assembly may comprise a tool for high-impact applications.

Abstract: A conductive rubber component 10 includes a laminate 9 in which conductive rubber layers 1 and insulating rubber layers 2 are laminated alternately in parallel, the conductive rubber layers 1 and the insulating rubber layers 2 are integrated at their boundaries by a cross-linking reaction, the conductive rubber layers 1 have a thickness of 0.01 mm to 1.0 mm and electrical conductivity such that the volume resistivity is 10?5 ?·cm or more and 10 K ?·cm or less, and the insulating rubber layers have a thickness of 0.01 mm to 1.0 mm and electrical insulation properties such that the volume resistivity is 1 M ?·cm or more and 1016 ?·cm or less. A solderable metal coating 3 is integrated with at least one surface of the laminate 9 that is perpendicular to the electrical conduction direction by the deposition of at least one selected from atoms and molecules.

Abstract: An apparatus for reinforcing a railway tank car includes a tank shell. A plurality of attachment pads are welded to the tank shell to form a tank assembly. The tank assembly is subjected to a post-weld heat treatment. A plurality of shield plates may each be welded directly to at least one of the plurality of attachment pads. The shield plates are not subjected to the post-weld heat treatment.

Abstract: The present invention relates to a method for manufacturing a housing-less sensor, in particular a proximity sensor. Here it is proposed to build all of the components needed for the mechanical and electrical functions on one sensor chassis and then to inject a plastic compound around the components.

Abstract: In order to provide a sealing assembly for a fuel cell stack comprising a plurality of fuel cell units, which are arranged consecutively in a stacking direction, wherein each of the fuel cell units comprises a housing with at least one housing part made of a metallic material, which also has an adequate electrical insulation effect and an adequate mechanical strength at a high operating temperature of the fuel cell stack, it is proposed that the sealing assembly comprises at least one intermediate element made of a metallic material, wherein the intermediate element is soldered to a housing part of a first fuel cell unit at least one location by means of a metal solder and is secured to a housing part of a second fuel cell unit at least another location, wherein the intermediate element and/or the housing part of the first fuel cell unit is provided with a coating made of a ceramic material.

Abstract: The present invention relates to a magnesium-based composite material includes at least two magnesium-based metallic layers; and at least one magnesium-based composite layer respectively sandwiched by the at least two magnesium-based metallic layers. The present invention also relates to a method for fabricating a magnesium-based composite material, the method includes the steps of: (a) providing at least two magnesium-based plates; (b) providing a plurality of nanoscale reinforcements; (c) sandwiching the nanoscale reinforcements between the at least two magnesium-based plates to form a preform; and (d) hot pressing the preform to achieve the magnesium-based composite material.

Abstract: The invention relates to a brake disk for a motor vehicle having a brake disc cup (10) and having a friction ring (18) supported thereby and made of a cast material, joined to each other by means of a joint connection, particularly a welded connection (32), wherein an intermediate component (20) is cast into the friction ring (18), by means of which the friction ring (18) is connected to the brake disk cup (10). The invention further relates to a method for producing such a brake disk.

Abstract: A method of forming a part that includes a first component and a second component and which two components are diffusion bonded together. The first component is configured as a pressure component and includes a first bond land surface. The second component is configured as a suction component and includes a second bond land surface. A mandrel is provided that includes a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component. The first and second components are positioned on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment. The first and second components together with the mandrel are positioned in a die assembly. The die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die.

Abstract: System and method of producing multi-layered aluminum alloy products are disclosed. A multi-layered aluminum alloy product may be formed by first heating a first aluminum alloy to a first temperature where the first temperature is at least about 5° C. lower than the eutectic temperature of the first aluminum alloy, second heating a second aluminum alloy to a second temperature where the second temperature is at least about 5° C. higher than the liquidus temperature of the second aluminum alloy, and coupling the second aluminum alloy to the first aluminum alloy to produce a multi-layered aluminum alloy product.

Abstract: A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.

Abstract: A method of welding a component is provided. The component is welded using a preheating temperature of the component below 500° C. and above 400° C., wherein no material is added to an area to be welded.

Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

Abstract: A structural element used for attenuating aviation turbine noise is provided with pores (1, 2) embodied in the form of cylindrical channels which are open on the first ends inside the turbine housing and closed on the opposite ends thereof, wherein the diameter (D) of each channel ranges approximately from 0.1 to 0.3 mm, each channel is remote at least along one part of the length thereof from the closest neighbours at a minimum distance ranging approximately from 0.02 to 0.3 mm and the ratio between the channel length and diameter thereof is of the order of 102.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: A welded joint of a lined pipeline has a main pipe and an extension piece having a generally tubular shape, an inner wall and an annular weld connecting the extension piece to the main pipe. A liner extends through the main pipe and partially into the extension piece. A compression ring includes a flange and a compression portion. The compression portion engages the liner internally and compresses the liner radially outwardly against the extension piece so that the liner is sealed with the compression ring.

Abstract: Provided is a method for joining two strands of second-generation high-temperature superconducting wire, each of which includes a substrate, a buffer layer, a superconducting layer and a stabilizer layer. The method comprises: partially removing each of the stabilizer layers to expose a portion of the superconducting layer; bringing the exposed portions of the superconducting layers into contact with each other and fixing the superconducting layers to each other; heating the strands of superconducting wire to the melting point of the superconducting layers to melt-diffuse the superconducting layers in contact with each other and to join the strands of superconducting wire together; and oxidizing the junction between the strands of superconducting wire in an oxygen atmosphere (‘oxygenation annealing’). The oxygenation annealing restores the superconducting properties of the superconducting wires lost during the melting diffusion.

Abstract: A foil for producing a metal honeycomb or catalyst carrier body, has an average surface roughness of more than 0.3 ?m (micrometers) on both surfaces in at least one measurement direction. Preferably, the foil is rolled and has an average surface roughness of more than 0.3 or 0.5 ?m, especially approximately 0.6 ?m, in the rolling direction and/or transverse thereto. The foil can have an oxide coating with a thickness between 60 and 80 or between 70 and 75 nm (nanometers) on both surfaces. Despite the roughness, an even thickness of the oxide coating with a tolerance of less than 10% or 5% is advantageous on both surfaces. The foil allows production of durable honeycomb bodies, especially for exhaust systems of internal combustion engines, requiring an exactly defined distribution and quality of compounds in the interior thereof. A honeycomb body and method of production using a foil, are also provided.

Abstract: For fastening the contact strip (8) to the back electrode layer (4) of a photovoltaic module, the back electrode layer (4) is provided on its outer side with a tin-, copper- and/or silver-containing contact layer (12). Subsequently the contact strip (8) provided with solder (17) on the joining surface is connected to the back electrode layer (4) by soldering. The contact layer (12) causes good adhesion of the back surface encapsulation material (13) to be obtained. A barrier layer (11) prevents alloying of the tin-solder with the layers (9, 10) of the back electrode layer (4).

Abstract: A unique heat treat method for relieving stresses caused by a repairing weld joint in a full hoop part heat treats locally, at the location of the weld joint, and at a diametrically opposed location. By providing the diametrically opposed heat treat location, the present invention relieves stresses caused by the weld joint, without creating any additional residual stress in the weld joint.

Abstract: The invention relates to a gas distributor (1, 2) for a CVD reactor comprising two or more chambers (8, 9, 14), with supply lines ending therein, wherein at least one of the chambers (8, 9) forms a gas volume and is connected to gas outlet openings (23) associated with the bottom (2) of the gas distributor (1, 2) by means of a plurality of small tubes (11, 12, 13) crossing at least one other chamber (9, 14). For simplified production and technical enhancement, the gas distributor (1, 2), at least in the region of the small tubes (11, 12, 13), is made of a plurality of structured disks resting on top of each other, which are diffusion-welded to each other by pressure and temperature.

Abstract: An aluminum alloy comprises aluminum, magnesium, scandium, and an enhancing system. The magnesium is from about 0.5 percent to about 10.0 percent by weight based on the aluminum alloy. The scandium is from about 0.05 percent to about 10.0 percent by weight based on the aluminum alloy. The enhancing system is from about 0.05 percent to about 1.5 percent by weight based on the aluminum alloy.

Abstract: With a method for manufacturing welded rotors for a turbine, especially a gas-turbine engine, in which two or more rotor disks are joined to each other by conventional welding processes using welds extending radially to the rotor axis and the weld zone is subsequently thermally treated at a certain temperature to relieve residual tensile stresses by relaxation, the weld is set to a significantly lower non-relaxatory temperature level than the heat-affected zone adjoining the weld so that, as a result of the high temperature gradient, a residual compressive stress or at least a substantially reduced residual tensile stress is impressed on the weld. Compared to conventionally heat treated and welded rotors, improved strength properties in the weld zone and an increased service life are obtained as a result of the reduced tensile stresses.

Abstract: Method and apparatus for coating a pipe (2) or a pipe section with a layer of at least one polymer. The method comprises providing a pipe (2) or a pipe section having an outer surface defining the periphery of the pipe or pipe section; applying on the outer surface of the pipe or pipe section a layer of at least one polymer material in melt stage using a nozzle (3), which is mounted on a carriage capable of travelling along the periphery of the pipe (2) or pipe section; and moving the carriage along at least a part of the periphery during the application of the polymer material to form a layer on the surface of the pipe (2) or pipe section. The present invention is particularly useful for coating field joints in pipelines.

Abstract: In a method for bonding semiconductor wafers of the present invention, a bonding layer containing a flux-active curing agent and a thermosetting resin is interposed between a first semiconductor wafer and a second semiconductor wafer, thereby producing a semiconductor wafer stacked body in which the first and second semiconductor wafers are stacked together, and then the semiconductor wafer stacked body is compressed in a thickness direction thereof while heating it so that the first and second semiconductor wafers are fixed together by melting and solidifying solder bumps while curing the thermosetting resin, thereby producing a semiconductor wafer bonded body in which first connector portions and second connector portions are electrically connected together through solidified products obtained by melting and solidifying the solder bumps.

Abstract: One exemplary embodiment of a high pressure tank and a method thereof includes providing a liner of the high pressure tank. A liner having at least one open end with a first inner diameter and a first outer diameter. The method also including providing a cap having a second outer diameter which is greater than the first inner diameter. The method further includes providing a collar having a second inner diameter which is less than the first outer diameter. The liner is brought to a first temperature, the cap is brought to a second temperature which is less than the first temperature, and the collar is brought to a third temperature which is greater than the first temperature. At least a portion of the cap is placed inside the open end and at least a portion of the collar is placed over the open end.

Abstract: A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling.

Abstract: This method of coating the area of hybridization of a component constituted by two elements associated with one another by means of a soldering material, comprises depositing in proximity to said component a coating substance capable of filling by capillarity the volume defined between the hybridized elements of said component. On the periphery of the hybridization area on the lower element of said component is defined an area (10) of non-wettability as regards said substance, by deposition of a covering anti-wetting as regards said substance, applied by PECVD, and defining on said first element, in line with the hybridization, a wetting surface for the coating substance.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduced or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.

Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivin

Abstract: A method of joining pipes (3) to produce underwater pipelines (2), wherein the facing free ends (15) of two adjacent pipes (3), aligned along an axis (A), are welded to define a cutback (18); a protective sheet (22) of plastic material is extruded close to the cutback (18); and the protective sheet (22) is wound about the cutback (18).

Abstract: Systems and methods for brazing and soldering using low and non-silver based filler metals are described. The present invention includes methods and systems for brazing and soldering using copper based or bronze type filler metals in lieu of silver containing filler metals. The systems and methods provide advantages in that the bronze filler metals are substantially cheaper than silver alloy filler metals that are commonly used. Furthermore, the present invention uses a low-temperature, water-soluble flux that provides for easier cleanup after the completion of the brazing process. Additionally, the present invention provides significant advantages over traditional copper brazing in that it allows for a one-piece workflow and eliminates the need for large component pieces and filler metal inventories. This results in a significant decrease in capital expenditures and utility costs.

Abstract: An on-chip low baseline drift SAW/LAW chemical sensor array and method of forming the same. A dual SAW delay line includes a common IDT for generating an acoustic wave and a pair of IDT for reception of the acoustic wave. One sensing layer or one reference layer can be deposited in position on each side of the common IDT. An ASIC chip includes on chip dual operational amplifiers and a mixer in order to obtain a differential measurement utilizing a difference being given by the sensing and the reference layers. A 3D technology can be employed in order to connect the sensor array and the ASIC in the same package and thereby form a 3D stack. The chemical sensor array and the ASIC can be configured in different packages and interconnected on the same substrate utilizing 2D technologies. A number of gases can be detected independently, and each gas can be detected differentially, with respect to its associated sensing layer and specific reference layer.

Abstract: A structure includes a first part provided in a first plane and second and third parts provided in a second plane located under the first plane. The second and third parts are welded together at a welded seam. The first part has at least one recess configured to receive a welding mechanism that forms the welded seam on the second and third parts. Another structure includes an “n” number of layers, n being at least three. Adjacent layers are in contact with one another and are connected by a welded seam. The structure also includes an outer surface. The layers between the outer surface and the respective welded seam define a recess through which a welding mechanism is configured to be passed as far as the respective layers to be welded to produce the welded seam.

Abstract: This invention relates to a method producing a common rail excellent in fatigue strength from an inexpensive steel which uses as the material of the common rail a steel for high-strength liquid phase diffusion bonding having good toughness and fatigue strength, which steel contains, in mass %, C: 0.01 to 0.3%, Si: 0.01 to 0.5%, Mn: 0.01 to 3.0%, Cr: 1.0 to 12.0% and Mo: 0.1 to 2.0%, further contains, in mass %, V: 0.01 to 1.0%, B: 0.0003 to 0.01%, Ti: 0.01 to 0.05% and N: 0.001 to 0.01%, has P content limited to 0.03% or less, S content to 0.01% or less and O content to 0.01% or less, further has total content of grain boundary segregated embrittling elements As, Sn, Sb, Pb and Zn limited to 0.015% or less, and a balance of unavoidable impurities and Fe. The steel is used for liquid phase diffusion bonding.

Abstract: A method of manufacturing a micro electro-mechanical component having a three-dimensional structure includes preparing a conductive substrate, selectively insulating or removing the conductive substrate to form a functional structure for performing a desired electro-mechanical function, forming a plated structure serving as an electrical connection portion on at least one surface of the functional structure, and mounting the functional structure on a circuit substrate so that the electrical connection portion is connected to a circuit pattern of the circuit substrate.

Abstract: An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

Abstract: A rotating anode plate for rotating anode x-ray tubes, has a curved disc to be attached positively on a rotation center. The curved disc is formed of a material with high thermal shock resistance that is creep-resistant and simultaneously highly heat-conductive. Particularly suitable materials are ceramics made of silicon carbide (SiC) or alloys made of molybdenum-titanium-zirconium (TZM).

Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 ?m.

Abstract: Process for reducing cracking in superalloy metal components by selectively growing large single grains during the casting operation at a region where fusion welding will be required.