Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract: An umbilical for use in the offshore production of hydrocarbons, the umbilical comprising at least one electric cable, the electric cable comprising at least one electric conductor (18), and at least one electric conductor (18) comprising plurality of electric strands having interstices (15), wherein the interstices are filled with a metal-based material. In this way, there is provided an umbilical with a ‘void-free1 or completely gap-filled conductor construction which therefore prevents water or gas migration or transport along such a conductor.

Abstract: The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

Abstract: Method and apparatus for coating a pipe or a pipe section with a layer of at least one polymer. The method includes providing the pipe or the pipe section having an outer surface defining the periphery of the pipe or the pipe section; applying on the outer surface of the pipe or pipe section a layer of at least one polymer material in melt stage using a nozzle, which is mounted on a carriage capable of travelling along the periphery of the pipe or the pipe section; and moving the carriage along at least a part of the periphery during the application of the polymer material to form a layer on the surface of the pipe or the pipe section that is particularly useful for coating field joints in pipelines.

Abstract: An LED area light module has a substrate and a circuit layer and a solder mask layer formed on the substrate. The solder mask layer partially covers the circuit layer for the partially exposed circuit layer to form multiple electrical contacts. An embankment wall is formed on the solder mask layer with a solder mask material for the electrical contacts to be located within the embankment wall. Multiple LED chips are mounted on the solder mask layer within the embankment wall and electrically connected to the electrical contacts. Optically-transmissive adhesive is filled and concentrated within the embankment wall and covers the LED chips by a tension force thereof, and forms an optically-transmissive adhesive layer after congealed. Accordingly, the LED area light module eliminates the use of thick frame made of metal or rubber and steps of manufacturing and mounting the frame to simplify the packaging processes.

Abstract: The invention relates to a pipe element comprising at least one hoop-wound tube (T), said hoop-wound tube (T) comprising a central part consisting of a metal core (A) covered by at least one hoop layer (F), at least one connecting means (C). Hoop-wound tube (T) also comprises at least one transition element (B) welded, on one side, to one end of said core (A) and, on the other side, to one end of connecting means (C). This pipe element can be used as an auxiliary line of a drilling riser pipe.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

Abstract: A method for the production of a fibrous metal structure by weaving with metal weft yarns and metal warp yarns. The method includes weaving the fibrous structure by successive weaving of metal clasps that are used as weft yarns. For the purpose of weaving, each of the arms of each of the metal clasps is introduced into at least one shed, each shed being formed by two warp yarns.

Abstract: A method for manufacturing an element (8) of a modular scaffolding system, comprising: providing an at least partly galvanized pipe part (10) having a first end (12) and a second end; providing an at least partly galvanized first connection head (40) which is designed to be connected to the first end (12) of the pipe part (10); forming, through welding, a weld (24) which connects the first end (12) of the pipe part (10) to the first connection head (40), the weld (24) comprising an internal weld surface (24b) and an external weld surface (24a), which internal weld surface is proximal to the pipe part (10) and/or the connection head (40), and which external weld surface is proximal to an outside environment (60) of the pipe part (10) and the connecting head (40).; and covering the external weld surface with a protective layer, such that the external weld surface is screened off from the outside environment (60).

Abstract: The present application relates to a method of manufacturing a heat sink from a plurality of extruded lamellas, each lamella including a base portion having a top surface, a bottom surface, and two side surfaces, each lamella further including a fin portion extending from the top surface of the base portion, wherein the base portion is wider than the fin portion. The method includes aligning the base portions of the plurality of lamellas with the fin portion of each lamella extending in the same direction and the side surfaces of adjacent base portions facing each other; pressing the base portions of adjacent lamellas into contact with each other by applying a force to the side surface of at least one of the base portions; and welding the bottom surfaces of adjacent base portions together. A heat sink and a lamella for use in manufacturing a heat sink are also disclosed.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.

Abstract: A rotation detector component detects a rotational state of a rotor and sends a rotational detection signal. A signal transmission component is electrically connected with a lead frame of the rotation detector component to transmit the rotational detection signal to an external device. A body portion holds the rotation detector component and a part of the signal transmission component. The body portion is integrally molded of a first resin to cover a joint portion between the lead frame and the signal transmission component, the rotation detector component, and a part of the signal transmission component. The rotation detector component has corners including at least two exposed corners, which are exposed from the body portion.

Abstract: A rotation detector component detects a rotational state of a rotor and sends a rotational detection signal. A signal transmission component is electrically connected with a lead frame of the rotation detector component to transmit the rotational detection signal to an external device. A body portion holds the rotation detector component and a part of the signal transmission component. The body portion is integrally molded of a first resin to cover a joint portion between the lead frame and the signal transmission component, the rotation detector component, and a part of the signal transmission component. A part of the rotation detector component forms an exposed portion exposed from the body portion.

Abstract: A cable assembly configured to prevent the wicking of fluid inside the cable assembly and method for producing same. The assembly includes at least one wire surrounded by an insulative wire jacket. A portion of the wire jacket is removed to expose a portion of the wire. The at least one wire is overmolded with a material that adheres to the wire jacket and the exposed portion of the wire, thereby preventing the wicking of fluid along the inside and outside surfaces of the wire jacket. Solder may be applied to the exposed portion of the wire, thereby providing a fluid barrier within the wire in instances in which the wire is stranded.

Abstract: A target assembly comprising—a support body having a carrying surface;—a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface,—wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

Abstract: This disclosure provides systems, methods and apparatus for fabricating encapsulated devices, including electromechanical systems devices. In one aspect, a cover plate including one or more encapsulation lids releasably attached to a carrier substrate is provided. The one or more encapsulation lids can be joined to a device substrate to encapsulate one or more devices on the device substrate in a batch process. After joining, the encapsulation lids are released from the carrier substrate resulting in the formation of encapsulated devices on the device substrate. In another aspect, encapsulated devices are provided.

Abstract: In one embodiment, a plasma etching system may include a process gas source, a plasma processing chamber, and a gas supply conduit. A plasma can be formed from a process gas recipe in the plasma processing chamber. The gas supply conduit may include a corrosion resistant layered structure forming an inner recipe contacting surface and an outer environment contacting surface. The corrosion resistant layered structure may include a protective silicon layer, a passivated coupling layer and a stainless steel layer. The inner recipe contacting surface can be formed by the protective silicon layer. The passivated coupling layer can be disposed between the protective silicon layer and the stainless steel layer. The passivated coupling layer can include chrome oxide and iron oxide. The chrome oxide can be more abundant in the passivated coupling layer than the iron oxide.

Abstract: Various embodiments of this disclosure concern a lead end having an inner support. Such a lead can include a first end, a second end, a main body, and a plurality of exposed electrical elements on each of the lead ends. A metal support can be contained within the first end, the metal support comprising a plurality of longitudinal members and a plurality of cross members between the longitudinal members, the metal support having an interior space. The first lead end can further include polymer fill within the interior space of the metal support and encapsulating at least a substantial portion of the metal support, the polymer fill defining at least some of the exterior surface of the first end between the exposed electrical elements of the first end.

Abstract: A method of generating a welded assembly includes providing a work-hardened steel component. The method also includes annealing a region on the work-hardened steel component to impart a local temper to the region such that formability of the region is increased. The method additionally includes forming a projection on the annealed region. Furthermore, the method includes clamping a panel against the projection and joining the panel and the work-hardened steel component at the projection via a welding apparatus to generate the welded assembly. A system for generating a welded assembly employing the disclosed method and a method of generating a reinforced assembly are also disclosed.

Abstract: In a method of making a leading edge component for an airfoil device a first elongate sheet is provided and has a shape substantially conforming to a surface on one of a suction side or a pressure side of an airfoil. A second elongate sheet is provided and has a shape substantially conforming to a surface on the other of the suction side or the pressure side of the airfoil. The elongate sheet can be welded together at least along respective elongate edges thereof, in such a way as to form a leading edge base structure comprising a weld extending the length of the elongate sheets. Material deposits can be provided onto an outer surface of the leading edge base structure in such a way as to substantially cover the weld, whereby the leading edge component is formed.

Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.

Abstract: A high-temperature-resistant component for an exhaust-gas treatment unit, an exhaust-gas treatment unit and a method for producing such a unit, include providing the component or the exhaust-gas treatment unit with a surface layer intended to prevent the formation of chromium carbide bridges during a brazing process for producing the exhaust-gas treatment unit.

Abstract: There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate.

Abstract: Methods of forming connection bumps for semiconductor devices in which rewiring patterns are formed. The method includes preparing a semiconductor substrate on which a pad is partially exposed through a passivation film, forming a seed layer on the pad and passivation film, forming a photoresist pattern including an opening pattern comprising a first opening that exposes a portion of the seed layer on the pad and a second opening that exposes a portion of the seed layer on the passivation film and is separated from the first opening, performing a first electroplating to form filler layers in the opening patterns, performing a second electroplating to form a solder layer on the filler layers, removing the photoresist pattern and performing a reflow process to form a collapsed solder layer that electrically connects the filler layers to each other and a solder bump on the filler layer formed in the second opening.

Abstract: A method of making a galvanized upper coupler assembly for use in a trailer and the corresponding upper coupler assembly apparatus is disclosed. The method comprises the steps of providing a frame, covering at least one area of the frame with a mask, galvanizing the portions of the frame that are not covered, removing the mask, providing a kingpin, and attaching the kingpin to the frame. After attachment of the kingpin to the frame, the combined assembly can be coated with a rust resistant coating. if desired, a cover plate can be attached to the frame, over the kingpin.

Abstract: Sealing disks (44) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel (54) is fastened on a main plate (53) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.

Abstract: A method and apparatus for fixturing an airfoil stub during linear friction welding are described. Critical clamping support structures are manufactured by a direct digital manufacturing process such as direct metal laser sintering to minimize time and expense of the process.

Abstract: There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power module 1 by stacking a cooler 5, an insulating resin sheet 4, a heat sink block 3, and a semiconductor chip 2, wherein a first insulating resin sheet 41, which forms a lower layer of the insulating resin sheet 4, is first bonded to the cooler 5 by thermal compression. Next, with a second insulating resin sheet 42, which forms an upper layer of the insulating resin sheet 4, interposed between the first insulating resin sheet 41 and the heat sink block 3, the second insulating resin sheet 42 is bonded to the first insulating resin sheet 41 by thermal compression, and the heat sink block 3 is bonded to the second insulating resin sheet 42 by thermal compression. The semiconductor chip 2 is then soldered onto the heat sink block 3.

Abstract: The invention relates to a method for producing a blade tip plating (20) on a blade (10) for a turbomachine, in particular on a high-pressure rotating compressor blade for a gas turbine, comprising the following steps: —producing a particle composite material (24) having embedded hard material particles (18); —placing the panicle composite material (24) on a solder (30) applied to the blade tip (16); and—healing the solder (30).

Abstract: A microfluidic device for separating a sample by chromatography includes diffusion bonded metallic sheets joined together to create a hermetically sealed interface between each adjacent metallic sheet without the introduction of a secondary material. Enclosed within the diffusion bonded sheets is a separation channel accessible by at least one of an inlet or an outlet. The separation channel is packed with micrometer-sized particles serving as a stationary phase in a chromatographic separation. Wetted surfaces of the separation channel include a coating of an organic material at least one monolayer thick.

Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

Abstract: A process for manufacturing a device comprising at least a support and a component, joined together by at least one braze, includes a brazing operation which is carried out starting from a metal oxalate. Advantageously, it is a silver oxalate or a mixture of silver and copper oxalates, the component and/or the support being covered with a film comprising gold or copper in contact with said braze and the component possibly being a power component.

Abstract: Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic material chosen from the group consisting of oxides, carbides, and nitrides of at least one metal. The nonmetallic material is more susceptible to heating by microwave radiation than the metallic material of the first particles, and the nonmetallic material is present in the braze material in an amount sufficient to enable the first particles to completely melt when the first and second particles are subjected to heating by microwave radiation.

Abstract: A cartridge microreactor includes a tubular heater, a metal capillary reaction tubing and a brazing alloy. The tubular heater includes an inner tube surrounded by an outer heater sheath. The metal capillary reaction tubing has a high aspect ratio, an inlet port and an outlet port and is wrapped around the tubular heater so that it is in intimate thermal contact with the heater sheath. The brazing alloy permanently bonds the tubular heater with the metal capillary reaction tubing. The metal capillary reaction tubing is configured to be heated by the tubular heater and is configured to receive one or more reactants through the inlet port and to allow the reactants to react under a selected temperature and pressure and to produce one or more products exiting through the outlet port.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Abstract: A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Abstract: A portable electronic device may have a sealed connector secured within a device housing. The sealed connector may have a metal shell. A plastic contact housing may be insert molded within the shell. Conductive signal contacts may be laterally spaced in the contact housing. An elastomeric gasket may be assembled or compression molded onto the metal shell. Left and right metal brackets may be welded onto the metal shell to moisture-seal latch windows. A water-resistant sealing layer may be attached to the bottom plate of the metal shell to moisture-seal alignment rail windows. The sealed connector may be pressed against the device housing to place the gasket in a compressed state. The connector may be secured to the device housing by screwing down the metal brackets to a circuit board assembled within the housing while the gasket is in the compressed state.

Abstract: A subsea contaminate remediation apparatus is provided. The apparatus includes a conduit. The conduit includes a first end adapted to receive a first liquid stream having at least one contaminate; a second end adapted to release a second liquid stream; a grating associated with the second end of the housing; and at least one chemical injection port. The chemical injection port is adapted to introduce a chemical to the first liquid stream to form the second liquid stream.

Abstract: Forming an implantable component assembly by bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact filler layer of titanium-nickel particulate material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, when implanted in a human body.

Abstract: A cable lighting assembly comprising two electrically isolated electrical conductors, and at least one light emitting diode comprising an anode lead and a cathode lead. An electrical joint is formed between the anode lead and one of the electrical conductors, an electrical joint is formed between the cathode lead and the other electrical conductor, and a thermal joint is formed between the light emitting diode and one of the electrical conductors.

Abstract: Components and methods of forming a protective coating system on the components are provided. In an embodiment, and by way of example only, the component includes a ceramic substrate and a braze layer disposed over the ceramic substrate. The braze layer includes a silicon matrix having a first constituent and a second constituent that is different than the first constituent. The first constituent forms a first intermetallic with a portion of the silicon matrix and the second constituent forms a second intermetallic with another portion of the silicon matrix, wherein the braze layer is formulated to provide a barrier to oxygen diffusion therethrough.

Abstract: A method of manufacturing a wiring substrate, includes: a step of preparing a first metal circuit layer, one face of the first metal circuit layer has thereon a first conductor circuit and a first interlayer connecting section having a different height from that of the first conductor circuit; and a step of forming a first insulating resin layer covering the one face of the first metal circuit layer so that a tip end of the first interlayer connecting section is exposed.

Abstract: A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.